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2025
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Invention
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Communication system between dies and operation method thereof.
A die-to-die communication syste... |
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Invention
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Heterogeneous thermal interface material element and pressing test device having the same.
A het... |
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2024
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Invention
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Semiconductor package device and semiconductor wiring substrate thereof.
A semiconductor wiring ... |
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Invention
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Testing apparatus and its conductive terminal.
A testing apparatus includes a circuit board, a b... |
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Invention
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Resistor array circuit, digital-to-analog converter circuit and layout method of the same.
A res... |
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Invention
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Testing apparatus of packaged modules and its manufacturing method.
A testing apparatus includes... |
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Invention
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Wiring substrate.
A wiring substrate includes a main ground area, a multi-layer board structure,... |
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Invention
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Interposer device and semiconductor package device.
An interposer device configured to provide t... |
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Invention
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Semiconductor device, interface device and operation method.
An interface device includes a firs... |
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Invention
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Integrated circuit device and adaptive power scaling method thereof.
The invention provides an i... |
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Invention
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Semiconductor device, interface device and operation method.
An interface device is adapted for ... |
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Invention
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Substrate structure and semiconductor package.
A substrate structure includes a substrate, a red... |
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Invention
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Analysis method and analysis device.
An analysis method and an analysis device are provided. The... |
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Invention
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Semiconductor chiplet device and interposer.
A semiconductor chiplet device includes a first die... |
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Invention
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Semiconductor device and method of arranging an interface of a semiconductor device.
A semicondu... |
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2023
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Invention
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Method for estimating performance values of chips, computing system, and non-transitory computer-... |
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Invention
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Circuit board device and its circuit module. A circuit board device includes a multilayer board s... |
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Invention
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Testing circuit. A testing circuit is provided. The testing circuit includes a clock cone, a seri... |
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Invention
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Element pickup mechanism.
An element pickup mechanism includes a pick-up arm and an elastic gask... |
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Invention
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Chip storing device.
A chip storing device includes a supporting frame, an elastic airbag and an... |
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Invention
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Communication system between dies and repairing method for lanes between dies. The disclosure pro... |
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Invention
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Temperature sensing device and calibration method thereof.
A temperature sensing device and a ca... |
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Invention
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Communication system between dies and operation method thereof. A die-to-die communication system... |
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Invention
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Interposer routing structure and semiconductor package. An interposer routing structure includes ... |
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Invention
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High-frequency transmission element.
A high-frequency transmission element is provided. The high... |
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Invention
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Semiconductor chip and sequence checking circuit. A semiconductor chip includes a physical layer ... |
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Invention
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Interposer device and semiconductor package structure. An interposer device comprises two bump re... |
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Invention
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Testing apparatus. A testing apparatus includes a circuit board, a probe station and a probe arra... |
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Invention
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Semiconductor packaging device and heat dissipation cover thereof. A semiconductor packaging devi... |
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Invention
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Method of measuring chip characteristics, test device and non-transitory computer readable media.... |
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Invention
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Temperature sensing device and temperature sensing method. A temperature sensing device and a tem... |
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2022
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Invention
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Dbi encoding device and dbi encoding method. The disclosure provides a data bus inversion (DBI) e... |
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Invention
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Digital-to-analog converter and operation method thereof. A digital-to-analog converter and an op... |
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Invention
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Communication system between dies and operation method thereof. A communication system and an ope... |
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Invention
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Calibration system of canceling effect of phase noise and analog-to-digital converting device com... |
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Invention
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Interface device and signal transceiving method thereof. An interface device and a signal transce... |
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Invention
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Semiconductor package device and semiconductor wiring substrate thereof. A semiconductor wiring s... |
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Invention
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Electric device, its circuit board and method of manufacturing the electric device. An electric d... |
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Invention
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Analog-to-digital converting device and method of offset calibration. An analog-to-digital conver... |
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Invention
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Communication interface structure and die-to-die package. A communication interface structure and... |
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Invention
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Interface for a semiconductor chip with adaptive via region arrangement and semiconductor device ... |
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Invention
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Probe card device and circuit protection assembly thereof. A probe card device includes a wiring ... |
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Invention
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Capture ir drop analyzer and analyzing method thereof. A capture IR drop analyzer and an analyzin... |
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Invention
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Chip power consumption analyzer and analyzing method thereof. Disclosed are a chip power consumpt... |
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Invention
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Conductive probe, method of manufacturing the same, and probe card device having the same.
A con... |
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Invention
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Power distribution device, power distribution system and manufacturing method thereof. A power di... |
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2015
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G/S
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Design, testing and analysis of integrated circuits for others; computer software programming ser... |
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2012
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G/S
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Circuit boards; printed circuit boards; integrated circuits; semiconductor devices; embedded memo... |
