|
2023
|
Invention
|
Method for estimating performance values of chips, computing system, and non-transitory computer-... |
|
|
Invention
|
Element pickup mechanism.
An element pickup mechanism includes a pick-up arm and an elastic gask... |
|
|
Invention
|
Chip storing device.
A chip storing device includes a supporting frame, an elastic airbag and an... |
|
|
Invention
|
Communication system between dies and repairing method for lanes between dies.
The disclosure pr... |
|
|
Invention
|
Temperature sensing device and calibration method thereof.
A temperature sensing device and a ca... |
|
|
Invention
|
Communication system between dies and operation method thereof.
A die-to-die communication syste... |
|
|
Invention
|
Interposer routing structure and semiconductor package. An interposer routing structure includes ... |
|
|
Invention
|
High-frequency transmission element.
A high-frequency transmission element is provided. The high... |
|
|
Invention
|
Semiconductor chip and sequence checking circuit.
A semiconductor chip includes a physical layer... |
|
|
Invention
|
Interposer device and semiconductor package structure.
An interposer device comprises two bump r... |
|
|
Invention
|
Testing apparatus. A testing apparatus includes a circuit board, a probe station and a probe arra... |
|
|
Invention
|
Semiconductor packaging device and heat dissipation cover thereof.
A semiconductor packaging dev... |
|
|
Invention
|
Method of measuring chip characteristics, test device and non-transitory computer readable media.... |
|
|
Invention
|
Temperature sensing device and temperature sensing method.
A temperature sensing device and a te... |
|
2022
|
Invention
|
Dbi encoding device and dbi encoding method. The disclosure provides a data bus inversion (DBI) e... |
|
|
Invention
|
Digital-to-analog converter and operation method thereof. A digital-to-analog converter and an op... |
|
|
Invention
|
Communication system between dies and operation method thereof.
A communication system and an op... |
|
|
Invention
|
Calibration system of canceling effect of phase noise and analog-to-digital converting device com... |
|
|
Invention
|
Interface device and signal transceiving method thereof. An interface device and a signal transce... |
|
|
Invention
|
Interface device and signal transceiving method thereof.
An interface device and a signal transc... |
|
|
Invention
|
Semiconductor package device and semiconductor wiring substrate thereof. A semiconductor wiring s... |
|
|
Invention
|
Electric device, its circuit board and method of manufacturing the electric device.
An electric ... |
|
|
Invention
|
Analog-to-digital converting device and method of offset calibration. An analog-to-digital conver... |
|
|
Invention
|
Methods of manufacturing semiconductor packaging device and heat dissipation structure. A manufac... |
|
|
Invention
|
Communication interface structure and die-to-die package. A communication interface structure and... |
|
|
Invention
|
Interface for a semiconductor chip with adaptive via region arrangement and semiconductor device ... |
|
|
Invention
|
Probe card device and circuit protection assembly thereof.
A probe card device includes a wiring... |
|
|
Invention
|
Capture ir drop analyzer and analyzing method thereof.
A capture IR drop analyzer and an analyzi... |
|
|
Invention
|
Chip power consumption analyzer and analyzing method thereof.
Disclosed are a chip power consump... |
|
|
Invention
|
Conductive probe, method of manufacturing the same, and probe card device having the same.
A con... |
|
|
Invention
|
Semiconductor chiplet device.
A semiconductor chiplet device includes a package substrate, an in... |
|
|
Invention
|
Inspecting device and its testing socket. A testing socket includes a metal block, an assembly bl... |
|
|
Invention
|
Power distribution device, power distribution system and manufacturing method thereof.
A power d... |
|
|
Invention
|
Circuit board device. A circuit board device includes a multilayer structure, a main ground area ... |
|
|
Invention
|
Pogo pin-free testing device for ic chip test and testing method of ic chip. A pogo pin-free test... |
|
2021
|
Invention
|
Interposer and semiconductor package each having conductive terminals on redistribution layer wit... |
|
|
Invention
|
Placement method and non-transitory computer readable storage medium. A placement method for inte... |
|
|
Invention
|
Analog to digital converter device and method for controlling calibration circuit. An analog to d... |
|
|
Invention
|
Analog to digital converter device and method for calibrating clock skew. An analog to digital co... |
|
|
Invention
|
Communication system between dies and operation method thereof. A communication system and an ope... |
|
|
Invention
|
Electronic system, integrated circuit die and operation method thereof. An electronic system, an ... |
|
|
Invention
|
Testing apparatus and its element pickup module.
A testing apparatus includes a testing stage an... |
|
|
Invention
|
Testing system, crack noise monitoring device and method for monitoring crack noise. A testing sy... |
|
|
Invention
|
Thermal peak suppression device. A thermal peak suppression device includes a heat dissipation fi... |
|
|
Invention
|
Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semic... |
|
|
Invention
|
Routing structure between dies and method for arranging routing between dies. A routing structure... |
|
|
Invention
|
Communication interface structure between processing die and memory die. A communication interfac... |
|
|
Invention
|
Circuit for providing clock to de-serializer in communication physical layer. A circuit is provid... |
|
2020
|
Invention
|
Interface of integrated circuit die and method for arranging interface thereof. An interface of i... |
|
2015
|
P/S
|
Design, testing and analysis of integrated circuits for others; computer software programming ser... |
|
2012
|
P/S
|
Circuit boards; printed circuit boards; integrated circuits; semiconductor devices; embedded memo... |
