Global Unichip Corporation

Taïwan, Province de Chine


Commandez votre montre hebdomadaire Global Unichip Corporation
Quantité totale PI 242
Rang # Quantité totale PI 5 460
Note d'activité PI 3/5.0    132
Rang # Activité PI 5 112
Symbole boursier 3443 (twse)
ISIN TW0003443008
Capitalisation 170.2B  (TWD)
Industrie Semiconductors
Secteur Technology
Classe Nice dominante Services scientifiques, technolo...

Brevets

Marques

235 2
0 0
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Dernier brevet 2025 - Substrate structure and semicond...
Premier brevet 1999 - Programmable built in self test ...
Dernière marque 2015 - PowerHero
Première marque 2008 - GUC

Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Communication system between dies and operation method thereof. A die-to-die communication syste...
2024 Invention Testing apparatus and its conductive terminal. A testing apparatus includes a circuit board, a b...
Invention Testing apparatus of packaged modules and its manufacturing method. A testing apparatus includes...
Invention Interposer device and semiconductor package device. An interposer device configured to provide t...
Invention Semiconductor package device and semiconductor wiring substrate thereof. A semiconductor wiring ...
Invention Substrate structure and semiconductor package. A substrate structure includes a substrate, a red...
Invention Analysis method and analysis device. An analysis method and an analysis device are provided. The...
Invention Semiconductor chiplet device and interposer. A semiconductor chiplet device includes a first die...
Invention Semiconductor device and method of arranging an interface of a semiconductor device. A semicondu...
2023 Invention Method for estimating performance values of chips, computing system, and non-transitory computer-...
Invention Circuit board device and its circuit module. A circuit board device includes a multilayer board s...
Invention Testing circuit. A testing circuit is provided. The testing circuit includes a clock cone, a seri...
Invention Element pickup mechanism. An element pickup mechanism includes a pick-up arm and an elastic gask...
Invention Chip storing device. A chip storing device includes a supporting frame, an elastic airbag and an...
Invention Communication system between dies and repairing method for lanes between dies. The disclosure pro...
Invention Temperature sensing device and calibration method thereof. A temperature sensing device and a ca...
Invention Communication system between dies and operation method thereof. A die-to-die communication system...
Invention Interposer routing structure and semiconductor package. An interposer routing structure includes ...
Invention High-frequency transmission element. A high-frequency transmission element is provided. The high...
Invention Semiconductor chip and sequence checking circuit. A semiconductor chip includes a physical layer ...
Invention Interposer device and semiconductor package structure. An interposer device comprises two bump r...
Invention Testing apparatus. A testing apparatus includes a circuit board, a probe station and a probe arra...
Invention Semiconductor packaging device and heat dissipation cover thereof. A semiconductor packaging dev...
Invention Method of measuring chip characteristics, test device and non-transitory computer readable media....
Invention Temperature sensing device and temperature sensing method. A temperature sensing device and a tem...
2022 Invention Dbi encoding device and dbi encoding method. The disclosure provides a data bus inversion (DBI) e...
Invention Digital-to-analog converter and operation method thereof. A digital-to-analog converter and an op...
Invention Communication system between dies and operation method thereof. A communication system and an ope...
Invention Calibration system of canceling effect of phase noise and analog-to-digital converting device com...
Invention Interface device and signal transceiving method thereof. An interface device and a signal transce...
Invention Semiconductor package device and semiconductor wiring substrate thereof. A semiconductor wiring s...
Invention Electric device, its circuit board and method of manufacturing the electric device. An electric ...
Invention Analog-to-digital converting device and method of offset calibration. An analog-to-digital conver...
Invention Communication interface structure and die-to-die package. A communication interface structure and...
Invention Interface for a semiconductor chip with adaptive via region arrangement and semiconductor device ...
Invention Probe card device and circuit protection assembly thereof. A probe card device includes a wiring ...
Invention Capture ir drop analyzer and analyzing method thereof. A capture IR drop analyzer and an analyzin...
Invention Chip power consumption analyzer and analyzing method thereof. Disclosed are a chip power consumpt...
Invention Conductive probe, method of manufacturing the same, and probe card device having the same. A con...
Invention Semiconductor chiplet device. A semiconductor chiplet device includes a package substrate, an int...
Invention Inspecting device and its testing socket. A testing socket includes a metal block, an assembly bl...
Invention Power distribution device, power distribution system and manufacturing method thereof. A power di...
Invention Circuit board device. A circuit board device includes a multilayer structure, a main ground area ...
Invention Pogo pin-free testing device for ic chip test and testing method of ic chip. A pogo pin-free test...
2021 Invention Interposer and semiconductor package each having conductive terminals on redistribution layer wit...
Invention Placement method and non-transitory computer readable storage medium. A placement method for inte...
2015 P/S Design, testing and analysis of integrated circuits for others; computer software programming ser...
2012 P/S Circuit boards; printed circuit boards; integrated circuits; semiconductor devices; embedded memo...