Sonicmems (Zhengzhou) Technology Co.,Ltd.

Chine

 
Quantité totale PI 15
Rang # Quantité totale PI 100 945
Note d'activité PI 2,1/5.0    17
Rang # Activité PI 49 503

Brevets

Marques

15 0
0 0
0 0
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Dernier brevet 2025 - Ultrasonic sensing element assem...
Premier brevet 2018 - Ultrasonic module and method for...

Derniers inventions, produits et services

2023 Invention Ultrasonic sensing element assembly and ultrasonic sensing element. An ultrasonic sensing elemen...
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2022 Invention Wafer level ultrasonic chip module having suspension structure. A wafer level ultrasonic chip mo...
2021 Invention Suspended piezoelectric ultrasonic transducer and manufacturing thereof. A suspended piezoelectr...
Invention Array-type ultrasonic sensor. An array-type ultrasonic sensor includes a semiconductor substrate,...
2020 Invention Wafer level ultrasonic device and manufacturing method thereof. A wafer level ultrasonic device i...
Invention Wafer scale ultrasonic sensing device and manufacturing method thereof. A wafer scale ultrasonic ...
Invention Integrated package structure for mems element and asic chip and method for manufacturing the same...
2019 Invention Wafer scale ultrasonic sensor assembly and method for manufacturing the same. A wafer scale ultra...
Invention Wafer level ultrasonic chip module and manufacturing method thereof. A wafer level ultrasonic chi...
Invention Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof. ...
2018 Invention Ultrasonic module and method for manufacturing the same. An ultrasonic module and a manufacturing...