Abstract

This electroconductive paste contains electroconductive particles in which the tap density measured in accordance with ISO 3953:2011 is 2.5 g／mL or greater and the BET specific surface area is 2.5 m2/g or greater, (B) a thermoplastic resin, and (C) a solvent. Provided are: an electroconductive paste, an electroconductive film or an electroconductive pattern having exceptional low-resistance properties even when continuously caused to expand and contract; a cured article of said electroconductive paste, electroconductive film or electroconductive pattern; and a wearable device containing said electroconductive film or electroconductive pattern.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• A61B 5/266 - Bioelectric electrodes therefor characterised by the electrode materials containing electrolytes, conductive gels or pastes
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
• H01B 7/06 - Extensible conductors or cables, e.g. self-coiling cords

Abstract

Provided is a liquid compression molding material which has excellent injectability and forms a cured product containing few aggregates.　This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used for at least sealing a gap between an element and a substrate, wherein the initial viscosity at 25ºC is 10-250 Pa∙s, and a cured product obtained by curing the liquid compression molding material under condition (1) satisfies condition (2). (1) The molding temperature is 150ºC, the molding time is 700 seconds, the curing temperature is 180ºC, and the curing time is 60 minutes. (2) When a region of 250 μm×180 μm in length and width on a cross section of the cured product is observed with a scanning electron microscope (magnification: 500 times), the area ratio of aggregates, which have a circle equivalent diameter of at least 1 μm and are present in said region, is at most 1.0%.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/1539 - Cyclic anhydrides
• C08K 5/3445 - Five-membered rings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a resin composition that has excellent adhesive strength at room temperature and excellent wire bonding properties in a temperature range suitable for Cu wire bonding. This resin composition contains: (A) a phenoxy resin having a glass transition temperature Tg1 of 50°C or less; (B) a curing agent; (C) a filler; and (D) at least one resin selected from the group consisting of a phenoxy resin having a glass transition temperature Tg2 of 100°C or more, a trifunctional or higher epoxy resin, and a naphthalene-type epoxy resin. The resin composition has a glass transition temperature Tg3 of 130°C or more, and the cured product thereof has a modulus of elasticity of 0.5 GPa or more at 200°C.

IPC Classes  ?

• C08L 71/10 - Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/373 - Cooling facilitated by selection of materials for the device

Abstract

Provided is an epoxy resin composition having a low viscosity and a short gap filling time.　This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) core-shell rubber particles, wherein the shell layer of the core-shell rubber particles (D) contains (meth)acrylic acid and butyl (meth)acrylate as constituent units.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/50 - Amines
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 3/36 - Silica
• C08L 51/04 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to rubbers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

123412344 represents an aryl group having 6-14 carbon atoms.) and of a counter cation, and also satisfying at least one of the following characteristics (a) and (b); an adhesive agent or a sealing material including the same; a cured product thereof; and a semiconductor device and an electronic component including the cured product. (a) (D) A filler is further included. (b) The content of (A) the epoxy compound is 100-1300 parts by weight with respect to 100 pats by weight of (B) the oxetane compound.

IPC Classes  ?

• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08G 65/18 - Oxetanes
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/56 - Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

123412344 represents an aryl group having 6 to 14 carbon atoms) and a counter cation other than an iodonium cation; an adhesive agent or a sealing material which contains the resin composition; a cured product of the resin composition; a semiconductor device which comprises the cured product; and an electronic component.

IPC Classes  ?

• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08G 65/18 - Oxetanes
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/56 - Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing at least a photocurable or thermosetting polymerizable composition and adhesive capable of suppressing a bleeding phenomenon.　Provided are a polymerizable composition and an adhesive that contain (A) a cationically polymerizable compound, (B) an acid generator, and (C) a modified polydimethylsiloxane that satisfies at least one of the following features (a), (b), and (c): (a) an organic substituent containing a COOH group is bonded to the polydimethylsiloxane directly or via a linker; (b) an organic substituent containing an OH group and optionally an ether group is bonded to the polydimethylsiloxane directly or via a linker, and when the organic substituent contains an ether group, the ratio of the number of polypropylene glycol repeating units to the number of polyethylene glycol repeating units in the organic substituent is less than 0.3; and (c) the modified polydimethylsiloxane has a specific signal in a 1H NMR spectrum measured in deuterated chloroform and satisfies a specific formula.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 83/04 - Polysiloxanes
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing: a curable resin composition which can be applied with a narrow line width (for example, 1,000 μm or less) and a high coating height; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component.　Provided are: a curable resin composition which contains (A) a polymerizable compound, (B) a polymerization initiator, (C) an inorganic thixotropy-imparting agent, and (D) a modified polydimethylsiloxane, wherein the content of (C) the inorganic thixotropy-imparting agent is 10-70 parts by mass with respect to 100 parts by mass of the curable resin composition, and the content of (D) the modified polydimethylsiloxane is 0.01-15 parts by mass with respect to 100 parts by mass of (C) the inorganic thixotropy-imparting agent; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component.

IPC Classes  ?

• C08L 83/04 - Polysiloxanes
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 183/04 - Polysiloxanes
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a conductive paste capable of forming an electrode having a relatively low specific resistance even when conductive particles having a relatively low silver content are used.　Provided is a conductive paste containing (A) conductive particles, (B) an epoxy resin, and (C) a curing agent, wherein the (A) conductive particles include silver-coated copper particles, and in the particle size distribution of the silver-coated copper particles obtained by particle size distribution measurement using a laser diffraction scattering method, when the silver-coated copper particle content is set as 100 vol%, the amount of silver-coated copper particles having a particle diameter of less than 5.0 μm is 50 vol% or less.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01G 4/005 - Electrodes
• H10F 10/00 - Individual photovoltaic cells, e.g. solar cells

Abstract

R120R120 obtained by measuring solid content in the insulating composition at 120°C and 100 rpm using a rheometer is 28 mPa·s or more. The insulating composition preferably further contains a solvent (D).　

IPC Classes  ?

• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• C09D 5/25 - Electrically-insulating paints or lacquers
• C09D 7/20 - Diluents or solvents
• C09D 7/40 - Additives
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/63 - Additives non-macromolecular organic
• C09D 7/65 - Additives macromolecular
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins

Abstract

Provided is a film for an adhesive layer, which is capable of suppressing breakage of a plating layer that is disposed on the inner surface of a through hole which is formed in a multilayer wiring board. Specifically provided is a film 10A for an adhesive layer, which is used for the production of a multilayer wiring board 100. The multilayer wiring board 100 comprises a fluororesin substrate 20 and the film 10A for an adhesive layer. The film 10A for an adhesive layer has a thickness of 10-35 μm. The film 10A for an adhesive layer has a thermal expansion coefficient in the thickness direction of 110 ppm/°C or less after curing, and satisfies the following relational expression (1).　(1): X + Y ≤ 14,000 (In the relational expression (1), X is a value obtained by multiplying the thickness (μm) of the film 10A for an adhesive layer by the thermal expansion coefficient (ppm/°C) in the thickness direction after curing, Y is a value obtained by multiplying the thickness (μm) of the fluororesin substrate 20 by the thermal expansion coefficient (ppm/°C) in the thickness direction, and the thickness of the fluororesin substrate 20 is 50 μm or more.)

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties

Abstract

The present invention provides: a resin composition that has excellent low gloss properties even when a specific trithiol compound is contained therein; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition.　Provided are: a resin composition containing (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), and (C) a thermally latent curing catalyst that is solid at room temperature; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition.

IPC Classes  ?

• C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• C09J 4/02 - Acrylmonomers
• C09J 11/06 - Non-macromolecular additives organic
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing: a resin composition having favorable storage stability and low-temperature curability even when a specific trithiol compound is contained; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component.　Provided are: a resin composition comprising (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), (C) a thermally latent curing catalyst, and (D) an inorganic filler having a specific surface area of at least 4 m2/g; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component.

IPC Classes  ?

• C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 81/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon onlyCompositions of polysulfonesCompositions of derivatives of such polymers
• C09J 4/02 - Acrylmonomers
• C09J 11/06 - Non-macromolecular additives organic
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides: a thermosetting insulating film which is capable of achieving excellent insulating properties when used for the production of a multilayer substrate; and a multilayer insulating sheet which uses this thermosetting insulating film. Provided are: a thermosetting insulating film which contains at least a solid epoxy resin as an epoxy resin, wherein the area change rate R expressed by formula (1) is 222% or less; and a multilayer insulating sheet which uses this thermosetting insulating film. Formula (1): R = 100 × Sp/Si (In formula (1), Sp represents the area (cm2) of a square film after being subjected to vacuum pressure pressing under conditions of a pressing temperature of 175°C, a pressing pressure of 2.5 MPa, and a pressing time of 30 minutes, the square film having a thickness of 100 μm and a horizontal and vertical size of 160 mm × 160 mm, and Si represents the area (cm2) of the film before the vacuum heating pressing is performed.)

IPC Classes  ?

• H01B 17/56 - Insulating bodies
• C08J 5/18 - Manufacture of films or sheets
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

Abstract

The present invention addresses the problem of providing a novel latent polymerization initiator which is excellent in terms of storage stability and enables thermal curing of a resin composition at a low temperature. The present invention also addresses the problem of providing a resin composition and an adhesive or a sealing material, which are excellent in terms of storage stability and can be thermally cured at a low temperature.　The present invention provides: a thermal latent polymerization initiator in which a thermal radical initiator is supported by inorganic ion exchanger particles; a resin composition which contains (A) a radically polymerizable compound and (B) the thermal latent polymerization initiator; and an adhesive or a sealing material which contains the resin composition.

IPC Classes  ?

• C08F 4/02 - Carriers therefor
• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08F 4/04 - Azo-compounds
• C09J 11/02 - Non-macromolecular additives
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds

Abstract

11) of a shape when an electrode formed using the conductive paste is extended or contracted in one cycle with a length of 115% with respect to the length before the extension of the electrode is 8.0% or less.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C08K 3/02 - Elements
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon

Abstract

Provided are: a conductive paste capable of forming a circuit pattern by a screen printing method and forming a conductive film having high adhesion to a ceramic substrate; a conductive film; a ceramic circuit substrate; and an electronic component.　The conductive paste includes (A) a conductive powder, (B) a glass frit, and (C) an organic vehicle. The (B) glass frit may be a glass frit in which, when the glass frit is disposed on a ceramic substrate and is melted under the condition of 900°C in a nitrogen atmosphere, the contact angle of the molten glass frit with respect to the ceramic substrate measured in conformance with JIS R3257 is 40 degrees or less.　

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
• H05K 1/03 - Use of materials for the substrate
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

Abstract

The present invention provides an epoxy resin composition wherein running on the surface of a BSM-treated silicon chip is less likely to occur.　This epoxy resin composition contains an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin composition has a surface tension of 30-40 mN/m as measured at 110°C using a plate method.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/011 - Crosslinking or vulcanising agents, e.g. accelerators
• C08K 3/013 - Fillers, pigments or reinforcing additives
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing at least a thermosetting resin composition and an adhesive agent that can suppress the bleeding phenomenon. 　Provided is a resin composition comprising (A) a polymerizable compound having a carbon-carbon double bond, (B) a polythiol compound, (C) a polymerization initiator, and (D) a modified polydimethylsiloxane satisfying at least one of features (a) and (b): (a) an organic substituent group including a COOH group or an OH group is bound to a polydimethylsiloxane directly or via a linker; and (b) an 122O.

IPC Classes  ?

• C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• C08G 75/02 - Polythioethers
• C08L 81/02 - PolythioethersPolythioether-ethers
• C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
• C09J 4/02 - Acrylmonomers
• C09J 11/02 - Non-macromolecular additives
• C09J 11/06 - Non-macromolecular additives organic
• C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing: a curable resin composition that can be rapidly cured at a low temperature (for example, cured at 70°C-80°C within 30 minutes), exhibits high adhesive strength after curing at a low temperature for a short time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product.　Provided are: a curable resin composition comprising (A) a radically polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, wherein the content of the (C) polymerization inhibitor in the curable resin composition falls within the range of 0.1-3.0 parts by mass with respect to 100 parts by mass of the radical polymerization initiator (B); a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product.

IPC Classes  ?

• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08F 2/38 - Polymerisation using regulators, e.g. chain terminating agents

Abstract

A copper member, comprising a copper material and a protrusion formed on the surface of the copper material. The protrusion contains copper and/or a copper oxide. When the copper member is measured using a nanoindenter under a prescribed measurement condition, the copper member satisfies at least one of (1) indentation creep (CIT) of 80% or greater, (2) indentation hardness (GPa) of 1 or less, and (3) an indentation elastic modulus (GPa) of 120 or less. The copper member is excellent in adhesion to a resin base material and heat-resistance reliability.

IPC Classes  ?

• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 7/00 - Electroplating characterised by the article coated
• C25D 7/06 - WiresStripsFoils
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

Provided is a liquid compression molding material including an epoxy resin composition containing an epoxy resin (A), a curing accelerator (B), a filler (C), and an elastomer (D), in which blending ratio of the filler (C) to the epoxy resin composition is 73.0 mass % or more, and blending ratio of the elastomer (D) to a total of components excluding the filler (C) from the epoxy resin composition is 7.0 mass % or more.

IPC Classes  ?

• B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
• B29K 21/00 - Use of unspecified rubbers as moulding material
• B29K 63/00 - Use of epoxy resins as moulding material
• B29K 105/00 - Condition, form or state of moulded material
• B29K 105/16 - Fillers
• B29L 31/34 - Electrical apparatus, e.g. sparking plugs or parts thereof
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

This invention prevents the occurrence of peeling failure during lamination processing using a multilayer sheet. A multilayer sheet 100 is formed by laminating a first base material film 12, an adhesive film 14, a second base material film 16, and a third base material film 18 in this order, and satisfies the following formula (1). Formula (1): P1 < P2 < P3 [In the formula, P1 represents a peel strength between the first base material film and the adhesive film, P2 represents a peel strength between the adhesive film and the second base material film, and P3 represents a peel strength between the second base material film and the third base material film.]

IPC Classes  ?

• B32B 7/06 - Interconnection of layers permitting easy separation
• C09J 7/29 - Laminated material
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds

Abstract

CSCSCSS: the radius of the support when viewed in plan

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• B29C 43/58 - Measuring, controlling or regulating
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 3/36 - Silica
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

This invention makes it possible to achieve a semiconductor device demonstrating excellent electrical connection reliability despite a narrow pitch between electrodes. There is provided an adhesive film which is used for bonding a semiconductor element with a semiconductor element or bonding a semiconductor element with a circuit board, the film having: a width of 40°C or more and less than 110°C of a temperature range indicative of a melt viscosity of 50000 Pa･s or less in a temperature range of more than 90°C and less than 200°C; and a ratio (V2/V1) exceeding 1.0 of a melt viscosity V2 at 200°C to a minimum melt viscosity V1 in a temperature range of more than 90°C and less than 200°C.

IPC Classes  ?

• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 21/52 - Mounting semiconductor bodies in containers

Abstract

The prevent invention is a conductive paste comprising (A) conductive particles, (B) a thermosetting resin, and (C) rubber particles. The rubber particles (C) include a carbon-carbon bond in the main chain skeleton thereof. Rubber particles having an average particle size less of than 1 μm are included. The present invention makes it possible to provide a conductive paste having improved adhesion to a copper base material.

IPC Classes  ?

• H01G 4/30 - Stacked capacitors
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below: A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below: A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below: and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.

IPC Classes  ?

• C08F 122/14 - Esters having no free carboxylic acid groups
• C08K 7/26 - Silicon-containing compounds
• C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds

Abstract

The present invention provides a resin composition which has a low refractive index and good heat resistance such as good reflow resistance.　Disclosed is a resin composition which contains (A1) a cyclic siloxane compound that has a reactive functional group, (A2) a linear siloxane compound that has a reactive functional group, and (B) a polymerization initiator. It is preferable that the cyclic siloxane compound (A1) that has a reactive functional group is an epoxy-modified cyclic siloxane compound that has 2 or 4 epoxy groups. It is also preferable that the linear siloxane compound (A2) that has a reactive functional group has a glycidyl ether structure at both ends.

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 183/04 - Polysiloxanes
• G02B 6/24 - Coupling light guides
• G02B 6/30 - Optical coupling means for use between fibre and thin-film device

Abstract

Provided is a resin composition for an adhesive, the composition having a low refractive index and a low weight reduction rate after a reflow step is performed.　The resin composition for an adhesive comprises: (A) a siloxane compound that has a reactive functional group; and (B) a polymerization initiator. The (B) polymerization initiator contains at least one onium salt selected from the group consisting of onium borate salts and onium gallate salts. The onium salt preferably contains at least one cation selected from the group consisting of iodonium and sulfonium.

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 183/04 - Polysiloxanes
• G02B 6/24 - Coupling light guides
• G02B 6/30 - Optical coupling means for use between fibre and thin-film device

Abstract

This invention provides a resin composition having low viscosity and high transparency.　The resin composition comprises (A) an organic substance, (B) a polymerization initiator, and (C) inorganic particles, wherein the (C) inorganic particles include inorganic particles which have a median diameter (D50) of 0.05-3.0 μm and for which D90/D10 is 1-4, D90/D10 being the ratio of a cumulative volume 90% value (D90) to a cumulative volume 10% value (D10) in particle size distribution. It is preferable that the (C) inorganic particles include silica particles.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C08K 3/013 - Fillers, pigments or reinforcing additives
• G02B 6/24 - Coupling light guides

Abstract

Provided is an optical fiber array (1) comprising an adhesive layer (20) that exhibits a low refractive index and excellent transparency.　This optical fiber array comprises an optical fiber (10) and an adhesive layer (20), wherein the optical fiber (10) is optically coupled to an optical waveguide element (30) by the adhesive layer (20) and the content of the adhesive layer (20) in terms of the element Si is at least 10%. The adhesive layer (20) preferably has a transmittance of at least 90% at a wavelength of 1310 nm. The adhesive layer (20) preferably has a refractive index of not greater than 1.47 at a wavelength of 1310 nm. The adhesive layer (20) preferably contains a cured product of (A) a siloxane compound having a reactive functional group and (B) a polymerization initiator.

IPC Classes  ?

• G02B 6/30 - Optical coupling means for use between fibre and thin-film device
• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 183/04 - Polysiloxanes
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds

Abstract

The present invention provides a novel method for manufacturing a hybrid quantum dot, a novel hybrid quantum dot, a novel energy storage device, a novel energy generation device, and a novel paste for forming a varistor. The present invention relates to a method for producing a hybrid quantum dot. The hybrid quantum dot contains elemental carbon and an elemental metal. The method includes: a gelling step in which a composition containing elemental carbon precursor and an elemental metal precursor is gelled to obtain a gelled product; a supercritical drying step in which the gelled product is dried by supercritical drying to obtain an aerogel powder; and a pyrolysis step in which the aerogel powder is pyrolyzed to obtain the hybrid quantum dot.

IPC Classes  ?

• B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units

Abstract

The present invention addresses the problem of providing: an epoxy resin composition with which it is possible to suppress the discoloration of an object having the composition applied thereto even when the composition contains a specific trithiol compound; an adhesive agent or a sealing material containing the composition; a cured article; and a semiconductor device or an electronic component.　Provided are: an epoxy resin composition containing (A) an epoxy resin having a halogen content of 1600 ppm or less, (B) a thiol compound represented by chemical formula (I), and (C) a basic curing catalyst; an adhesive agent or a sealing material containing the epoxy resin composition; a cured article; and a semiconductor device or an electronic component.

IPC Classes  ?

• C08G 59/66 - Mercaptans
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing: an epoxy resin composition which exhibits good low temperature curability even if a specific trithiol compound is contained therein; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.　Provided are: an epoxy resin composition that contains (A) a thiol compound represented by chemical formula (I), (B) a thiol compound having an isocyanuric acid skeleton, (C) an epoxy resin and (D) a latent thermal curing catalyst; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.

IPC Classes  ?

• C08G 59/66 - Mercaptans
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention addresses the problem of providing: a photocurable resin composition that does not require full curing by heat; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition.　Provided are: a photocurable resin composition containing (A) a polymerizable compound, (B) a photopolymerization initiator, and (C) a photon upconversion material; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C08F 20/20 - Esters of polyhydric alcohols or phenols
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
• C08K 5/3415 - Five-membered rings
• C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers

Abstract

An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity. Thus, in a semiconductor device that includes electronic components manufactured using the composition as a mold underfill material for TSV, deterioration of performance due to heat is suppressed. Furthermore, an electronic component manufactured using the liquid epoxy resin composition of the present invention as a mold underfill material for TSV exhibits sufficient reliability. Thus, the liquid epoxy resin composition of the present invention is highly suitable for use as a mold underfill material for TSV.

IPC Classes  ?

• C08K 13/06 - Pretreated ingredients and ingredients covered by the main groups
• C08G 59/62 - Alcohols or phenols
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

The present invention suppresses the occurrence of a mold flash at the time of compression molding. Provided are: a liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl polymer; an electronic component and a semiconductor device manufactured using the same; and a method for manufacturing an electronic component using the same.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08G 59/02 - Polycondensates containing more than one epoxy group per molecule
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 57/00 - Compositions of unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

GFGFGF of the glass frit (C) and the content G of the glass frit (C) in terms of parts by weight in the electrically conductive paste, if the content of the electrically conductive particles (A) in the electrically conductive paste is taken to be 100 parts by weight, falls within the range 0.25-1.45.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/068 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells

Abstract

The present invention suppresses warping of a sealed article and has excellent rapid curing properties. A liquid compression molding material according to the present invention comprises a resin composition containing (A) an epoxy resin, (B1) a phenolic curing agent, (B2) an acid anhydride curing agent, and (C) an inorganic filler, wherein a glass transition temperature Tg of a cured product of the resin composition is in a range of 50°C to 120°C.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• B29C 43/34 - Feeding the material to the mould or the compression means
• C08G 59/00 - Polycondensates containing more than one epoxy group per moleculeMacromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compoundsMacromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08G 59/62 - Alcohols or phenols

Abstract

[Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 μm or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.

IPC Classes  ?

• C08K 3/28 - Nitrogen-containing compounds
• C08G 59/14 - Polycondensates modified by chemical after-treatment
• C08G 59/22 - Di-epoxy compounds
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08G 59/50 - Amines
• C08G 59/62 - Alcohols or phenols
• C08K 3/36 - Silica
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

Provided are a resin composition for a semiconductor device of a wafer level chip size package type, which exhibits excellent high-frequency properties, and can form a coating film which has a thickness that has less unevenness, and is unlikely to cause warpage of the semiconductor substrate, a semiconductor device using the same, and a method for producing a semiconductor device. A resin composition for a semiconductor device of a wafer level chip size package type, the resin composition comprising (A) a modified polyphenylene ether resin having an unsaturated double bond at the end thereof, (B) an elastomer having a butadiene skeleton, and optionally (C) a solvent, a semiconductor device using the same, and a method for producing a semiconductor device.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

The purpose of the present invention is to provide a novel metal member.　A metal member according to the present invention includes a layer containing Ni and Zn on at least one surface of a metal material, wherein the Zn adhesion amount in the layer containing Ni and Zn is 1.0 mg/dm2to 7.5 mg/dm2 (exclusive of 7.5), and the Zn content in the layer containing Ni and Zn is 55 mass% to 100 mass% (exclusive of 100 mass%).

IPC Classes  ?

• C25D 7/06 - WiresStripsFoils
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• C25D 5/16 - Electroplating with layers of varying thickness
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

The objective of the present invention is to provide a novel metal member.　A metal member according to the present invention comprises a metal material which is a non-magnetic body, and a layer formed on the surface of the metal material and containing a magnetic metal and a non-magnetic metal. The metal member has a peak having a peak height of 0.7 to 1.2 times a reference value and/or a phase width of 0.8 to 1.5 times a reference value in a histogram obtained by measuring a magnetic field using a magnetic force microscope (MFM), wherein the peak height is a measured peak maximum value (hmax) of the histogram, the phase width is a range in which h/hmax is 0.01 or more, and the reference value is a value obtained by using the metal member yet to be processed.

IPC Classes  ?

• C25D 7/06 - WiresStripsFoils
• B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 5/34 - Pretreatment of metallic surfaces to be electroplated
• C25D 5/48 - After-treatment of electroplated surfaces
• C25D 7/00 - Electroplating characterised by the article coated
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

The present invention addresses the problem of providing: a novel substance capable of solving the problem of conventional bismaleimides having a dimer acid skeleton; a curable composition, adhesive, or sealing material containing same and having excellent photo-curability and adhesive strength; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product.　Provided are: a dimer acid-modified acrylamide; a composition mainly containing the dimer acid-modified acrylamide; a curable composition, adhesive, or sealing material containing the dimer acid-modified acrylamide and a radical polymerization initiator; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product.

IPC Classes  ?

• C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
• C08F 20/56 - AcrylamideMethacrylamide
• C09J 4/02 - Acrylmonomers
• C09J 11/06 - Non-macromolecular additives organic
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers

Abstract

To provide: an epoxy resin composition capable of suppressing small pores generated when the surface of a cured product thereof is polished; an electronic component using the epoxy resin composition; a semiconductor device using the epoxy resin composition; and a method for manufacturing the semiconductor device.　The epoxy resin composition contains an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer. The solid elastomer has a structure in which a double bond is not included in the main chain.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/013 - Fillers, pigments or reinforcing additives
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

Provided are: a semiconductor device comprising an interlayer insulating film having a high tensile elongation; and a resin composition.　The semiconductor device comprises: a semiconductor chip; an encapsulation material for covering the semiconductor chip; wiring for electrically connecting the semiconductor chip to an external terminal; and a rewiring layer including an interlayer insulating film that surrounds the wiring, wherein the rewiring layer has an area larger than that of the semiconductor chip in a plan view, and the interlayer insulating film has a tensile elongation of at least 15% at 25°C.　

IPC Classes  ?

• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
• C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

There are provided: a resin composition that has low elasticity, is curable at low temperature, and has a long pot life; an electrically conductive adhesive that contains the resin composition; a cured product of the resin composition; and a semiconductor device that contains the electrically conductive adhesive or the cured product of the resin composition. The resin composition contains (A) a radically polymerizable curable resin, (B) a radical polymerization initiator, and (C) a radical polymerization inhibitor. The (C) component contains (C1) a nitrosamine compound. The (A) component contains (A1) a urethane acrylate oligomer. The (A1) component has a mass average molecular weight of 1,600 or more and 20,000 or less. The resin composition is useful as an electrically conductive adhesive, a material for mounting components or a sealing material for protecting components, and an insulating material for reinforcement which are used in the FHE field.

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 9/02 - Electrically-conducting adhesives

Abstract

Provided is a resin composition with low dielectric characteristics while having good ability to permeate into circuit boards. This composition comprises (A) a thermosetting resin comprising vinylbenzyl groups and/or maleimide groups, and (B) a compound with a butadiene backbone that has a 1,2-vinyl group, and the number average molecular weight of component (B) is 1000-10000.

IPC Classes  ?

• C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
• B32B 27/00 - Layered products essentially comprising synthetic resin
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/14 - Peroxides
• C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 7/35 - Heat-activated
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/08 - Macromolecular additives
• C09J 109/00 - Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured product having a low Tg; a semiconductor apparatus including the cured product; and an electronic device including the cured product. The curable resin composition comprises (A) a cationic curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxydicarbonate-type organic peroxide. The component (A) includes at least one selected from the group consisting of (A1) an epoxy resin having a ring skeleton in a molecule, and (A2) an oxetane resin.

IPC Classes  ?

• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 21/52 - Mounting semiconductor bodies in containers

Abstract

Provided are: a curable resin composition which can be cured at a low temperature and which has excellent pot life; an adhesive; a sealing material; a cured product; a semiconductor device; and an electronic device. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxy dicarbonate-type organic peroxide represented by formula (1). The peroxycarbonate-type organic peroxide represented by formula (1) includes an alkyl group represented by R1and an alkyl group represented by R2, the alkyl groups each having at least 10 carbon atoms.

IPC Classes  ?

• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 21/52 - Mounting semiconductor bodies in containers

Abstract

Provided are: a curable resin composition which can be cured through heating at a low temperature and/or ultraviolet ray irradiation and with which corrosion of an adherend is suppressed; an adhesive; a sealing material; a cured product obtained by curing same; and a semiconductor device and electronic device including the cured product. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) an ion trapping agent including at least one kind of atom selected from the group consisting of Zr, Mg, and Al.

IPC Classes  ?

• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 21/52 - Mounting semiconductor bodies in containers

Abstract

Provided are: an epoxy resin composition that yields a cured product that can prevent warping of a board and peeling from a chip; a cured product using the same; and a semiconductor device. The epoxy resin composition contains an epoxy resin, a filler, and at least one selected from a curing agent and a curing catalyst. The epoxy resin contains a flexible epoxy resin, and the content of flexible epoxy resin is from 8.0 mass% to 25.0 mass% relative to the epoxy resin.

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides: a resin composition which has a low viscosity and enables the achievement of a cured product that has a high Tg; an adhesive and a sealing material, each of which comprises this resin composition; a die attachment material; a cured product; and an electronic device.　This resin composition is characterized by containing (A) a pentaerythritol tetraglycidyl ether and (B) an epoxy resin other than the component (A), and is also characterized in that the amount of the component (A) is less than 30% by mass in 100% by mass of organic matters that include the component (A) and the component (B).　

IPC Classes  ?

• C08G 59/04 - Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof

Abstract

The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.

IPC Classes  ?

• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
• C23C 18/38 - Coating with copper
• C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
• C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
• C25D 5/02 - Electroplating of selected surface areas
• C25D 7/12 - Semiconductors
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• G03F 7/16 - Coating processesApparatus therefor
• G03F 7/26 - Processing photosensitive materialsApparatus therefor
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

The present invention addresses the problem of providing an insulative resin composition suitable for aerosol-jet printing technologies.　Provided is an insulative resin composition which contains (A) inorganic particles having a mean particle diameter (D50) of 0.02-0.5 μm, (B) a polyfunctional thermosetting compound, and (C) a curing agent, and which has a viscosity of 400 mPa·s or less as measured using a type-E viscometer at a condition of 25°C and 50 rpm.

IPC Classes  ?

• C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
• B05D 1/02 - Processes for applying liquids or other fluent materials performed by spraying
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
• C09D 11/30 - Inkjet printing inks
• H05K 1/03 - Use of materials for the substrate

Abstract

The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.

IPC Classes  ?

• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
• G01N 23/20058 - Measuring diffraction of electrons, e.g. low energy electron diffraction [LEED] method or reflection high energy electron diffraction [RHEED] method
• G01N 23/20091 - Measuring the energy-dispersion spectrum [EDS] of diffracted radiation
• G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
• H05K 1/05 - Insulated metal substrate
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

122 each independently represent an alkyl group having at least 11 carbon atoms.

IPC Classes  ?

• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08F 4/34 - Per-compounds with one peroxy-radical
• C08F 290/06 - Polymers provided for in subclass
• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 4/02 - Acrylmonomers
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

Provided is a highly efficient crystalline silicon solar cell which has a high open-circuit voltage (Voc) and fill factor (FF). A solar cell comprising a crystalline silicon substrate (1) which contains an impurity diffusion layer, a passivation film (2) positioned on at least the impurity diffusion layer of the substrate (1), and an electrode (20) which contains silver (Ag) and is positioned on at least part of the passivation film (2), wherein: one or more AgSi regions (30) are further included in the solar cell and positioned in at least part of the interval between the electrode (20) and the substrate (1); the AgSi regions (30) include one or more AgSi regions (30) which have a depth of at least 100nm; and the residual rate of the passivation film (2), which is the proportion of the residual length of the passivation film (2) in a scanning electron micrograph of a cross-section which is 5.7µm×3.9µm and includes the AgSi regions (30) of the solar cell, is 10-90%.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The present invention provides an electrically conductive paste which is suitable for the formation of an electrode by a laser process for the production of a crystalline silicon solar cell.　This electrically conductive paste is used for the purpose of forming an electrode on a passivation film which is disposed on the surface of a p-type semiconductor layer that is disposed on the surface of an n-type semiconductor substrate; and this electrically conductive paste contains (A) silver particles, (B) an organic vehicle and (C) glass frit. This electrically conductive paste additionally contains 0.5 part by weight or less of (D) aluminum particles relative to 100 parts by weight of the (A) silver particles; or alternatively, this electrically conductive paste does not contain the (D) aluminum particles.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The present invention further suppresses the occurrence of recess defects which are formed in a polished surface when a surface of a cured product of an epoxy resin composition is polished. Provided is an epoxy resin composition comprising (A) an epoxy resin, B) at least one component selected from the group consisting of curing agents and curing accelerators, and (C) a filler, wherein the average presence density of recesses which have a diameter of not less than 0.5 μm and which are observed in a polished surface of a cured product of the epoxy resin composition is not more than 1.00/mm2. Also provided are an electronic component mounting structure using the epoxy resin composition, and a method for producing the electronic component mounting structure.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 7/22 - Expanded, porous or hollow particles
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive.　Provided is a resin composition comprising: (A) a polyfunctional epoxy compound having an epoxy equivalent of less than 215 g/eq; (B) a polyfunctional epoxy compound having an epoxy equivalent of at least 215 g/eq; (C) a polyfunctional thiol compound; (D) a curing catalyst; and (E) a monofunctional compound having one group (e), which includes an unsaturated double bond and an electron-withdrawing group adjacent thereto, in a molecule.

IPC Classes  ?

• C08G 59/66 - Mercaptans
• C09J 4/02 - Acrylmonomers
• C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

The object of the present invention is to provide a resin composition and an adhesive that cure under a low temperature condition, provide a cured product with an excellent stress relaxation property, and have a low self-exothermic temperature during a curing reaction. The present invention provides a resin composition comprising (A) a polyfunctional epoxy compound, (B) a polyfunctional thiol compound, (C) a monofunctional compound having one group (c) containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule, and (D) a curing catalyst.

IPC Classes  ?

• C08G 59/06 - Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

The object of the present invention is to provide a resin composition and an adhesive that can reduce odor derived from thiol curing agents and provide a cured product with reduced odor. The present invention provides a resin composition comprising (A) a thiol curing agent having two or more thiol groups, (B) a main agent having two or more groups (b) each of which is reactive with a thiol group, (C) an odor masking agent having one group (c) reactive with a thiol group, and (D) a heat latent curing catalyst, wherein the amount of the (A) thiol curing agent is 10 to 60% by weight of the total weight of the resin composition, and the component (C) is a monofunctional compound having one group containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08G 59/66 - Mercaptans
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds

Abstract

To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device.　The epoxy resin composition contains a polyalkylene glycol epoxy resin, a heterocyclic compound including a nitrogen atom, and a filler. The content of the filler is 55 mass% or more and less than 77 mass% with respect to the total amount of the epoxy resin composition.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/22 - Di-epoxy compounds
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/3445 - Five-membered rings
• C08K 5/3492 - Triazines
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device.　This epoxy resin composition contains a polytetramethylene glycol-type epoxy resin, a heterocyclic compound that contains a nitrogen atom, and a filler; the filler is surface-treated with at least one of 3-methacryloxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane; and the content of the filler is not less than 55% by mass but less than 77% by mass relative to the total mass of this epoxy resin composition.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/22 - Di-epoxy compounds
• C08K 5/34 - Heterocyclic compounds having nitrogen in the ring
• C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The problem addressd by this invention is to provide a conductive composition that can be sintered at low temperature and has low resistance, the composition forming a conductive film having excellent flexibility and bend resistance.　Provided is a conductive composition comprising (A) surface-modified silver nanoparticles in which the surface is coated with a lower carboxylic acid, (B) a binder resin, and (C) an organic solvent, wherein the lower carboxylic acid of (A) the surface-modified silver nanoparticles present in the conductive composition starts desorption from the silver nanoparticles at 40 to 130 °C.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
• B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
• B22F 1/102 - Metallic powder coated with organic material
• B22F 9/00 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor
• C08K 9/04 - Ingredients treated with organic substances
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form

Abstract

The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device.　That is, provided is a resin composition containing a polyfunctional epoxy resin, a monofunctional epoxy resin, and a latent curing agent. The polyfunctional epoxy resin contains a polyfunctional epoxy resin having an epoxy equivalent weight of 400 g/eq. or greater, and the resin composition satisfies the following conditions. Conditions: Given X as the content of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater / the epoxy equivalent weight of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater, Y as the content of the monofunctional epoxy resin / the epoxy equivalent weight of the monofunctional epoxy resin, and Z as the content of all polyfunctional epoxy resin / the epoxy equivalent weight of all polyfunctional epoxy resin, X/Z is 0.3 to 1.0 and Y/Z is 0.35 to 1.20.

IPC Classes  ?

• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• G02B 1/16 - Optical coatings produced by application to, or surface treatment of, optical elements having an anti-static effect, e.g. electrically conducting coatings
• C08K 3/08 - Metals

Abstract

The present invention provides: a resin composition which is curable at a relatively low temperature and which has a long pot life; a cured product; and a semiconductor device and an electronic component which include the cured product.　Provided are: a resin composition comprising (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor that can be sublimated, said resin composition further comprising (D) conductive particles as necessary; a cured product obtained by curing the resin composition; and a semiconductor device and an electronic component which comprise the cured product.　

IPC Classes  ?

• C08L 101/02 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups
• C08F 20/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• C08F 290/06 - Polymers provided for in subclass
• C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
• C08K 5/08 - Quinones
• C08K 5/14 - Peroxides
• C08K 5/3415 - Five-membered rings
• H01L 21/52 - Mounting semiconductor bodies in containers
• C09J 4/02 - Acrylmonomers
• C09J 9/02 - Electrically-conducting adhesives

Abstract

Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an end and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.

IPC Classes  ?

• C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 71/12 - Polyphenylene oxides
• C09J 7/35 - Heat-activated
• C09J 153/02 - Vinyl aromatic monomers and conjugated dienes
• C09J 171/12 - Polyphenylene oxides
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

This conductive paste contains (A) conductive particles and (B) a binder resin. The (A) conductive particles include surface-treated metal particles. The surface-treated metal particles each contain a metal particle and a surface-treated layer disposed on at least a portion of the surface of the metal particle. The conductive paste has high sulfidization resistance, and an electrode can be formed therefrom at relatively low cost.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 5/00 - Non-insulated conductors or conductive bodies characterised by their form

Abstract

An electroconductive paste comprising (A) electroconductive particles and (B) a binder resin, wherein the electroconductive particles (A) include surface-treated metal particles, the surface-treated metal particles comprising metal particles and a surface treatment layer disposed on at least some of the surfaces of the metal particles, the surface treatment layer including a zinc compound. The electroconductive paste has high sulfurization resistance and can form relatively inexpensive electrodes.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

Provided is a conductive paste comprising conductive particles (A) and a binder resin (B), wherein the conductive particles (A) have metal particles and a surface treatment layer containing a palladium compound, the surface treatment layer being placed on at least a part of the surface of the metal particles. This conductive paste contains the conductive particles (A) in an amount of 80 parts by weight or more with respect to 100 parts by weight of the conductive paste. The conductive paste exhibits high sulfidation resistance, and can achieve excellent printing characteristics even with an increased content of conductive particles.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

Provided is a conductive paste comprising conductive particles (A), binder resin (B), and glass frits (C), wherein the conductive particles (A) have metal particles and a surface treatment layer containing a palladium compound, the surface treatment layer being placed on at least a part of the surface of the metal particles. The softening point of the glass frits (C) is 800 °C or below. Even when containing glass frits with a low softening point, this conductive paste can suppress outflow of glass components from an electrode during firing, and exhibits excellent sulfidation resistance.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

An alumina composite sol composition includes (A) an alumina sol containing an alumina hydrate, (B) an alkoxysilane compound, (C) a polyvalent organic acid, and (D) a solvent, wherein the amount of the alumina hydrate in the alumina sol (A) is 3 to 11% by mass.

IPC Classes  ?

• C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
• C09D 5/02 - Emulsion paints
• C09D 7/20 - Diluents or solvents
• C09D 7/62 - Additives non-macromolecular inorganic modified by treatment with other compounds

Abstract

Provided is a resin composition exhibiting excellent high frequency characteristics and heat resistance reliability. The resin composition comprises: (A) a polyphenylene ether resin that has, at a terminal end, a functional group including a carbon-carbon double bond; and (B) a compound that is a liquid at 25°C and has an isocyanuric ring structure and two allyl groups per molecule. (Provided that R1 in formula (1) is a hydrogen atom or an alkyl group.)

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided is a conductive composition capable of achieving excellent die shear strength by sintering silver particles together even by heat treatment at a low temperature or for a short period of time regardless of whether pressure is applied or not. The conductive composition contains silver particles (A) having an average particle size of 0.05 to 5 μm, a solvent (B), and a thermosetting resin (C). Easily saponifiable chlorine concentration of the thermosetting resin (C) is 3,000 to 12,000 ppm. The conductive composition contains 0.1 to 1.5 parts by mass of the thermosetting resin (C) based on 100 parts by mass of the silver particles (A).

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• B22F 1/10 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material
• B22F 1/054 - Nanosized particles
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C

Abstract

ITIT found from a load-displacement curve obtained by means of a nanoindentation test of procedures described in the specification is 10-20 GPa.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C08K 3/08 - Metals
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09D 5/24 - Electrically-conducting paints
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

Provided is an electroconductive paste capable of forming, in an electric circuit, an electric wiring line that is less likely to break even when the electric circuit and/or the electric wiring line is elongated and/or flexed.　This flexible electric circuit-forming electroconductive paste is for forming an electric circuit on the surface of a flexible substrate, and comprises (A) electroconductive particles, (B) a thermoplastic resin, and (C) a solvent. When the temperature Tm (°C) for measuring the storage modulus of the electroconductive paste is set to Tm=178°C, the storage modulus of a cured product obtained by curing the electroconductive paste at 120°C for 30 minutes is 0.001-0.5 GPa at said temperature Tm.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01B 5/14 - Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

A base-releasing composition which suppresses release of a basic compound at room temperature and rapidly releases the basic compound under predetermined conditions. The base-releasing composition includes (A) a side-chain crystalline (meth)acrylate copolymer includes (i) repeating units each derived from an ester of a C8-C32 saturated, linear primary alcohol with acrylic acid or methacrylic acid and (ii) repeating units each derived from acrylic acid or methacrylic acid, and (B) a basic compound. The amount of basic groups in the (B) basic compound is 0.01 to 1.00 mmol per 1 g of the base-releasing composition, and at least a portion of the Component (B) is included in the Component (A). A curable resin composition includes a specific 2-methylene-1,3-dicarbonyl compound in combination with the base-releasing composition.

IPC Classes  ?

• C09J 11/06 - Non-macromolecular additives organic
• C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
• C08K 5/07 - AldehydesKetones
• C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids

Abstract

GFGFGF of the glass frit (C) and the contained amount G of the glass frit (C), where the unit of the contained amount G of the glass frit (C) is expressed as parts by weight in the electrically conductive paste with respect to 100 parts by weight of the electrically conductive particles (A) contained in the electrically conductive paste, is in the range of 0.25-1.45.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/068 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

The present invention addresses the problem of providing a resin composition and an adhesive which are curable at least thermally and can be inhibited from suffering bleeding.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) zeolite particles.

IPC Classes  ?

• C08G 75/02 - Polythioethers
• C08L 81/02 - PolythioethersPolythioether-ethers
• C09J 4/02 - Acrylmonomers
• C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 11/08 - Macromolecular additives
• C09J 181/02 - PolythioethersPolythioether-ethers
• H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Abstract

The present invention addresses the problem of providing: a resin composition which has at least thermosetting properties and with which the bleeding phenomenon can be suppressed; and an adhesive agent.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) a surfactant having at least two hydrophilic groups per molecule, the hydrophilic groups being selected from hydroxyl groups and carbonyl groups.

IPC Classes  ?

• C08G 75/02 - Polythioethers
• C08L 81/02 - PolythioethersPolythioether-ethers
• C09J 4/02 - Acrylmonomers
• C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
• C09J 11/06 - Non-macromolecular additives organic
• C09J 181/02 - PolythioethersPolythioether-ethers
• H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Abstract

An object of the present invention is to provide at least a thermosetting resin composition and an adhesive that can suppress the bleeding phenomenon.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polythiol compound, (C) a curing catalyst, and (D) a rubber component.

IPC Classes  ?

• C08G 75/02 - Polythioethers
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 21/00 - Compositions of unspecified rubbers
• C08L 33/04 - Homopolymers or copolymers of esters
• C09J 4/02 - Acrylmonomers
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 133/04 - Homopolymers or copolymers of esters
• C09J 181/02 - PolythioethersPolythioether-ethers
• H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container

Abstract

The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding.　Provided is a resin composition comprising (A) an epoxy compound, (B) a polythiol compound, (C) a cyclic carbodiimide compound, and (D) a curing catalyst.

IPC Classes  ?

• C08G 59/66 - Mercaptans
• C08K 5/34 - Heterocyclic compounds having nitrogen in the ring
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

thth for the fatigue crack propagation lower limit of 0.55 MPa∙m0.5 or greater.

IPC Classes  ?

• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The purpose of the present invention is to provide a curable resin composition that cures rapidly and can reduce the occurrence of bleed.　That is, this curable resin composition comprises an epoxy resin, a latent curing agent, and an imidazole derivative having a melting point of not more than 180°C.

IPC Classes  ?

• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

The present invention addresses the problem of providing a resin composition and an adhesive with which a cured material, in which unreacted residues are suppressed after thermal curing following UV curing, can be obtained.　Provided is a resin composition comprising (A) a (meth)acrylate compound, (B) a polyfunctional thiol compound, (C) a photoradical polymerization initiator, and (D) a thermal curing accelerator containing an azabicyclo ring compound having bridgehead nitrogen.

IPC Classes  ?

• C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
• C08G 59/50 - Amines
• C09J 4/02 - Acrylmonomers
• C09J 11/06 - Non-macromolecular additives organic

Abstract

A conductive paste that can reduce an increase in electrical resistance caused by stretching of a wiring when the wiring of an electrical circuit and/or an electronic circuit is formed on a surface of a stretchable and/or bendable base material. The stretchable conductive paste includes (A) surface-treated silver particles and (B) a thermoplastic resin. The (A) surface-treated silver particles include a surface-treated layer.

IPC Classes  ?

• C09D 11/52 - Electrically conductive inks
• C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
• C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The purpose of the present invention is to provide a resin composition containing a 2-methylene-1,3-dicarbonyl compound and having improved workability.　The resin composition contains: (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) and having a molecular weight of 230 to 1000; and (B) fumed silica having an average primary particle diameter of 1 to 50 nm and a specific surface area of 50 m2/g to 250 m2/g.

IPC Classes  ?

• C08L 35/02 - Homopolymers or copolymers of esters
• C08F 22/14 - Esters having no free carboxylic acid groups
• C08K 3/36 - Silica
• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 135/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofAdhesives based on derivatives of such polymers
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers

Abstract

One purpose of the present invention is to provide a liquid polymerizable composition that can impart a suitable viscosity to a 2-methylene-1,3-dicarbonyl compound without impairing curability.　A polymerizable composition according to the present invention includes (a) a 2-methylene-1,3-dicarbonyl compound, and (b) a specific (meth)acrylate polymer.

IPC Classes  ?

• C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
• C08K 5/04 - Oxygen-containing compounds
• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a conductive composition for forming an electrode, which has a low specific resistance, at low temperatures.　The present invention provides a conducive composition which contains (A) conductive particles, (B) a solvent and (C) an epoxy resin, wherein: the concentration of easily saponifiable chlorine of the epoxy resin (C) is 1,600 ppm or more; and the amount of the epoxy resin (C) is 1.2 to 10 parts by weight relative to 100 parts by weight of the conductive particles (A).

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01L 31/0224 - Electrodes
• H10K 30/50 - Photovoltaic [PV] devices

Abstract

The purpose of the present invention is to provide a novel metal member. According to the present invention, provided is a metal member containing a first metal wherein N and Si are detected by elemental analysis of the surface of the metal member by X-ray Photoelectron Spectroscopy (XPS), the value of the ratio (N/Si) of the number of the N atoms to that of the Si atoms is 0.04-0.8, and the color difference ΔE*ab before and after an alkali metal elution test on the surface is 15 or less.

IPC Classes  ?

• C23C 26/00 - Coating not provided for in groups
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
• C25D 5/48 - After-treatment of electroplated surfaces

Abstract

The purpose of the present invention is to provide a novel composite copper member and a power module which includes the composite copper member. The composite copper member includes a copper member and a nickel layer which is formed on at least a partial surface of the copper member. The surface including the nickel layer has convex parts, wherein in a cross-sectional image of the composite copper member photographed using a scanning electron microscope, convex parts having a length of 50 nm to 1500 nm as measured in a direction parallel to the surface including the nickel layer are present in the quantity of 5 or more per 3.8 µm, and the nickel layer has a predetermined amount or a predetermined thickness of nickel. The power module includes the composite copper member and an insulating material which is bonded to the composite copper member at the surface including the nickel layer.

IPC Classes  ?

• C25D 7/12 - Semiconductors
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties

Abstract

There are provided a photosensitive resin composition, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product. This photosensitive resin composition is cured by irradiation with active energy rays, instead of by heat treatment at high temperatures. In this photosensitive resin composition, film loss after a development process is restrained. Furthermore, a miniaturized pattern can be accurately formed by photolithography. An aspect of the present invention is a photosensitive resin composition including components (A) to (C): (A) a modified polyphenylene ether represented by formula (1) and formula (2), (B) a silsesquioxane compound represented by formula (3), and (C) a photopolymerization initiator, a cured product thereof, and a wiring structure body, an electronic component, a semiconductor device, and a camera module each including the cured product.

IPC Classes  ?

• G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• C08K 5/3417 - Five-membered rings condensed with carbocyclic rings
• C08L 83/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
• G03F 7/075 - Silicon-containing compounds
• C08F 290/06 - Polymers provided for in subclass

Abstract

An object of the present invention is to provide an epoxy amine adduct, a curing catalyst, a resin composition, a sealing material, an adhesive agent, and a cured product, which have good characteristics. There is prepared an epoxy amine adduct in which a value of (melting onset temperature at a temperature increasing rate of 50° C./min)/(melting onset temperature at a temperature increasing rate of 10° C./min) in differential scanning calorimetry (DSC) is 1.00 or more and 1.10 or less. There are prepared a curing catalyst for epoxy resin containing the epoxy amine adduct, a resin composition containing the curing catalyst, a sealing material or an adhesive agent each containing the resin composition, and a cured product obtained by curing the resin composition.

IPC Classes  ?

• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08G 59/50 - Amines
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used

Abstract

A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

IPC Classes  ?

• C08G 59/02 - Polycondensates containing more than one epoxy group per molecule
• C08G 59/14 - Polycondensates modified by chemical after-treatment
• C08K 3/36 - Silica
• B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor

Abstract

[Problem] To provide an epoxy resin composition that has excellent injection properties and thermal conductivity for a cured product and can be used to produce a semiconductor device that has high operation reliability. [Solution] An epoxy resin composition that includes an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D). The epoxy resin composition is characterized by: the filler (D) including an aluminum nitride filler (D-1); the average particle size of the aluminum nitride filler (D-1) being no more than 10.0 μm; the uranium content in the aluminum nitride filler (D-1) being no more than 20 ppb; and the blending ratio of the aluminum nitride filler (D-1) to the total amount of filler (D) is at least 70% by mass.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08K 3/28 - Nitrogen-containing compounds
• C08K 3/36 - Silica
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

The present invention provides a curable resin composition that yields a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by curing the curable resin composition or the sealing material. The present invention further provides a camera module that includes the cured product.

IPC Classes  ?

• C08G 59/62 - Alcohols or phenols
• C08G 59/56 - Amines together with other curing agents
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses