Provided is a resin composition excellent in high frequency characteristics and heat resistance reliability. The resin composition includes: (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at a terminal; and (B) a compound having an isocyanuric ring structure and two allyl groups in one molecule and being liquid at 25° C. (in the formula (1), R1 represents a hydrogen atom or an alkyl group).
C08L 51/08 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
C08F 283/08 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
A resin composition contains (A) a thermosetting resin having at least one of a vinylbenzyl group and a maleimide group; and (B) a compound having a butadiene skeleton having a 1,2 vinyl group. The component (B) has a number average molecular weight of 1,000 to 10,000. The resin composition may have a minimum melt viscosity of less than 40,000 Pa·s.
The present invention addresses the problem of providing: a resin composition which can be cured at a low temperature (for example, 100°C or lower) and gives a cured product that has excellent adhesive strength with respect to an engineering plastic by thermal curing at low temperatures; an adhesive agent or a sealing material which contains the resin composition; a cured product of the resin composition; and a semiconductor device and an electronic component, each of which contains the cured product. Provided are: a resin composition which contains (A) an oxetane compound, (B) an alicyclic epoxy compound, (C) an epoxy compound other than the alicyclic epoxy compound, and (D) a thermal polymerization initiator; an adhesive agent or a sealing material which contains the resin composition; a cured product of the resin composition; and a semiconductor device and an electronic component, each of which contains the cured product. In a DSC chart obtained by differential scanning calorimetry of the resin composition, the temperature of the onset of the exothermic peak is in the range of 70-90°C, and the maximum value of the slope from the onset to the peak top of the exothermic peak is in the range of 0.23-0.90 mW/mg∙°C.
The present invention addresses the problem of providing: a resin composition which can be cured at a low temperature (for example, 100°C or lower) and which, by being subjected to low-temperature thermal curing, results in a cured product that is excellent in adhesive strength to an engineering plastic; an adhesive agent or sealing material containing said resin composition; a cured product of said resin composition; and a semiconductor device and electronic component containing said cured product. Provided are: a resin composition containing (A) an oxetane compound, (B) an alicyclic epoxy compound, (C) an epoxy compound having a polyalkylene oxide chain, an aliphatic moiety derived from an alicyclic diol, an aliphatic moiety derived from hydrogenated bisphenol A, or a combination thereof, and (D) a thermal acid generator containing tetrakis(pentafluorophenyl)borate or tetrakis(pentafluorophenyl)gallate as anionic species; an adhesive agent or sealing material containing said resin composition; a cured product of said resin composition; and a semiconductor device and electronic component containing said cured product.
Provided is a composition which gives a cured product that has excellent delamination resistance. Also provided are: an adhesive which gives a cured product that has excellent delamination resistance; a cured product which has excellent delamination resistance; and an optical fiber array which is provided with the cured product. This composition contains a compound (A) that has a reactive functional group, and a polymerization initiator (B). The composition contains, as the polymerization initiator (B), a photoacid generator (B1) in which an anionic species is at least one selected from the group consisting of a phosphate, an antimonate, a gallate, and a sulfonate. A cured product of the composition has a glass transition temperature (Tg) of 0°C or lower.
C08L 101/00 - Compositions of unspecified macromolecular compounds
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
Provided is a resin composition that can be cured at a low temperature and in a short time, and exhibits excellent adhesive strength. This resin composition includes (A) a (meth)acrylate compound, (B) a polyfunctional thiol compound, and (C) a curing catalyst system that includes at least one type of latent curing catalyst, wherein the component (C) has the following characteristic (1). Characteristic (1): In a DSC chart from when a mixed solution resulting from mixing 1.0 g of the component (C) and 9.0 g of 1,3,4,6-tetrakis(3-mercaptopropyl)glycoluril is subjected to differential scanning calorimetry, the temperature of the endothermic peak top is 50-70°C, and the slope of the line segment connecting the onset of the endothermic peak and the peak top is –0.0007 mW/mg∙°C or less.
To provide an epoxy resin composition capable of suppressing small pores generated when a surface of a cured product is polished, an electronic component using the epoxy resin composition, a semiconductor device using the epoxy resin composition, and a method for manufacturing the semiconductor device. The epoxy resin composition includes an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer, and the solid elastomer has a structure having no double bond in the main chain.
Provided are a semiconductor device including an interlayer insulating film having a large tensile elongation and a resin composition. A semiconductor device including a semiconductor chip, an encapsulation material for covering the semiconductor chip, and a rewiring layer including a wiring for electrically connecting the semiconductor chip and an external terminal, and an interlayer insulating film for covering a portion around the wiring, in which the rewiring layer has an area larger than that of the semiconductor chip in a plan view, and in which the interlayer insulating film has a tensile elongation of 15% or more at 25° C.
The present invention addresses the problem of providing: a curable functional paste having excellent depth curability in a curing method using light irradiation; an adhesive, a sealing material, or a coating agent which contains the same; a cured product of the same; a semiconductor device or an electronic component which includes said cured product; and a curing method, an adhering method, a sealing method, and a coating method which use said curable functional paste. Provided are: a curable functional paste comprising (A) a polymerizable compound, (B) a photopolymerization initiator, (C) a photosensitizer, and (D) a luminous body, wherein the (C) photosensitizer is present in the curable functional paste so as to absorb light having a wavelength of greater than 500 nm, cause triplet-triplet energy transfer to the (D) luminous body, and induce decomposition by means of light having a wavelength of greater than 500 nm; an adhesive, a sealing material, or a coating agent which contains the same; a cured product of the same; a semiconductor device or an electronic component which includes said cured product; and a curing method, an adhering method, a sealing method, and a coating method which use said curable functional paste.
The present invention addresses the problem of providing: a curable function-expressing paste that excels in deep portion curability in a method for curing by irradiating with light; an adhesive, sealing material, or coating agent containing this curable function-expressing paste; a cured product of this curable function-expressing paste; a semiconductor device or electronic component containing this cured product; and a curing method, an adhering method, a sealing method, and a coating method in which this curable function-expressing paste is used. Provided is a curable function-expressing paste comprising a polymerizable compound (A), a polymerization initiator (B), a photosensitizer (C), and a light emitter (D). The polymerization initiator (B) contains at least a photoacid generator (B1) that can be directly activated by light having a wavelength of 500 nm or less, a thermal acid generator (B2) that can be indirectly activated by light having a wavelength of 500 nm or less in a state of being present in the curable function-expressing paste, or a combination thereof. Also provided are: an adhesive, a sealing material, or a coating agent containing this curable function-expressing paste; a cured product of this curable function-expressing paste; a semiconductor device or electronic component containing this cured product; and a curing method, an adhering method, a sealing method, and a coating method in which this curable function-expressing paste is used.
The present invention addresses the problem of providing: a curing function expressing paste for curing which uses a triplet-triplet annihilation photon upconversion mechanism and a method for using the same, wherein the curing function expressing paste is capable of achieving a good degree of curing by prolonging the triplet-triplet annihilation photon upconversion emission duration; an adhesive, a sealing material, or a coating agent containing the same; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, a bonding method, a sealing method, and a coating method using the curing function expressing paste. Provided is a curing function expressing paste containing (A) a polymerizable compound, (B) a photopolymerization initiator, (C) a photosensitizer, and (D) a light emitter, wherein the polymerizable compound (A) contains at least a polymerizable compound having a functional group equivalent of 105 or more, the photosensitizer (C) is a compound capable of absorbing light having a wavelength of more than 500 nm and causing triplet-triplet energy transfer to the light emitter (D), and the light emitter (D) can exhibit photon upconversion emission having a wavelength of 500 nm or less. Further provided are: an adhesive, a sealing material, or a coating agent containing the same; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, a bonding method, a sealing method, and a coating method using the curing function expressing paste.
C09D 201/06 - Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
An insulating resin composition includes: (A) inorganic particles with an average particle size (D50) of 0.02 to 0.5 μm, (B) a polyfunctional thermo-curable compound, and (C) a curing agent, wherein the insulating resin composition has a viscosity of 400 mPa-s or less as measured with an E-type viscometer at 25° C. and 50 rpm.
C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
Provided is an epoxy resin composition which has excellent temporary adhesiveness and can inhibit the substrate from warping during final hardening. The epoxy resin composition comprises an epoxy resin (A), a hardener (B), a latent hardening catalyst (C), and an inorganic filler (D), wherein the molar ratio of reactive groups contained in the hardener (B) to epoxy groups contained in the epoxy resin (A) is 0.35-0.85 and the proportions of the latent hardening catalyst (C) and the inorganic filler (D) are 10-16 mass% and 35-67 mass%, respectively, with respect to the resin component (100 mass%) of the composition.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08G 59/56 - Amines together with other curing agents
Provided is a conductive paste in which voids, cracks, and the like are less likely to occur. This conductive paste contains metal particles and a solvent. The metal particles contain first nanoparticles having an average particle diameter of 80-500 nm. When thermogravimetric analysis is performed in a nitrogen atmosphere at a temperature warming speed of 10°C/minute from 25°C or lower, items [1] and [2] are satisfied. [1] The residual weight ratio at 120°C is 98% or more [2] The weight reduction ratio Δ 120°C-160°C from 120°C to 160°C is 2.0-5.0%
H01L 21/52 - Mounting semiconductor bodies in containers
H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
15.
EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition which hardly causes warpage of a wafer after being molded. This epoxy resin composition contains an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C). As the epoxy resin (A), an epoxy resin (A1) having a glycidyl ether group, and a polyethylene glycol group and/or a polypropylene glycol group is included.
Provided is an epoxy resin composition having good adhesion. Also provided are a cured product formed from the epoxy resin composition, a semiconductor device comprising the cured product, and a method for producing the semiconductor device. The epoxy resin composition includes an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The content of a naphthalene-type epoxy resin with respect to the epoxy resin (A) (100 mass%) is 51 mass% or more, and the content of the inorganic filler (C) is 40-90 mass%.
The present invention provides excellent visibility of a printed part formed by laser marking. This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a coloring material, wherein the absorbance measured under the following absorbance measurement conditions using a photometer is 3.5 or more. (Absorbance measurement conditions) Measurement sample: a cured product obtained by curing the liquid compression molding material through a heat treatment at 150°C for 60 minutes. Thickness of measurement sample: 260 μm Measurement wavelength: 1064 nm
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
The present invention addresses the problem of providing: a curable resin composition capable of reducing misalignment and separation of a cured product from an adherend; an adhesive or sealing material containing same; a cured product thereof; and a semiconductor device and an electronic component containing said cured product. Provided are: a curable resin composition which contains (A) a (meth)acrylate compound, (B) a polythiol compound, and (C) a photo-radical polymerization initiator that generates a methyl radical or a phenyl radical as an active species, and in which the content of component (C) is 0.01-10 mass% relative to the total mass of the curable resin composition, the curable resin composition may contain (D) a thermal polymerization initiator, and the content of the thermal polymerization initiator (D) is 0-10 mass% relative to the total mass of the curable resin composition; an adhesive or sealing material containing same; a cured product thereof; and a semiconductor device and an electronic component containing said cured product.
A material includes sulfur, and a quantum dot component. The quantum dot component is at least one component selected from the group consisting of: a quantum dot-nanotube composite, a quantum dot-graphene composite, carbon quantum dots consisting essentially of carbon, and hybrid quantum dots comprising carbon and at least one metal oxide. Another material includes sulfur, a carbon quantum dot composite material and an electrically conductive component. The carbon quantum dot composite material includes a carbon source, carbon nanotubes and at least one metal and/or metalloid selected from the group consisting of tungsten, molybdenum, ruthenium, niobium, tantalum, germanium, iron, silver, manganese, titanium, tin, antimony, bismuth, gold, silicon, nickel, cobalt, chromium, zirconium, and vanadium; or oxide thereof; and combinations thereof. The material may be used in a lithium-sulfur battery. This may overcome or partially overcome the shuttle effect.
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
Provided is a resin composition capable of suppressing bleeding on a ceramic substrate during thermal curing. This resin composition comprises: (A) an epoxy resin; (B) a curing agent; and (C) a rheology controlling agent, the component (C) satisfying the feature (1). Feature (1): When 1 μL of a composition containing 99 g of a bisphenol F epoxy resin and 1 g of the component (C) is formed at the tip of a Cathelin needle at room temperature, and the contact angle θ1 measured 6 seconds after droplet deposition on a ceramic substrate is taken as 100%, the contact angle θ3 measured 5 minutes after the droplet deposition is 88%-100%.
A material may include sulfur and a quantum dot component. The quantum dot component may be a quantum dot-nanotube composite, a quantum dot-graphene composite, carbon quantum dots consisting essentially of carbon, hybrid quantum dots comprising carbon and at least one metal oxide, or any combination. A method of making the material may involve making the quantum dot component by a sol-gel process and combining the quantum dot component with the sulfur. The material may serve as a cathode material for a battery, particularly a lithium-sulfur battery. The lithium-sulfur battery may overcome or partially overcome the shuttle effect.
Provided are a resin composition which cures at low temperatures to give cured objects having low electrical resistance, an adhesive including the resin composition, cured objects, and a semiconductor device and an electronic component which include these cured objects. The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a hardener or a free-radical polymerization initiator, (C) electroconductive particles, and (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides; an adhesive including the resin composition; cured objects; and a semiconductor device and an electronic component which include these cured objects.
C08F 20/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
C08F 22/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the moleculeSalts, anhydrides, esters, amides, imides, or nitriles thereof
C08F 292/00 - Macromolecular compounds obtained by polymerising monomers on to inorganic materials
C08K 9/04 - Ingredients treated with organic substances
C08L 51/10 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to inorganic materials
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
The present invention addresses the problem of providing: a novel substance which is capable of solving the problems of conventional bismaleimides each having a dimer acid skeleton; a high-concentration composition of the substance; a curable composition which contains the composition; an adhesive agent or a sealing material; a cured article obtained by curing the composition or the like; and a semiconductor device or an electronic component which includes the cured article. Provided are: a dimer acid-modified N-substituted (meth)acrylamide; a high-concentration composition of the dimer acid-modified N-substituted (meth)acrylamide; a curable composition which contains the composition; an adhesive agent or a sealing material; a cured article obtained by curing the composition or the like; and a semiconductor device or an electronic component which includes the cured article.
To provide a resin composition capable of forming a cured product having excellent flame retardancy, small relative permittivity and dielectric loss tangent values at 25°C in a high frequency band, and small temperature dependence of the dielectric loss tangent. A resin composition contains a flame retardant containing a cyclic phosphazene compound having an oxaphospholine ring-containing structure represented by formula (A1), and a cured product of the resin composition has a relative permittivity of 3.5 or less at 10 GHz and 25°C, a dielectric loss tangent of 0.003 or less at 10 GHz and 25°C, and a dielectric loss tangent at 120°C which is 30% or less with respect to the dielectric loss tangent at 10 GHz and 25°C. [In formula (A1), n is an integer of 3-8; a and b are each an integer of 0-4; and R1and R2 (i) are either an alkyl group or an alkoxy group, and an aryl group or an aryloxy group or (ii) have a structure formed therebetween by saturated or unsaturated cyclic structures.]
Provided is a resin composition having excellent embeddability with respect to an electronic substrate and the periphery of an electronic element and excellent slittability for a B-stage film. The resin composition contains (A) a thermosetting resin, (B) a compound that has a butadiene skeleton having a 1,2 vinyl group, and (C) a compound that has an isocyanuric ring structure and has one or two double bonds at a molecular terminal. The number average molecular weight of the component (B) is 1,000-10,000. Preferably, the minimum melt viscosity is 500-5,000. Preferably, the component (B) is a compound that has a styrene skeleton.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japan)
NAMICS CORPORATION (Japan)
Inventor
Yanai Nobuhiro
Uji Masanori
Nagata Rieko
Iwaya Kazuki
Saito Nobuo
Otsubo Kodai
Abstract
The present invention addresses the problem of providing a photocurable resin composition for curing using a photon upconversion mechanism and a method for using such a photocurable resin composition, with which it is possible to achieve a favorable cure degree by prolonging a photon upconversion emission lifetime, while also providing an adhesive, sealant, or coating agent including same, a cured product thereof, a semiconductor device or electronic component including said cured product, and a curing method, bonding method, sealing method, and coating method using the photocurable resin composition. Provided is a photocurable resin composition comprising (A) a polymerizable compound and (B) triplet-triplet annihilation photon upconversion particles, and satisfying at least one of: feature (a) in which the polymerizable compound (A) includes a maleimide compound; and feature (b) in which the photocurable resin composition includes (C) a photopolymerization initiator. Also provided are: an adhesive, sealant, or coating agent including said photocurable resin composition; a cured product thereof; a semiconductor device or electronic component including the cured product; and a curing method, bonding method, sealing method, and coating method using the photocurable resin composition.
C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
27.
CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT COMPRISING EXTERNAL ELECTRODE FORMED USING SAME
Provided is a conductive paste having high heat resistance making it possible to withstand heat from solder with a high melting temperature, while also having flexibility making it possible to relax stress even against rapid expansion of a moisture absorbing material. This conductive paste for an external electrode contains (A) conductive particles, (B) epoxy resin, (C) a curing agent, and (D) a bismaleimide compound.
B22F 9/00 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
The present invention addresses the problem of providing: a thiol-based curing agent composition which can be used in a two-part or multi-part thermally curable composition for a semiconductor device or an electronic component; a container in which the thiol-based curing agent composition is accommodated; a thermally curable composition kit; a method for producing a thermally curable composition; a cured product of a thermally curable composition; and a method for transporting and storing a thiol-based curing agent composition. Provided are: a curing agent composition containing (A) a thiol compound having no ester bond, (B) a thermally latent curing catalyst, and (C) water, wherein the content of the water (C) in the curing agent composition is 10-15,000 ppm; a container in which the curing agent composition is accommodated; a thermally curable composition kit; a method for producing a thermally curable composition; a cured product of a thermally curable composition; and a method for transporting and storing a curing agent composition.
A resin composition that can cure at a relatively low temperature and has a long pot life, a cured product, and a semiconductor device and an electronic component including a cured product are provided. The resin composition includes (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor having sublimability. The resin composition further includes (D) electrically conductive particles as necessary.
Provided is a conductive paste that makes it possible to suppress cracking at an external electrode even when a thermal fatigue–resistant solder is used. A conductive paste according to the present invention includes (A) metal particles and (B) a thermosetting resin. When the surface of a cured product obtained by thermally curing the conductive paste for 30 minutes at 180°C is observed using a scanning electron microscope, the area percentage of metal as given by expression (1) is at least 50%. The flexural modulus of a cured product obtained by thermally curing the conductive paste for 30 minutes at 180°C is no more than 6.0 GPa. (1) Area percentage (%) of metal=(area occupied by metal÷measurement area)×100.
Provided is an epoxy resin composition which is less apt to form voids caused by air inclusion. Also provided are a cured object formed from the epoxy resin composition, a semiconductor device including the cured object, and a method for producing the semiconductor device. The epoxy resin composition comprises an epoxy resin (A), a hardener (B), and an inorganic filler (C), wherein the inorganic filler (C) includes an inorganic filler (C1) surface-treated with a silane coupling agent having a C4-C15 hydrocarbon group.
Provided is an epoxy resin composition in which a void is less likely to be generated after molding. Moreover, provided are: a cured product of said epoxy resin composition; a semiconductor device comprising said cured product; and a method for manufacturing said semiconductor device. This epoxy resin composition comprises an epoxy resin (A), a curing accelerator (B), and an inorganic filling material (C), and satisfies expression (V). Expression (V): Viscosity (1)×viscosity (2)≤500 The viscosity (1) is the viscosity (Pa∙s) of the epoxy resin composition at 25ºC. The viscosity (2) is the viscosity (Pa∙s) of the epoxy resin composition at 150ºC.
Provided is an optical component bonding composition which yields a cured product exhibiting excellent yellowing resistance. Also provided are: a cured product having a good appearance due to excellent yellowing resistance; and an optical fiber array comprising the cured product. The optical component bonding composition contains a siloxane compound (A) having a reactive functional group, a polymerization initiator (B), a filler (C), and an antioxidant (D).
An objective of the present invention is to provide a composition having excellent curability. Another objective of the present invention is to provide an optical fiber array in which a cured product of the composition is used. The optical component bonding composition contains a siloxane compound (A) having a reactive functional group, a polymerization initiator (B), a filler (C), and a photosensitizer (D).
The present invention addresses the problem of providing: a photocurable resin composition that is cured only by light irradiation and does not require full curing by heat; an adhesive, a sealant or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, a bonding method, a sealing method, and a coating method using the photocurable resin composition. Provided are: a photocurable resin composition containing (A) a maleimide compound, and (B) a photon upconversion material; an adhesive, a sealant, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, a bonding method, a sealing method, and a coating method using the photocurable resin composition.
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
36.
CURING METHOD FOR PHOTOCURABLE RESIN COMPOSITION, BONDING, SEALING, AND COATING METHOD USING SAME, AND CURED PRODUCT THEREOF
The present invention addresses the problem of providing: a curing method for a photocurable resin composition under atmospheric conditions by using a photon up-conversion mechanism, which achieves both surface curability and curability in deep portions of the photocurable resin composition; a bonding, sealing, and coating method using the curing method; and a cured product thereof. Provided are: a curing method for a photocurable resin composition, the method including a step for simultaneously or sequentially irradiating a photocurable resin composition that contains a polymerizable compound with light having a wavelength of 500 nm or less and light having a wavelength of more than 500 nm, and polymerizing the polymerizable compound using at least a photon up-conversion mechanism under atmospheric conditions; a bonding, sealing, and coating method using the curing method; and a cured product thereof.
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
37.
PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, ADHESION, SEALING, AND COATING METHODS EACH USING PHOTOCURABLE RESIN COMPOSITION
The present invention addresses the problem of providing a photocurable resin composition in which curing is completed without performing a curing treatment using heat and in which emission of volatile organic compounds is suppressed, an adhesive, a sealing material, or a coating agent containing the same, a cured product of the same, a semiconductor device or an electronic component containing said cured product, and a curing method, an adhesion method, a sealing method, and a coating method each using a curable resin composition. Provided is a photocurable resin composition comprising a polymerizable compound (A) and a phosphor (B) that emits light at a wavelength of not more than 500 nm upon X-ray irradiation in a state in which the phosphor is mixed with the polymerizable compound, wherein at least one of the following characteristics (a) and (b) is satisfied: (a) the polymerizable compound (A) includes a maleimide compound; and (b) the photocurable resin composition contains an oxime ester-based photopolymerization initiator (C). Also provided are an adhesive, a sealing material, or a coating agent containing the same, a cured product of the same, a semiconductor device or an electronic component containing said cured product, and a curing method, an adhesion method, a sealing method, and a coating method each using a photocurable resin composition.
C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
38.
EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition which hardly causes warpage of a wafer after molding. Also provided are: a cured product of the epoxy resin composition; a semiconductor device comprising the cured product; and a method for producing the semiconductor device. More specifically, the epoxy resin composition contains: an epoxy resin (A); a compound (B) containing a carbonate group (-O-(C = O)-O-) and/or an ether group (- O -) in the molecule; an inorganic filler (C); and a curing accelerator (D).
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
39.
EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition which hardly causes warpage of a wafer after molding. Also provided are: a cured product of the epoxy resin composition; a semiconductor device comprising the cured product; and a method for producing the semiconductor device. More specifically, the epoxy resin composition contains: an epoxy resin (A); a compound (B) having a polytetramethylene ether structure in the molecule; an inorganic filler (C), and a curing agent (E).
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 69/00 - Compositions of polycarbonatesCompositions of derivatives of polycarbonates
C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
40.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition that is unlikely to undergo delamination. Also provided are a cured product of the epoxy resin composition, a semiconductor device provided with the cured product, and a method for producing the semiconductor device. This epoxy resin composition contains an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C). The epoxy resin (A) contains an aminophenol-type epoxy resin (A1) and a low-shrinkage epoxy resin (A2).
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
41.
ELECTROCONDUCTIVE PASTE AND STRETCHABLE CONDUCTOR BASE MATERIAL
This electroconductive paste contains electroconductive particles in which the tap density measured in accordance with ISO 3953:2011 is 2.5 g／mL or greater and the BET specific surface area is 2.5 m2/g or greater, (B) a thermoplastic resin, and (C) a solvent. Provided are: an electroconductive paste, an electroconductive film or an electroconductive pattern having exceptional low-resistance properties even when continuously caused to expand and contract; a cured article of said electroconductive paste, electroconductive film or electroconductive pattern; and a wearable device containing said electroconductive film or electroconductive pattern.
Provided is a liquid compression molding material which has excellent injectability and forms a cured product containing few aggregates. This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used for at least sealing a gap between an element and a substrate, wherein the initial viscosity at 25ºC is 10-250 Pa∙s, and a cured product obtained by curing the liquid compression molding material under condition (1) satisfies condition (2). (1) The molding temperature is 150ºC, the molding time is 700 seconds, the curing temperature is 180ºC, and the curing time is 60 minutes. (2) When a region of 250 μm×180 μm in length and width on a cross section of the cured product is observed with a scanning electron microscope (magnification: 500 times), the area ratio of aggregates, which have a circle equivalent diameter of at least 1 μm and are present in said region, is at most 1.0%.
The present invention provides a resin composition that has excellent adhesive strength at room temperature and excellent wire bonding properties in a temperature range suitable for Cu wire bonding. This resin composition contains: (A) a phenoxy resin having a glass transition temperature Tg1 of 50°C or less; (B) a curing agent; (C) a filler; and (D) at least one resin selected from the group consisting of a phenoxy resin having a glass transition temperature Tg2 of 100°C or more, a trifunctional or higher epoxy resin, and a naphthalene-type epoxy resin. The resin composition has a glass transition temperature Tg3 of 130°C or more, and the cured product thereof has a modulus of elasticity of 0.5 GPa or more at 200°C.
Provided is an epoxy resin composition having a low viscosity and a short gap filling time. This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) core-shell rubber particles, wherein the shell layer of the core-shell rubber particles (D) contains (meth)acrylic acid and butyl (meth)acrylate as constituent units.
C08L 51/04 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to rubbers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
123412344 represents an aryl group having 6-14 carbon atoms.) and of a counter cation, and also satisfying at least one of the following characteristics (a) and (b); an adhesive agent or a sealing material including the same; a cured product thereof; and a semiconductor device and an electronic component including the cured product. (a) (D) A filler is further included. (b) The content of (A) the epoxy compound is 100-1300 parts by weight with respect to 100 pats by weight of (B) the oxetane compound.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
123412344 represents an aryl group having 6 to 14 carbon atoms) and a counter cation other than an iodonium cation; an adhesive agent or a sealing material which contains the resin composition; a cured product of the resin composition; a semiconductor device which comprises the cured product; and an electronic component.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
The present invention addresses the problem of providing at least a photocurable or thermosetting polymerizable composition and adhesive capable of suppressing a bleeding phenomenon. Provided are a polymerizable composition and an adhesive that contain (A) a cationically polymerizable compound, (B) an acid generator, and (C) a modified polydimethylsiloxane that satisfies at least one of the following features (a), (b), and (c): (a) an organic substituent containing a COOH group is bonded to the polydimethylsiloxane directly or via a linker; (b) an organic substituent containing an OH group and optionally an ether group is bonded to the polydimethylsiloxane directly or via a linker, and when the organic substituent contains an ether group, the ratio of the number of polypropylene glycol repeating units to the number of polyethylene glycol repeating units in the organic substituent is less than 0.3; and (c) the modified polydimethylsiloxane has a specific signal in a 1H NMR spectrum measured in deuterated chloroform and satisfies a specific formula.
The present invention addresses the problem of providing: a curable resin composition which can be applied with a narrow line width (for example, 1,000 μm or less) and a high coating height; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component. Provided are: a curable resin composition which contains (A) a polymerizable compound, (B) a polymerization initiator, (C) an inorganic thixotropy-imparting agent, and (D) a modified polydimethylsiloxane, wherein the content of (C) the inorganic thixotropy-imparting agent is 10-70 parts by mass with respect to 100 parts by mass of the curable resin composition, and the content of (D) the modified polydimethylsiloxane is 0.01-15 parts by mass with respect to 100 parts by mass of (C) the inorganic thixotropy-imparting agent; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component.
The present invention provides a conductive paste capable of forming an electrode having a relatively low specific resistance even when conductive particles having a relatively low silver content are used. Provided is a conductive paste containing (A) conductive particles, (B) an epoxy resin, and (C) a curing agent, wherein the (A) conductive particles include silver-coated copper particles, and in the particle size distribution of the silver-coated copper particles obtained by particle size distribution measurement using a laser diffraction scattering method, when the silver-coated copper particle content is set as 100 vol%, the amount of silver-coated copper particles having a particle diameter of less than 5.0 μm is 50 vol% or less.
R120R120 obtained by measuring solid content in the insulating composition at 120°C and 100 rpm using a rheometer is 28 mPa·s or more. The insulating composition preferably further contains a solvent (D).
Provided is a film for an adhesive layer, which is capable of suppressing breakage of a plating layer that is disposed on the inner surface of a through hole which is formed in a multilayer wiring board. Specifically provided is a film 10A for an adhesive layer, which is used for the production of a multilayer wiring board 100. The multilayer wiring board 100 comprises a fluororesin substrate 20 and the film 10A for an adhesive layer. The film 10A for an adhesive layer has a thickness of 10-35 μm. The film 10A for an adhesive layer has a thermal expansion coefficient in the thickness direction of 110 ppm/°C or less after curing, and satisfies the following relational expression (1). (1): X + Y ≤ 14,000 (In the relational expression (1), X is a value obtained by multiplying the thickness (μm) of the film 10A for an adhesive layer by the thermal expansion coefficient (ppm/°C) in the thickness direction after curing, Y is a value obtained by multiplying the thickness (μm) of the fluororesin substrate 20 by the thermal expansion coefficient (ppm/°C) in the thickness direction, and the thickness of the fluororesin substrate 20 is 50 μm or more.)
The present invention provides: a resin composition that has excellent low gloss properties even when a specific trithiol compound is contained therein; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition. Provided are: a resin composition containing (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), and (C) a thermally latent curing catalyst that is solid at room temperature; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition.
The present invention addresses the problem of providing: a resin composition having favorable storage stability and low-temperature curability even when a specific trithiol compound is contained; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component. Provided are: a resin composition comprising (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), (C) a thermally latent curing catalyst, and (D) an inorganic filler having a specific surface area of at least 4 m2/g; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component.
C08G 75/045 - Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 81/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon onlyCompositions of polysulfonesCompositions of derivatives of such polymers
The present invention provides: a thermosetting insulating film which is capable of achieving excellent insulating properties when used for the production of a multilayer substrate; and a multilayer insulating sheet which uses this thermosetting insulating film. Provided are: a thermosetting insulating film which contains at least a solid epoxy resin as an epoxy resin, wherein the area change rate R expressed by formula (1) is 222% or less; and a multilayer insulating sheet which uses this thermosetting insulating film. Formula (1): R = 100 × Sp/Si (In formula (1), Sp represents the area (cm2) of a square film after being subjected to vacuum pressure pressing under conditions of a pressing temperature of 175°C, a pressing pressure of 2.5 MPa, and a pressing time of 30 minutes, the square film having a thickness of 100 μm and a horizontal and vertical size of 160 mm × 160 mm, and Si represents the area (cm2) of the film before the vacuum heating pressing is performed.)
The present invention addresses the problem of providing a novel latent polymerization initiator which is excellent in terms of storage stability and enables thermal curing of a resin composition at a low temperature. The present invention also addresses the problem of providing a resin composition and an adhesive or a sealing material, which are excellent in terms of storage stability and can be thermally cured at a low temperature. The present invention provides: a thermal latent polymerization initiator in which a thermal radical initiator is supported by inorganic ion exchanger particles; a resin composition which contains (A) a radically polymerizable compound and (B) the thermal latent polymerization initiator; and an adhesive or a sealing material which contains the resin composition.
11) of a shape when an electrode formed using the conductive paste is extended or contracted in one cycle with a length of 115% with respect to the length before the extension of the electrode is 8.0% or less.
C08L 101/00 - Compositions of unspecified macromolecular compounds
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
57.
CONDUCTIVE PASTE, CONDUCTIVE FILM, CERAMIC CIRCUIT SUBSTRATE, AND ELECTRONIC COMPONENT
Provided are: a conductive paste capable of forming a circuit pattern by a screen printing method and forming a conductive film having high adhesion to a ceramic substrate; a conductive film; a ceramic circuit substrate; and an electronic component. The conductive paste includes (A) a conductive powder, (B) a glass frit, and (C) an organic vehicle. The (B) glass frit may be a glass frit in which, when the glass frit is disposed on a ceramic substrate and is melted under the condition of 900°C in a nitrogen atmosphere, the contact angle of the molten glass frit with respect to the ceramic substrate measured in conformance with JIS R3257 is 40 degrees or less.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
58.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
The present invention provides an epoxy resin composition wherein running on the surface of a BSM-treated silicon chip is less likely to occur. This epoxy resin composition contains an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin composition has a surface tension of 30-40 mN/m as measured at 110°C using a plate method.
The present invention addresses the problem of providing at least a thermosetting resin composition and an adhesive agent that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a polymerizable compound having a carbon-carbon double bond, (B) a polythiol compound, (C) a polymerization initiator, and (D) a modified polydimethylsiloxane satisfying at least one of features (a) and (b): (a) an organic substituent group including a COOH group or an OH group is bound to a polydimethylsiloxane directly or via a linker; and (b) an 122O.
The present invention addresses the problem of providing: a curable resin composition that can be rapidly cured at a low temperature (for example, cured at 70°C-80°C within 30 minutes), exhibits high adhesive strength after curing at a low temperature for a short time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product. Provided are: a curable resin composition comprising (A) a radically polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, wherein the content of the (C) polymerization inhibitor in the curable resin composition falls within the range of 0.1-3.0 parts by mass with respect to 100 parts by mass of the radical polymerization initiator (B); a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product.
A copper member, comprising a copper material and a protrusion formed on the surface of the copper material. The protrusion contains copper and/or a copper oxide. When the copper member is measured using a nanoindenter under a prescribed measurement condition, the copper member satisfies at least one of (1) indentation creep (CIT) of 80% or greater, (2) indentation hardness (GPa) of 1 or less, and (3) an indentation elastic modulus (GPa) of 120 or less. The copper member is excellent in adhesion to a resin base material and heat-resistance reliability.
Provided is a liquid compression molding material including an epoxy resin composition containing an epoxy resin (A), a curing accelerator (B), a filler (C), and an elastomer (D), in which blending ratio of the filler (C) to the epoxy resin composition is 73.0 mass % or more, and blending ratio of the elastomer (D) to a total of components excluding the filler (C) from the epoxy resin composition is 7.0 mass % or more.
B29C 43/00 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/36 - Moulds for making articles of definite length, i.e. discrete articles
B29K 21/00 - Use of unspecified rubbers as moulding material
B29K 63/00 - Use of epoxy resins as moulding material
B29K 105/00 - Condition, form or state of moulded material
This invention prevents the occurrence of peeling failure during lamination processing using a multilayer sheet. A multilayer sheet 100 is formed by laminating a first base material film 12, an adhesive film 14, a second base material film 16, and a third base material film 18 in this order, and satisfies the following formula (1). Formula (1): P1 < P2 < P3 [In the formula, P1 represents a peel strength between the first base material film and the adhesive film, P2 represents a peel strength between the adhesive film and the second base material film, and P3 represents a peel strength between the second base material film and the third base material film.]
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
This invention makes it possible to achieve a semiconductor device demonstrating excellent electrical connection reliability despite a narrow pitch between electrodes. There is provided an adhesive film which is used for bonding a semiconductor element with a semiconductor element or bonding a semiconductor element with a circuit board, the film having: a width of 40°C or more and less than 110°C of a temperature range indicative of a melt viscosity of 50000 Pa･s or less in a temperature range of more than 90°C and less than 200°C; and a ratio (V2/V1) exceeding 1.0 of a melt viscosity V2 at 200°C to a minimum melt viscosity V1 in a temperature range of more than 90°C and less than 200°C.
The prevent invention is a conductive paste comprising (A) conductive particles, (B) a thermosetting resin, and (C) rubber particles. The rubber particles (C) include a carbon-carbon bond in the main chain skeleton thereof. Rubber particles having an average particle size less of than 1 μm are included. The present invention makes it possible to provide a conductive paste having improved adhesion to a copper base material.
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.
The present invention provides a resin composition which has a low refractive index and good heat resistance such as good reflow resistance. Disclosed is a resin composition which contains (A1) a cyclic siloxane compound that has a reactive functional group, (A2) a linear siloxane compound that has a reactive functional group, and (B) a polymerization initiator. It is preferable that the cyclic siloxane compound (A1) that has a reactive functional group is an epoxy-modified cyclic siloxane compound that has 2 or 4 epoxy groups. It is also preferable that the linear siloxane compound (A2) that has a reactive functional group has a glycidyl ether structure at both ends.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
Provided is a resin composition for an adhesive, the composition having a low refractive index and a low weight reduction rate after a reflow step is performed. The resin composition for an adhesive comprises: (A) a siloxane compound that has a reactive functional group; and (B) a polymerization initiator. The (B) polymerization initiator contains at least one onium salt selected from the group consisting of onium borate salts and onium gallate salts. The onium salt preferably contains at least one cation selected from the group consisting of iodonium and sulfonium.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
This invention provides a resin composition having low viscosity and high transparency. The resin composition comprises (A) an organic substance, (B) a polymerization initiator, and (C) inorganic particles, wherein the (C) inorganic particles include inorganic particles which have a median diameter (D50) of 0.05-3.0 μm and for which D90/D10 is 1-4, D90/D10 being the ratio of a cumulative volume 90% value (D90) to a cumulative volume 10% value (D10) in particle size distribution. It is preferable that the (C) inorganic particles include silica particles.
OPTICAL FIBER ARRAY, OPTICAL WAVEGUIDE MODULE, METHOD FOR REDUCING REFRACTIVE INDEX OF ADHESIVE LAYER, AND METHOD FOR MANUFACTURING OPTICAL FIBER ARRAY
Provided is an optical fiber array (1) comprising an adhesive layer (20) that exhibits a low refractive index and excellent transparency. This optical fiber array comprises an optical fiber (10) and an adhesive layer (20), wherein the optical fiber (10) is optically coupled to an optical waveguide element (30) by the adhesive layer (20) and the content of the adhesive layer (20) in terms of the element Si is at least 10%. The adhesive layer (20) preferably has a transmittance of at least 90% at a wavelength of 1310 nm. The adhesive layer (20) preferably has a refractive index of not greater than 1.47 at a wavelength of 1310 nm. The adhesive layer (20) preferably contains a cured product of (A) a siloxane compound having a reactive functional group and (B) a polymerization initiator.
G02B 6/30 - Optical coupling means for use between fibre and thin-film device
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
The present invention provides a novel method for manufacturing a hybrid quantum dot, a novel hybrid quantum dot, a novel energy storage device, a novel energy generation device, and a novel paste for forming a varistor. The present invention relates to a method for producing a hybrid quantum dot. The hybrid quantum dot contains elemental carbon and an elemental metal. The method includes: a gelling step in which a composition containing elemental carbon precursor and an elemental metal precursor is gelled to obtain a gelled product; a supercritical drying step in which the gelled product is dried by supercritical drying to obtain an aerogel powder; and a pyrolysis step in which the aerogel powder is pyrolyzed to obtain the hybrid quantum dot.
B82B 3/00 - Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
The present invention addresses the problem of providing: an epoxy resin composition with which it is possible to suppress the discoloration of an object having the composition applied thereto even when the composition contains a specific trithiol compound; an adhesive agent or a sealing material containing the composition; a cured article; and a semiconductor device or an electronic component. Provided are: an epoxy resin composition containing (A) an epoxy resin having a halogen content of 1600 ppm or less, (B) a thiol compound represented by chemical formula (I), and (C) a basic curing catalyst; an adhesive agent or a sealing material containing the epoxy resin composition; a cured article; and a semiconductor device or an electronic component.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
The present invention addresses the problem of providing: an epoxy resin composition which exhibits good low temperature curability even if a specific trithiol compound is contained therein; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition. Provided are: an epoxy resin composition that contains (A) a thiol compound represented by chemical formula (I), (B) a thiol compound having an isocyanuric acid skeleton, (C) an epoxy resin and (D) a latent thermal curing catalyst; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
75.
PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION
The present invention addresses the problem of providing: a photocurable resin composition that does not require full curing by heat; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition. Provided are: a photocurable resin composition containing (A) a polymerizable compound, (B) a photopolymerization initiator, and (C) a photon upconversion material; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition.
C08L 101/00 - Compositions of unspecified macromolecular compounds
C08F 20/20 - Esters of polyhydric alcohols or phenols
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08K 3/01 - Use of inorganic substances as compounding ingredients characterised by their specific function
An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity. Thus, in a semiconductor device that includes electronic components manufactured using the composition as a mold underfill material for TSV, deterioration of performance due to heat is suppressed. Furthermore, an electronic component manufactured using the liquid epoxy resin composition of the present invention as a mold underfill material for TSV exhibits sufficient reliability. Thus, the liquid epoxy resin composition of the present invention is highly suitable for use as a mold underfill material for TSV.
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
77.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
The present invention suppresses the occurrence of a mold flash at the time of compression molding. Provided are: a liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl polymer; an electronic component and a semiconductor device manufactured using the same; and a method for manufacturing an electronic component using the same.
GFGFGF of the glass frit (C) and the content G of the glass frit (C) in terms of parts by weight in the electrically conductive paste, if the content of the electrically conductive particles (A) in the electrically conductive paste is taken to be 100 parts by weight, falls within the range 0.25-1.45.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 31/068 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
79.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE
The present invention suppresses warping of a sealed article and has excellent rapid curing properties. A liquid compression molding material according to the present invention comprises a resin composition containing (A) an epoxy resin, (B1) a phenolic curing agent, (B2) an acid anhydride curing agent, and (C) an inorganic filler, wherein a glass transition temperature Tg of a cured product of the resin composition is in a range of 50°C to 120°C.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
B29C 43/18 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
B29C 43/34 - Feeding the material to the mould or the compression means
C08G 59/00 - Polycondensates containing more than one epoxy group per moleculeMacromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compoundsMacromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
[Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 μm or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.
Provided are a resin composition for a semiconductor device of a wafer level chip size package type, which exhibits excellent high-frequency properties, and can form a coating film which has a thickness that has less unevenness, and is unlikely to cause warpage of the semiconductor substrate, a semiconductor device using the same, and a method for producing a semiconductor device. A resin composition for a semiconductor device of a wafer level chip size package type, the resin composition comprising (A) a modified polyphenylene ether resin having an unsaturated double bond at the end thereof, (B) an elastomer having a butadiene skeleton, and optionally (C) a solvent, a semiconductor device using the same, and a method for producing a semiconductor device.
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
The purpose of the present invention is to provide a novel metal member. A metal member according to the present invention includes a layer containing Ni and Zn on at least one surface of a metal material, wherein the Zn adhesion amount in the layer containing Ni and Zn is 1.0 mg/dm2to 7.5 mg/dm2 (exclusive of 7.5), and the Zn content in the layer containing Ni and Zn is 55 mass% to 100 mass% (exclusive of 100 mass%).
The objective of the present invention is to provide a novel metal member. A metal member according to the present invention comprises a metal material which is a non-magnetic body, and a layer formed on the surface of the metal material and containing a magnetic metal and a non-magnetic metal. The metal member has a peak having a peak height of 0.7 to 1.2 times a reference value and/or a phase width of 0.8 to 1.5 times a reference value in a histogram obtained by measuring a magnetic field using a magnetic force microscope (MFM), wherein the peak height is a measured peak maximum value (hmax) of the histogram, the phase width is a range in which h/hmax is 0.01 or more, and the reference value is a value obtained by using the metal member yet to be processed.
The present invention addresses the problem of providing: a novel substance capable of solving the problem of conventional bismaleimides having a dimer acid skeleton; a curable composition, adhesive, or sealing material containing same and having excellent photo-curability and adhesive strength; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product. Provided are: a dimer acid-modified acrylamide; a composition mainly containing the dimer acid-modified acrylamide; a curable composition, adhesive, or sealing material containing the dimer acid-modified acrylamide and a radical polymerization initiator; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product.
To provide: an epoxy resin composition capable of suppressing small pores generated when the surface of a cured product thereof is polished; an electronic component using the epoxy resin composition; a semiconductor device using the epoxy resin composition; and a method for manufacturing the semiconductor device. The epoxy resin composition contains an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer. The solid elastomer has a structure in which a double bond is not included in the main chain.
Provided are: a semiconductor device comprising an interlayer insulating film having a high tensile elongation; and a resin composition. The semiconductor device comprises: a semiconductor chip; an encapsulation material for covering the semiconductor chip; wiring for electrically connecting the semiconductor chip to an external terminal; and a rewiring layer including an interlayer insulating film that surrounds the wiring, wherein the rewiring layer has an area larger than that of the semiconductor chip in a plan view, and the interlayer insulating film has a tensile elongation of at least 15% at 25°C.
There are provided: a resin composition that has low elasticity, is curable at low temperature, and has a long pot life; an electrically conductive adhesive that contains the resin composition; a cured product of the resin composition; and a semiconductor device that contains the electrically conductive adhesive or the cured product of the resin composition. The resin composition contains (A) a radically polymerizable curable resin, (B) a radical polymerization initiator, and (C) a radical polymerization inhibitor. The (C) component contains (C1) a nitrosamine compound. The (A) component contains (A1) a urethane acrylate oligomer. The (A1) component has a mass average molecular weight of 1,600 or more and 20,000 or less. The resin composition is useful as an electrically conductive adhesive, a material for mounting components or a sealing material for protecting components, and an insulating material for reinforcement which are used in the FHE field.
Provided is a resin composition with low dielectric characteristics while having good ability to permeate into circuit boards. This composition comprises (A) a thermosetting resin comprising vinylbenzyl groups and/or maleimide groups, and (B) a compound with a butadiene backbone that has a 1,2-vinyl group, and the number average molecular weight of component (B) is 1000-10000.
C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured product having a low Tg; a semiconductor apparatus including the cured product; and an electronic device including the cured product. The curable resin composition comprises (A) a cationic curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxydicarbonate-type organic peroxide. The component (A) includes at least one selected from the group consisting of (A1) an epoxy resin having a ring skeleton in a molecule, and (A2) an oxetane resin.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/52 - Mounting semiconductor bodies in containers
Provided are: a curable resin composition which can be cured at a low temperature and which has excellent pot life; an adhesive; a sealing material; a cured product; a semiconductor device; and an electronic device. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxy dicarbonate-type organic peroxide represented by formula (1). The peroxycarbonate-type organic peroxide represented by formula (1) includes an alkyl group represented by R1and an alkyl group represented by R2, the alkyl groups each having at least 10 carbon atoms.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/52 - Mounting semiconductor bodies in containers
Provided are: a curable resin composition which can be cured through heating at a low temperature and/or ultraviolet ray irradiation and with which corrosion of an adherend is suppressed; an adhesive; a sealing material; a cured product obtained by curing same; and a semiconductor device and electronic device including the cured product. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) an ion trapping agent including at least one kind of atom selected from the group consisting of Zr, Mg, and Al.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/52 - Mounting semiconductor bodies in containers
92.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Provided are: an epoxy resin composition that yields a cured product that can prevent warping of a board and peeling from a chip; a cured product using the same; and a semiconductor device. The epoxy resin composition contains an epoxy resin, a filler, and at least one selected from a curing agent and a curing catalyst. The epoxy resin contains a flexible epoxy resin, and the content of flexible epoxy resin is from 8.0 mass% to 25.0 mass% relative to the epoxy resin.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
93.
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DIE ATTACHMENT MATERIAL, CURED PRODUCT AND ELECTRONIC DEVICE
The present invention provides: a resin composition which has a low viscosity and enables the achievement of a cured product that has a high Tg; an adhesive and a sealing material, each of which comprises this resin composition; a die attachment material; a cured product; and an electronic device. This resin composition is characterized by containing (A) a pentaerythritol tetraglycidyl ether and (B) an epoxy resin other than the component (A), and is also characterized in that the amount of the component (A) is less than 30% by mass in 100% by mass of organic matters that include the component (A) and the component (B).
The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 5/02 - Electroplating of selected surface areas
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
95.
INSULATIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT
The present invention addresses the problem of providing an insulative resin composition suitable for aerosol-jet printing technologies. Provided is an insulative resin composition which contains (A) inorganic particles having a mean particle diameter (D50) of 0.02-0.5 μm, (B) a polyfunctional thermosetting compound, and (C) a curing agent, and which has a viscosity of 400 mPa·s or less as measured using a type-E viscometer at a condition of 25°C and 50 rpm.
The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.
G01N 23/20058 - Measuring diffraction of electrons, e.g. low energy electron diffraction [LEED] method or reflection high energy electron diffraction [RHEED] method
G01N 23/20091 - Measuring the energy-dispersion spectrum [EDS] of diffracted radiation
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
Provided is a highly efficient crystalline silicon solar cell which has a high open-circuit voltage (Voc) and fill factor (FF). A solar cell comprising a crystalline silicon substrate (1) which contains an impurity diffusion layer, a passivation film (2) positioned on at least the impurity diffusion layer of the substrate (1), and an electrode (20) which contains silver (Ag) and is positioned on at least part of the passivation film (2), wherein: one or more AgSi regions (30) are further included in the solar cell and positioned in at least part of the interval between the electrode (20) and the substrate (1); the AgSi regions (30) include one or more AgSi regions (30) which have a depth of at least 100nm; and the residual rate of the passivation film (2), which is the proportion of the residual length of the passivation film (2) in a scanning electron micrograph of a cross-section which is 5.7µm×3.9µm and includes the AgSi regions (30) of the solar cell, is 10-90%.
The present invention provides an electrically conductive paste which is suitable for the formation of an electrode by a laser process for the production of a crystalline silicon solar cell. This electrically conductive paste is used for the purpose of forming an electrode on a passivation film which is disposed on the surface of a p-type semiconductor layer that is disposed on the surface of an n-type semiconductor substrate; and this electrically conductive paste contains (A) silver particles, (B) an organic vehicle and (C) glass frit. This electrically conductive paste additionally contains 0.5 part by weight or less of (D) aluminum particles relative to 100 parts by weight of the (A) silver particles; or alternatively, this electrically conductive paste does not contain the (D) aluminum particles.
The present invention further suppresses the occurrence of recess defects which are formed in a polished surface when a surface of a cured product of an epoxy resin composition is polished. Provided is an epoxy resin composition comprising (A) an epoxy resin, B) at least one component selected from the group consisting of curing agents and curing accelerators, and (C) a filler, wherein the average presence density of recesses which have a diameter of not less than 0.5 μm and which are observed in a polished surface of a cured product of the epoxy resin composition is not more than 1.00/mm2. Also provided are an electronic component mounting structure using the epoxy resin composition, and a method for producing the electronic component mounting structure.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08K 3/013 - Fillers, pigments or reinforcing additives
