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2009
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Invention
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Copper foil for printed circuit board and copper clad laminate plate for printed circuit board. D... |
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Invention
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Substrate. Provided is a substrate wherein resistances of a gate electrode and a source/drain reg... |
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Invention
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Tin-plated cu-ni-si alloy strip with excellent unsusceptibility to thermal tin deposit peeling. A... |
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Invention
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Cu-ni-si alloy for electronic materials. Corson alloy characteristics are improved by controlling... |
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Invention
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Cu-ni-si-co-cr alloy for electronic material. The issue is to provide a Corson alloy which has si... |
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Invention
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Cu-ni-si alloy to be used in electrically conductive spring material. A Cu-Ni-Si base alloy conta... |
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Invention
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Tinned copper alloy bar with excellent abrasion resistance, insertion properties, and heat resist... |
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Invention
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Low particulate-generating sputtering target. Disclosed is a low particulate-generating sputterin... |
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Invention
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Sputtering target of nonmagnetic-in-ferromagnetic dispersion type material. A sputtering target c... |
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Invention
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Sintered silicon wafer. Disclosed is a sintered silicon wafer which is characterized by having a ... |
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Invention
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Cu-ni-si-co copper alloy for electronic material and process for producing the same. A Cu-Ni-Si-C... |
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Invention
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Electrolytic solution for producing electrolytic copper foil. An electrolytic copper solution for... |
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Invention
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Positive electrode active material for lithium ion battery, positive electrode for rechargeable b... |
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Invention
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Platinum powder for magnetic material target, method for producing the powder, method for produci... |
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Invention
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Electronic member wherein barrier-seed layer is formed on base. Disclosed is a technique for form... |
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Invention
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Sb-te alloy powder for sintering, process for production of the powder, and sintered target. An S... |
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Invention
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Ytterbium sputtering target and method for manufacturing the target. Provided is a method for man... |
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Invention
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Method of recovering valuable metals from izo scrap. A method of recovering valuable metals from ... |
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Invention
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Ulsi micro-interconnect member having ruthenium electroplating layer on barrier layer. An object ... |
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2008
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Invention
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Non-adhesive flexible laminate.
Provided is a non-adhesive flexible laminate comprising a polyim... |
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Invention
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Adhesive-free flexible laminate. An adhesive-free flexible laminate comprising a polyimide film a... |
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Invention
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Process for producing thin film of a-igzo oxide. Disclosed is a process for producing a thin film... |
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Invention
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Copper foil for printed wiring board. Provided is a copper foil which is to be used for a printed... |
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Invention
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Method for manufacturing double layer copper clad laminated board, and double layer copper clad l... |
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Invention
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Sintered target and method for production of sintered material. Disclosed is a sintered target wh... |
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Invention
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Process for recovery of valuable metals from scrap izo. A process for the recovery of valuable me... |
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Invention
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Thin film mainly composed of titanium oxide, sintered sputtering target suitable for the producti... |
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Invention
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Substrate and method for manufacturing the same. Disclosed is a substrate having a barrier film f... |
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Invention
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Copper foil including resistive film layer. Copper foil including an electric resistive film laye... |
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Invention
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Highly pure lanthanum, sputtering target comprising highly pure lanthanum, and metal gate film ma... |
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Invention
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Tin-plated material for electronic part. A tin-plated material having a three-layer structure com... |
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Invention
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Copper anode or phosphorus-containing copper anode, method for electroplating copper on semicondu... |
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Invention
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High-purity ytterbium, sputtering target made of high-purity ytterbium, thin film containing high... |
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Invention
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Method for supporting metal nano particle, and substrate carrying metal nano particle. A metal na... |
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Invention
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Metal covered polyimide composite, process for producing the composite, and apparatus for produci... |
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Invention
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Metal covered polyimide composite, process for producing the composite, and process for producing... |
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Invention
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Copper foil for printed circuit and copper clad laminate. With the development of electronic equi... |
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Invention
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Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy.... |
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Invention
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High-strength high-electroconductivity copper alloy possessing excellent hot workability. This in... |
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Invention
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Method for producing sintered body, sintered body, sputtering target composed of the sintered bod... |
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Invention
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Fuel cell separator material and fuel cell stack. [PROBLEMS] To provide a fuel cell separator mat... |
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Invention
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Substrate for epitaxial growth and method for producing nitride compound semiconductor single cry... |
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Invention
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Copper electrolytic solution and two-layer flexible substrate obtained using the same.
To provid... |
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2007
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Invention
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High strength titanium copper alloy, manufacturing method therefor, and terminal connector using ... |
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Invention
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Two-layered copper-clad laminate.
A two-layered copper-clad laminate having a copper layer forme... |
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Invention
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Manufacturing method of gan thin film template substrate, gan thin film template substrate and ga... |
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2005
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Invention
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Method for vulcanization-adhering rubber composition to adherent of brass or plated with brass, r... |
