Abrégé

A substrate processing method includes loading a substrate by placing the substrate on a substrate supporter in a treatment space within a housing, preheating the substrate by ejecting a heat transfer medium having a first temperature to the substrate while the substrate is stationary, and subsequent to the preheating, and while rotating the substrate supporter to rotate the substrate, supplying a liquid chemical having a second temperature lower than the first temperature toward an upper surface of the substrate supported by the substrate supporter, the liquid chemical being a polymer-based cleaning solution for performing a cleaning process on the substrate.

Classes IPC  ?

• B05C 5/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage
• B05C 13/00 - Moyens pour manipuler ou tenir des objets, p. ex. des objets individuels
• H10P 70/00 -
• H10P 72/00 -

Abrégé

An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution. The apparatus includes a substrate rotating device configured to rotate a seated substrate in a spinning manner, a chemical solution supply device configured to supply a chemical solution to the substrate, a chemical solution discharge line configured to discharge the chemical solution having undergone a process to an outside, a chemical solution circulation line configured to circulate the chemical solution having undergone the process to the chemical solution supply device, and a discharged chemical solution selection device configured to discharge a chemical solution containing a first amount of process by-products to the outside through the chemical solution discharge line and to circulate a chemical solution containing a second amount of process by-products through the chemical solution circulation line, wherein the first amount of process by-products is larger than the second amount of process by-products.

Classes IPC  ?

• H10P 72/00 -
• H10P 50/64 -

Abrégé

The present invention provides an apparatus for treating a substrate, the apparatus including: a processing tank having an accommodation space in which a processing liquid is accommodated; a support member for supporting at least one substrate in the receiving space in a vertical posture; and a posture changing robot for changing a posture of the substrate in a state of being immersed in the liquid state from the vertical posture to a horizontal posture, in which wherein the posture changing robot includes: a hand configured to grip the substrate; and an arm for moving the hand.

Classes IPC  ?

• H10P 72/00 -
• H10P 72/30 -

Abrégé

The method includes placing the substrate on the chuck, identifying at least one condition related to the substrate, selecting one mode among a first mode, a second mode, and a third mode, generating a plasma in the plasma space and treating the substrate mainly by species generated in the plasma space, generating plasmas in both the plasma space and the treating space and treating the substrate by species generated in the plasma space and the treating space, generating a plasma in the treating space and treating the substrate mainly by species generated in the treating space, and changing the mode between the first mode, the second mode, and the third mode according to the condition such that treatment selectivity between different materials on the substrate is controlled.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H10P 72/72 -

Abrégé

Provided is a transfer unit, including: a hand on which a substrate is placed; and a detector for detecting whether the substrate supported on the hand protrudes from a regular position on the hand, in which the detector includes: a light-emitting sensor for emitting light; a body in which a light-receiving sensor that receives light emitted from the light-emitting sensor is installed on a bottom surface thereof; and a light blocking wall installed in the body and preventing light other than the light emitted by the light-emitting sensor from being introduced into the light-receiving sensor.

Classes IPC  ?

• H10P 72/00 -
• H10P 72/30 -
• H10P 72/76 -

Abrégé

A semiconductor processing apparatus includes a storage container storing a photoresist, a supply control unit including pump devices, at least one pump controller controlling the pump devices, a system substrate connected to the pump devices and the at least one pump controller, and a bulkhead structure defining first and second space, wherein the pump devices are disposed in the first space and the at least one pump controller is disposed in the second space, and a spin coating unit including a stage on which a wafer is disposed, and a nozzle discharging the photoresist onto the wafer. The system substrate includes first and second surfaces, first connectors directly connected to a first group of pump devices, and second connectors directly connected to a second group of pump devices. Each first connector and each second connector are arranged alternately in the first direction.

Classes IPC  ?

• G03F 7/16 - Procédés de couchageAppareillages à cet effet

Abrégé

A liquid supply apparatus includes a nozzle unit including a nozzle body, a housing cover coupled to the nozzle body by a plurality of fastening members, and a plurality of thin film-type pressure sensors inserted between the nozzle body and the housing cover, and a control portion configured to monitor whether the nozzle body and the housing cover are airtightly coupled to each other, based on measurement values of the plurality of thin film-type pressure sensors.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

The present disclosure provides a substrate processing apparatus including a processing container in which a substrate is disposed; a cleaning unit disposed at least partially in an upper end portion of the processing container and supplying a cleaning liquid to the processing container; an exhaust line having a first end portion connected to the processing container, having a second end portion extended to an external side of the processing container, and discharging gas in the processing container externally; a fume-collecting unit including a fume collector collecting fumes included in the gas while the gas passes through the exhaust line; and a connection line connecting the processing container and the exhaust line, and supplying at least a portion of the cleaning liquid supplied to the processing container, to the fume-collecting unit.

Classes IPC  ?

• B08B 15/02 - Précautions prises pour empêcher les crasses ou les fumées de s'échapper de la zone où elles sont produitesRamassage ou enlèvement des crasses ou des fumées de cette zone par utilisation de chambres ou de hottes recouvrant cette zone
• B08B 9/08 - Nettoyage de récipients, p. ex. de réservoirs
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

The present disclosure provides an apparatus for bonding a substrate and a method for bonding a substrate. An apparatus for bonding a substrate according to an embodiment of the present disclosure includes an ultraviolet light irradiation chamber irradiating a plurality of substrates with ultraviolet light; and a substrate bonding chamber bonding the plurality of substrates irradiated with ultraviolet light by bringing the same into close contact with each other.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• B32B 37/00 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons
• B32B 38/00 - Opérations auxiliaires liées aux procédés de stratification

Abrégé

A substrate treatment apparatus includes a treatment container having a treatment space for a substrate, a support portion provided in the treatment space, and configured to support the substrate, and a rotary nozzle unit provided in the treatment space, the rotary nozzle unit configured to spray a treatment liquid onto a central region of a lower surface of the substrate by rotating about a rotational shaft within a first angular range, and to spray the treatment liquid onto an edge region of the lower surface of the substrate by rotating about the rotational shaft within a second angular range.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

A liquid supply unit includes a nozzle configured to discharge a processing liquid through a discharge passage formed therein, a camera configured to acquire an image of the nozzle, and a detection unit configured to detect a position of a liquid level within the discharge passage from the image of the nozzle. The detection unit is configured to derive an edge profile by processing the image of the nozzle, to derive one or more search regions by dividing the edge profile, and to detect the liquid level within the one or more search regions.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

A stocker including a main frame, and a plurality of storage units disposed in a vertical direction and a horizontal direction in the main frame. Each of the plurality of storage units includes a sliding shelf that is withdrawable in both forward and backward directions in a depth direction of the main frame. The sliding shelf directly loads an article from an overhead hoist transport (OHT) vehicle or directly unloads the article from the sliding shelf to the OHT vehicle.

Classes IPC  ?

• H10P 72/30 -
• B65G 1/137 - Dispositifs d'emmagasinage mécaniques avec des aménagements ou des moyens de commande automatique pour choisir les objets qui doivent être enlevés
• B66C 19/00 - Ponts roulants ou portiques fixes ou mobiles, portant un chariot ou un treuil mobile

Abrégé

Disclosed are a substrate support unit configured to control the slope of non-sinusoidal bias voltage and a substrate processing apparatus including the same. The substrate support unit is disposed in a chamber body for plasma processing of a substrate and holds the substrate. The substrate support unit includes an electrostatic chuck configured to adsorb the substrate, a bias electrode included in the electrostatic chuck and configured to control plasma characteristics inside the chamber body, and a bias power unit configured to apply a non-sinusoidal wave as bias voltage to the bias electrode. The bias power unit adjusts the slope of a portion of the non-sinusoidal wave and applies the non-sinusoidal wave adjusted in slope as the bias voltage.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse

Abrégé

A substrate processing apparatus with improved cleaning efficiency is provided. The substrate processing apparatus includes: a support member configured to support a substrate; a chemical solution supplier configured to supply chemical solution to the substrate; a sonic oscillator including an ultrasonic nozzle; a home port provided on one side of the support member and configured to accommodate the ultrasonic nozzle in a standby state; and a controller configured to control the support member, the chemical solution supplier, the sonic oscillator, and the home port, wherein the controller controls the ultrasonic nozzle to vibrate the chemical solution applied on the substrate during a cleaning period, and controls the ultrasonic nozzle to vibrate in the home port during a standby period to remove particles adhering to the ultrasonic nozzle.

Classes IPC  ?

• B08B 3/12 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations par des vibrations soniques ou ultrasoniques
• B08B 3/04 - Nettoyage impliquant le contact avec un liquide
• B08B 3/08 - Nettoyage impliquant le contact avec un liquide le liquide ayant un effet chimique ou dissolvant
• B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
• G03F 1/82 - Procédés auxiliaires, p. ex. nettoyage ou inspection
• H10P 72/00 -

Abrégé

Disclosed is an apparatus of processing a substrate, the apparatus including: a liquid treating chamber for processing a substrate with a treatment liquid; a recovery tank for recovering the treatment liquid used in the liquid treating chamber through a recovery pipe; and a supply pipe for supplying the treatment liquid recovered from the recovery tank to the liquid treating chamber, in which the recovery tank includes: a tank body having a storage space in which the used treatment liquid is stored; a decompression pipe connected to the storage space and having an opening/closing valve installed; and a decompressor connected to the decompression pipe to decompress the storage space.

Classes IPC  ?

• H10P 72/00 -

Abrégé

Disclosed relates to a jig for attaching and detaching an inner dome of a plasma chamber, particularly, to a plasma chamber dome attachment and detachment jig configured to easily attach and detach a dome to and from a central portion of a chamber frame without the use of a separate gauge, and the dome jig attaching and detaching the dome of the plasma chamber includes a base plate, and a plurality of raising and lowering units that are installed along an edge of the base plate and configured to move the base plate upward and downward.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse

Abrégé

The apparatus features a plurality of treating chambers arranged vertically for processing a substrate. The treatment liquid supply unit manages the liquid flow from a supply source via upstream and downstream lines. the plurality of pump units are (each comprising a pump and filter) installed on the downstream lines and positioned at different heights. These feed the liquid to the chambers. For discharge, a drainage line, including a vertical line that drains downward, is connected to the pump units. This vertical line incorporates a plurality of pressure compensation units to stabilize the pressure within the drainage line.

Classes IPC  ?

• H10P 72/00 -

Abrégé

Disclosed is a method and system for processing a substrate. The substrate processing method includes providing a substrate having a metal film deposited thereon, etching the metal film by a first thickness, oxidizing the metal film to form a metal oxide film, and etching the metal oxide film. The metal film is removed by the first thickness before the metal oxide film formation step during the metal film etching process for metal gate node separation of a 3D NAND device, thereby minimizing residual metal film.

Classes IPC  ?

• H10D 30/01 - Fabrication ou traitement
• H10B 41/27 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par les agencements tridimensionnels, p. ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p. ex. avec des canaux inclinés les canaux comprenant des parties verticales, p. ex. des canaux en forme de U
• H10B 41/30 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région noyau de mémoire
• H10B 43/27 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par les agencements tridimensionnels, p. ex. avec des cellules à des niveaux différents de hauteur la région de source et la région de drain étant à différents niveaux, p. ex. avec des canaux inclinés les canaux comprenant des parties verticales, p. ex. des canaux en forme de U
• H10B 43/30 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région noyau de mémoire
• H10D 30/68 - Transistors IGFET à grille flottante
• H10D 30/69 - Transistors IGFET ayant des isolateurs de grille à piégeage de charges, p. ex. transistors MNOS
• H10D 64/66 - Électrodes ayant un conducteur couplé capacitivement à un semi-conducteur par un isolant, p. ex. électrodes du type métal-isolant-semi-conducteur [MIS]
• H10D 64/68 - Électrodes ayant un conducteur couplé capacitivement à un semi-conducteur par un isolant, p. ex. électrodes du type métal-isolant-semi-conducteur [MIS] caractérisées par l’isolant, p. ex. par l’isolant de grille
• H10P 14/60 -
• H10P 50/66 -
• H10P 50/68 -
• H10P 72/00 -

Abrégé

Disclosed is a liquid exchange method in a liquid supply apparatus. The liquid exchange method in a liquid supply apparatus including a recovery tank, a sub-tank, a main tank, and a pre-tank includes: (a) a liquid exchange operation of the main tank and the sub tank; (b) a flushing operation of the recovery tank; and (c) a liquid exchange operation of the pre-tank, in which in the operation (a), a liquid supply is switched to a double tank operation mode in which a liquid is supplied to a substrate processing apparatus using only the recovery tank and the pre-tank as the pre-tank is switched to a main supply tank.

Classes IPC  ?

• B08B 9/08 - Nettoyage de récipients, p. ex. de réservoirs
• H10P 72/00 -

Abrégé

Provided is a substrate processing method and apparatus. The substrate processing method includes: a substrate processing operation of discharging a liquid to a substrate loaded into an inner space of a liquid treating chamber to liquid-treat the substrate; after the substrate processing operation, a chamber cleaning operation of unloading the substrate from the inner space of the liquid treating chamber and cleaning the liquid treating chamber; and an inspection operation of inspecting a degree of contamination of the liquid treating chamber after the chamber cleaning operation, in which the inspection operation includes acquiring an image by photographing the inner space with a camera in a state where first light of a wavelength band in an ultraviolet ray region to the inner space of the liquid treating chamber, and inspecting the degree of contamination of the liquid treating chamber based on the image.

Classes IPC  ?

• G01N 21/94 - Recherche de souillures, p. ex. de poussières
• B08B 3/04 - Nettoyage impliquant le contact avec un liquide
• B08B 9/00 - Nettoyage d'objets creux par des procédés ou avec un appareillage spécialement adaptés à cet effet
• B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
• B08B 15/02 - Précautions prises pour empêcher les crasses ou les fumées de s'échapper de la zone où elles sont produitesRamassage ou enlèvement des crasses ou des fumées de cette zone par utilisation de chambres ou de hottes recouvrant cette zone
• G01N 21/33 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière ultraviolette
• G06T 7/00 - Analyse d'image
• H10P 72/00 -

Abrégé

The substrate processing apparatus includes: a chamber body having an inner space; a cup placed in the inner space and having a treatment space with an open top; a spin chuck for supporting the substrate in the treatment space; a liquid supply unit for supplying a treatment liquid to the substrate supported by the spin chuck; a fan unit for providing descending airflow to the inner space; an exhaust pipe for exhausting atmosphere in the inner space; and an airflow adjustment unit for controlling a flow of the descending airflow supplied from the fan unit, in which the airflow adjustment unit includes: an airflow adjustment plate provided in a first mode or a second mode to control a flow of descending airflow supplied from the fan unit; and a driver for driving the airflow adjustment plate so that the airflow adjustment plate is provided in the first mode or the second mode.

Classes IPC  ?

• H10P 72/00 -
• H10P 72/76 -

Abrégé

A substrate transferring apparatus and a substrate processing apparatus are provided. The substrate transferring apparatus includes a base, a hand mounted on the base to support a substrate, and a position detector for detecting a position of the substrate. The position detector includes at least one sensor unit disposed at a position corresponding to a peripheral portion of the substrate. Each sensor unit includes a light emitting unit and a light receiving unit facing each other. The light receiving unit includes a plurality of light receiving members, wherein a gap between the light receiving members is greater than a width of a notch formed on the substrate. This configuration enables efficient identification of the notch and alignment of the substrate by comparing light amount data received by the light receiving members.

Classes IPC  ?

• H10P 72/50 -
• H10P 72/00 -
• H10P 72/30 -

Abrégé

Disclosed is a substrate processing method including: a liquid treatment operation of processing a substrate by supplying a treatment liquid to the substrate supported on a spin head; and a bowl cleaning operation of cleaning a bowl surrounding the spin head and simultaneously stabilizing a temperature of a treatment fluid discharged from a back nozzle of the spin head before the liquid treatment operation.

Classes IPC  ?

• H10P 72/00 -
• H10P 72/76 -

Abrégé

Disclosed are a jig device and a method of mounting a focus ring using the jig device, wherein the jig device is configured to align the position of a consumable component on a substrate processing device and to support mounting of the consumable component on the substrate processing device, and the focus ring is mounted on a substrate support unit by the method using the jig device.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse

Abrégé

A substrate treating apparatus is provided. The substrate treating apparatus comprises a substrate treating assembly including a substrate supporting unit configured to support a substrate treated with a treatment liquid and a bowl unit surrounding the substrate supporting unit; a tank unit including a plurality of tanks, the plurality of tanks including first and second tanks that are configured to receive the treatment liquid supplied to the substrate treating assembly and are arranged in series in a downstream direction, wherein the second tank is configured to supply the treatment liquid to the substrate; a liquid level detection unit configured to detect a liquid level of the tank unit; and a control unit configured to regulate a flow rate of the treatment liquid discharged from the tank unit based on the liquid level detected by the liquid level detection unit.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

A substrate treatment apparatus includes a nozzle portion applying a treatment liquid to a substrate, and a liquid supply unit supplying the treatment liquid to the nozzle portion. The liquid supply unit includes a storage container storing the treatment liquid, a pump unit including a first pump portion filled with the treatment liquid before being supplied to the nozzle portion, and a second pump portion supplying the treatment liquid to the nozzle portion, the first pump portion being connected to the second pump portion via a supply line and controlling supply pressure of the treatment liquid supplied to the second pump portion, a valve opening and closing the pump unit and the supply line, and a control unit maintaining the supply pressure at atmospheric pressure when the valve is closed and controlling the supply pressure to vary to a target pressure when the valve is opened.

Classes IPC  ?

• G03F 7/16 - Procédés de couchageAppareillages à cet effet
• G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet

Abrégé

There is provided a transfer robot capable of picking up different types of containers. The transfer robot comprising, a base, a first hand installed on the base and configured to pick up a first-type container having a first width, a second hand installed on the base and configured to pick up a second-type container having a second width different from the first width, the second hand including a passage through which the first hand passes, a first actuator configured to adjust a position in an up-and-down direction between the first hand and the second hand, and a controller configured to control the first actuator, wherein, in a case where the first hand picks up the first-type container, the controller controls the first actuator to position the first hand higher than the second hand relative to the base.

Classes IPC  ?

• B65G 1/04 - Dispositifs d'emmagasinage mécaniques
• B25J 5/02 - Manipulateurs montés sur roues ou sur support mobile se déplaçant le long d'un chemin de guidage

Abrégé

An apparatus for processing a substrate is provided, the apparatus including a heat treatment unit including a plurality of heat treatment chambers for heat-treating a substrate, a cooling unit including a first cooling chamber and a second cooling chamber for cooling the substrate, a liquid treatment unit for liquid-treating the substrate, and a transfer unit including a transfer robot for transferring the substrate between the heat treatment unit, the cooling unit, and the liquid treatment unit, wherein the plurality of heat treatment chambers, the first cooling chamber, and the second cooling chamber are disposed in a line, the first cooling chamber is disposed on one side of the plurality of heat treatment chambers, and the second cooling chamber is disposed between the plurality of heat treatment chambers.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• G03F 7/16 - Procédés de couchageAppareillages à cet effet
• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

A substrate treatment apparatus includes a treatment container having an internal space, a support portion provided in the internal space, the support portion configured to support the substrate, and a cleaning unit provided in the internal space, the cleaning unit configured to spray a treatment liquid toward a rear surface of the substrate. The treatment container includes a lower cup having a lower surface having a rectangular shape and an open upper portion, an upper cup coupled to the lower cup to form the internal space, and a vortex prevention unit disposed between the lower cup and the upper cup. The vortex prevention unit includes a plurality of blade layers in which an outer radius of a lower layer is less than an outer radius of an upper layer.

Classes IPC  ?

• H10P 72/00 -
• B08B 15/02 - Précautions prises pour empêcher les crasses ou les fumées de s'échapper de la zone où elles sont produitesRamassage ou enlèvement des crasses ou des fumées de cette zone par utilisation de chambres ou de hottes recouvrant cette zone

Abrégé

The present invention relates to a multi-axis stage apparatus capable of significantly improving the precision of wafer bonding, a wafer bonding method using the apparatus, and a wafer bonding apparatus. The apparatus includes a base, an alignment stage configured to align a first wafer held by a first wafer chuck, a first driving device positioned between the base and the alignment stage and configured to vertically move the alignment stage with low precision, and a second driving device also positioned between the base and the alignment stage and configured to vertically move the alignment stage with high precision. The second driving device may include a flexure hinge, at least a portion of which is configured to distribute load. By combining coarse and fine vertical movement control and supporting structures based on flexure mechanics, the apparatus enables precise multi-axis alignment and bonding of wafers.

Classes IPC  ?

• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
• H01L 21/18 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges les dispositifs ayant des corps semi-conducteurs comprenant des éléments du groupe IV du tableau périodique, ou des composés AIIIBV, avec ou sans impuretés, p. ex. des matériaux de dopage
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement

Abrégé

A substrate processing apparatus includes an index unit configured to unload a substrate from a container storing the substrate; and a control unit configured to control the index unit. The index unit is configured to unload the substrate from the container at a predetermined time interval, and to close a door of the container after unloading the substrate.

Classes IPC  ?

• G05B 15/02 - Systèmes commandés par un calculateur électriques
• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail

Abrégé

There is provided a substrate processing apparatus in which the distribution of the amount of etching is improved. The substrate processing apparatus includes: a support stand configured to rotate a substrate; a first chemical solution supplier configured to supply a first chemical solution to the substrate; a second chemical solution supplier configured to supply a second chemical solution to the substrate; and a controller configured to control the support stand, the first chemical solution supplier, and the second chemical solution supplier, wherein the substrate includes a first region, including an edge of the substrate, and a second region arranged inward of the first region, and the controller is further configured to control, while rotating the support stand at a first speed, such that the first chemical solution supplier discharges the first chemical solution to the first region and the second chemical solution supplier discharges the second chemical solution to the second region, thereby performing etching in the first region while preventing etching in the second region, and to control, while rotating the support stand at a second speed higher than the first speed, such that the first chemical solution supplier discharges the first chemical solution to the second region, thereby performing etching on a front surface of the substrate.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail

Abrégé

A substrate processing device includes an application module applying a processing liquid to a substrate and performing heat treatment and a buffer module loading a substrate into the application module or removing a substrate from the application module, wherein the application module includes an application chamber portion applying photoresist (PR) to the substrate, a heat treatment chamber portion heat-treating the substrate, and a PR bottle cabinet storing the PR.

Classes IPC  ?

• G03F 7/16 - Procédés de couchageAppareillages à cet effet
• B05B 1/00 - Buses, têtes de pulvérisation ou autres dispositifs de sortie, avec ou sans dispositifs auxiliaires tels que valves, moyens de chauffage

Abrégé

A substrate conveyance apparatus includes a hand supporting a substrate, the hand having a plurality of holes formed in a surface thereof, an adsorption unit vacuum-adsorbing the substrate placed on the hand through the plurality of holes, a movement unit connected to one end of the hand, the movement unit moving the hand in a vertical direction, and a control unit controlling the hand, the adsorption unit, and the movement unit. The control unit controls, based on a result of inspection of an adsorption state of the substrate using the adsorption unit, movement of the hand in the vertical direction using the movement unit.

Classes IPC  ?

• B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion

Abrégé

Disclosed is a treatment liquid supply apparatus configured to supply a chemical to a substrate processing apparatus, the apparatus including: a first tank in which a used chemical is recovered; a second tank configured to receive the chemical from the first tank; a third tank configured to receive the chemical from the second tank and connected to a main circulation line configured to supply the chemical to the apparatus; a chemical supply source configured to supply an undiluted liquid to the first tank; and a controller configured to control the tanks and supply source to perform a chemical exhaustion mode, stopping new undiluted liquid supply for a set time before maintenance liquid exchange, and exhausting residuals in the tanks.

Classes IPC  ?

• C02F 1/68 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par addition de substances spécifiées, pour améliorer l'eau potable, p. ex. par addition d'oligo-éléments
• C02F 103/34 - Nature de l'eau, des eaux résiduaires ou des eaux ou boues d'égout à traiter provenant de l'industrie chimique non prévue dans les groupes

Abrégé

Provided is an apparatus for processing a substrate. The apparatus includes: a treating unit for processing a substrate; and a liquid supply unit for supplying a treatment liquid to the substrate disposed in the treating unit, in which the liquid supply unit includes: a bottle for storing the treatment liquid; a liquid supply line for supplying the treatment liquid from the bottle to the treating unit; a trap tank installed in the liquid supply line and temporarily storing the treatment liquid; a negative pressure forming unit for forming a negative pressure inside the trap tank to feed the treatment liquid in the bottle to the trap tank; a cleaning liquid supply unit for supplying a cleaning liquid to the negative pressure forming unit; and a sampling unit for detecting the amount of the treatment liquid introduced into the negative pressure forming unit.

Classes IPC  ?

• H10P 72/00 -

Abrégé

Disclosed relates to semiconductor manufacturing equipment and a semiconductor manufacturing method and, more particularly to semiconductor manufacturing equipment and a semiconductor manufacturing method, the semiconductor manufacturing equipment including a process station in which a plurality of dry processing units is provided on an upper level and a plurality of wet processing units is provided on a lower level, and a cover surrounds each dry processing unit and each wet processing unit to shield electromagnetic waves of the dry processing unit.

Classes IPC  ?

• H10P 72/00 -
• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H10P 50/26 -
• H10P 50/66 -

Abrégé

Provided is a process chamber. The process chamber includes: a chamber process unit where a process unit for processing a substrate is provided; a chamber driving unit including a driving mechanism involved in an operation of the process unit and providing an inner space in which the driving mechanism is disposed; and a wall-shaped chamber control unit for controlling the operation of the process unit and defining the inner space.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• B65G 47/90 - Dispositifs pour saisir et déposer les articles ou les matériaux
• H10P 72/00 -

Abrégé

An apparatus for processing a substrate includes: a housing configured to provide a treatment space; a support unit configured to support the substrate therein; a supply unit configured to supply a treatment fluid to the space; and a discharge unit configured to discharge the fluid. The discharge unit has an exhaust box with an inner space, a discharge pipe with a valve configured to flow the fluid into the space, an exhaust duct connected to exhaust the fluid, and a gas supply unit configured to supply gas via a pipe to form airflow, preventing cold air accumulation, condensation, and freezing.

Classes IPC  ?

• H10P 72/00 -
• B08B 15/02 - Précautions prises pour empêcher les crasses ou les fumées de s'échapper de la zone où elles sont produitesRamassage ou enlèvement des crasses ou des fumées de cette zone par utilisation de chambres ou de hottes recouvrant cette zone

Abrégé

Disclosed is a substrate support unit capable of addressing problems caused by floating charges accumulated therein. The substrate support unit includes an adsorption plate configured to adsorb and support a substrate disposed on an upper surface thereof and provided therein with a heater assembly configured to heat the substrate, a cooling plate disposed below the adsorption plate and provided therein with a coolant channel configured to allow a coolant to circulate therethrough, an electric circuit board electrically connected to the heater assembly and configured to control the heater assembly, and a discharge unit electrically connected to the electric circuit board via a discharge line connected to ground and including a protection module including surge protection components.

Classes IPC  ?

• H10P 72/72 -
• H01J 37/32 - Tubes à décharge en atmosphère gazeuse

Abrégé

Disclosed is a substrate processing apparatus that controls plasma density distribution using an electromagnet unit. The substrate processing apparatus controls magnetic field intensity and distribution using a variable core, controls a magnetic field formed on a substrate during substrate processing operation based on a magnetic field profile constructed in advance through a first magnetic field measurement sensor and a second magnetic field measurement sensor, and diagnoses the state of the electromagnet unit.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H10P 72/00 -

Abrégé

Disclosed are a component inspection apparatus and a component inspection method that inspect a component in a non-contact and non-destructive manner. According to an exemplary embodiment of the present invention, an emitting unit emits light to a component, a light receiving unit receives transmitted or reflected light from the component, and a controller acquires information from the received light to recognize a fraction of fillers in the component. The above process may be repeatedly and continuously performed while moving the component, and accordingly, the degree of dispersion of the filler in the component may be predicted.

Classes IPC  ?

• G01N 21/3563 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge pour l'analyse de solidesPréparation des échantillons à cet effet
• G01N 21/95 - Recherche de la présence de criques, de défauts ou de souillures caractérisée par le matériau ou la forme de l'objet à analyser
• G01N 33/44 - RésinesMatières plastiquesCaoutchoucCuir

Abrégé

Disclosed is a method of processing a substrate. The method includes: supplying a treatment liquid from a treatment liquid supply source that supplies a treatment liquid to a first tank; filtering the treatment liquid by circulating the treatment liquid stored in the first tank through a first circulation line in which a first filter is installed; supplying the treatment liquid from the first tank to a second tank; and liquid-treating the substrate by supplying the treatment liquid stored in the second tank to the substrate, in which when the treatment liquid stored in the first tank is filtered for a set time or longer, the treatment liquid is supplied from the first tank to the second tank, and the set time is set differently depending on the amount of replenishment of the treatment liquid supplied from the treatment liquid supply source to the first tank.

Classes IPC  ?

• H10P 72/00 -

Abrégé

Disclosed are an optical module and a substrate processing apparatus including the same. The substrate processing apparatus includes an optical module, in which the optical module includes: a camera; a direction changing mirror placed in a position facing the camera; a first reflection mirror; a second reflection mirror; and a mirror driver configured to drive the direction changing mirror, and the direction changing mirror is provided so as to be position-changeable between a first position and a second position, the first position is a position where the camera photographs the inner space through the first reflection mirror, and the second position is a position where the camera photographs the inner space through the second reflection mirror. Accordingly, the position of the component may be measured during the process and the position may be corrected in real time.

Classes IPC  ?

• H10P 72/00 -

Abrégé

Provided is an apparatus for processing a substrate, the apparatus including: an index module including a load port and an index robot; and a treating module including a buffer unit, a liquid treating chamber for liquid-treating a substrate, a drying chamber for removing the liquid remaining on the substrate, and a transfer unit for transferring the substrate between the buffer unit, the liquid treating chamber, and the drying chamber, in which the buffer unit includes: a frame; a buffer disposed in an upper space of an inner space of the frame and temporarily storing the substrate transferred between the index module and the treating module; and a weight measuring unit disposed in a lower space of the inner space of the frame and measuring the weight of the substrate.

Classes IPC  ?

• G01G 23/00 - Dispositifs accessoires pour appareils de pesée
• B08B 3/04 - Nettoyage impliquant le contact avec un liquide
• F26B 5/00 - Procédés de séchage d'un matériau solide ou d'objets n'impliquant pas l'utilisation de chaleur
• G01G 21/14 - Fléaux
• H10P 72/00 -

Abrégé

Provided is an apparatus for processing a substrate. The apparatus includes: a housing; a support unit a fluid pipe in which a supercritical fluid flows; a main valve installed in the fluid pipe and opening and closing a passage through which the fluid flows in the fluid pipe; an emergency valve installed in the fluid pipe and opening and closing a passage through which the fluid flows in the fluid pipe; and a controller for controlling the main valve and the emergency valve. The controller controls the flow of the fluid in the fluid pipe by operating the main valve when the main valve is in a normal state, and controls the flow of fluid in the fluid pipe by operating the emergency valve when the main valve is in an abnormal state.

Classes IPC  ?

• H10P 72/00 -

Abrégé

A substrate processing apparatus includes: a process chamber; and a filler member. The treatment space is defined by an upper surface, a bottom surface, and a side surface. The bottom surface includes: a lower central region in which a first supply port is formed to supply a supercritical fluid; a lower edge region disposed outside the lower central region and positioned higher than the lower central region; and a lower connection region positioned between the lower central region and the lower edge region. When viewed from above, the first supply port overlaps the filler member. The connection region includes a vortex generator that generates a vortex from the supercritical fluid while the supercritical fluid introduced between the filler member and the lower central region flows toward the lower edge region.

Classes IPC  ?

• F26B 5/00 - Procédés de séchage d'un matériau solide ou d'objets n'impliquant pas l'utilisation de chaleur
• B08B 15/02 - Précautions prises pour empêcher les crasses ou les fumées de s'échapper de la zone où elles sont produitesRamassage ou enlèvement des crasses ou des fumées de cette zone par utilisation de chambres ou de hottes recouvrant cette zone
• H10P 72/00 -

Abrégé

Provided is a sealed shutter device including: a shutter door for opening and closing an opening on a front surface of a chamber; and a shutter driving unit for moving the shutter door to a first position to close the opening, a second position facing the opening but spaced apart from the front surface, and a third position not facing the opening, in which the shutter driving unit includes: a cam follower provided on the shutter door; and a cam guide having a track into which the cam follower is fitted so that the shutter door moves along the first position, the second position, and the third position; and an elastic member for providing elastic force so that the cam follower is in contact with only one predetermined surface of the track.

Classes IPC  ?

• H10P 72/00 -
• H10P 72/30 -

Abrégé

Disclosed is A substrate processing apparatus. The apparatus includes: an upper vessel in which a first space with an open lower portion is formed; and a substrate holder coupled to the upper vessel, on which a substrate loaded into a treatment space from an external transfer robot is placed, in which the upper vessel includes: an upper wall; and a side wall extending downward from an end of the upper wall, and the substrate holder is coupled to the side wall.

Classes IPC  ?

• F26B 5/00 - Procédés de séchage d'un matériau solide ou d'objets n'impliquant pas l'utilisation de chaleur
• H10P 72/00 -

Abrégé

Provided is an apparatus for processing a substrate, the apparatus including: an index module including a load port and an index robot; and a treating module including a transfer frame including a buffer for temporarily storing a substrate, a liquid treating chamber for liquid-treating a substrate, a drying chamber for removing the liquid remaining on the substrate, and a transfer unit for transferring the substrate between the buffer, the liquid treating chamber, and the drying chamber, in which the transfer unit includes: a hand; a weight measuring unit for measuring a weight of the substrate; and a lifting driver configured to raise and lower the weight measuring unit relative to the hand.

Classes IPC  ?

• H10P 72/30 -
• H10P 72/00 -

Abrégé

The present disclosure provides a vacuum pipe assembly, a support unit, and a substrate treating apparatus. A vacuum pipe assembly according to an embodiment of the present disclosure includes a vacuum pipe disposed through a through-hole of a heater cup, and connected to a vacuum hole of a heating plate disposed above the heater cup; and a spring member installed in the heater cup, and elastically supporting the vacuum pipe toward the heating plate, wherein the vacuum pipe is installed in a floating structure, which is not fixed to the heater cup by the spring member.

Classes IPC  ?

• F27D 5/00 - Supports, grilles ou appareillage analogue pour la charge à l'intérieur du four
• F27B 17/00 - Fours d'un genre non couvert par l'un des groupes
• H10P 72/76 -

Abrégé

The present disclosure provides a support unit and a substrate treating apparatus. A support unit according to an embodiment of the present disclosure includes a heater assembly including an upper plate and a lower plate formed of metal, and a heater disposed between the upper plate and the lower plate; a cover plate disposed on the upper plate, and formed of ceramic; a sealing member inserted into a cover vacuum hole of the cover plate and an upper vacuum hole of the upper plate, which are formed to be connected to each other, and having a hollow portion communicating with the upper vacuum hole.

Classes IPC  ?

• B25H 1/00 - ÉtablisÉtagères ou supports portatifs pour disposer des outils portatifs ou des pièces à travailler
• H10P 72/78 -

Abrégé

Disclosed relates to semiconductor manufacturing equipment and a substrate processing method using the same and, for a method of atomic layer-based etching a metal oxide film formed on a substrate, the method includes supplying halogen-based modified gas into a processing space of a chamber where the substrate is disposed, and modifying the metal oxide film, supplying adsorbed gas into the processing space and allowing the adsorbed gas to be adsorbed on a surface of the modified metal oxide film, and supplying heat to the substrate on which the adsorbed gas is adsorbed, and etching the metal oxide film, and the modified gas is bromine-based gas or chloride-based gas, and the adsorbed gas is a β-diketone-based precursor.

Classes IPC  ?

• H10P 50/28 -
• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H10P 72/00 -

Abrégé

A transfer module includes a hand body supporting and handling a substrate, a detection unit including a light emitting portion disposed on a first side of the hand body and emitting light in one direction and a light receiving portion disposed on a second side of the hand body and receiving the light and detecting warpage of the substrate, and a controller determining a warpage state of the substrate based on a detection result of the warpage.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

Abrégé

In the present disclosure, provided are a home port and an apparatus for processing a substrate, the home port including a housing including a receiving space for receiving a lower portion of a nozzle, a cleaning liquid supply unit for supplying a cleaning liquid for cleaning the nozzle to the receiving space, a suction unit for suctioning the cleaning liquid or air from the receiving space, and a drain unit for draining a cleaning liquid having overflowed from the receiving space and a cleaning liquid suctioned through the suction unit to the outside of the housing.

Classes IPC  ?

• B05B 15/555 - Aménagements pour le nettoyageAménagements pour empêcher les dépôts, le séchage ou un blocageAménagements pour détecter une évacuation incorrecte en raison de la présence d’un corps étranger en utilisant des fluides nettoyants délivrés par des buses de nettoyage
• F26B 5/12 - Procédés de séchage d'un matériau solide ou d'objets n'impliquant pas l'utilisation de chaleur par aspiration
• G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides

Abrégé

Provided is a transfer robot for transferring a substrate. The transfer robot includes: a base; a plurality of arms installed above the base to be vertically spaced apart and to extend and retract in a forward and backward direction relative to the base, each having a hand supporting the substrate; and a photographing unit disposed above the base and photographing an area of each of the plurality of hands in which the substrate is placed, and an area photographed by the photographing unit includes an edge area of the substrate.

Classes IPC  ?

• G06T 7/00 - Analyse d'image
• B25J 11/00 - Manipulateurs non prévus ailleurs
• B25J 15/00 - Têtes de préhension
• B25J 19/02 - Dispositifs sensibles
• G06T 7/70 - Détermination de la position ou de l'orientation des objets ou des caméras
• H10P 72/00 -
• H10P 72/76 -

Abrégé

Provided is an apparatus of processing a substrate. The apparatus includes: a treating chamber for processing a substrate with a treatment liquid; and a treatment liquid supply unit for supplying the treatment liquid to the treating chamber, in which the treatment liquid supply unit includes: a treatment liquid tank for storing the treatment liquid; a treatment liquid supply line for connecting the treatment liquid tank and the treating chamber; and an acoustic wave applying module which is installed in the treatment liquid supply line and applies an acoustic wave to the treatment liquid supply line to improve cleanliness of the treatment liquid. Accordingly, foreign substances, such as particles and bubbles, in the treatment liquid may be removed by applying acoustic waves to the treatment liquid.

Classes IPC  ?

• B01D 21/28 - Dispositifs mécaniques auxiliaires pour accélérer la sédimentation, p. ex. par des vibrateurs
• B01D 19/00 - Dégazage de liquides
• B01D 21/30 - Dispositifs de commande
• H10P 72/00 -

Abrégé

A nozzle collision-detection method is provided that prevents collisions among two or more nozzles by monitoring their movements in real time. The nozzle collision-detection method is performed by a computing device and includes: generating, within an orthogonal coordinate system, a first nozzle image corresponding to a first nozzle and a second nozzle image corresponding to a second nozzle; moving the first nozzle image according to first encoder information and moving the second nozzle image according to second encoder information; when the first nozzle image is at a first position and the second nozzle image is at a second position, generating a first projection image and a second projection image by projecting the first nozzle image and the second nozzle image from a first side of the orthogonal coordinate system; and determining whether a collision occurs between the first nozzle and the second nozzle by analyzing the first projection image and the second projection image.

Classes IPC  ?

• B05B 12/00 - Aménagements de commande de la distributionAménagements de réglage de l’aire de pulvérisation
• B05B 3/00 - Appareillages de pulvérisation ou d'arrosage avec des éléments de sortie mobiles ou des éléments déflecteurs mobiles
• G06T 1/00 - Traitement de données d'image, d'application générale
• G06T 7/215 - Découpage basé sur le mouvement

Abrégé

A substrate processing device includes a plurality of processing chambers in which substrates are disposed, respectively, and an ultraviolet (UV) light source disposed between the plurality of processing chambers and irradiating the respective substrates in the plurality of processing chambers with UV light.

Classes IPC  ?

• G03F 7/20 - ExpositionAppareillages à cet effet
• G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
• H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

An article storage system is provided, in which a container in which an article is stored is stored. The article storage system comprises a support unit perpendicular to an installation surface, a rotation unit rotated axially in the support unit, and a shelf module provided in the rotation unit so that its arrangement is changed in conjunction with rotation of the rotation unit, accommodating the container.

Classes IPC  ?

• B65G 1/127 - Dispositifs d'emmagasinage mécaniques avec supports ou porte-objets mobiles en circuit fermé pour faciliter l'insertion ou l'enlèvement des objets le circuit étant entièrement situé dans un plan vertical
• B65G 1/04 - Dispositifs d'emmagasinage mécaniques

Abrégé

Semiconductor manufacturing equipment and a substrate processing method and the same are disclosed, the substrate processing method includes annealing a silicon substrate including an insulating film by supplying hydrogen gas to the silicon substrate; and supplying a laser beam to reduce an interface trap density between the insulating film and the silicon substrate.

Classes IPC  ?

• H10P 34/42 -
• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H10P 72/00 -
• H10P 95/90 -

Abrégé

A vacuum pad, a hand, and a transfer apparatus are provided. The vacuum pad includes a piezoelectric element installed on a hand body while covering a suction hole of the hand body, and having a hollow portion, and a pad member installed on the piezoelectric element to cover the hollow portion, and having a pad hole communicating with the suction hole.

Classes IPC  ?

• B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
• B25J 11/00 - Manipulateurs non prévus ailleurs
• B25J 13/08 - Commandes pour manipulateurs au moyens de dispositifs sensibles, p. ex. à la vue ou au toucher
• F16K 31/00 - Moyens de fonctionnementDispositifs de retour à la position de repos
• G05D 16/20 - Commande de la pression d'un fluide caractérisée par l'utilisation de moyens électriques
• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension

Abrégé

Provided is an apparatus for processing a substrate. The apparatus includes a valve assembly. The valve assembly includes: a body which has an inlet port and an outlet port, and is formed with a driving space and a flow passage therein; a diaphragm for opening and closing the flow passage; and a plunger for moving the diaphragm between a closed position that closes the flow passage and an open position that opens the flow passage, and the plunger includes: a plate; and a shaft, the body is formed with a first hole and a second hole connected to the driving space to exhaust atmosphere in the driving space, the first hole and the second hole are disposed to be spaced apart from each other in a moving direction of the plunger.

Classes IPC  ?

• F16K 7/17 - Dispositifs d'obturation à diaphragme, p. ex. dont un élément est déformé, sans être déplacé entièrement, pour fermer l'ouverture à diaphragme plat, en forme d'assiette ou en forme de bol disposé pour être déformé contre un siège plat le diaphragme étant actionné par pression d'un fluide
• B08B 3/04 - Nettoyage impliquant le contact avec un liquide
• F16K 31/122 - Moyens de fonctionnementDispositifs de retour à la position de repos actionnés par un fluide le fluide agissant sur un piston

Abrégé

Provided are a temperature measuring apparatus and a substrate processing apparatus. The temperature measuring apparatus includes: a base plate on which a plurality of measurement pads is formed; a plurality of sensor units provided on the base plate and electrically connected to the corresponding measurement pad; and a signal processing unit electrically connected to the measurement pads and configured to receive sensing values from the plurality of sensor units, in which the signal processing unit includes: a plate; a signal processing substrate provided on the plate, on which a processor configured to process the sensing value is mounted; and a plurality of legs extending downward from a lower surface of the plate to separate the plate and the base plate from each other.

Classes IPC  ?

• G01K 1/02 - Moyens d’indication ou d’enregistrement spécialement adaptés aux thermomètres
• G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
• G03F 7/16 - Procédés de couchageAppareillages à cet effet
• H10P 72/00 -

Abrégé

A substrate processing apparatus includes a support unit supporting a substrate; a recovery vessel disposed around the support unit, a mounting base on which the recovery vessel is mounted, and a driving unit moving the mounting base longitudinally and transversely.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

A substrate processing apparatus and a substrate processing method are proposed, and the substrate processing apparatus includes a chamber having a processing space therein, a substrate support unit arranged in the processing space and for supporting a substrate, an ion blocker arranged above the substrate support unit and for dividing the processing space into an upper region where plasma is generated and a lower region, a gas supply unit for supplying a fluorine-containing gas to the upper region, an upper electrode module arranged above the ion blocker and for supplying the fluorine-containing gas to the upper region, and a high-frequency power module for applying electric power to the upper electrode module to generate the plasma in the upper region, wherein a coating layer for capturing fluorine radicals of the plasma is formed on at least a part of a surface of the upper electrode module.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H01L 21/311 - Gravure des couches isolantes

Abrégé

Disclosed is a method of processing a substrate. The method includes: a first etching operation of rotating a substrate having a first film and a second film and etching the second film by supplying an etchant to the substrate; and after the first etching operation, a second etching operation of etching the second film by supplying the etchant to the rotating substrate, in which a second temperature, which is a temperature for etching the second film in the second etching operation, is lower than a first temperature for etching the second film in the first etching operation.

Classes IPC  ?

• H10P 50/64 -
• H10P 72/00 -

Abrégé

Disclosed is a method of processing a substrate. The method includes: an etchant supply operation of rotating a substrate on which a first film and a second film are formed and supplying an etchant for etching the first film onto the substrate; and a puddle operation of stopping the supply of the etchant, forming a puddle made of the etchant on the substrate, and selectively etching the first film with respect to the second film by the puddle, in which the puddle is a liquid film made of the etchant, and a temperature of the puddle is adjusted in the puddle operation.

Classes IPC  ?

• H01L 21/306 - Traitement chimique ou électrique, p. ex. gravure électrolytique
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

Disclosed is an atomic layer etching method of etching an etching target film by performing a surface modification step and an etching step. The surface modification step includes a surface modification layer formation step of forming a surface modification layer on a surface of the etching target film using radicals and a precursor supply step of adsorbing precursor molecules onto the surface of the etching target film having the surface modification layer. The etching step includes a heat treatment step of thermally treating a substrate having undergone the surface modification step to remove the surface modification layer from the etching target film and a cooling step of cooling the substrate. The surface modification step further includes a plasma treatment step of treating the surface of the etching target film using ions in at least one of sections before the surface modification layer formation step and after the precursor supply step.

Classes IPC  ?

• H01L 21/223 - Diffusion des impuretés, p. ex. des matériaux de dopage, des matériaux pour électrodes, à l'intérieur ou hors du corps semi-conducteur, ou entre les régions semi-conductricesRedistribution des impuretés, p. ex. sans introduction ou sans élimination de matériau dopant supplémentaire en utilisant la diffusion dans ou hors d'un solide, à partir d'une ou en phase gazeuse
• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs

Abrégé

Disclosed are a substrate support unit and a substrate processing apparatus including the same, in which a heat generation issue of a bias electrode is improved. The substrate support unit is disposed inside a chamber body for processing of a substrate using plasma to hold the substrate, and includes a dielectric plate including a chucking electrode for adsorption of the substrate, a bias electrode provided inside the dielectric plate at a position below the chucking electrode to control plasma treatment process characteristics, and a bias power line configured to supply power to the bias electrode. The bias power line branches into a plurality of lines, and the plurality of lines forms junction portions together with the bias electrode in a region outside the substrate.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H01J 9/30 - Fabrication des culots

Abrégé

Provided is a transfer robot for transferring a substrate. The transfer robot includes: a base; an arm which is connected to the base and is movable forward and backward with respect to the base; a hand connected to the arm; a driving unit for driving the arm; and a body which includes an electromagnet and is fixedly installed on the base, in which the hand includes: a support plate; a front guide fixedly installed at a front end of an upper surface of the support plate to support a region of a lower surface of an edge of a substrate placed on the support plate; a rear guide fixedly installed at a rear side of the upper surface of the support plate and including a rear support surface for supporting the region of the lower surface of the edge of the substrate placed on the support plate; and a movable guide unit located at the rear side of the upper surface of the support plate and movable between a first position at which the substrate is not supported and a second position capable of supporting the region of the lower surface of the substrate, the movable guide unit includes: a rail; a movable guide including a movable support surface capable of supporting the region of the lower surface of the substrate, and movable along the rail; a support rod connected to the movable guide; and a first magnetic block fixedly installed on the support rod and connectable with the electromagnet by magnetic force.

Classes IPC  ?

• H10P 72/76 -
• B08B 3/04 - Nettoyage impliquant le contact avec un liquide
• H10P 72/50 -

Abrégé

The apparatus may include an index module including a plurality of load ports on which a container for accommodating a substrate is placed and a transfer frame in which an index robot for transferring a substrate is installed; a plurality of treating modules each including a plurality of treating chambers vertically stacked in multiple stages and a transfer robot for loading and unloading a substrate to and from the stacked treating chamber; and a plurality of movable buffers configured to temporarily store the substrate, in which the index module and the plurality of treating modules are arranged along a first direction, and each of the plurality of movable buffers is provided to be movable between a standby position accessible by the index robot and a conveyance position accessible by the transfer robot provided to each of the plurality of treating modules.

Classes IPC  ?

• H10P 72/00 -
• B08B 3/04 - Nettoyage impliquant le contact avec un liquide
• B65G 47/90 - Dispositifs pour saisir et déposer les articles ou les matériaux
• H10P 72/76 -

Abrégé

Provided is a substrate processing apparatus including: a liquid treating chamber for processing a substrate with multiple types of treatment liquids; an individual exhaust pipe connected to the liquid treating chamber to exhaust an atmosphere in the liquid treating chamber; a plurality of collective exhaust pipes connected to the individual exhaust pipes; and an exhaust switching unit which is disposed between the individual exhaust pipe and the collective exhaust pipe, and switches an exhaust path of the exhaust gas to a corresponding collective exhaust pipe according to the property of the exhaust gas flowing in the individual exhaust pipe, in which the exhaust switching unit includes an exhaust switching module disposed between the individual exhaust pipe and each of the collective exhaust pipes.

Classes IPC  ?

• H10P 72/00 -

Abrégé

Provided is a transfer robot for transferring a substrate, the transfer robot including: a hand assembly including a hand supporting a substrate and a hand support connected to the hand; and a driving unit for driving the hand assembly, in which wherein the hand includes: a support plate coupled to the hand support to support the substrate; a fixed guide which is fixedly installed on a front end of an upper surface of the support plate to support a region of a lower surface of an edge of the substrate placed on the support plate; a rotary guide located at a rear end of the upper surface of the support plate so as to be spaced apart from the fixed guide to support the region of the lower surface of the edge of the substrate; and a guide driving unit for driving the rotary guide.

Classes IPC  ?

• H10P 72/76 -
• B25J 11/00 - Manipulateurs non prévus ailleurs
• B25J 15/00 - Têtes de préhension

Abrégé

Disclosed are a substrate transfer robot capable of accurately recognizing the positions of a plurality of substrates while transferring the substrates, a method of recognizing the positions of the substrates by the substrate transfer robot, and a substrate processing apparatus including the substrate transfer robot. The substrate transfer robot includes a robot arm, an upper robot hand coupled to the robot arm to support a first substrate from below, a lower robot hand coupled to the robot arm at a position below the upper robot hand to support a second substrate from below, an upper camera disposed above the upper robot hand, and a lower camera disposed below the lower robot hand. The upper camera and the lower camera capture images of the first substrate and the second substrate in directions tilted from inner sides of the first and second substrates toward outer sides of the first and second substrates.

Classes IPC  ?

• B25J 11/00 - Manipulateurs non prévus ailleurs
• B25J 9/16 - Commandes à programme
• B25J 13/08 - Commandes pour manipulateurs au moyens de dispositifs sensibles, p. ex. à la vue ou au toucher
• B25J 19/02 - Dispositifs sensibles

Abrégé

A substrate processing apparatus includes a processing chamber having a processing space, a support portion disposed within the processing space, capable of being raised and lowered and rotatable, and including a hot plate configured to support and heat a substrate, and a heating unit disposed within the processing space to be spaced apart from an upper side of the support portion, and including a lamp unit containing a plurality of lamps heating the substrate. The processing chamber includes a gas inlet portion for introducing gas into the processing space, a gas discharge portion spaced apart from the gas inlet portion and discharging the gas from the processing space, and a sealing portion disposed below the gas inlet portion or the gas discharge portion, and selectively sealing between upper and lower portions of the substrate when the substrate is seated on the support portion.

Classes IPC  ?

• G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
• G03F 7/16 - Procédés de couchageAppareillages à cet effet
• G03F 7/20 - ExpositionAppareillages à cet effet

Abrégé

An embodiment of the present disclosure provides a substrate processing apparatus including a processing chamber having a processing space provided therein, and including a gas-supply unit introducing gas into the processing space; a support portion disposed in the processing space and supporting a substrate; a heating unit disposed to be spaced apart from an upper side of the support portion in the processing space, and including a lamp portion including a plurality of lamps heating the substrate, and a window disposed between the lamp portion and the support portion; and a discharge unit disposed to reciprocate in one direction between the support portion and the heating unit, and suctioning and discharging gas in the processing space.

Classes IPC  ?

• G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
• G03F 7/16 - Procédés de couchageAppareillages à cet effet

Abrégé

An inkjet head cleaning apparatus includes: a first bath receiving a cleaning liquid from a supply tank, the first bath including a first bath bottom surface and a plurality of sidewalls connected to the first bath bottom surface, and having an open top; a second bath in contact with a first sidewall among the sidewalls of the first bath, the second bath including a second bath bottom surface; a water level detection sensor configured to detect a water level in the second bath; and a controller configured to control an amount of the cleaning liquid supplied to the first bath according to the detected water level in the second bath, wherein a machined groove is provided on the first sidewall of the first bath, and the cleaning liquid in the first bath overflows through the machined groove and is delivered to the second bath along the first sidewall.

Classes IPC  ?

• B41J 2/165 - Prévention du colmatage des ajutages, p. ex. nettoyage, obturation par un capuchon ou humidification des ajutages

Abrégé

Provided is an apparatus for processing a substrate. The apparatus includes a cleaning unit for cleaning a nozzle. The cleaning unit includes: a body having an inner space; a first inner plate for dividing the inner space into a first space and a first buffer space; a cleaning liquid supply pipe for supplying a cleaning liquid to clean the nozzle into the first buffer space; a first driver for rotating the first inner plate; a second inner plate for dividing the inner space into a second space and a second buffer space; a second gas supply pipe for supplying gas to dry the nozzle into the second buffer space; and a second driver for rotating the second inner plate.

Classes IPC  ?

• H10P 72/00 -
• H10P 70/00 -

Abrégé

The present invention relates to a substrate treating apparatus and a substrate treating method using the same, and a first driving unit, which is a structure that allows a chuck pin and a guide ring unit to move at the same time, includes a bearing, thereby reducing damage to a puddle and ensuring substrate treatment uniformity by rotating the substrater even when a guide ring is lowered and the chuck pin is separated from the substrate.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Provided is an apparatus for processing a substrate. The apparatus includes standby port which is located on one side of a cup unit and in which a nozzle is located after supplying a treatment liquid. The standby port includes: an outer wall with an inner space; a first gas discharge port provided to supply gas toward one side of the nozzle accommodated in the standby port; and a second gas discharge port provided to supply gas independently of the first gas discharge port toward the other side of the nozzle accommodated in the standby port. The first gas discharge port and the second gas discharge port are provided at mutually opposite positions.

Classes IPC  ?

• B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Disclosed are a unit that circulates a liquid at a constant temperature and an apparatus for processing a substrate by maintaining a constant temperature of the treatment liquid by using the same. According to an embodiment, when a concentration measured by a sensor unit is equal to or greater than a set value, a controller controls a liquid circulation unit to discharge pure water to a discharge unit, supply pure water into a manifold, and add a rust inhibitor to prevent corrosion of the liquid circulation unit, and damage and leakage due to the corrosion, thereby improving the lifespan and reliability of a substrate processing apparatus.

Classes IPC  ?

• G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides
• B01D 15/10 - Adsorption sélective, p. ex. chromatographie caractérisée par des caractéristiques de structure ou de fonctionnement
• C02F 1/00 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout
• C02F 1/28 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par absorption ou adsorption
• C02F 1/66 - Traitement de l'eau, des eaux résiduaires ou des eaux d'égout par neutralisationAjustage du pH
• C02F 103/34 - Nature de l'eau, des eaux résiduaires ou des eaux ou boues d'égout à traiter provenant de l'industrie chimique non prévue dans les groupes
• H10P 72/00 -

Abrégé

Provided is an apparatus for processing a substrate, the apparatus including: a liquid processing chamber for processing a substrate; and a liquid supply unit for supplying a liquid to the substrate. The liquid supply unit includes: a storage assembly in which a liquid is stored; a liquid supply pipe for supplying the liquid in the storage assembly to the liquid processing chamber; and a trap tank installed in the liquid supply pipe. The storage assembly includes: a pack unit including an inner pack in which a liquid is stored and an outer pack provided to surround the inner pack; and a pressurization unit for pressurizing the inner pack, and the liquid supply pipe is coupled to the inner pack so that the liquid in the inner pack is transmitted to the trap tank by gravity. The inside of the inner pack is provided with vacuum, and the liquid does not directly contact gas, thereby preventing bubbles from being generated inside the liquid. In addition, it is possible to save energy by transmitting the liquid in the inner pack to the trap tank by gravity.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluideRécupération de l'excès de liquide ou d'un autre matériau fluide
• G03F 7/16 - Procédés de couchageAppareillages à cet effet

Abrégé

Provided is an apparatus for processing a substrate, the apparatus including: at least one transfer chamber; and a transfer robot which is linearly movable within the transfer chamber and transfers a substrate, in which the transfer robot includes a power receiving unit that receives power, the transfer chamber includes: a chamber base; and a power feeding unit provided on the chamber base and wirelessly transmitting power to the power receiving unit, and the power feeding unit includes: a plurality of power feeding cables; a plurality of terminal units connected to the plurality of power feeding cables; and at least one connection member connected to at least one of the plurality of terminal units so as to switch a direction of a current flowing in the power feeding cable at least twice or more times.

Classes IPC  ?

• B25J 19/00 - Accessoires adaptés aux manipulateurs, p. ex. pour contrôler, pour observerDispositifs de sécurité combinés avec les manipulateurs ou spécialement conçus pour être utilisés en association avec ces manipulateurs
• B25J 11/00 - Manipulateurs non prévus ailleurs
• B25J 21/00 - Enceintes à dispositifs de manipulation intégrés
• H01R 13/73 - Moyens de montage des pièces de couplage sur les appareils ou structures, p. ex. sur un mur

Abrégé

Disclosed is an apparatus for treating a substrate, the apparatus including: a vessel having a treatment space therein; a support unit for supporting a substrate in the treatment space; a supply port provided in the vessel, and for supplying a process fluid to the treatment space; and a filler unit disposed below the substrate supported on the support unit in the treatment space, in which the filler unit includes: a plate disposed opposite the substrate supported on the support unit; and a plurality of legs extending downwardly from a lower surface of the plate to support the plate within the vessel, a bottom wall of the vessel is formed with a groove defined by an inner surface and a bottom surface, the plate is positioned higher than the groove, and each of the plurality of legs is provided to be in contact with the inner surface forming the groove.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

A ground-based transport apparatus for transporting a container in a semiconductor manufacturing plant includes a driving controller configured to move the ground-based transport apparatus on a ground of the semiconductor manufacturing plant, a housing on the driving controller, a shelf structure in the housing and including a plurality of shelves, and a manipulator arm assembly in the housing and spaced apart from the shelf structure. The manipulator arm assembly is configured to remove the container from a first shelf of the plurality of shelves, and set the container on a second shelf of the plurality of shelves. The driving controller is further configured to transport the container between a plurality of facilities, and store the container in a ground-based storage apparatus disposed on the ground of the semiconductor manufacturing plant. Each facility of the plurality of facilities includes a substrate treating apparatus. The container stores a substrate.

Classes IPC  ?

• G05D 1/667 - Livraison ou récupération de charges utiles
• G05D 1/661 - Amarrage à une station de base
• G05D 1/689 - Interaction avec des charges utiles ou des entités externes dirigeant des charges utiles vers des cibles fixes ou en mouvement
• G05D 107/70 - Sites industriels, p. ex. entrepôts ou usines
• G05D 109/10 - Véhicules terrestres
• G05D 111/10 - Signaux optiques
• G05D 111/50 - Signaux internes, c.-à-d. provenant de capteurs situés à l’intérieur du véhicule, p. ex. boussoles ou capteurs angulaires
• G06K 7/14 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire utilisant la lumière sans sélection des longueurs d'onde, p. ex. lecture de la lumière blanche réfléchie

Abrégé

The present disclosure relates to a multi-axis stage apparatus capable of significantly improving the precision of wafer bonding. The apparatus may include a base portion, a first driving device configured to vertically move at least a portion thereof in a third axis direction by a first distance with respect to the base portion, a second driving device formed on the first driving device and configured to vertically move at least a portion thereof in the third axis direction by a second distance, and an alignment stage connected to the second driving device and configured to align a first wafer chuck holding a first wafer such that the first wafer can be vertically moved in the third axis direction by a distance equal to the sum of the first and second distances.

Classes IPC  ?

• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
• H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
• H10D 88/00 - Dispositifs intégrés tridimensionnels [3D]

Abrégé

Provided is an apparatus for processing a substrate, the apparatus including: a liquid treating chamber for liquid-treating a substrate; and a liquid supply unit for supplying a treatment liquid to the liquid treating chamber. The liquid supply unit includes: a supply tank for storing the treatment liquid therein; a circulation line connected to the supply tank to circulate the treatment liquid; and a liquid supply line having an opening/closing valve installed and branching from the circulation line to supply the treatment liquid to the liquid treating chamber. The supply tank is provided with a first stirrer that configured to apply flow pressure to the treatment liquid in the supply tank.

Classes IPC  ?

• B01F 23/43 - Mélange de liquides avec des liquidesÉmulsion en utilisant des agitateurs entraînés
• B01F 23/45 - Mélange de liquides avec des liquidesÉmulsion en utilisant le mélange à écoulement
• B01F 25/50 - Mélangeurs de circulation, p. ex. dans lesquels au moins une partie du mélange est évacuée d'un récipient et réintroduite dans celui-ci
• B01F 33/45 - Mélangeurs magnétiquesMélangeurs avec agitateurs à entraînement magnétique
• B01F 35/90 - Systèmes de chauffage ou de refroidissement
• B01F 101/58 - Mélange de matières pour les semi-conducteurs, p. ex. pendant le processus de fabrication de semi-conducteurs ou de plaquettes
• B08B 3/08 - Nettoyage impliquant le contact avec un liquide le liquide ayant un effet chimique ou dissolvant
• B08B 3/10 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Provided is an apparatus for processing a substrate, the apparatus including: a process module for processing a substrate; a buffer unit having a buffer blade on which the substrate is placed; and transfer unit for transferring the substrate between the process module and the buffer unit, in which the buffer unit includes a moving member for moving the buffer blade so that the buffer blade is moved to a standby position and a use position where the transfer unit is accessible.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• B08B 5/02 - Nettoyage par la force de jets, p. ex. le soufflage de cavités
• B08B 5/04 - Nettoyage par aspiration, avec ou sans action auxiliaire
• B08B 17/02 - Procédés pour empêcher la salissure pour empêcher le dépôt de crasses ou de poussières

Abrégé

Disclosed is a method of processing a substrate, the method including: processing a substrate by supplying a treatment liquid to the substrate through a liquid supply line in which an opening/closing valve and a suck-back valve are installed; closing the opening/closing valve based on a first opening/closing profile; and performing a suck-back operation based on a first suck-back profile, in which the first opening/closing profile includes information on a closing slope, which is a slope of a pneumatic pressure applied to the opening/closing valve over time, the first suck-back profile includes information on a suck-back slope, which is a slope of a pneumatic pressure applied to the suck-back valve over time, and the first suck-back profile includes a plurality of different suck-back slopes.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Provided is a method of processing a substrate. The method includes: a liquid treating operation of supplying a treatment liquid to the substrate; a drying operation of removing the treatment liquid supplied in the liquid treating operation from the substrate; and a line width correcting operation of correcting a line width of a pattern formed on the substrate in the liquid treating operation, in which the line width correcting operation includes correcting the line width of the pattern by supplying the treatment liquid to a treatment space in which the substrate is provided, but controlling a pressure of the treatment space to a pressure capable of maintaining the treatment fluid in a supercritical or subcritical state.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Provided is a transfer robot for transferring a substrate, the transfer robot including: a hand for supporting a substrate; and a driving unit for driving the hand, in which the hand includes: a base plate; a first support part mounted on the base plate and vacuum-adsorbing a bottom surface of the substrate and supporting the substrate; and a second support part mounted on the base plate and supporting an edge region of the substrate, and the first support part and the second support part are configured to support the substrate at different heights.

Classes IPC  ?

• B25J 11/00 - Manipulateurs non prévus ailleurs
• B25J 9/10 - Manipulateurs à commande programmée caractérisés par des moyens pour régler la position des éléments manipulateurs
• B25J 15/06 - Têtes de préhension avec moyens de retenue magnétiques ou fonctionnant par succion
• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail

Abrégé

Proposed is an optical-based high-speed temperature measurement method and a high-speed temperature measurement device, wherein the method includes heating a substrate with a heat source, emitting a measured light to the substrate and providing an original wavelength signal of the measured light to a processing device, receiving a reflected optical signal of the measured light to provide the same to the processing device as a reflected wavelength signal, and calculating a temperature change of the substrate, and the device includes a measurement laser unit for emitting the measured light to the substrate in order to monitor the temperature change of the substrate, a detection unit for detecting an optical signal by the measurement laser unit, and a high-speed signal processing unit for outputting data on the temperature change of the substrate by using the optical signal detected by the detection unit.

Classes IPC  ?

• G01J 5/00 - Pyrométrie des radiations, p. ex. thermométrie infrarouge ou optique
• G01J 5/08 - Dispositions optiques
• G01J 5/0803 - Dispositions pour l’atténuation en fonction du temps des signaux de rayonnement

Abrégé

The present invention relates to a buffer chamber and a substrate processing apparatus including the buffer chamber. In more detail, the present invention relates to a buffer chamber that can maintain the atmosphere of a buffer unit at low humidity, and a substrate processing apparatus including the buffer chamber. According to an embodiment, the substrate processing apparatus includes: a processing module processing substrates; and an index module transferring substrates to the processing module from a container accommodating substrates, and putting substrates processed at the processing module into the container, wherein the processing module comprises: a transfer chamber having a transfer unit transferring substrates to the processing module; and a buffer chamber that is disposed between the index module and the transfer chamber and in which substrates are temporarily placed, the buffer chamber comprises: a housing providing a standby space; a door opening and closing the housing; a buffer unit in which substrates are placed in the standby space; a gas supply unit supplying gas to the standby space; and an exhaust unit exhausting the standby space, and pressures in the transfer chamber and the index module are different from each other.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

The present invention provides an apparatus for treating a substrate. The apparatus of processing a substrate includes: a treatment bath having an receiving space accommodating treatment liquid, and treating a plurality of substrates; and a supporting unit supporting the substrates in the treatment bath, wherein the supporting unit includes: a support having a first supporting rod supporting end portions of the substrates in a vertical state; and a fixing plate coupled to the support and fixing the support, a plurality of first slots in which edges of the substrates are inserted is formed at the first supporting rod, each of the plurality of first slots is defined by a first side, a second side facing the first side, and a bottom, a front and a rear of the first slot are open toward the receiving space, and the bottom of the first slot comprises contact protrusions protruding upward from a lower end of the first side of the first slot and supporting lower end portions of the substrates.

Classes IPC  ?

• H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

An exhaust unit includes a housing configured to provide an inflow space into which byproducts generated during a substrate processing process are introduced; a byproduct inlet portion including at least one inlet port provided in an open upper surface of the housing and having a structure that partially opens the inflow space so that the byproducts are introduced into the inflow space, the byproduct inlet portion including a plurality of piece plates that respectively cover open regions, excluding the open region in which the at least one inlet port is provided, among a plurality of open regions of the open upper surface of the housing; and a byproduct exhaust portion having a hole structure provided on a portion of a lower surface of the housing so as to exhaust the byproducts introduced into the inflow space of the housing through the byproduct inlet portion, to the outside.

Classes IPC  ?

• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Disclosed are a support unit and a substrate processing apparatus including the same, which prevent a backflow, a wake, or an upward airflow from occurring around a spin chuck. The support unit and the substrate processing apparatus including the same include: a spin chuck; a guide ring provided to surround the spin chuck; a guide ring is installed under the guide ring, and includes cylindrical support with open top and bottom, and a supporting body installed under the guide ring and having a cylindrical shape with open top and bottom portions, in which the supporting body is provided to surround the side of the spin chuck, and a plurality of discharge ports is formed in the supporting body.

Classes IPC  ?

• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

Provided is a transfer unit for transferring a substrate. The transfer unit includes: a hand on which a substrate is placed; and a detector for detecting the degree to which the substrate placed on the hand is out of a correct position of the substrate on the hand. The detector includes: a light emitting sensor located on one side between an upper side and a lower side of the substrate placed at the correct position on the hand to emit light; and a light receiving sensor located on the other side between the upper side and the lower side of the substrate placed at the correct position on the hand to receive the light emitted by the light emitting sensor. The light emitting sensor is installed to emit light obliquely to the substrate in a direction toward an outside of a radial direction of the substrate placed at the correct position on the hand.

Classes IPC  ?

• H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces

Abrégé

Disclosed are a transfer module capable of effectively discharging very fine particles present on a wall surface or a bottom surface and semiconductor manufacturing equipment including the transfer module. The transfer module configured to transfer a substrate in the semiconductor manufacturing equipment includes a frame body, a track disposed on the frame body, a transfer robot configured to travel along the track, and a particle collection device provided in the frame body. The particle collection device includes a stacked substrate in which three-phase electrodes are disposed to be spaced apart from each other in a horizontal direction and a vertical direction and a three-phase power supply configured to supply three-phase power to the three-phase electrodes.

Classes IPC  ?

• B03C 7/02 - Séparateurs
• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail

Abrégé

Disclosed are an interface module capable of increasing substrate throughput, a method of operating the interface module, and a substrate processing apparatus including the interface module. The interface module configured to load and unload a substrate in the substrate processing apparatus includes a load port module including a plurality of load ports configured to allow a container accommodating a substrate to be placed thereon and an index module disposed on one side of the load port module and configured to unload the substrate from the container and load the substrate into a buffer module or to load a substrate processed in the substrate processing apparatus into the container.

Classes IPC  ?

• H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces