Abrégé

A local dry etching apparatus includes a vacuum chamber that has a predetermined degree of vacuum therewithin, a nozzle including a first end and a second end, at least the first end of the nozzle open to the vacuum chamber, a discharge tube including a first end that is connected to the second end of the nozzle, a plasma generator provided in the discharge tube, an electromagnetic wave irradiation part configured to oscillate electromagnetic waves and connected to the discharge tube via the electromagnetic wave transmitter to introduce the oscillated electromagnetic waves to the plasma generator, and a spacer interposed between the nozzle and the discharge tube.

Classes IPC  ?

• H01J 37/32 - Tubes à décharge en atmosphère gazeuse
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants

Abrégé

The purpose of the present invention is to provide a grinding fluid having relatively high recovery efficiency by centrifugation while suppressing a decrease in dispersibility when abrasive grains are contained. This grinding fluid has a total content of alcohol-based solvents and ether-based solvents in the total solvents of the grinding fluid of 95-100 mass%, and the ratio of the mass of the ether-based solvents to the alcohol-based solvents is 1-5 times. The viscosity of the ether-based solvents at 25°C is lower than the viscosity of the alcohol-based solvents, and the difference in the viscosity of the ether-based solvents and the alcohol-based solvents is preferably 15-20 mPa⋅s.

Classes IPC  ?

• C09K 3/14 - Substances antidérapantes; Abrasifs
• H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

Abrégé

The purpose of the present invention is to provide an abrasive material which can has relatively high machining efficiency while inhibiting damage to a workpiece caused when the workpiece falls in a groove, etc. The present invention is an abrasive material that comprises a base material, and an abrasive layer stacked on a surface side of the base material, and that is characterized in that: the abrasive layer contains abrasive grains and a binder for the abrasive grains, and includes multiple kinds of abrasive parts which show different abrasion amounts in the Taber abrasion test; a first abrasive part which shows the smallest abrasion amount among the multiple kinds of abrasive parts is surrounded by other abrasive parts; the ratio of the abrasion amounts of the other abrasive parts to the abrasion amount of the first abrasive part is at least 3; and the ratio of the area occupied by all the abrasive parts in the abrasive layer is 15-100% inclusive. The ratio of the area occupied by the first abrasive part in the abrasive layer is preferably 3-16% inclusive. The first abrasive part may contain diamond abrasive grains, and the content of the diamond abrasive grains in the first abrasive part is preferably 1-20 vol% inclusive.

Classes IPC  ?

• B24D 11/00 - Caractéristiques de construction des matériaux abrasifs flexibles; Caractéristiques particulières de la fabrication de ces matériaux
• B24D 3/00 - Propriétés physiques des corps ou feuilles abrasives, p.ex. surfaces abrasives de nature particulière; Corps ou feuilles abrasives caractérisés par leurs constituants
• B24D 11/04 - Surfaces à dureté variable

Abrégé

The present invention addresses the following problems: reducing the frequency of tuning in a local dry etching device, or making it possible to perform processing for a long period of time at the same tuning; reducing to the extent possible the frequency of evacuating for the purpose of changing discharge tubes and improving the overall processing efficiency in local dry etching processing; and hindering the progress of deterioration of the discharge tubes and thereby suppressing as much as possible fluctuations in processing conditions caused by such deterioration and performing highly accurate processing while maintaining a stable processing rate. A local dry etching device (1) is provided with a vacuum chamber (2), a single work table (7), a plurality of discharge tubes (31-34), a material gas supply device (9) for supplying material gas to one discharging tube that has been selected, a single electromagnetic wave oscillator (6) for which output is adjustable, and waveguide tubes (41-45) to which an electromagnetic wave change apparatus (5) is provided. The electromagnetic wave change apparatus (5) sequentially switches between the discharge tubes to select one by which to emit electromagnetic waves.

Classes IPC  ?

• H01L 21/3065 - Gravure par plasma; Gravure au moyen d'ions réactifs
• H05H 1/46 - Production du plasma utilisant des champs électromagnétiques appliqués, p.ex. de l'énergie à haute fréquence ou sous forme de micro-ondes

Abrégé

[Problem] To provide a circumferential polishing device capable of polishing edges of a workpiece having different bevel angles. [Solution] An edge polishing unit (2A, 2B) that polishes edges (Ea, Eb) on the front and back faces of a workpiece (W) comprises: a polishing part mount (11) to which a polishing part (10) is mounted; a mount support part (12) that tiltably supports the polishing part mount (11); an angle adjusting mechanism for the mount (13) that adjusts the tilt angle of the polishing part mount (11); an oscillation support base (15) that pivotably supports the mount support part (12) along an oscillation line; a base support (17) that tiltably supports the oscillation support base (15); an angle adjusting mechanism for a base (18) that adjusts the tilt angle of the oscillation support base (15) so that the same is parallel to the workpiece (W) edge (Eb); and a base (19) that supports the base support (17) in the horizontal and vertical directions so that the position can be corrected.

Classes IPC  ?

• B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavures; Accessoires à cet effet
• H01L 21/304 - Traitement mécanique, p.ex. meulage, polissage, coupe

Produits et services

Abrasive paper, abrasive cloth, abrasive sand, artificial pumice stone, polishing paper, polishing cloth, polishing preparations, polishing slurry, polishing preparations to be used for polishing machines for silicon wafers, polishing slurry to be used for polishing machines for silicon wafers, polishing preparations to be used for polishing machines for semiconductor wafers, polishing slurry to be used for polishing machines for semiconductor wafers.