344); - from 0.015 wt% to 0.2 wt% of a compound chosen from among diethylenetriamine penta(methylene phosphonic acid) (DTPMP), aminotris(methylenephosphonic acid) (ATMP) and mixtures thereof; - water, wherein the weight percentages are expressed relative to the weight of the chemical etching solution, the solution having a pH of 6.5 to 8.6. The invention also relates to a method for chemically etching a layer of a titanium-based material on a microelectronic device by means of the etching solution and to a method for preparing the etching solution.
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
C23F 1/26 - Compositions acides pour les métaux réfractaires
Methods of and apparatuses for monitoring a plating bath composition by using complex designer voltammetry. The designer waveforms are optimized in order to maximize analytical output of the solitary measurement thus drastically reducing the total time required for a full analysis of a plating bath compared to traditional analytical techniques.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
4.
Chemical composition for removing nickel-platinum alloy residues from a substrate, and method for removing such residues
characterised in that it is prepared by mixing a composition B comprising bromide ions and a composition H comprising hydrogen peroxide such that in the composition C, at the moment of mixing, the molar concentration of bromide ions is comprised between 0.15 mol/L and 0.45 mol/L and the molar ratio of hydrogen peroxide with respect to bromide ions is comprised between 1.1 and 2.
placing the hot chemical composition C and the substrate in contact for a sufficient duration to remove the nickel-platinum alloy residues from the substrate.
The present invention concerns an aqueous chemical composition C for selective hot removal, from a substrate, of nickel-platinum alloy residues containing at least 8% by mass Pt in relation to the total weight of the nickel-platinum alloy, characterised in that it is prepared by mixing a composition B comprising bromide ions and a composition H comprising hydrogen peroxide so that in the composition C, at the time of mixing, the molar concentration of bromide ions is between 0.15 mol/L and 0.45 mol/L and the molar ratio of hydrogen peroxide to bromide ions is between 1.1 and 2. The invention also relates to a method for selectively removing nickel-platinum alloy residues containing at least 8% by mass Pt in relation to the total weight of the nickel-platinum alloy from a substrate, comprising the following steps: - hot preparation of a chemical composition C according to any one of claims 1 to 3, - placing the hot chemical composition and the substrate in contact for a sufficient duration to remove the nickel-platinum alloy residues from the substrate.
C23F 1/28 - Compositions acides pour les métaux du groupe du fer
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/28 - Fabrication des électrodes sur les corps semi-conducteurs par emploi de procédés ou d'appareils non couverts par les groupes
H01L 21/285 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un gaz ou d'une vapeur, p. ex. condensation
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
6.
Cleaning chemical composition for the removal of an amorphous passivation layer at the surface of crystalline materials
A cleaning chemical composition suitable, for removing a passivation layer from a substrate, wherein the passivation layer comprises residues resulting from etching of said Substrate.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of precious metals and non-precious metals; etchants for use in electronics manufacturing
8.
Solution and method for etching titanium based materials
The invention relates to a solution for etching titanium based materials, comprising from about 27 w % to about 39 w % hydrogen peroxide, from about 0.2 w % to about 0.5 w % potassium hydroxide, and at about 0.002 w % to about 0.02 w % 1,2-Diaminocyclohexane-N,N,N,N Tetra acetic Acid (CDTA), the rest being water, said solution comprising no corrosion inhibitor, and said solution having a pH comprised between about 7 and about 8. The invention further relates to a chemical composition for preparing such a solution by mixing said composition with concentrated hydrogen peroxide, said chemical composition comprising potassium hydroxide from about 5 w % to about 30 w %, C.D.T.A. at a concentration ranging from about 1% to about 5% of the potassium hydroxide concentration, the rest being water. The invention also relates to a method of etching a Titanium, Titanium nitride or Titanium Tungsten barrier layer from a microelectronic device, said method comprising contacting the Titanium, Titanium nitride or Titanium tungsten barrier layer with the solution for a time sufficient to remove the Titanium, Titanium nitride or Titanium tungsten barrier layer.
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
9.
CHEMICAL CLEANING COMPOSITION FOR REMOVING AN AMORPHOUS PASSIVATION LAYER AT THE SURFACE OF CRYSTALLINE MATERIALS
The present invention concerns a chemical cleaning composition suitable for removing, from a substrate (1A, 1B, 4), a passivation layer (2) comprising etching residues resulting from the etching of said substrate (1A, 1B, 4), comprising: - a weak acid comprising acetic acid, the amount of weak acid being between 20% by weight and 95% by weight, and preferably between 0% by weight and 80% by weight, relative to the weight of the chemical composition, - a strong non-oxidising acid comprising sulfonic methane acid, the amount of strong non-oxidising acid being between 5% by weight and 50% by weight, and preferably between 15% by weight and 50% by weight, relative to the weight of the chemical composition, - hydrofluoric acid, in an amount of between 0.2% by weight and 2% by weight relative to the weight of the chemical composition, - water, in amount of between 2% by weight and 20% by weight relative to the weight of the chemical composition. The invention also concerns a cleaning method for removing, from a substrate (1A, 1B, 4), a passivation layer (2) comprising etching residues resulting from the etching of said substrate (1A, 1B, 4), comprising the following steps: - providing a chemical cleaning composition according to the abovementioned composition, - bringing the chemical cleaning composition into contact with the passivation layer (2) for a period sufficient to remove said passivation layer (2) from the substrate (1A, 1B, 4).
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
10.
ELECTRO-DEPOSITING METAL LAYERS OF UNIFORM THICKNESS ON SEMICONDUCTING WAFERS
An apparatus for the electrodeposition of metals or metal alloys on semiconductor wafers is described. The apparatus includes plating cell, an anode disposed within the plating cell, a cathode comprising a semiconductor wafer positioned with the surface to be electroplated facing and in spaced-apart relation to the anode, a power supply providing electrical contact between the anode and the cathode, a hollow bar positioned mean the cathode having a series of spaced-apart holes facing the cathode and arranged in a line extending from one end or near one end of the cross bar to the other end or near end of the cross bar and means for rotating either the cathode or the hollow bar about a central axis to spray the surface of the semiconducting wafer to be plated continuously and repeatedly as the cathode or the solution spraying means rotates.
B05B 5/04 - Appareillages pour délivrer le matériau, p. ex. pistolets de pulvérisation électrostatique caractérisés en ce qu'ils comportent une sortie rotative ou des éléments déflecteurs
H01L 21/288 - Dépôt de matériaux conducteurs ou isolants pour les électrodes à partir d'un liquide, p. ex. dépôt électrolytique
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
The invention relates to a solution for etching titanium based materials, comprising from about 27w% to about 39w% hydrogen peroxide, from about 0.2w% to about 0.5w% potassium hydroxide, and at about 0.002 w% to about 0.02 w% 1,2-Diaminocyclohexane-N,N,N,N Tetra acetic Acid (CDTA), the rest being water, said solution comprising no corrosion inhibitor, and said solution having a pH comprised between about 7 and about 8. The invention further relates to a chemical composition for preparing such a solution by mixing said composition with concentrated hydrogen peroxide, said chemical composition comprising potassium hydroxide from about 5w% to about 30w%, C.D.T.A. at a concentration ranging from about 1% to about 5% of the potassium hydroxide concentration, the rest being water. The invention also relates to a method of etching a Titanium, Titanium nitride or Titanium Tungsten barrier layer from a microelectronic device, said method comprising contacting the Titanium, Titanium nitride or Titanium tungsten barrier layer with the solution for a time sufficient to remove the Titanium, Titanium nitride or Titanium tungsten barrier layer.
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
05 - Produits pharmaceutiques, vétérinaires et hygièniques
10 - Appareils et instruments médicaux
Produits et services
Perfumery products and perfumes; beauty care and body
cleaning preparations; mineral water sprays for cosmetic
use; cosmetics; cosmetics other than for medical use;
cosmetics in the form of oils; massage creams, other than
for medical use; massage oils; scented lotions [toiletries];
scented body lotions [toiletries]; cleansing foams; cosmetic
foams; shaving foam; shaving foams; pre-shave foams; shower
gels; cleansing gels; soapy gels; shaving gels; bath gels;
moisturizing gels [cosmetics]; cleansing gels and soaps;
after-sun gels [cosmetics]; sun-tanning gels [cosmetics];
bath foaming gels; cosmetic eye contour gels; soaps; liquid
soaps; perfumed soaps; shaving soaps; shower soaps; washes
or deodorants for intimate hygiene; douching preparations
for intimate hygiene, deodorant or for sanitary purposes
[toiletries]; perfumed oils; cosmetic oils; moisturizers
[cosmetics]; sunscreens [cosmetics]; self-tanning products
[cosmetics]; make-up; make-up products; lipstick; perfumes;
perfumes in solid form; perfumes for personal use; shaving
creams; non-medicated hair shampoos; body milks; depilatory
cream; creams for cellulite reduction; cleansing creams;
perfumed creams; exfoliating creams; cosmetic creams. Contraceptive foams; spermicidal gels; gels for sexual
stimulation; vaginal lubricants; sexual lubricants; hygienic
lubricants; hygiene preparations (toiletries) and hygienic
articles, namely napkins, panty liners, tissues, tampons,
diapers. Vibration massage apparatus; massage apparatus for personal
use; condoms; spermicidal condoms; condoms for prophylactic
use; condoms for hygiene use; condoms for medical use;
vibrators being adult sex toys; geisha balls, namely adult
sex toys; electric massage apparatus.
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
05 - Produits pharmaceutiques, vétérinaires et hygièniques
10 - Appareils et instruments médicaux
Produits et services
Perfumery and fragrances; Body cleaning and beauty care preparations; Mineral water sprays for cosmetic purposes; Cosmetics; Non-medicated cosmetics; Cosmetics in the form of oils; Massage creams, not medicated; Massage oils; Perfumed lotions [toilet preparations]; Perfumed body lotions [toilet preparations]; Cleansing foam; Mousses [cosmetics]; Shaving soap; Shower gels; Cleansing gels; Soaps in gel form; Shaving gel; Bath gel; Moisturising gels [cosmetic]; Soaps and gels; After-sun gels [cosmetics]; Foaming bath gels; Cosmetic eye gels; Cakes of toilet soap; Soaps in liquid form; Perfumed soaps; Shower soap; Douching preparations for personal sanitary or deodorant purposes [toiletries]; Oils for perfumes and scents; Oils for cosmetic purposes; Cosmetic moisturisers; Sun protecting creams [cosmetics]; Self-tanning preparations [cosmetics]; Make-up; Lipsticks; Perfumes; Solid perfumes; Fragrances for personal use; Shaving cream; Non-medicated hair shampoos; Body milks; Depilatory creams; Creams for cellulite reduction; Cleansing creams; Perfumed creams; Exfoliant creams; Cosmetic creams. Contraceptive foams; Spermicidal gels; Sexual stimulant gels; Vaginal lubricants; Personal sexual lubricants; Hygienic lubricants; Hygienic preparations and articles. Vibromassage apparatus; Massaging apparatus for personal use; Condoms; Spermicidal condoms; Condoms for prophylactic purposes; Condoms for hygienic purposes; Condoms for medical purposes; Vibrators, being adult sexual aids; Benwa balls, being adult sexual aids; Electrically operated massagers.
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
05 - Produits pharmaceutiques, vétérinaires et hygièniques
10 - Appareils et instruments médicaux
Produits et services
cosmetics; cosmetics other than for medical use; cosmetics in the form of oils; massage creams, other than for medical use; massage oils; [ cosmetic foams; shaving foam; shaving foams; pre-shave foams; ] shower gels; [ shaving gels; ] bath gels; bath foaming gels; [ cosmetic eye contour gels; soaps; liquid soaps; perfumed soaps; shaving soaps; shower soaps; ] washes or deodorants for intimate hygiene; perfumed oils; cosmetic oils; make-up; lipstick; perfumes; [ perfumes in solid form; ] perfumes for personal use; [ shaving creams; non-medicated hair shampoos; body milks; depilatory cream; creams for cellulite reduction; cleansing creams; perfumed creams; exfoliating creams; ] cosmetic creams [ Contraceptive foams; spermicidal gels; ] gels for sexual stimulation; vaginal lubricants; sexual lubricants [ Vibration massage apparatus; massage apparatus for personal use; condoms; spermicidal condoms; condoms for prophylactic use; condoms for hygiene use; condoms for medical use; vibrators being adult sex toys; geisha balls, namely, adult sex toys; electric massage apparatus ]
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
05 - Produits pharmaceutiques, vétérinaires et hygièniques
10 - Appareils et instruments médicaux
Produits et services
Perfumery and fragrances; Body cleaning and beauty care preparations; Mineral water sprays for cosmetic purposes; Cosmetics; Non-medicated cosmetics; Cosmetics in the form of oils; Massage creams, not medicated; Massage oils; Perfumed lotions [toilet preparations]; Perfumed body lotions [toilet preparations]; Cleansing foam; Mousses [cosmetics]; Shaving soap; Shaving soap; Shaving soap; Shower gels; Cleansing gels; Soaps in gel form; Shaving gel; Bath gel; Moisturising gels [cosmetic]; Soaps and gels; After-sun gels [cosmetics]; After-sun gels [cosmetics]; Foaming bath gels; Cosmetic eye gels; Soaps; Soaps in liquid form; Perfumed soaps; Shaving soap; Shower soap; Douching preparations for personal sanitary or deodorant purposes [toiletries]; Douching preparations for personal sanitary or deodorant purposes [toiletries]; Oils for perfumes and scents; Oils for cosmetic purposes; Cosmetic moisturisers; Sun protecting creams [cosmetics]; Self-tanning preparations [cosmetics]; Make-up; Make-up; Lipstick; Perfumery; Solid perfumes; Fragrances for personal use; Shaving cream; Non-medicated hair shampoos; Body milks; Depilatory creams; Creams for cellulite reduction; Cleansing creams; Perfumed creams; Exfoliant creams; Creams (Cosmetic -). Contraceptive foams; Spermicidal gels; Sexual stimulant gels; Vaginal lubricants; Personal sexual lubricants; Hygienic lubricants; Hygiene preparations and articles. Vibromassage apparatus; Massaging apparatus for personal use; Condoms; Spermicidal condoms; Condoms for prophylactic purposes; Condoms for hygienic purposes; Condoms for medical purposes; Vibrators, being adult sexual aids; Benwa balls, being adult sexual aids; Electrically operated massagers.
The invention, concerns conductive coatings for use in the manufacture of for example, electrical connectors, LED arrays, and lead frames used in the computer industry. The coatings are composed of silver, antimony, and a protective layer composed of a fluoropolymer.
The invention provides an electroplating composition, method, and improved apparatus, which enables electroplating tin-silver alloys at high speed and without burning. The composition is an aqueous acidic solution including salts of stannous tin and a monovalent silver, and a complexing agent selected from the group consisting of thiocarbazides and thiohydrazides, and optionally an aldehyde and/or dialdehyde organic brightener compound. A sulfonic acid and a surfactant may also be included. The improved apparatus provides a protective structure substantially surrounding the anode(s) to decrease turbulence and the problematic silver displacement reaction.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
07 - Machines et machines-outils
Produits et services
chemical preparations, namely, solutions, powders, salts and alloys for use in plating, immersing and coating of precious metals and non-precious metals; chemical preparations, namely, powders and chemicals for use in the manufacture of photovoltaic and solar cells, modules and devices; chemicals for use in the manufacture of photovoltaic and solar cells, modules and devices Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts; machines for the processing and electrodeposition of solar cells and semiconductors
19.
COMPOSITION OF SOLUTIONS AND CONDITIONS FOR USE ENABLING THE STRIPPING AND COMPLETE DISSOLUTION OF PHOTORESISTS
The present invention relates to the formulation of a chemical, comprised of an ether solvent as the principal solvent, an ether or non-ether cosolvent, an acid, optionally a surfactant and optionally a corrosion inhibitor, dedicated to the complete and selective stripping by pure dissolution of photoresists (novolac and semi-novolac) of all thicknesses used in microelectronic component integration processes. Said solution is optimized to dissolve the polymer matrix while ensuring and protecting the physicochemical integrity of exposed materials such as metal interconnections (copper, aluminum), dielectrics (SiO2, MSQ, etc.) and adhesion and diffusion barriers (TiN, Ti, Ta, TaN, etc.). Furthermore, the singular cleaning properties and performance characteristics of these solutions make it possible to envisage the use thereof in a variety of industrial applications such as single wafer, batch, immersion and/or spray by simple adjustment of process time and temperature.
G03F 7/42 - Élimination des réserves ou agents à cet effet
C23G 5/024 - Nettoyage ou dégraissage des matériaux métalliques par d'autres méthodesAppareils pour le nettoyage ou le dégraissage de matériaux métalliques au moyen de solvants organiques au moyen de solvants organiques contenant des hydrocarbures
20.
ELECTRO-DEPOSITING METAL LAYERS OF UNIFORM THICKNESS
The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
02 - Couleurs, vernis, laques
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
07 - Machines et machines-outils
09 - Appareils et instruments scientifiques et électriques
Produits et services
chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of precious metals and non-precious metals chemical solutions, powders, and salts for use in preventing tarnish of precious metals and non-precious metals chemical solutions, powders, and salts for use in cleaning and stripping of precious metals and non-precious metals machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts; machines for the processing and electrodeposition of solar cells and semiconductors computer programs for use in operating and monitoring machines for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts and machines for the processing and electrodeposition of solar cells and semiconductors
Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
Chemical solutions for use in the manufacture of electronic components, namely, electronic connectors, lead frames, light emitting diodes, integrated circuits and semiconductor components
The invention relates to a metallized solar cell and the method of making thereof that includes depositing a metal or metals such as silver, nickel, copper, tin, indium, gallium, or selenium or their alloys on solar cells in a manner to form more substantial and robust electrical contacts that can carry current more efficiently and effectively or to provide the active layers required to convert sunlight into electricity. These deposits also protect the underlying metallic materials from corrosion, oxidation or other environmental changes that would deleteriously affect the electrical performance of the cell. The invention also relates to the use of specialized electroplating chemistries that minimize residual stress and/or are free of organic sulfonic acids to minimize chemical attack on solar cell substrates or prior metallizations that include organic and/or inorganic binders or related materials for depositing the initial metallic portions of the cell.
A tin deposit which is inherently less prone to tin whisker formation or growth is obtained by one or more of: (i) the deposition of a fine-grained tin deposit having an average grain diameter in the range of 0.05 to 5 microns; (ii) a phosphorous compound in the solution that is used to electroplate the tin deposit so that that the deposit incorporates trace amounts of phosphorous which reduces tin whisker formation by preventing surface oxides even when exposed to heat or humidity; or (iii) a phosphorous, mercaptan or organic compound in a solution that applies a protective coating to the surface of a previously electroplated tin deposit, wherein the protective coating acts to minimize or prevent oxide formation or corrosion of the tin deposit during exposure to heat or humidity. Such tin deposits containing 80% to 100% by weight of tin exhibit minimal to no tin whisker growth.
The invention relates to a method of reducing tin whisker formation in a plated substrate that includes a surface layer comprising tin. The method includes providing on electroplatable portions of the substrate (a) an underlayer comprising silver or (b) a barrier layer that passes a mechanical load test when the surface layer, after 48 hours of contact with a 1mm hemispherical tip that carries a load of between 500 to 2000 g, exhibits no whiskers having a length of greater than 5 microns. The underlayer or barrier layer, whichever is present, is provided in a thickness sufficient to prevent formation of intermetallic compounds between the substrate and surface layer so that the surface layer exhibits reduced whisker formation compared to the same surface layer deposited directly upon the substrate. Typically, the underlayer or barrier layer includes 50 to 100% by weight silver or similar ductile material.
Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
CHEMICAL COMPOSITION FOR A TARNISH PREVENTATIVE SILVER, SILVER ELECTROPLATE, COPPER, COPPER ALLOYS, BRASS AND GOLD PLATED SILVER AND GOLD PLATED COPPER
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
Produits et services
COMPOSITIONS AND MIXTURES OF PALLADIUM AND SALTS THEREOF (( USEFUL IN PROCESSES FOR THE DEPOSITION OF BRIGHT COATINGS OF PALLADIUM FOR USE IN THE ELECTRONICS AND DECORATIVE COATING INDUSTRIES AND WHENEVER A SURFACE COATING OF PALLADIUM IS DESIRED ))
