Technic, Inc.

États‑Unis d’Amérique


 
Quantité totale PI 34
Quantité totale incluant filiales 46 (+ 12 pour les filiales)
Rang # Quantité totale PI 41 649
Note d'activité PI 0,9/5.0    2
Rang # Activité PI 467 433
Activité incl filiales 1,5/5.0    8
Classe Nice dominante Produits chimiques destinés à l'...

Brevets

Marques

2 25
0 0
7 0
0
 
Dernier brevet 2024 - System for the simultaneous moni...
Premier brevet 1975 - Method for producing alkali meta...
Dernière marque 2024 - TECHNIFLEX
Première marque 1959 - OROSENE

Filiales

2 subsidiaries with IP (8 patents, 4 trademarks)

1 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 P/S liquid photo-definable halogen-free flexible black matte solder mask
2023 Invention System for the simultaneous monitoring of constituents of an electroplating bath. Methods of and...
2019 P/S Chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of preci...
2017 Invention Electro-depositing metal layers of uniform thickness on semiconducting wafers. An apparatus for t...
2015 Invention Electrochemical characterization of plating solutions and plating performance. A process for qua...
2014 Invention Eliminating temperature variation effects to improve accuracy of electroplating bath monitoring. ...
2013 Invention Silver antimony coatings and connectors. The invention, concerns conductive coatings for use in t...
P/S chemical preparations, namely, solutions, powders, salts and alloys for use in plating, immersing...
2012 P/S chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of preci...
P/S Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodiz...
P/S chemical solutions for use in the manufacture of semiconductors
2011 Invention Electro-depositing metal layers of uniform thickness. The invention is an apparatus and method f...
Invention Electro-depositing metal layers of uniform thickness. The invention is an apparatus and method fo...
P/S Chemical solutions for use in the manufacture of electronic components, namely, electronic connec...
P/S chemical solutions used in the manufacture of semiconductors, namely, solutions for removing phot...
2010 Invention Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating....
2008 Invention Method of metallizing solar cell conductors by electroplating with minimal attack on underlying ...
Invention Method of metallizing solar cell conductors by electroplating with minimal attack on underlying m...
Invention Electroplating system including interchangeable carriers for supporting and providing cathode pot...
Invention Electroplating system with movable support structure providing cathode potential. A processing s...
2007 P/S Chemicals for use in the manufacture of photovoltaic and solar cells, modules, and devices
2006 Invention Electroless gold plating solution and method. Electroless gold plating compositions that include...
Invention Electroless gold plating solution. An electroless gold plating solution that includes a solution...
Invention Non-cyanide silver plating bath composition. Disclosed is an electroplating solution for the dep...
Invention Tin electrodeposits having properties or characteristics that minimize tin whisker growth. A tin ...
Invention Tin electrodeposits having properties or characteristics that minimize tin whisker growth. A met...
Invention Silver barrier layer to minimize whisker growth in tin electrodeposits. The invention relates to ...
Invention Silver barrier layers to minimize whisker growth in tin electrodeposits. The invention relates t...
Invention Pulse plating process for deposition of gold-tin alloy. The invention relates to a solution for ...
Invention Underlayer for reducing surface oxidation of plated deposits. Methods of providing improved metal...
Invention Underlayer for reducing surface oxidation of plated deposits. Methods of providing improved meta...
Invention Pulse plating process for deposition of gold-tin alloy. The invention relates to a solution for u...
2005 Invention Near neutral ph tin electroplating solution. The present invention relates to a solution for use...
Invention System and method for electroplating flexible substrates. A processing system for processing fle...
Invention Near neutral ph tin electroplating solution. The present invention relates to a solution for use ...
Invention Reduction of surface oxidation during electroplating. Methods of providing improved metal coatin...
Invention Bright rhodium electrodeposition. Disclosed is an electroplating solution for obtaining bright w...
Invention Electroplating solution for gold-tin eutectic alloy. The invention relates to an electrolyte used...
Invention System and method of transporting and providing a cathode contact to articles in an electroplatin...
Invention System and method of controlling the demarcation line formed on partially electroplated articles....
Invention Non-cyanide silver plating bath composition. Disclosed is an electroplating solution for the depo...
2004 Invention Minimizing whisker growth in tin electrodeposits. The present invention relates to a method for ...
Invention Near neutral ph cleaning/activation process to reduce surface oxides on metal surfaces prior to e...
Invention Electroplating solution for alloys of gold with tin. The invention relates to an electroplating s...
Invention Electroplating solution containing organic acid complexing agent. A solution for use in connectio...
2003 Invention Reduction of surface oxidation during electroplating. Methods of providing improved metal coating...
Invention Method and apparatus for real time monitoring of industrial electrolytes. The present invention r...
Invention Method and apparatus for real time monitoring of electroplating bath performance and early fault ...
Invention Media for use in plating electronic components. Improvements in methods for plating metal on subs...
P/S Semiconductor wafer plating processing machines
Invention Minimizing whisker growth in tin electrodeposits. The present invention relates to a method for r...
1989 P/S CHEMICAL GOLD ELECTROPLATING SOLUTIONS WHICH CONSIST IN PART OF PURE GOLD AND ALLOYS OF GOLD
P/S CHEMICAL COMPOSITION FOR A TARNISH PREVENTATIVE SILVER, SILVER ELECTROPLATE, COPPER, COPPER ALLOY...
P/S RHODIUM PLATING SOLUTIONS
P/S SILVER PLATING SOLUTIONS
1979 P/S COMPOSITIONS AND MIXTURES OF PALLADIUM AND SALTS THEREOF (( USEFUL IN PROCESSES FOR THE DEPOSITIO...
P/S Flattened Fine Silver Powders for General Use in the Industrial Arts
P/S Silver Powders Having Diversified Use in the Industrial Arts
1976 P/S CYANIDE-FREE METALLIC SALTS FOR USE AS AN ELECTROPLATING COMPOSITION
1969 P/S GOLD PLATING SOLUTION
1968 P/S PLATING SOLUTIONS FOR RHODIUM
1966 P/S GOLD PLATING SOLUTIONS
1961 P/S Gold Plating Solution and Salts to Be Used in Gold Plating Solutions
1959 P/S GOLD PLATING SOLUTION AND SALTS TO BE USED IN GOLD PLATING SOLUTIONS