A probe head for the testing of electronic devices is disclosed having a contact probe that includes a body which extends between first and second ends adapted to contact respective contact pads, and a guide having a guide hole configured for housing at least a portion of the contact probe. The contact probe includes an intermediate section arranged between the first and second ends which is elastically compliant, wherein the elastically compliant intermediate section is structured as a plurality of elastic elements which follow one another in series so that the elastically compliant intermediate section is not rectilinear. At least one of the elastic elements is in contact with a wall of the guide hole.
A probe head for the testing of electronic devices is described having a contact probe having a body which extends between first and second ends adapted to contact respective contact pads, and a guide having a guide hole configured for housing at least a portion of the contact probe. The contact probe includes an elastically compliant intermediate section arranged between the first and second ends. The contact probe has a length of less than 2000 μm, and the probe head includes a conductive portion formed on the guide which includes a group of guide holes and adapted to contact and short-circuit a corresponding group of contact probes that are housed in the group of holes and are intended to carry a given type of signal, thereby forming a given conductive domain, wherein a portion of the contact probe is in contact with the conductive portion.
A probe head for the testing of electronic devices is herein disclosed having a contact probe with a body which extends along a longitudinal axis between a first and a second end which are adapted to contact respective contact pads. The body has a maximum thickness measured along a direction that is orthogonal to the longitudinal axis and a guide having at least one guide hole configured to house at least a portion of the contact probe. The contact probe includes an elastically compliant intermediate section arranged between the first and second ends. The elastically compliant intermediate section includes a reduced portion with a thickness less than the maximum thickness of the body of the contact probe.
A probe head for testing electronic devices is disclosed having a contact probe with a body which extends between first and second ends which are adapted to contact respective contact pads and first and second guides having respective first and second guide holes. The contact probe includes an elastically compliant intermediate section arranged between the first and the second end. The elastically compliant intermediate section is arranged at at least one of the first and second guide holes. The contact probe also includes intermediate stop means arranged between the first and second guide and is configured to mechanically contact a portion of the first and/or second guide to hold the contact probe inside the probe head.
A probe head for testing a device under test is disclosed, said probe head having at least one contact probe comprising a body extended along a longitudinal axis between a first end portion and a second and opposite end portion, which are adapted to contact respective contact pads, and at least one guide comprising at least one guide hole for housing the contact probe, wherein the body of the contact probe comprises at least one longitudinal opening defining at least a first arm and a second arm separated by said opening and joined together at at least one junction region, and wherein the contact probe is configured to switch from a first configuration, in which it is not housed in the guide hole, to a second configuration, in which it is at least partially housed in the guide hole. In the second configuration, the opening extends at least partially inside the guide hole so that at least a portion of said first arm and a portion of said second arm is housed in said guide hole, wherein the contact probe comprises at least one elastic stopper formed by at least one section of at least one of said portion of said first arm and said portion of said second arm housed in said guide hole, said elastic stopper being elastically deformable in the passage between the first configuration, in which at said elastic stopper the contact probe has a first transverse diameter that is greater than a corresponding transverse diameter of the guide hole, and the second configuration, in which at said elastic stopper the contact probe has a second transverse diameter that is smaller than the first transverse diameter, the term transverse diameter meaning a maximum transverse dimension of a section, even not circular, taken according to a plane orthogonal to said longitudinal axis, and wherein, in the second configuration, said elastic stopper is deformed by contact with at least one wall of said guide hole and exerts a reaction force on said wall ensuring the retention of the contact probe.
A test system for testing a device under test integrated on a semiconductor wafer is herein disclosed, the system comprising at least one test element configured to monitor a temperature of the device under test or of the semiconductor wafer and at least one support. The test element comprises a first branch including a first portion made of a first conductive material, and a second branch including a second portion made of a second conductive material that is different from the first conductive material, the second portion being connected to the first portion at a junction region, wherein the junction region comprises a contact end, wherein the first branch and the second branch form at least part of a circuit adapted to be subjected to a temperature difference between the contact end of the junction region, which during the test is located at the device under test or at the semiconductor wafer, and a reference which is at a reference temperature, and wherein said first conductive material and said second conductive material are selected to cause a potential difference proportional to the temperature difference to be generated in the circuit.
A probe card (20) adapted to be inserted in an apparatus for testing electronic devices is described, said probe card (20) comprising at least one probe head (11) housing a plurality of contact probes (13), each contact probe (13) having at least one first end portion (13A) adapted to abut onto contact pads (15A) of a device under test (15) and a second end portion (13B) adapted to abut onto corresponding contact pads formed on a first face (FA) of a space transformer (14) facing the device under test (15), as well as a main board (17) connected to the space transformer (14) by means of an interconnection layer (18) provided with a plurality of mechanical and electrical connection elements (18A) between the space transformer (14) and the main board (17). Suitably, the probe card (20) further comprises a microfluidic cooling system (30, 40) including one or more microfluidic channels (34A, 34B, 44) provided with respective microfluidic passages (33A, 33B, 43) in which a cooling fluid circulates, said microfluidic channels (34A, 34B, 44) being in thermal contact with the space transformer (14) to collect and dissipate heat therefrom.
A probe card (20) adapted to be inserted in an apparatus for testing electronic devices is described, said probe card (20) comprising at least one probe head (11) housing a plurality of contact probes (13), each contact probe (13) having at least one first end portion (13A) adapted to abut onto contact pads (15A) of a device under test (15) and a second end portion (13B) adapted to abut onto corresponding contact pads formed on a first face (FA) of a space transformer (14) facing the device under test (15), as well as a main board (17) connected to the space transformer (14) and one or more active devices (19; 19A, 19B) housed on the first face (FA) of the space transformer (14) and in thermal contact with said space transformer (14). Suitably, the probe card (20) further comprises a microfluidic cooling system (30) including at least one manifold (31) provided with one or more microfluidic channels (32, 33) in which a cooling fluid circulates, said microfluidic channels (32, 33) being in direct or indirect thermal contact with the active devices (19; 19A, 19B) to collect and dissipate heat produced by said active devices (19; 19A, 19B) as active thermal power (PT2).
A probe head for testing devices under test integrated on a semiconductor wafer includes a plurality of contact probes having a body extending between first and second ends. The first end contacts contact pads of a device under test and the second end contacts contact Dads and a guide having guide holes housing a portion of the contact probes. The guide lies in a plane wherein the first and second ends of the contact probes are offset from each other and define a scrub direction of the first ends projecting from the guide holes which define abutting points against which corresponding inclined opposite walls of the contact probes abut. The inclined opposite walls deform the contact probes during contact with the device under test and control movement of the portion thereof within the guide holes, and the movement of the first end of the contact probes in the scrub direction.
A probe card configured to be mounted in a testing apparatus of electronic devices includes at least one probe head that houses a plurality of contact probes, each contact probe having at least one first end portion configured to abut onto contact pads of a device under test, as well as a main board and an intermediate board connected to the main board , the intermediate board being adapted to perform a distance spatial transformation between contact pads formed on opposite faces thereof and acting as a space transformer. The space transformer comprises at least one core made of a material having a thermal conductivity greater than 100 W/(m·K) to collect and dissipate a heat produced by the probe card during testing operations of the electronic device.
A probe card configured to be mounted in a testing apparatus of electronic devices in contact with a test cell of the apparatus is described. The probe card includes at least one probe head that houses a plurality of contact probes and is arranged between a device under test and a space transformer, which is in turn in contact with a main board configured to be connected to the test cell and provided with a stiffener. Suitably, the probe card includes a heat dispersion device provided with at least one thermal pipe configured to thermally connect the probe card and the test cell and to realize a dispersion of a heat generated inside the probe card during the operation thereof.
It is herein described a probe head including at least one guide and a plurality of contact probes housed in a plurality of guide holes formed in the at least one guide, the plurality of contact probes being configured to abut onto a plurality of contact pads of a device under test, as well as at least one housing element configured to enclose the contact probes, further including a heat dispersion structure configured to collect and dissipate heat produced by the probe head and by the contact probes therein contained during test operations of the electronic device, the heat dispersion structure including at least one layer having thermal conductivity greater than 100 W/(m·K).
A probe head for testing a device under test integrated on a semiconductor wafer contains a plurality of contact probes having a body with first and second end portions adapted to contact respective pads, a guide with guide holes for housing the contact probes, and an air-conveying system to convey an air flow into the probe head to facilitate heat dissipation. The probe head further includes a conductive portion on the guide having a group of the guide holes which contacts and short circuits a corresponding group of contact probes in the group of holes and intended to carry a determined type of signal, defining a conductive domain on the guide. The heat dissipation conductive portion formed on the guide extends the conductive domain so that the air flow of the air-conveying system facilitates the dissipation of the heat exchanged by the heat dissipation conductive portion.
A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.
A measurement system (100) for testing a device under test integrated on a semiconductor wafer is herein described, having a plurality of contact elements provided with at least one first end portion adapted to contact a corresponding contact pad of the device under test, an optical sensor comprising a light source configured to emit light towards the semiconductor wafer or the device under test and a detector which is arranged at a given relative distance from the light source and is configured to collect the light reflected from the semiconductor wafer or the device under test and to generate a signal based on the collected reflected light, and a control unit which is in operative communication with the optical sensor and is configured to measure a distance based on the signal of the detector.
A probe card for testing a device under test is described, which has a plurality of contact elements arranged at a given distance from each other along a side by side placing direction. The contact elements have an interface end configured to transmit a signal coming from the device under test to a signal transmission line of the probe card, a body portion, and a contact portion comprising an end adapted to contact contact pads of the device under test. The end of the contact portion is spaced from the interface end along a first axis, and a dimension of the body portion measured along a second axis that is different from the first axis is selected in a range between 50% and 150% with respect to the distance between the contact elements along the side by side placing direction.
A probe head for testing a device under test is described, the probe head having a plurality of contact elements with a body extending between a first end portion and a second and opposite end portion, which are adapted to contact respective contact pads, and at least one guide comprising a plurality of guide holes adapted to house the contact elements, said guide holes being defined by at least one wall, wherein a corresponding portion of said contact elements is adapted to contact said at least one wall. The guide comprises a core made of a conductive material, said core having an interface surface, and an outer coating made of a dielectric material and arranged on at least part of the interface surface of the core at least at the guide holes, this outer coating forming at least part of said at least one wall of said guide holes. The wall of at least one of said guide holes is at least partially coated by a conductive layer configured to mechanically and electrically contact only the contact element housed in said at least one guide hole, wherein, in said at least one guide hole, said outer coating is arranged between said core and said conductive layer.
TEC163BWO - 23 - ABSTRACT A probe card for testing a device under test is described, said probe card having a plurality of contact elements, a containment structure configured to house the contact elements, an interface board adapted to interface the probe card with a test equipment, and at least 5 one connection system configured to connect the containment structure and the interface board to each other. The connection system is equipped with a connection element comprising a first portion through which it is fixedly connected to the interface board, and a second portion projecting from the interface board and housed in a recess formed in the 10 containment structure, and at least one elastic element which is inside the recess and connected, at a first end thereof, to the second portion of the connection element and, at a second end thereof, to the containment structure, said elastic element being in a compressed configuration under the action of the connection element and exerting a reaction elastic force 15 which maintains the containment structure and the interface board in mutual contact. (Fig. 1)
It is herein described a measuring system (100) including a probe head (100) which comprises a plurality of contact probes (1) and an interface board (9). The interface board (9) comprises an interface body (I) and a related test pad (9A, 9B, 9C) at each contact probe (1) of the plurality of contact probes, said contact probe (1) comprising a first end portion (2) that ends with a contact tip (2A) configured to abut onto a contact pad of a device under test and a second end portion (3) which ends with a contact head (3A) configured to abut onto the related test pad (9A, 9B, 9C) of the interface board (9), as well as a probe body (4) extended between the first end portion (2) and the second end portion (3) according to a longitudinal development axis (HH). Furthermore, each related test pad (9A, 9B, 9C) comprises at least one integrated resistive portion (11A, 11B, 11C).
It is herein described a contact probe (20) having a first end portion (2) that ends with a contact tip (2A) configured to abut onto a contact pad of a device under test and a second end portion (4) which ends with a contact head (5) configured to abut onto a contact pad of a board of a testing apparatus, as well as a probe body (1A) extended between said first end portion (2) and said second end portion (4) according to a longitudinal development axis (HH). The contact probe (20) comprises at least one resistive portion (11) comprised between the first end portion (2) and the second end portion (4), said at least one resistive portion (11) being adapted for passing a current between said first end portion (2) and said second end portion (4) opposing a resistance value greater than 20 Ω. A related probe head comprising at least one of said probes is also herein described.
It is herein described a contact probe (11) having a first end portion (12) which ends with a contact tip (12A) configured to abut onto a contact pad of a device under test and a second end portion (13) which ends with a contact head (13A) configured to abut onto a contact pad of an interface board for a testing apparatus, as well as a probe body (14) extended between said first end portion (12) and said second end portion (13) according to a longitudinal development axis (HH), the contact probe (11) comprising a first structural element (21) and a second structural element (22), the first structural element (21) including the first end portion (12) and a first probe body portion (23) and the second structural element (22) including the second end portion (14) and a second probe body portion (24), the first probe body portion (23) being adapted to be housed in a hollow portion (24A) of the second probe body portion (24), said contact probe (11) further comprising at least one resistive insert (20) interposed between the first probe body portion (23) and the second probe body portion (24) being adapted for passing a current between said first probe body portion (23) and said second probe body portion (24) opposing a resistance. A related probe head (30) comprising at least one of said probes is also herein described.
A probe card mounted in an of electronic device testing apparatus is described, having a probe head housing a plurality of contact probes, each having a first end portion which abuts onto contact pads of a device under test, a main board and a connected intermediate board which provides a distance spatial transformation between contact pads made on opposite faces thereof. The intermediate board is a space transformer which includes a plurality of modules that are plate-shaped and coplanar, and structurally and functionally independent from each other. Each module has a first face facing towards the probe head and a first plurality of contact pads whereonto respective second end portions of the contact probes abut and an opposite second face facing towards the main board. The second face has a second plurality of contact pads connected to the first plurality of contact pads.
A probe head (100) for testing a device under test (DUT) is disclosed, the probe head (100) having a plurality of contact probes (10) with a body (10') extended between a first end portion (10a) and a second end portion (10b), said end portions being adapted to contact respective pads (DUTa, 25a), at least one guide (20) provided with guide holes (20h) for housing the contact probes (10), a housing (30) configured to support the at least one guide, a first portion (L1), which is a heat dissipation structure and is configured to collect and dissipate heat produced by said probe head during the test, and a second portion (L2), which is made of a conductive material and is in contact with the first portion (L1). A related measuring system is also disclosed.
A measuring system (100, 100') for the testing of devices under test (DUT) integrated on a semiconductor wafer (WS) is described, comprising a probe head (101) comprising a plurality of contact elements (1) which extend along a longitudinal direction (H-H) between a first end (la), adapted to contact pads of a device under test (DUT), and a second and opposite end (lb) and a housing (2) configured to house the plurality of contact elements (1). The measuring system (100, 100') further comprises a pressurization structure (4) adapted to abut, in use during the test, on a semiconductor wafer (WS) or on a chuck (3) that houses the semiconductor wafer (WS). The pressurization structure (4) comprises a peripheral wall (5) defining a housing area (A) therein and at least one sealing component (6) arranged inside the housing area (A) and comprising a hole (8) in which the housing (2) is housed, defining a chamber (P) in the housing area (A) and at least one inlet (I) adapted to allow conveying a pressurized gas into the chamber (P), making, in use during the test, said chamber (P) an overpressure area. An apparatus comprising this measuring system is also described.
A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
A test system (100) for testing a device under test (DUT) is herein described, said test system (100) having a plurality of contact elements (10) which extend along a longitudinal direction (H-H) between a first end (10a), adapted to contact pads (DUTa, DUTb) of the device under test (DUT), and a second and opposite end (10b), at least one guide (20) provided with guide holes (20h) for housing at least a portion of the contact elements (10), a conveying system provided with at least one duct (30c) and configured to convey a gas flow (A) toward the device under test (DUT), and a peripheral structure (40) having a body (40b) with an end face (40f) facing the device under test (DUT), wherein the peripheral structure (40) is structured to define a cabin (C) that is in fluid communication with the conveying system for conveying the gas flow (A) thereinto, the first ends (10a) of the contact elements (10) being protruding from the guide (20) and being housed in said cabin (C), wherein the body (40b) of the peripheral structure (40) has an extension along the longitudinal direction (H-H) such as to form, during the testing operation of the device under test (DUT), a fluid constriction (S) between said device under test (DUT) and its end face (40f), thus causing an overpressure in said cabin (C) when the gas flow (A) is introduced thereinto.
It is herein disclosed a probe head (100) for testing a device under test (DUT) of the type having at least one first pad (DUTa) and one second pad (DUTb) that is different from the first pad (DUTa), the probe head (100) having a plurality of contact probes (10) with a body (10p) extended between a first end portion (10a) and a second end portion (10b) adapted to contact respective pads, wherein said contact probes (10) are divided into first contact probes (10'), which are grouped into at least one group (10g) and are configured to contact, as a group, a corresponding first pad (DUTa) of the device under test (DUT), and into at least one second contact probe (10") configured to contact a corresponding second pad (DUTb) of the device under test (DUT) that is different from the first pad (DUTa), and at least one guide (40) equipped with guide holes (40h) for housing at least one portion of the contact probes (10), wherein the guide (40) comprises a first face (FA) facing, during the test, toward the device under test (DUT) and a second face (FB) opposite the first face (FA). The probe head also comprises a protective element (50) which, during the test, is arranged between the first face (FA) of the guide (40) and the device under test (DUT), said protective element (50) comprising a body (50') equipped with holes (50h) in which the first contact probes (10') are housed, wherein said body (50') is configured as a protection barrier against emissions of molten metal coming from the device under test (DUT) toward the first face (FA) of the guide (40), thus preventing said emissions from reaching the guide (40).
A test system (100) for an apparatus for testing electronic devices integrated on a semiconductor wafer (23) is described, the test system having a first support (20) comprising a plurality of first through openings (20h), a second support (30) comprising a plurality of second through openings (30h) which correspond to the first through openings (20h) of the first support (20), an elastomeric element arranged between the first support (20) and the second support (30), and a plurality of contact elements (50), each of said contact elements (50) comprising a first contact portion (50a) which ends with a first contact end (50a') and is housed at least partially within one of the first through openings (20h) of the first support (20), said first contact end (50a') being adapted to contact a pad (DUTa) of a device under test (DUT), and a second contact portion (50b) which ends with a second contact end (50b') and is housed at least partially within one of the second through openings (30h) of the second support (30). The first contact portion (50a) and the second contact portion (50b) are electrically connected to each other, and at least one of said first contact portion and said second contact portion is movable with respect to the other, and the contact elements (50) are configured to switch between a first configuration or rest configuration in which the first contact end (50a') and the second contact end (50b') are spaced apart from each other by a first distance (D1), and a second configuration or test configuration in which said first contact end (50a') and said second contact end (50b') are spaced apart from each other by a second distance (D2) that is smaller than the first distance (D I) following the contact with the pads (DUTa) of the device under test (DUT), and the elastomeric element (40) is at least partially compressed due to the approach between said first contact portion (50a) and said second contact portion (50b) and exerts a reaction force (F) thereon.
A probe head (100) for testing a device under test (DUT) is herein disclosed, said probe head having a plurality of contact probes (10) with a body (10p) extended between a first end portion (10a) and a second end portion (10b), which are adapted to contact respective contact pads, at least one guide (40) comprising guide holes (40h) for housing at least a portion of the contact probes (10), each guide hole (40h) being defined by a plurality of walls, and at least one conductive portion (30) which is formed on a first face (FA) of the guide (40) and includes at least one group (40hg) of the guide holes (40h), said conductive portion (30) being configured to contact and short-circuit a corresponding group (10g) of contact probes that are housed in said group (40hg) of guide holes and are intended to carry a same type of signal. At least one of the guide holes of the group (40hg) of guide holes includes at least one wall (40hw) of said walls which is coated by the conductive portion (30) through a part thereof extending inside said guide hole (40h), wherein said wall (40hw) of the guide hole (40h) is only partially coated by the conductive portion (30), which extends along said wall (40hw) up to a terminal portion (30t) of said conductive portion, said wall (40hw) thus comprising an uncovered portion (40hp) which extends from the terminal portion (30t) of the conductive portion (30) up to a second face (FB) of the guide (40), said second face being opposite the first face (FA) on which the conductive portion (30) is formed, and wherein the walls of said guide hole (40h) are shaped so as to define a tapered portion (40hr) which extends from the second face (FB) to a hole inner position (Z), said tapered portion (40hr) of the hole having a variation of its sectional dimensions from the second face (FB) up to the hole inner position (Z), the guide hole (40h) having substantially constant sectional dimensions from said hole inner position (Z) up to the first face (FA).
A probe head (100) having a plurality of contact probes (10) with a body (10p) extended between a first end portion (10a) and a second end portion (10b) is herein disclosed, the end portions being adapted to contact respective contact pads; the probe head has at least one guide (40) provided with guide holes (40h) for housing at least one portion of the contact probes (10), and at least one conductive portion (30) which includes at least one group of the guide holes and which is configured to contact and short-circuit a corresponding group of contact probes that are housed in said group of the guide holes and are intended to carry a given same type of signal, said conductive portion (30) being divided into at least a first portion (30a) and a second portion (30b) arranged on different faces or different guides.
A contact probe is disclosed having a first end portion which ends with a contact tip configured to abut onto a contact pad of a device under test and a second end portion which ends with a contact head configured to abut onto a contact pad of a board of a testing apparatus, as well as a probe body extended between the first end portion and the second end portion along with a longitudinal development axis The first end portion includes a first support part, interposed between the probe body and the contact tip. Suitably, the first support part includes at least one contact pin and one probe length which extend parallel to each other along the longitudinal development axis and are separated by an air gap.
A probe card (100) for testing a device under test (DUT) is described, the probe card having an interface board (20), which comprises a plurality of contact pads (20a) which include at least one test pad (20a-test) which is the terminal part of a sense line (20line) formed on the interface board (20) and adapted to be connected to monitoring means, and a plurality of contact probes (10) comprising a body (10p) extending between a first end portion (10a), which is adapted to contact contact pads (DUTa) of the device under test (DUT), and a second end portion (10b), which is adapted to contact the contact pads (20a) of the interface board (20); there is then at least one guide (40) provided with guide holes (40h) and at least one conductive portion (30) formed at the guide (40), said conductive portion (30) including at least one group (40hg) of the guide holes (40h) and being configured to short-circuit a corresponding group (10g) of contact probes housed in said group (40hg) of guide holes and intended to carry a same given type of signal, at least one test contact probe (10t) being among these probes.
The present invention relates to an adjustable connector support (1) for semi-rigid coaxial cables, the support (1) comprising: - a support body (2) comprising a support base (3) having a recess (5) which is at least partially slide-shaped; - at least one cable-holder element (9) comprising at least one passage portion (15) for a cable, the passage portion (15) comprising curved side walls and having a decreasing cross section moving away from the support body (2), the passage portion (15), in an assembled state of said support (1), lying in the same plane (X) of the recess (5) of the support base (3) of the support body (2); - a flange (16) connected to the at least one cable-holder element (9); - at least one adjustable fixing element (22) adapted, in an assembled state of the support (1), to connect the support body (2) and the at least one cable-holder element (9) and to engage onto the flange (16).
H01R 24/50 - Dispositifs de couplage en deux pièces, ou l'une des pièces qui coopèrent dans ces dispositifs, caractérisés par leur structure générale ayant des contacts disposés concentriquement ou coaxialement spécialement adaptés à la haute fréquence montés sur une PCB [carte de circuits imprimés]
A probe head (100) for the testing of electronic devices is described, the probe head (100) having at least one contact probe (10) comprising a body (10') which extends along a longitudinal axis (H-H) between a first end (10a) and a second end (10b), said ends (10a, 10b) being adapted to contact respective contact pads (20a, 30b), and at least one guide (40) comprising at least one guide hole (40h) configured for housing at least one portion of the contact probe (10). The contact probe (10) comprises at least one intermediate section (10s) arranged between the first end (10a) and the second end (10b) which is elastically compliant at least along said longitudinal axis (H-H).
A probe head (100) for the testing of electronic devices is herein described, the probe head having at least one contact probe (10) which comprises a body (10') which extends between a first end (10a) and a second end (10b), said ends (10a, 10b) being adapted to contact respective contact pads (20a, 30b), and at least one guide (40) comprising at least one guide hole (40h) configured for housing at least one portion of the contact probe (10). The contact probe (10) comprises at least one intermediate section (10s) arranged between the first end (10a) and the second end (10b) which intermediate section is elastically compliant, wherein the contact probe (10) has a length which is less than 2000 µm, preferably less than 1000 µm, still more preferably equal to or less than 800 µm, said length being measured along a longitudinal axis (H-H), and wherein said probe head (100) further comprises a conductive portion (21) formed on the guide (40), said conductive portion (21) including at least one group (40h') of said guide holes (40h) and being adapted to contact and short-circuit a corresponding group of contact probes that are housed in said group (40h') of holes and are intended to carry a given type of signal, thereby forming a given conductive domain, wherein at least one portion of the contact probe (10) is in contact with said conductive portion (21).
A probe head (100) for the testing of electronic devices is herein disclosed, the probe head (100) having at least one contact probe (10) that comprises a body (10') which extends between a first end (10a) and a second end (10b), said ends (10a, 10b) being adapted to contact respective contact pads (20a, 30b), and at least one guide (40) comprising at least one guide hole (40h) configured for housing at least one portion of the contact probe (10). The contact probe (10) comprises at least one intermediate section (10s) arranged between the first end (10a) and the second end (10b) which is elastically compliant, wherein the elastically compliant intermediate section (10s) is structured as a plurality of elastic elements (10sr'') which follow one another in series in such a way that said elastically compliant intermediate section (10s) is not rectilinear, wherein at least one of said elastic elements (10sr'') is in contact with a wall (40W) of the guide hole (40h).
A probe head (100) for the testing of electronic devices is herein disclosed, the probe head (100) having at least one contact probe (10) with a body (10') which extends along a longitudinal axis (H-H) between a first end (10a) and a second end (10b), said ends (10a, 10b) being adapted to contact respective contact pads (20a, 30b), said body (10') having a maximum thickness (Tmax) measured along a direction that is orthogonal to said longitudinal axis (H-H), and at least one guide (40) comprising at least one guide hole (40h) configured to house at least a portion of the contact probe (10). The contact probe (10) comprises at least one intermediate section (10s) arranged between the first end (10a) and the second end (10b) which is elastically compliant, wherein said elastically compliant intermediate section (10s) comprises at least one reduced portion with a thickness (Tel) lower than the maximum thickness (Tmax) of the body (10') of the contact probe (10).
A probe head (100) for the testing of electronic devices is herein disclosed, the probe head having at least one contact probe (10) comprising a body (10') which extends between a first end (10a) and a second end (10b), said ends (10a, 10b) being adapted to contact respective contact pads (20a, 30b), a first guide (40a) comprising respective first guide holes (40ah), and a second guide (40b) comprising respective second guide holes (40bh). The contact probe (10) comprises at least one intermediate section (10s) arranged between the first end (10a) and the second end (10b) which is elastically compliant; the elastically compliant intermediate section (10s) is arranged at at least one of said first guide holes (40ah) and second guide holes (40bh); the contact probe (10) further comprises intermediate stop means arranged between said first guide (40a) and said second guide (40b), said intermediate stop means being configured to mechanically contact at least a portion of said first guide (40a) and/or said second guide (40b) for holding the contact probe (10) inside the probe head (100).
A probe head (20) for testing devices under test (DUT) integrated on a semiconductor wafer (W) is described, the probe head comprising a plurality of contact probes (21) comprising a body (21') extending along a longitudinal axis (H-H) between a first end (21a) and a second end (21b), the first end (21a) being adapted to contact contact pads (25) of a device under test (DUT) and the second end (21b) being adapted to contact respective contact pads (30), and at least one guide (22) comprising a plurality of guide holes (22h) adapted to house a portion of the contact probes (21), said guide (22) lying in a plane (a), wherein the first end (21a) and the second end (21b) of the contact probes (21) are offset from each other, with reference to the longitudinal axis (H-H), along an offset direction (Dir), thereby defining a scrub direction (Dscrub) of said first ends (2 la) projecting from the respective guide holes (22h). The guide (22) comprises guide holes (22h) having at least one pair of opposite walls (Wh) which are inclined with respect to the longitudinal axis (H-H), said guide holes (22h) having an axis of symmetry which is not perpendicular with respect to the plane (a) of the guide (22), defining abutting points (P) against which corresponding opposite walls (W) of the contact probes (21) are adapted to abut, said inclined opposite walls being configured to define, by means of the inclination thereof, a deformation of the contact probes (21) during the contact with the device under test (DUT) and to control the movement of the portion thereof housed within the guide holes (22h), thereby controlling the movement of the first end (21a) of the contact probes (21) in the scrub direction (Dscrub).
It is herein described a probe head (20) for testing a device under test, comprising a plurality of contact probes (10) comprising a body (10') extending along a longitudinal axis (H-H) between a first end portion (10a) and a second end portion (10b), said end portions being adapted to contact respective pads (22, 24), at least one guide (40) provided with guide holes (40h) for housing portions of the contact probes (10), said guide (40) lying in a plane (α), and a housing (50) comprising a body (50') configured to contain the contact probes (10). The housing (50) comprises conveying means (M) for conveying an air flow (F) adapted to facilitate a heat dissipation inside the probe head (20), said conveying means (M) including at least one input duct (50in) configured to receive the air flow (F) and to allow conveying said air flow (F) into the housing (50), and at least one output duct (50out) configured to cause the air flow (F) to flow out of the housing (50), wherein the input ducts (50in) and output ducts (50out) are formed in the body (50') of the housing (50).
A probe card (10) configured to be mounted in a testing apparatus of electronic devices in contact with a test cell (17) of said apparatus is described, the probe card (10) comprising at least one probe head (11) that houses a plurality of contact probes (1) and is arranged between a device under test (13) and a space transformer (14), which is in turn in contact with a main board (15) configured to be connected to the test cell (17) and provided with a stiffener (16). Suitably, the probe card (10) comprises a heat dispersion device (20) provided with at least one thermal pipe (19) configured to thermally connect the probe card (10) and the test cell (17) and to realize a dispersion of a heat generated inside the probe card (10) during the operation thereof.
It is herein described a probe head (21) comprising at least one guide (24, 25, 25') and a plurality of contact probes (22) housed in a plurality of guide holes (24A, 25A, 25'A) formed in said at least one guide (24, 25, 25'), the plurality of contact probes (22) being adapted to abut onto a plurality of contact pads (23A) of a device under test (23), as well as at least one housing element (29) adapted to enclose the contact probes (22), suitably further comprising a heat dispersion structure (30) able to collect and dissipate heat produced by the probe head (21) and by the contact probes (22) therein contained during test operations of the electronic device (23), said heat dispersion structure (30) comprising at least one layer (30A, 30B, 30C, 30D) having thermal conductivity greater than 100 W/(m•K).
A probe card (20) configured to be mounted in a testing apparatus of electronic devices is described, said probe card (20) comprising at least one probe head (21) that houses a plurality of contact probes (22), each contact probe (22) having at least one first end portion (22A) configured to abut onto contact pads (23A) of a device under test (23), as well as a main board (27) and an intermediate board connected to the main board (27), said intermediate board being adapted to perform a distance spatial transformation between contact pads formed on opposite faces thereof and acting as a space transformer (30). Suitably, said space transformer (30) comprises at least one core (30C) made of a material having a thermal conductivity greater than 100 W/(m•K) to collect and dissipate a heat produced by the probe card (20) during testing operations of the electronic device (23).
A probe head (20) for testing a device under test, comprising a plurality of contact probes (10), at least one guide (40, 40') and an air-conveying system (60) to convey an air flow (F) and to thereby facilitate heat dissipation, wherein the probe head comprises a conductive portion (21) formed on the guide (40, 40') to contact and short circuit a corresponding group of contact probes, and wherein the probe head further comprises a heat dissipation conductive portion (65) formed on the guide and arranged so that the air flow (F) of the air conveying system (60) passes at the same, said heat dissipation conductive portion (65) being connected to the conductive portion (21) so as to extend the conductive domain and so that said air flow (F) of the air conveying system facilitates the dissipation of the heat exchanged by said heat dissipation conductive portion.
A probe head (20) for testing a device under test (DUT) is described, said probe head (20) comprising a plurality of contact elements (10) comprising a body (10p) extending between respective end portions (10a, 10b) which are adapted to contact respective contact pads, at least one guide (40) provided with guide holes (40h) for housing at least one portion of the contact elements (10), and at least one conductive portion (30) formed at the guide (40), said conductive portion (30) including at least one group (40hg) of said guide holes (40h) and being configured to contact and short-circuit a corresponding group of contact elements which are housed in said group (40hg) of guide holes and are intended to carry a given same type of signal (Sgn), forming a given conductive domain. Suitably, the above conductive portion (30) is divided into distinct conductive sub-portions (30p) which are separated from each other, so that said given conductive domain is divided into distinct conductive sub- domains, wherein each of said conductive sub-portions (30p) is configured to distribute the given same type of signal (Sgn) among the contact elements (10) that are short-circuited by it separately from the other conductive sub-portions, and wherein each conductive sub-portion comprises a number of contact elements from 2 to 50.
A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
A contact probe is disclosed having a first contact end portion adapted to abut onto a contact pad of a device under test, a second contact end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, and a rod-shaped probe body extended between the first and second contact end portions according to a longitudinal direction. The contact probe also includes an opening that extends along the probe body and along at least one contact end portion, a first opening part defining a pair of arms in the probe body and a second opening part defining a pair of end sections in the contact end portion.
A contact probe is disclosed having a first end portion with a contact tip adapted to abut onto a contact pad of a device under test, a second end portion with a contact head adapted to abut onto a contact pad of a board of a test equipment, a probe body extended between the first and the second end portions according to a longitudinal development axis, and an elastic stopper provided in an elastic portion of the probe body arranged contiguous to the second end portion. The elastic stopper is deformable between a first working condition, in which it has a transversal diameter greater than a transversal diameter of the probe body, and a second working condition in which it has a transversal diameter corresponding to the transversal diameter of the probe body.
A probe head for testing the operation of a device under test is disclosed. The probe head has a plurality of contact probes including a body extending along a longitudinal axis adapted to contact respective contact pads and having a substantially square or rectangular-shaped cross section, and a guide lying in a plane and provided with guide holes having a substantially square or rectangular-shaped cross section for slidingly housing the contact probes. In the plane of the guide the cross section of the guide holes and the cross section of the contact probes are rotated relative to each other around the longitudinal axis and have respective different orientations with respect to a reference system in the plane, so that an edge of the body is mechanically interfering with a corresponding wall of the guide holes The probe head also has a conductive portion formed at the guide and/or formed at another guide of the probe head being adapted to contact and short-circuit a corresponding group of contact probes.
A method of manufacturing a probe card for functionality testing of devices under test (DUT) is disclosed having the steps of providing an interface board configured for interfacing the probe card to a testing apparatus, providing a stiffener, connecting an interposer in the shape of a monobloc of material to the stiffener, cutting the monobloc according to a predetermined pattern after connecting it to the stiffener, thereby defining a plurality of modules which are independent and separated from each other, associating the interface board with the stiffener, and associating a probe head with the interposer. The probe head includes a plurality of contact elements adapted to electrically connect the interposer to contact pads of the devices under test. A probe card obtained by the method is also disclosed.
A contact element for a probe head for an electronic device test apparatus is disclosed, having a body extending along a longitudinal axis between a first and a second opposite contact end, each made of electrically conductive material. The body includes a first section which extends over a distance less than 1000 μm along the longitudinal axis starting from the first contact end towards the second contact end, a second section which extends along the longitudinal axis starting from the second contact end towards the first contact end, and a third section, interposed between the first and second sections, made of an electrically insulating material. The sections follow each other along the longitudinal axis so that the first contact end is included only in the first section, the second contact end is included only in the second section, and the third section electrically insulates the first section from the second section.
A method for manufacturing a probe head for the functionality testing of devices under test (DUT) is disclosed. The method includes providing a containment element, arranging a lower guide at a lower face of the containment element which faces toward the devices under test during the test, and arranging an upper guide at an upper face of the containment element. The containment element is interposed between the lower and upper guides which are initially in the shape of a single plate connected to the containment element. The method further includes cutting the lower and/or upper guide thereby defining a plurality of guide portions that are independent and separated from each other, and inserting a plurality of contact elements into respective guide holes formed in the guides. The contact elements are adapted to contact pads of the devices under test. A probe head obtained by the method is also disclosed.
G01R 3/00 - Appareils ou procédés spécialement adaptés à la fabrication des appareils de mesure
53.
Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices
A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 μm and the second total thickness is greater than the first total thickness.
A measurement system (20) for a testing apparatus of electronic devices is herein disclosed, the system having a flexible membrane (21) adapted to carry signals from/towards a device under test (DUT), a plurality of micro contact probes (22) comprising a first portion (22a) associated with the flexible membrane (21) and a second portion (22b) adapted to contact contact pads (DUTp) of the device under test (DUT), and a first damping structure (24) in contact with the flexible membrane (21). The first damping structure (24) comprises an elastomeric element (24a) configured to dampen the contact of the micro contact probes (22) with the contact pads (DUTp) of the device under test (DUT), and a containment structure (24b) of the elastomeric element (24a), said containment structure (24b) being rigid and configured to retain the elastomeric element (24a) in a containment space (S) defined thereby, and to define at least one first opening (O1), wherein a contact surface (Sa) of the elastomeric element (24a) is in contact with an active area (A) of the flexible membrane (21) through the first opening (O1) of the containment structure (24b), said active area (A) housing the micro contact probes (22), and wherein the containment structure (24b) comprises in turn a contact surface (Sb) in contact with an edge (A') of the active area (A), wherein the edge (A') of the active area (A) does not house the micro contact probes (22).
It is herein described a probe card (20) for the testing of devices under test (DUT), comprising a stiffener (21), an interface board (22) associated with the stiffener (21) and configured to interface the probe card (20) to a testing apparatus, an interposer (23), and a plurality of contact elements (51) adapted to electrically connect the interposer (23) with contact pads (P) of the devices under test (DUT), the contact elements (51) comprising a body (51') that extends along a longitudinal axis (H-H) between a first end (51a), which is adapted to contact the contact pads (P) of the devices under test (DUT), and a second and opposite end (51b) adapted to contact the interposer (23). Suitably, the interposer (23) comprises a plurality of modules (23m) which are separated and connected to each other by means of at least one material bridge (23mb), said at least one material bridge (23mb) being defined between adjacent modules by material removal from a starting substrate.
A probe card (20) adapted to be mounted in a testing apparatus of electronic devices is described, said probe card (20) comprising at least one probe head (21) that houses a plurality of contact probes (22), each contact probe (22) having at least one first end portion (22A) adapted to abut onto contact pads (23A) of a device under test (23), as well as a main board (27) and an intermediate board, connected to the main board (27) and adapted to provide a distance spatial transformation between contact pads made on opposite faces thereof, said intermediate board being a space transformer (30), wherein said space transformer (30) comprises a plurality of modules (40) that are plate-shaped and coplanar, structurally and functionally independent from each other, each module (40) having a first face (F1) facing towards the probe head (21) and provided with a first plurality of contact pads (40A) where onto respective second end portions (22B) of the contact probes (22) abut and a second face (F2), opposite the first face (F1) and facing towards the main board (27), said second face (F2) being provided in turn with a second plurality of contact pads (40B) connected to the first plurality of contact pads (40A) by means of electrical connections (40C) made inside the module (40) and in that the space transformer (30) comprises a connecting structure (31) made at the second faces (F2) of the modules (40), said modules (40) having a same thickness (S2).
A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
A testing head comprises a plurality of contact probes, and a guide having a plurality of guide holes for housing the contact probes and including a conductive portion. Each contact probe includes a first end region and a second end region, and a body which extends between the first and second end regions. Suitably, the conductive portion includes a group of the guide holes and electrically connects contact probes of a first group of the contact probes. The contact probes of the first group slide in the guide holes in the conductive portion and are adapted to carry a same signal, and each contact probe of a second group of the plurality of contact probes is surrounded by an insulating coating layer that extends along the body of each contact probe of the second group, thereby insulating the contact probes of the second group from the conductive portion.
A contact probe having a first end portion adapted to abut onto a contact pad of a device under test and a second end portion adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body extended between the end portions along a longitudinal development direction is provided with an opening extending along the longitudinal development direction and defines at least one pair of arms in the probe body. Suitably, each arm of the at least one pair of arms has a not constant transversal section, which is perpendicular to the longitudinal development direction, having different areas in correspondence of different points along the probe body and ensures a distribution of the stress along the probe body during bending thereof during testing operation of the device under test performed by means of the contact probe.
A probe head for a testing apparatus of electronic devices is disclosed having a plurality of contact probes, a guide provided with a plurality of guide holes for slidingly housing the contact probes, and a containment element which is adapted to support the guide. The containment element includes a first portion and a second portion which is movable with respect to the first portion, movement means adapted to move the second portion of the containment element with respect to the first portion, and a test optical signal distribution element configured to transmit a test optical signal to the device under test. The test optical signal distribution element is associated with the second portion of the containment element and is arranged to be moved integrally therewith. The movement means is configured to allow the alignment of the test optical signal distribution element.
G01R 19/00 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe
G01R 31/02 - Essai des appareils, des lignes ou des composants électriques pour y déceler la présence de courts-circuits, de discontinuités, de fuites ou de connexions incorrectes de lignes
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
A contact probe for a probe head for test equipment of electronic devices is provided. The contact probe includes a first end portion and a second end portion configured to realize a contact with suitable contact structures, and a body portion extended along a longitudinal development axis between respective the first and second end portions. The first end portion includes a base portion, a peripherally protruding element protruding from the base portion, and a hollow part having a base at a surface of the base portion and being surrounded by the peripherally protruding element. In addition, the peripherally protruding element is configured to penetrate into the contact structures.
It is herein described a contact probe (20) having a first end portion (20A) which ends with a contact tip (21A) configured to abut onto a contact pad (51A) of a device under test (51) and a second end portion (20B) which ends with a contact head (21B) configured to abut onto a contact pad (61A) of a board (60) of a testing apparatus, as well as a probe body (20C) extended between the first end portion (20A) and the second end portion (20B) along with a longitudinal development axis (HH), the first end portion (20A) comprising a first support part (22A), interposed between the probe body (20C) and the contact tip (21A). Suitably, the first support part (22A) comprises at least one contact pin (24) and one probe length (23) which extend parallel to each other along the longitudinal development axis (HH) and are separated by an air gap (ZA).
A contact probe having a first end portion and a second end portion, a probe body extended along a longitudinal development direction between the first end portion and the second end portion is disclosed. The probe body has a pair of arms separated by a slot and extending according to the longitudinal development direction and a conductive insert extended along the longitudinal development direction, in a bending plane of the contact probe. The conductive insert is made of a first material and the contact probe is made of a second material and the first material has a lower electrical resistivity than an electrical resistivity of the second material. The conductive insert is a power transmission element of the contact probe and the arms are structural support elements of the contact probe during a deformation of the probe body.
A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.
A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.
It is herein disclosed a contact probe (20) having a first end portion (20A) which ends with a contact tip (20F) adapted to abut onto a contact pad of a device under test and a second end portion (20B) which ends with a contact head (20E) adapted to abut onto a contact pad of a board of a test equipment, as well as a probe body (20C) extended between the first end portion (20A) and the second end portion (20B) according to a longitudinal development axis (HH), characterized in that it comprises an elastic stopper (21) provided in an elastic portion (20G) of the probe body (20C) arranged contiguous to the second end portion (20B), said elastic stopper (21) being elastically deformable between a first working condition, in which it has a transversal diameter (DG) greater than a transversal diameter (DC) of the probe body (20C), and a second working condition in which it has a transversal diameter (DG') substantially corresponding to the transversal diameter (DC) of the probe body (20C), the term transversal diameter meaning a maximum transversal dimension of a section, even not circular, taken according to a plane orthogonal to said longitudinal development axis (HH).
Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices
A flexible membrane (30) adapted to carry high-frequency power signals is described, the membrane comprising a plurality of contact pads (31A, 31B) adapted to electrically connect with a plurality of micro contact probes (25) and made in a central portion (30A) of the flexible 5 membrane (30) and a plurality of contact structures (31C) adapted to electrically connect with a support plate (24) and made in a peripheral portion (30C) of the flexible membrane (30), as well as a plurality of conductive tracks (33A, 33B) made in the flexible membrane (30), each of these conductive tracks (33A, 33B) electrically connecting one of the 10 contact pads (31A, 31B) with one of the contact structures (31C), this flexible membrane (30) further comprising an intermediate portion (30B) arranged and connected between the central portion (30A) and the peripheral portion (30C). Suitably, the elastic membrane is divided into a first area (34A) having a first total thickness (HA) and into a second area 15 (34B) having a second total thickness (HB), the first area (34A) being contiguous and adjacent to the second area (34B), the first total thickness (HA) having a value which is lower or equal to 75 μm and the second total thickness (HB) having a value which is greater than the value of the first total thickness (HA). Furthermore, the first area (34A) of the membrane 20 (30) extends at the central portion (30A) and comprises the plurality of contact pads (31A, 31B). A probe card (20) for testing electronic devices comprising this flexible membrane (30) is also described.
It is herein disclosed a method for manufacturing a probe head (50) for the functionality testing of devices under test (DUT). The method comprises the steps of providing a containment element (55), arranging a lower guide (60) at a lower face (Fa') of the containment element (55), said lower face (Fa') facing towards the devices under test (DUT) during the test, and arranging an upper guide (70) at an upper face (Fb') of the containment element (55), said upper face (Fb') being opposite the lower face (Fa'), wherein the containment element (55) is interposed between the lower guide (60) and the upper guide (70), and wherein said guides (60, 70) are initially in the shape of at least one single plate connected to the containment element (55). Suitably, the method further comprises the steps of cutting at least one of the lower guide (60) or the upper guide (70) thereby defining a plurality of guide portions (60p, 70p) that are independent and separated from each other, and inserting a plurality of contact elements (51) into respective guide holes (60h, 70h) formed in said guides (60, 70), said contact elements (51) being adapted to contact pads (P) of the devices under test (DUT). It is also disclosed a probe head (50) obtained by said method.
It is herein described a contact probe (20) having a first contact end portion (20B) adapted to abut onto a contact pad of a device under test and a second contact end portion (20A) adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body (20C) extended between said first and second contact end portions (20B, 20A) according to a longitudinal direction (x). Suitably, the contact probe (20) comprises at least one opening (17, 17', 17'') that extends along the probe body (20C) and along at least one contact end portion (20B, 20A), a first opening part (14, 14a, 14b) defining at least one pair of arms (13a, 13b, 13c) in the probe body (20C) and a second opening part (16, 16a, 16b; 16') defining at least one pair of end sections (15a, 15b, 15c; 15a', 15b') in said at least one contact end portion (20B, 20A).
It is herein disclosed a method for manufacturing a probe card (20) for the functionality testing of devices under test (DUT), comprising the steps of providing an interface board (22) configured for interfacing the probe card (20) to a testing apparatus, providing a stiffener (21), connecting an interposer (23) to the stiffener (21), said interposer (23) being in the shape of at least one monobloc of material, cutting the at least one monobloc of the interposer (23) according to a predetermined pattern after connecting it to the stiffener (21), thereby defining a plurality of modules (23m) which are independent and separated from each other, associating the interface board (22) with the stiffener (21), and associating a probe head (50) with the interposer (23), the probe head (50) comprising a plurality of contact elements (51) adapted to electrically connect the interposer (23) to contact pads (P) of the devices under test (DUT). A probe card (20) obtained through said method is also herein described.
A manufacturing method for manufacturing at least one contact probe for a probe head of a test equipment of electronic devices, comprising a step of submicrometric 3D printing of the contact probe with at least one printing material selected from a conductor material or a semiconductor material is disclosed.
A probe head adapted to verify the operation of a device to be tested integrated on a semiconductor wafer comprises at least one guide provided with a plurality of guide holes adapted to house a plurality of contact probes. Conveniently, the guide is made of a material suitable for manufacturing integrated circuits and comprises circuit components integrated therein, such guide being an electronically active element of the probe head.
A probe head for a test equipment of electronic devices comprises a plurality of contact probes inserted in guide holes provided in at least one upper guide and one lower guide, a bending area for the contact probes being defined between the upper and lower guides, each contact probe having at least one first terminal portion which protrudes of a first length from the lower guide and ends with a contact tip (22A) adapted to abut onto a respective contact pad of a device to be tested, as well as a second terminal portion which protrudes of a second length from the upper guide and ends with a contact head adapted to abut onto a contact pad of a board for connecting or interfacing with the test equipment, suitably comprising at least one protection structure projecting from the upper guide in direction of a longitudinal development axis of the contact probes towards the board, the protection structure thus extending in correspondence of the contact heads of the contact probes.
It is herein disclosed a contact element (10) for a probe head for an electronic device test apparatus, the contact element (10) comprising a body (10', 10pp) extending along a longitudinal axis (H-H) between a first contact end (10a), which is adapted to contact pads (11) of a device under test, and a second and opposite contact end (10b), wherein said body (10', 10pp) comprises a first section (S1) which extends along the longitudinal axis (H-H) starting from the first contact end (10a) towards the second contact end (10b) and is made of an electrically conductive material, said first section (S1) extending over a distance less than 1000 µm, a second section (S2) which extends along the longitudinal axis (H- H) starting from the second contact end (10b) towards the first contact end (10a) and is made of an electrically conductive material, and a third section (S3) which is interposed between the first section (S1) and the second section (S2) and is made of an electrically insulating material. Said sections (S1, S2, S3) follow each other along the longitudinal axis (H-H) so that the first contact end (10a) is included only in the first section (S1) and the second contact end (10b) is included only in the second section (S2), and wherein the third section (S3) is configured to electrically insulate the first section (S1) from the second section (S2).
It is herein disclosed a probe head (20) for testing the operation of a device under test, said probe head (20) comprising a plurality of contact probes (10) comprising a body (10') extending along a longitudinal axis (H-H) between respective end portions (10a, 10b) adapted to contact respective contact pads and having a substantially square or rectangular-shaped cross section, and at least one guide (40') lying in a plane (α) and provided with guide holes (40'h) for slidingly housing the contact probes (10), said guide holes (40'h) having a substantially square or rectangular-shaped cross section. Suitably, in the plane (α) of the guide (40'), the cross section of the guide holes (40'h) and the cross section of the contact probes (10) housed therein are rotated relative to each other around the longitudinal axis (H-H) and have respective different orientations with respect to a reference system (x-y) in said plane (α), so that at least one edge (S) of said body (10') is mechanically interfering with a corresponding wall (W) of said guide holes (40'h). Furthermore, the probe head (20) comprises a conductive portion (21) formed at the guide (40') and/or formed at another guide (40'') of the probe head (20) which another guide (40'') comprises respective guide holes (40''h), said conductive portion (21) including at least one group (40'h', 40''h') of guide holes (40'h, 40''h) and being adapted to contact and short-circuit a corresponding group of contact probes housed in said group (40'h', 40''h') of holes and adapted to carry a certain type of signal.
A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.
A probe head (10) for a testing apparatus of electronic devices, comprises a plurality of contact probes (11) adapted to electrically and mechanically contact contact pads (12a) of a device under test (13), at least one guide (20) provided with a plurality of guide holes (20h) for slidingly housing the contact probes (11), a containment element (40) which is adapted to support the guide (20) and which houses at least one portion of the contact probes (11), wherein said containment element (40) comprises a first portion (40a) and a second portion (40b) which is movable with respect to said first portion (40a), movement means (60) adapted to move the second portion (40b) of the containment element (40) with respect to the first portion (40a), and at least one test optical signal distribution element (50) configured to transmit a test optical signal to the device under test (13). Suitably, the test optical signal distribution element (50) is associated with the second portion (40b) of the containment element (40) and is arranged to be moved integrally therewith by means of the movement means (60), said movement means (60) being configured to allow the alignment of said test optical signal distribution element (50).
It is herein described a contact probe (20) having a first end portion (20A) adapted to abut onto a contact pad of a device under test and a second end portion (20B) adapted to abut onto a contact pad of a PCB board of a testing apparatus, as well as a rod-shaped probe body (20C) extending between said end portions (20A, 20B) along a longitudinal development direction (z) and provided with at least one opening (22) extending along said longitudinal development direction (z) and defines at least one pair of arms (21a, 21b) in said probe body (20C). Suitably, each arm (21a, 21b) of said at least one pair of arms has a not constant transversal section, which is perpendicular to said longitudinal development direction (z), having different areas at different points (A, B, C) along said probe body (20C) so as to ensure a distribution of the stress along the probe body (20C) during the bending thereof during the testing operation of the device under test performed by means of the contact probe (20).
A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.
A contact probe for a probe head for a testing apparatus of electronic devices comprises a body portion (30C) extended along a longitudinal development axis (HH) between respective end portions configured to realize a contact with suitable contact structures, at least one end portion (30A) comprising a peripherally protruding element (32) starting from a base portion (31) of the end portion (30A) configured to define a hollow part (34) that has a base (33) at a surface of the base portion (31) and is surrounded by the peripherally protruding element (32), said peripherally protruding element (32) being configured to penetrate into the contact structures.
A probe head for testing a device under test integrated on a semiconductor wafer includes a plurality of contact probes, each having a first end and a second end, and at least one first lower guide and one second lower guide at the first end. The guides are parallel to each other and have a respective plurality of first and second guide holes for slidingly housing the contact probes. At least one third lower guide is substantially parallel to the first lower guide and to the second lower guide and includes a plurality of third guide holes for slidingly housing the contact probes. The guide holes are disposed in a shifted arrangement to eliminate a scrub movement of the first ends of each contact probe of the probe head.
A testing head apt to verify the operation of a device under test integrated on a semiconductor wafer includes a plurality of contact elements, each including a body that extends between a first end portion and a second end portion, and a guide provided with a plurality of guide holes apt to house the contact elements. The guide includes a conductive portion that includes and electrically connects the holes of a group of guide holes to each other and is apt to contact a corresponding group of contact elements apt to carry a same type of signal.
A probe head for testing a device under test includes an upper guide and a lower guide parallel to each other and spaced apart. Each of the guides is provided with a respective plurality of guide holes, a plurality of contact probes housed in the guide holes and provided each with a first end and with a second end, the first end being adapted to contact pads of a device under test. At least one additional guide is associated with one of the guides. The additional guide includes first guide holes, housing a first group of the contact probes, and second guide holes, housing a second group of the contact probes. The first and second guide holes are shifted with respect to the guide holes of the guide which said additional guide is associated with, and the shift of the first guide holes is in a direction opposite the shift of the second guide holes.
A contact probe comprises a probe body being extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body. Suitably, the end portion comprises at least one indentation adapted to house a material scrap being on the contact probe after a separation from a substrate wherein the contact probe has been realized.
A probe head for a testing apparatus of electronic devices integrated on a semiconductor wafer of the type comprises: - a first plurality of contact probes (31) having a first transversal diameter; - a second plurality of micro contact probes (36) having a second transversal diameter, smaller than the first transversal diameter of the contact probes (31), said transversal diameter being a maximum extension of a cross section of the contact probes (31) and of the micro contact probes (36), even non-circular in shape; and - a flexible membrane (35) comprising suitable conductive tracks (35C) for electrically connecting a contact probe (31) of the first plurality with a corresponding micro contact probe (36) of the second plurality, the contact probes (31) of the first plurality being arranged between the testing apparatus and the flexible membrane (35) and the micro contact probes (36) of the second plurality being arranged between the flexible membrane (35) and a semiconductor wafer (39), said micro contact probes (36) of the second plurality being configured to abut onto contact pads (37A) of a device under test (37) integrated in the semiconductor wafer (39), each contact probe (31) of the first plurality being in electrical contact with a corresponding micro contact probe (36) of the second plurality through a conductive track (35C) of the flexible membrane (35) and being configured to electrically connect the device under test (37) with the testing apparatus.
A testing head (20) for testing the functionality of an electronic device comprises a plurality of contact probes (10, 10bis) including a probe body (10') longitudinally extended between respective end portions (10a, 10b) which are adapted to contact respective contact pads, at least one lower guide (40) provided with guide holes (40h) for slidingly housing the contact probes (10, 10bis), and a conductive portion (21) in the lower guide (40), this conductive portion (21) including at least one group (40h') of the guide holes (40h) and being adapted to contact and short-circuit a corresponding group of contact probes (10) housed in this group (40h') of holes and intended to carry a certain type of signal. Suitably, at least the contact probes (10) housed in this group (40h') of holes comprise an elastically deformable portion (P) which is adapted to be at least partially inserted into the guide holes of this group (40h'), wherein this portion (P), when housed in the guide holes of this group (40h'), is in a configuration in which it is deformed by the contact with at least one wall (40hW) of these guide holes and it exerts on this wall (40hW) a reaction force (F) ensuring a sliding contact during the test of the electronic device.
It is herein described a contact probe (20) comprising a probe body (20C) extended between a first end portion (20A) and a second end portion (20B) and provided with at least one pair of arms (22a, 22b) separated by a slot (21) made in the probe body (20C) according to a longitudinal development direction of the contact probe (20). Suitably, the probe comprises at least one conductive insert (25) extended inside it along the longitudinal development direction arranged in a bending plane (α) of the contact probe (20), said conductive insert (25) being made of a first material having electrical resistivity lower than an electrical resistivity of a second material which the contact probe (20) is made of. In this way, the conductive insert (25) is a power transmission element whereas the arms (22a, 22b) are structural support elements of the contact probe (20) during a deformation of the probe body (20C).
A probe card for testing a device under test having a plurality of contact pads includes a support plate having first contact pads thereon. A flexible membrane has a first face and a peripheral portion including second contact pads thereon. A plurality of contact probes are associated with a first face of the flexible membrane and are configured to abut onto the plurality of contact pads of the device under test. A sliding contact area includes: the first contact pads formed on the support plate; the second contact pads formed on the peripheral portion of the flexible membrane, the peripheral portion of the flexible membrane configured to come in pressing contact onto the support plate at the sliding contact area. A pressing element contacts the peripheral portion of the flexible membrane at the sliding contact area, and the pressing element puts the second contact pads into pressing contact with the first contact pads.
A probe card for a test equipment of electronic devices includes a flexible membrane configured to carry high frequency signals between a device under test and a support plate. The flexible membrane is connected to the support plate through a peripheral zone, and a damping structure is arranged between the support plate and the flexible membrane. A plurality of micro contact probes include a body extending between a first end and a second end, and the second end is configured to abut onto contact pads of the device under test, and the damping structure and the first ends of the micro contact probes are in contact with opposite faces of a same contact zone of the flexible membrane. The flexible membrane includes at least one weakening zone arranged between the contact zone and the peripheral zone.
The invention describes a probe head (21) for a test equipment of electronic devices comprising a plurality of contact probes (22) inserted in guide holes provided in at least one upper guide (23) and one lower guide (24), a bending area (26) for the contact probes (22) being defined between the upper and lower guides (23, 24), each contact probe having at least one first terminal portion (21A) which protrudes of a first length (LA) from the lower guide (24) and ends with a contact tip (22A) adapted to abut onto a respective contact pad (30A) of a device to be tested (30), as well as a second terminal portion (21B) which protrudes of a second length (LB) from the upper guide (23) and ends with a contact head (22B) adapted to abut onto a contact pad (28A) of a PCB (28) for connecting or interfacing with the test equipment, suitably comprising at least one protection structure (27) projecting from the upper guide (23) in direction of a longitudinal development axis (z) of the contact probes (22) towards the PCB (28), said protection structure (27) thus extending at the contact heads (22B) of the contact probes (22).
A probe head (20) adapted to verify the operation of a device to be tested integrated on a semiconductor wafer comprises at least one guide (40, 50) provided with a plurality of guide holes (40h, 50h) adapted to house a plurality of contact probes (21). Conveniently, the guide (40, 50) is made of a material suitable for manufacturing integrated circuits and comprises circuit components (60) integrated therein, such guide (40, 50) being an electronically active element of the probe head (20).
A manufacturing method for manufacturing at least one contact probe (10) for a probe head of a test equipment of electronic devices, comprising a step of submicrometric 3D printing of said contact probe (10) with at least one printing material selected from a conductor material or a semiconductor material is disclosed.
An apparatus for the automated assembly of a probe head for testing electronic devices integrated on a semiconductor wafer, includes a support adapted to support at least two parallel guides, which are provided with a plurality of respective guides holes, and at least one holding means adapted to hold a contact probe to be housed in the guides holes, of the guides. Suitably, the support is a movable support adapted to be moved according to a preset trajectory between a first position, wherein the contact probe is held by the holding means at a predetermined position outside the guides holes, and a second position wherein the contact probe, which is held at the predetermined position, is housed in a set of guides holes that are substantially concentric to each other.
B23P 19/00 - Machines effectuant simplement l'assemblage ou la séparation de pièces ou d'objets métalliques entre eux ou des pièces métalliques avec des pièces non métalliques, que cela entraîne ou non une certaine déformationOutils ou dispositifs à cet effet dans la mesure où ils ne sont pas prévus dans d'autres classes
A contact probe for a testing head for testing electronic devices includes a rod-like body made of a first conductive material and extending along a longitudinal axis, and a contact tip supported by the body at an end portion thereof. The contact tip is made of a second conductive material that is different from the first conductive material. The contact tip includes a contact zone configured to perform mechanical and electrical contact with contact pads of a device under test. The body and the contact tip include respective contact surfaces in contact with each other. The contact surfaces are complementary to each other and include respective connection elements engaging each other. The connection elements include a protruding element projecting from the contact surface of one among the body and the contact tip, and a recess made in the other among the body and the contact tip.
A cantilever probe head includes a support ring associated with a PCB board and a plurality of contact probes, protruding from the support ring in a cantilever manner and being held by a support associated with the support ring. Each contact probe has a rod-like body having a longitudinal axis inclined with respect to a reference plane corresponding to a plane of a wafer of devices under test by the cantilever probe head, as well as at least one first end portion, provided in a first probe section protruding from the support in the direction of the wafer of devices under test, the first end portion being bent with respect to the longitudinal axis starting from a bending point and ending with a contact tip of the contact probe able to abut onto a contact pad of a device under test of the wafer.
G01R 31/00 - Dispositions pour tester les propriétés électriquesDispositions pour la localisation des pannes électriquesDispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
96.
Cantilever contact probe and corresponding probe head
A cantilever contact probe includes a shaped probe body included between a descending probe section and an ascending probe section. At least one end portion is formed in the descending probe section, and bent with respect to a longitudinal axis starting from a bending point and ending with a contact tip of the cantilever contact probe that is configured to abut onto a contact pad of a device under test of that wafer. Suitably, the shaped probe body comprises at least one base portion, an upper portion extending, starting from the base portion, along a longitudinal extension axis of the shaped probe body, orthogonally to the reference plane and a top portion, connected to the upper portion and having a greater diameter than a diameter of the upper portion to form a T, the upper portion being the stem of the T and the top portion being the crosspiece of the T.
It is herein described a contact probe of a testing head of an apparatus for testing electronic devices comprising a probe body being essentially extended in a longitudinal direction between respective end portions adapted to realize a contact with respective contact pads, at least one end portion having transverse dimensions greater than the probe body and comprising an enlarged portion, projecting only in correspondence of a first side wall of the contact probe. Suitably, the at least one end portion further comprises at least one protrusion projecting from a second side wall, opposite to the first side wall and substantially extending toward the second and opposite wall along a longitudinal axis of the contact probe starting from the enlarged portion.
A contact probe for a testing head of an apparatus for testing electronic devices comprises a body extending along a longitudinal axis between a first end portion and a second end portion, the second end portion being adapted to contact pads of a device under test. Suitably, the contact probe comprises a first section, which extends along the longitudinal axis from the first end portion and is made of an electrically non-conductive material, and a second section, which extends along the longitudinal axis from the second end portion up to the first section, the second section being electrically conductive and extending over a distance less than 1000 μm.
A probe head (20) for testing a device under test integrated on a semiconductor wafer (26) comprises a plurality of contact probes (21), each provided with a first end (21a) and a second end (21b), said first end (21a) being adapted to contact pads (25) of the device under test, and at least one first lower guide (22) and one second lower guide (23) at the first end (21a), said guides (22, 23) being parallel to each other and provided with a respective plurality of first and second guide holes (22h, 23h) for slidingly housing the contact probes (21), wherein the second guide holes (23h) of the second lower guide (23) are shifted with respect to the first guide holes (22h) of the first lower guide (22) along a first direction (Dir1). Suitably, the probe head (20) comprises at least one third lower guide (24), which is substantially parallel to the first lower guide (22) and to the second lower guide (23) and is provided with a plurality of third guide holes (24h) for slidingly housing the contact probes (21), wherein the second lower guide (23) is arranged between the first lower guide (22) and the third lower guide (24), and wherein the third guide holes (24h) of the third lower guide (24) are shifted with respect to the second guide holes (23h) of the second lower guide (23) along a second direction (Dir2) opposite the first direction (Dir1), the shift of the third guide holes (24h) being such as to eliminate a scrub movement of the first ends (21a) of each contact probe (21) of the probe head (20).
b). Suitably, the interconnections elements (23) are made of a conductive elastomer that fills the openings (22) of the support (21), each of the interconnection elements (23) forming a conductive channel between different and opposing faces (Fa, Fb) of the support (21).
