Abrégé

A delay locked loop includes a delay line, a phase detector, a controller, an output clock generator, and a feedback circuit. The delay line receives an input clock signal and a control code, and generates a delayed clock signal by delaying the input clock signal according to the control code. The phase detector receives a reference clock signal and a feedback clock signal, and detects a phase difference between the reference clock signal and the feedback clock signal to generate phase comparison information. The controller generates the control code and a switching signal according to the phase comparison information. The output clock generator selects the delayed clock signal or an inverted signal of the delayed clock signal according to the switching signal to generate an output clock signal. The feedback circuit generates the feedback clock signal according to the output clock signal.

Classes IPC  ?

• H03L 7/081 - Détails de la boucle verrouillée en phase avec un déphaseur commandé additionnel
• G11C 19/00 - Mémoires numériques dans lesquelles l'information est déplacée par échelons, p. ex. registres à décalage
• H03L 7/091 - Détails de la boucle verrouillée en phase concernant principalement l'agencement de détection de phase ou de fréquence, y compris le filtrage ou l'amplification de son signal de sortie le détecteur de phase ou de fréquence utilisant un dispositif d'échantillonnage
• H03K 19/20 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion caractérisés par la fonction logique, p. ex. circuits ET, OU, NI, NON

Abrégé

A semiconductor device is provided. The semiconductor device includes a substrate, a first source/drain region and a second source/drain region disposed within the substrate, and a gate structure disposed on the substrate and between the first source/drain region and the second source/drain region. The semiconductor device further includes an interlayer dielectric layer disposed over the first source/drain region, the second source/drain region, and the gate structure. The interlayer dielectric layer includes a second trench extending into the second source/drain region. The semiconductor device further includes a dielectric layer disposed in the second trench, and a second source/drain contact disposed over the second source/drain region and filling the remaining portion of the second trench.

Classes IPC  ?

• H10B 20/25 - Dispositifs ROM programmable une seule fois, p. ex. utilisant des jonctions électriquement fusibles

Abrégé

A sense amplifier capable of performing a logical NOT operation is provided, which includes a sense circuit, configured to sense a first voltage of a bit line and a second voltage of an inverse bit line; a first transistor, coupled between a first terminal of the sense circuit and the bit line; a second transistor, coupled between a second terminal of the sense circuit and the inverse bit line; and a third transistor, coupled between the bit line and the inverse bit line. First and second memory cells are respectively controlled by first and second word lines, and connected to the bit line. When the sense amplifier is in an inverse writing state, the sense amplifier writes the second voltage to the second memory cell through a predetermined path. A first logical state of the first voltage is complementary to a second logical state of the second voltage.

Classes IPC  ?

• G11C 7/06 - Amplificateurs de lectureCircuits associés
• G11C 11/4091 - Amplificateurs de lecture ou de lecture/rafraîchissement, ou circuits de lecture associés, p. ex. pour la précharge, la compensation ou l'isolation des lignes de bits couplées
• G11C 11/4094 - Circuits de commande ou de gestion de lignes de bits
• G11C 11/4096 - Circuits de commande ou de gestion d'entrée/sortie [E/S, I/O] de données, p. ex. circuits pour la lecture ou l'écriture, circuits d'attaque d'entrée/sortie ou commutateurs de lignes de bits

Abrégé

A memory device capable of performing in-memory computing is provided and includes a memory cell array, a sense amplifier, a voltage control circuit, and a word line decoding circuit. The memory cell array includes memory cells arranged in a two-dimensional array. The memory cells on each row of the memory cell array are connected to a corresponding word line, and the memory cells on each column of the memory cell array are connected to a corresponding bit line. The sense amplifier detects a voltage level of the activated bit line and a voltage level of an inverse bit line corresponding to the bit line. The voltage control circuit selects a detection voltage provided to the sense amplifier according to a control signal from a memory controller. The word line decoding circuit activates a first word line and a second word line according to the control signal.

Classes IPC  ?

• G11C 11/408 - Circuits d'adressage
• G11C 11/4091 - Amplificateurs de lecture ou de lecture/rafraîchissement, ou circuits de lecture associés, p. ex. pour la précharge, la compensation ou l'isolation des lignes de bits couplées
• G11C 11/4096 - Circuits de commande ou de gestion d'entrée/sortie [E/S, I/O] de données, p. ex. circuits pour la lecture ou l'écriture, circuits d'attaque d'entrée/sortie ou commutateurs de lignes de bits
• H03K 19/20 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion caractérisés par la fonction logique, p. ex. circuits ET, OU, NI, NON

Abrégé

A semiconductor device including a substrate, a capacitor, a stop layer, a first contact, and a second contact is provided. The substrate includes a memory array region and a peripheral circuit region. The capacitor is located in the memory array region. The capacitor includes a first electrode, a second electrode, and an insulating layer. The second electrode is located on the first electrode. The insulating layer is located between the first electrode and the second electrode. The stop layer is located on the second electrode in the memory array region and extends into the peripheral circuit region. A material of the stop layer is not a conductive material. The first contact is located in the memory array region, passes through the stop layer, and is electrically connected to the second electrode. The second contact is located in the peripheral circuit region and passes through the stop layer.

Classes IPC  ?

• H10B 12/00 - Mémoires dynamiques à accès aléatoire [DRAM]
• H01L 21/311 - Gravure des couches isolantes
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H10D 1/68 - Condensateurs n’ayant pas de barrières de potentiel

Abrégé

A probe tip landing method for a measurement system is provided. The probe tip landing method includes performing a first descending operation to lower a probe toward a sample by a first descending distance; performing a second descending operation to lower the probe toward the sample; and performing an inspection operation during the second descending operation. The inspection operation includes an imaging operation, scanning the sample to obtain a first image including a probe tip of the probe; and a determining operation, checking the first image to determine that in the first image, whether a region connected with the probe tip becomes bright. The probe tip landing method further includes in response to the region connected with the probe tip in the first image becoming bright, determining that the probe has contacted a surface of the sample and the probe has landed successfully.

Classes IPC  ?

• G01Q 30/02 - Dispositifs d'analyse d’un type autre que la microscopie à sonde à balayage SPM, p. ex. microscope électronique à balayage SEM [Scanning Electron Microscope], spectromètre ou microscope optique
• G01Q 20/00 - Contrôle du mouvement ou de la position de la sonde

Abrégé

A voltage generation circuit and a semiconductor memory device capable of decreasing the layout size and the consumed current are provided. A voltage generation circuit includes a plurality of voltage generation units which generate different output voltages based on an external power supply voltage. Each of the plurality of voltage generation unit comprises a plurality of resistors that are connected in series to detect the output voltages. At least one of these resistors is coupled to and shared by the plurality of voltage generation units.

Classes IPC  ?

• G11C 11/4074 - Circuits d'alimentation ou de génération de tension, p. ex. générateurs de tension de polarisation, générateurs de tension de substrat, alimentation de secours, circuits de commande d'alimentation
• G11C 5/14 - Dispositions pour l'alimentation

Abrégé

A memory device including a memory cell array, a signal generator, a word line decoder, a bit line decoder, a sensing amplifier circuit and a register circuit is provided. The signal generator generates a control signal according to a wrap around read command. The word line decoder, the bit line decoder, and the sensing amplifier circuit read data stored in the memory cell array according to the wrap around read command, so as to output a first wrap around read data. The register circuit is configured to latch the first wrap around read data and outputs successive wrap around read data according to the control signal and the latched first wrap around read data after the first wrap around read data is output. When the register circuit outputs the successive wrap around read data, the word line decoder, the bit line decoder, and the sensing amplifier circuit are disable.

Classes IPC  ?

• G11C 7/08 - Leur commande
• G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S

Abrégé

A memory controller for controlling a flash memory is provided. The memory controller includes a control circuit and a voltage generator. The control circuit is configured to program one or more pages of the flash memory in sequence, wherein each page includes a plurality of bytes. The voltage generator is configured to adjust the output voltage according to the control signal from the control circuit. The control circuit performs a programming verification operation on each byte of a current page of the one or more pages in a page programming mode, and calculates the first number of bytes which fail the programming verification operation and performs a programming operation again. The control circuit determines the programming mode of the page after the current page as the page programming mode or the byte programming mode according to the first number.

Classes IPC  ?

• G11C 11/34 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/30 - Circuits d'alimentation
• G11C 16/34 - Détermination de l'état de programmation, p. ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention

Abrégé

A voltage generating device includes a low-dropout voltage regulator and a control signal generator. The low-dropout voltage regulator provides an output voltage to a power distribution network. The low-dropout voltage regulator has a feedback circuit. The feedback circuit divides the output voltage to generate a feedback voltage according to a voltage dividing ratio, and the feedback circuit sets the voltage dividing ratio according to multiple control signals. The control signal generator is coupled to the feedback circuit and the power distribution network, and generates the control signals by comparing a sensing voltage at a reference terminal of the power distribution network with multiple threshold voltages.

Classes IPC  ?

• G05F 1/575 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final caractérisé par le circuit de rétroaction
• G05F 1/565 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final sensible à une condition du système ou de sa charge en plus des moyens sensibles aux écarts de la sortie du système, p. ex. courant, tension, facteur de puissance

Abrégé

A delay control circuit provided herein includes a DLL control circuit, a delay line circuit, and an N-value detection circuit. The DLL control circuit determines the delay amount based on the phase difference between the input and output clock signals. The delay line circuit delays the input clock signal based on the delay amount to generate an output clock signal. The N-value detection circuit performs an N-value detection operation for detecting the number of delayed clock cycles from the input clock signal to the output clock signal. When it is determined to be in an overflow state, the DLL control circuit outputs a signal indicating an overflow state to the N-value detection circuit. When the signal indicating the overflow state is received, the N-value detection circuit does not perform the N-value detection operation, but instead sets the number of delayed clock cycles to a predetermined value.

Classes IPC  ?

• G11C 11/40 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs utilisant des transistors
• G11C 11/4076 - Circuits de synchronisation
• G11C 11/4093 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. mémoires tampon de données
• H03L 7/081 - Détails de la boucle verrouillée en phase avec un déphaseur commandé additionnel
• H03L 7/085 - Détails de la boucle verrouillée en phase concernant principalement l'agencement de détection de phase ou de fréquence, y compris le filtrage ou l'amplification de son signal de sortie

Abrégé

The present invention provides a stress testing circuit including a control circuit. In a test mode, the control circuit controls a supply voltage which is applied to a pre-charge circuit including transistors in a semiconductor memory device. The control circuit controls the supply voltage according to the voltage of an external power supply and the threshold voltage of the transistors included in the pre-charge circuit.

Classes IPC  ?

• G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux

Abrégé

A semiconductor memory device that can easily recognize the content of errors in data is provided. The semiconductor memory device includes a memory cell array, an error detection and correction circuit, and an input/output circuit. The memory cell array includes a plurality of memory cells. The error detection and correction circuit detects and corrects error bits included in the data output by the memory cell array. The error detection and correction circuit activates an error detection signal when the data includes a correctable error bit. The input/output circuit stops the clocking of the data strobe signal output with data when the data includes uncorrectable error bits.

Classes IPC  ?

• G11C 29/44 - Indication ou identification d'erreurs, p. ex. pour la réparation
• G11C 29/02 - Détection ou localisation de circuits auxiliaires défectueux, p. ex. compteurs de rafraîchissement défectueux
• G11C 29/52 - Protection du contenu des mémoiresDétection d'erreurs dans le contenu des mémoires
• H03K 19/017 - Modifications pour accélérer la commutation dans les circuits à transistor à effet de champ

Abrégé

A fuse block unit includes a share flip-flop. The share flip-flop includes a first switch element, a second switch element, a third switch element, a fourth switch element, a first latch, and a second latch. The first switch element selectively couples a first laser latch to a first node according to the first load voltage. The second switch element selectively couples a second laser latch to the first node according to the second load voltage. The third switch element selectively couples an input node to the first node according to the inverted shift voltage. The first latch is coupled between the first node and a second node. The fourth switch element selectively couples the second node to a third node according to the shift voltage. The second latch is coupled between the third node and an output node.

Classes IPC  ?

• G11C 17/14 - Mémoires mortes programmables une seule foisMémoires semi-permanentes, p. ex. cartes d'information pouvant être replacées à la main dans lesquelles le contenu est déterminé en établissant, en rompant ou en modifiant sélectivement les liaisons de connexion par une modification définitive de l'état des éléments de couplage, p. ex. mémoires PROM

Abrégé

The present invention provides a memory system in which a semiconductor memory device can be accessed properly. The memory system includes a memory controller and a semiconductor memory device. The memory controller sends a command, an address, and first checking data to the semiconductor memory device. When the semiconductor memory device receives first response information that indicates that no error has been detected, it sends or receives read data or write data from the semiconductor memory device. When the semiconductor memory device receives the command, the address, and the first checking data, it uses the first checking data to detect errors in the command and the address, and sends the first reply information when no error is detected, and when no error is detected in the command and the address, it sends or receives read data or write data from the semiconductor memory device.

Classes IPC  ?

• G11C 29/52 - Protection du contenu des mémoiresDétection d'erreurs dans le contenu des mémoires
• G11C 11/4093 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. mémoires tampon de données
• G11C 11/4096 - Circuits de commande ou de gestion d'entrée/sortie [E/S, I/O] de données, p. ex. circuits pour la lecture ou l'écriture, circuits d'attaque d'entrée/sortie ou commutateurs de lignes de bits

Abrégé

A pseudo-static random access memory is provided herein, which may improve the speed of data transmission. After a first delay from a command and a row address being input in a first operation, the pseudo-static random access memory inputs or outputs the data in the memory cells corresponding to the input row address and the input column address, which includes a control unit controlling a delay in the second operation less than the initial delay when a specific condition is satisfied. The second operation is executed after the first operation.

Classes IPC  ?

• G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S

Abrégé

A semiconductor memory device has a NOR-type memory cell array, a crossbar array, an entry gate, and a column selecting/signal processing unit. The crossbar array has a plurality of rows and columns, variable resistor elements formed in intersections of rows and columns respectively. The entry gate arranged between the memory cell array and the crossbar array, connects a selected bit line of the memory cell array to the crossbar array based on a selection signal. The column selecting/signal processing unit has a column writing unit, a column reading unit, and a NOR writing unit. The column writing unit writes data read from the memory cell array to a selected column of the crossbar array. The column reading unit reads data of the selected column of the crossbar array. The NOR writing unit at least writes data read by the column writing unit to the memory cell array.

Classes IPC  ?

• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou
• G06N 3/065 - Moyens analogiques
• G06N 3/08 - Méthodes d'apprentissage
• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p. ex. FAMOS
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/26 - Circuits de détection ou de lectureCircuits de sortie de données

Abrégé

A synchronization circuit, a semiconductor storage device, and a synchronization method provided herein, which are capable of performing synchronization on a small circuit scale, includes: a first delay circuit delaying a input synchronization signal by a first predetermined time to generate a first delay synchronization signal; a second delay circuit delaying the first delay synchronization signal by a second predetermined time to generate a second delay synchronization signal; a first synchronization circuit outputting a first output data generated by synchronizing the input data with the input synchronization signal; a second synchronization circuit outputting a second output data generated by synchronizing the input data with the first delay synchronization signal; and a resynchronization circuit resynchronizing the input data with the second delay synchronization signal to update the first output data to the first synchronization circuit when the first output data is inconsistent with the second output data.

Classes IPC  ?

• H04L 7/00 - Dispositions pour synchroniser le récepteur avec l'émetteur

Abrégé

A pick-up structure for a memory device and method for manufacturing memory device are provided. The pick-up structure includes a substrate and a plurality of pick-up electrode strips. The substrate has a memory cell region and a peripheral pick-up region adjacent thereto. The pick-up electrode strips are parallel to a first direction and arranged on the substrate in a second direction. The second direction is different from the first direction. Each pick-up electrode strip includes a main part in the peripheral pick-up region and an extension part extending from the main part to the memory cell region. The main part is defined by fork-shaped patterns of a first mask layer. The extension part has a width less than that of the main part, and the extension part has a side wall surface aligned with a side wall surface of the main part.

Classes IPC  ?

• H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
• H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
• H01L 21/311 - Gravure des couches isolantes
• H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
• H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
• H10B 41/50 - Dispositifs de mémoire morte reprogrammable électriquement [EEPROM] comprenant des grilles flottantes caractérisés par la région limite entre la région noyau et la région de circuit périphérique
• H10B 43/50 - Dispositifs EEPROM avec des isolants de grille à piégeage de charge caractérisés par la région limite entre la région noyau et la région de circuit périphérique

Abrégé

A semiconductor memory device capable of suppressing an increase in power consumption and avoiding data destruction due to the row hammer problem is provided. The semiconductor memory device includes a refresh control unit (first control unit) that sets a memory cell refresh interval based on information about a memory cell refresh interval included in a predetermined command input from the outside.

Classes IPC  ?

• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G11C 29/42 - Dispositifs de vérification de réponse utilisant des codes correcteurs d'erreurs [ECC] ou un contrôle de parité
• G11C 11/4096 - Circuits de commande ou de gestion d'entrée/sortie [E/S, I/O] de données, p. ex. circuits pour la lecture ou l'écriture, circuits d'attaque d'entrée/sortie ou commutateurs de lignes de bits

Abrégé

A testing circuit includes a command pad, a first circuit, a second circuit, a first latch, and a second latch. The command pad receives an operation command. The first integrated circuit performs a corresponding test operation according to the operation command and an internal selection signal. The second integrated circuit performs the corresponding test operation according to the operation command and an internal selection signal. The first latch provides the operation command to the first integrated circuit according to the internal selection signal. The second latch provides the operation command to the second integrated circuit according to the internal selection signal.

Classes IPC  ?

• H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
• G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux

Abrégé

A semiconductor memory device can appropriately control operation timing, based on changes in the environment (for example, power supply voltage and temperature, etc.) when in use. The semiconductor memory device includes a temperature sensor 18 that detects the temperature of the semiconductor memory device, a voltage detection portion (composed of a ring oscillator 14 and a counter 15) that detects the power supply voltage of the semiconductor memory device, and a control portion 10 that controls the operation timing in the semiconductor memory device to meet specific conditions, according to the temperature detected by the temperature sensor 18 after the power is applied and the voltage detected by the voltage detection portion after the power is applied.

Classes IPC  ?

• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G11C 11/4076 - Circuits de synchronisation
• H03K 19/17728 - Blocs logiques reconfigurables, p. ex. tables de consultation
• G11C 11/4074 - Circuits d'alimentation ou de génération de tension, p. ex. générateurs de tension de polarisation, générateurs de tension de substrat, alimentation de secours, circuits de commande d'alimentation

Abrégé

A counting method adapted to count the stage number of an integrated circuit is provided herein. The counting method includes selecting an initial segment on a graphical user interface; determining whether the initial segment is floating; when it is determined that the initial segment is coupled to a first device, storing the first device in a device register; increasing the stage number by 1 to be a first stage number corresponding to the first device; storing all segments coupled to the first device except the initial segment in a first coupling register; selecting a first segment from the first coupling register; determining whether the first segment is floating; and when it is determined that the first segment is not floating, displaying the first stage number at the first segment on the graphical user interface.

Classes IPC  ?

• G06F 30/31 - Saisie informatique, p. ex. éditeurs spécifiquement adaptés à la conception de circuits

Abrégé

A semiconductor memory device is provided. The semiconductor memory device can suppress increases in power consumption. As a result, damage to the data normally caused by row hammer problem can be prevented. The semiconductor memory device includes a control unit. The control unit controls a refresh operation for a memory to be performed at any interval, wherein there are a plurality of possible intervals. When read/write access to the memory is required, the control unit controls the refresh operation for the memory to be performed with a shortest interval among the intervals, until a predetermined condition is met.

Classes IPC  ?

• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G11C 11/4096 - Circuits de commande ou de gestion d'entrée/sortie [E/S, I/O] de données, p. ex. circuits pour la lecture ou l'écriture, circuits d'attaque d'entrée/sortie ou commutateurs de lignes de bits
• G11C 11/4076 - Circuits de synchronisation

Abrégé

A delay control device for controlling a delay circuit includes an oscillator, a counter, and an output control circuit. The oscillator generates an internal clock signal according to an external clock signal. The counter generates an accumulative signal according to the internal clock signal. The counter is selectively reset by the external clock signal. The output control circuit generates a delay indication signal according to the accumulative signal. The delay time of the delay circuit is adjusted according to the delay indication signal.

Classes IPC  ?

• H03K 5/131 - Dispositions ayant une sortie unique et transformant les signaux d'entrée en impulsions délivrées à des intervalles de temps désirés contrôlées numériquement
• H03K 5/135 - Dispositions ayant une sortie unique et transformant les signaux d'entrée en impulsions délivrées à des intervalles de temps désirés par l'utilisation de signaux de référence de temps, p. ex. des signaux d'horloge
• H03K 5/00 - Transformation d'impulsions non couvertes par l'un des autres groupes principaux de la présente sous-classe

Abrégé

A power supply control circuit that is able to reliably discharge to the internal power supply, even when the external power supply is cut off instantaneously. The power supply control circuit includes a voltage detection unit, an internal power supply generation unit, and a control unit. The voltage detection unit detects the voltage of the external power supply. The internal power supply generation unit generates the internal power supply, according to the external power supply. The control unit controls the discharging to the internal power supply according to at least the second control signal among the first control signal and the second control signal, when the detected voltage of the external power supply drops below the predetermined value.

Classes IPC  ?

• H02M 3/155 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
• H03K 19/20 - Circuits logiques, c.-à-d. ayant au moins deux entrées agissant sur une sortieCircuits d'inversion caractérisés par la fonction logique, p. ex. circuits ET, OU, NI, NON

Abrégé

A semiconductor device that can compensate for threshold fluctuations in memory cells using capacitive coupling. The flash memory includes a NAND-type memory cell array, a programing device, a reading device, and an offset voltage determining unit. The programing device programs the memory cells connected to a selected word line. The reading device reads the memory cells connected to a selected word line. The programing device programs the memory cells of a monitoring NAND string simultaneously when programing a word line. The reading device comprises a current detecting unit applying a read voltage to an unselected word line n+1, and detecting the current of the monitoring NAND string. The offset voltage determining unit determines the first and second offset voltage based on the detected current, and a reading pass voltage is applied to the unselected word line, a read voltage is applied to the selected word line.

Classes IPC  ?

• G11C 7/00 - Dispositions pour écrire une information ou pour lire une information dans une mémoire numérique
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/26 - Circuits de détection ou de lectureCircuits de sortie de données
• G11C 16/34 - Détermination de l'état de programmation, p. ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
• G11C 16/24 - Circuits de commande de lignes de bits
• G11C 16/08 - Circuits d'adressageDécodeursCircuits de commande de lignes de mots

Abrégé

A flash memory including a NAND memory cell array, a current detection unit, an offset voltage determining unit, and a reading voltage generating unit. The NAND memory cell array forms at least one monitoring NAND string in each block, which are used to monitor the cycle frequency of programing and erasing. The current detection unit detects the current that flows through the monitoring NAND string. The offset voltage determining unit determines the first offset voltage and the second offset voltage that are respectively added to the read-pass voltage and the reading voltage, according to the current detected. The reading voltage generating unit generates the read-pass voltage with the first offset voltage added. The reading voltage generating unit also generates the reading voltage with the second offset voltage added.

Classes IPC  ?

• G11C 16/34 - Détermination de l'état de programmation, p. ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/16 - Circuits pour effacer électriquement, p. ex. circuits de commutation de la tension d'effacement pour effacer des blocs, p. ex. des réseaux, des mots, des groupes
• G11C 16/30 - Circuits d'alimentation
• G11C 16/08 - Circuits d'adressageDécodeursCircuits de commande de lignes de mots
• G11C 16/24 - Circuits de commande de lignes de bits
• G11C 16/28 - Circuits de détection ou de lectureCircuits de sortie de données utilisant des cellules de détection différentielle ou des cellules de référence, p. ex. des cellules factices

Abrégé

The present invention provides an oscillator circuit and a semiconductor integrated circuit, which can suppress the upper limit of the frequency of a clock signal due to an error of the constant current circuit. The oscillator circuit of the present invention includes a constant current circuit, an oscillator, and a current limiting circuit. The constant current circuit generates a first output current according to a supply voltage. The current limiting circuit receives the first output current and generates a second output current, and establishes an upper limit for the second output current when the supply voltage drops below a lower limit of a guaranteed operational range of the constant current circuit. The oscillator generates a clock signal according to the second output current. By establishing the upper limit for the second output current, the upper limit of the frequency of the clock signal can be suppressed.

Classes IPC  ?

• H03B 5/04 - Modifications du générateur pour compenser des variations dans les grandeurs physiques, p. ex. alimentation, charge, température
• G05F 3/26 - Miroirs de courant
• H03K 3/0232 - Circuits monostables
• H03K 3/011 - Modifications du générateur pour compenser les variations de valeurs physiques, p. ex. tension, température
• H03K 3/0231 - Circuits astables
• G05F 1/573 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final sensible à une condition du système ou de sa charge en plus des moyens sensibles aux écarts de la sortie du système, p. ex. courant, tension, facteur de puissance à des fins de protection avec détecteur de surintensité
• H03K 5/135 - Dispositions ayant une sortie unique et transformant les signaux d'entrée en impulsions délivrées à des intervalles de temps désirés par l'utilisation de signaux de référence de temps, p. ex. des signaux d'horloge
• G05F 1/56 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu utilisant des dispositifs à semi-conducteurs en série avec la charge comme dispositifs de réglage final

Abrégé

A conductive bridge random access memory and its manufacturing method are provided. The conductive bridge random access memory includes a bottom electrode, an inter-metal dielectric, a resistance switching assembly, and a top electrode. The bottom electrode is disposed on a substrate, and the inter-metal dielectric is disposed above the bottom electrode. The resistance switching assembly is disposed on the bottom electrode and positioned in the inter-metal dielectric. The resistance switching assembly has a reverse T-shape cross-section. The top electrode is disposed on the resistance switching assembly and the inter-metal dielectric.

Classes IPC  ?

• H01L 45/00 - Dispositifs à l'état solide spécialement adaptés pour le redressement, l'amplification, la production d'oscillations ou la commutation, sans barrière de potentiel ni barrière de surface, p.ex. triodes diélectriques; Dispositifs à effet Ovshinsky; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
• H01L 27/24 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants à l'état solide pour le redressement, l'amplification ou la commutation, sans barrière de potentiel ni barrière de surface

Abrégé

The present invention provides a short-circuit probe card, including: a substrate having an upper surface and a lower surface; a plurality of first contacts formed on the upper surface; and a plurality of second contacts formed on the lower surface and connected to the plurality of first contacts. The first contacts and second contacts are all grounded.

Classes IPC  ?

• G01R 1/073 - Sondes multiples

Abrégé

A three-dimensional resistive memory is provided. The three-dimensional resistive memory includes a resistive switching pillar, an electrode pillar disposed within the resistive switching pillar, a stack of bit lines adjacent to the resistive switching pillar, a plurality of sidewall contacts between each of the bit lines and the resistive switching pillar, and a selector pillar extending through the stack of bit lines. The bit lines are separated vertically from each other by an insulating layer. The selector pillar contacts each of the sidewall contacts.

Classes IPC  ?

• H01L 27/24 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants à l'état solide pour le redressement, l'amplification ou la commutation, sans barrière de potentiel ni barrière de surface
• H01L 45/00 - Dispositifs à l'état solide spécialement adaptés pour le redressement, l'amplification, la production d'oscillations ou la commutation, sans barrière de potentiel ni barrière de surface, p.ex. triodes diélectriques; Dispositifs à effet Ovshinsky; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives

Abrégé

A non-volatile memory device and a method thereof that are capable of improving programming speed are introduced. The non-volatile memory device includes a memory array, a charge-pump circuit, a bias detection circuit and a memory controller is introduced. The memory array includes a plurality of memory cells; and a charge-pump circuit is configured to generate a charge-pump voltage. The bias detection circuit is coupled to the charge-pump circuit and is configured to determine whether a level of the charge-pump voltage is less than a first pre-determined threshold value. The memory controller is coupled to the bias detection circuit and is configured to pause a programming operation being performed on at least one of the plurality of memory cells when the bias detection circuit determines that the level of the charge-pump voltage is less than the first pre-determined threshold value.

Classes IPC  ?

• G11C 16/30 - Circuits d'alimentation
• G11C 16/32 - Circuits de synchronisation
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 5/14 - Dispositions pour l'alimentation

Abrégé

A resistive random access memory device which includes a resistive random access memory array, a sense amplifier and a boosting circuit. The sense amplifier is coupled to the resistive random access memory array and is configured to sense a resistance value of the memory cell. The boosting circuit is coupled to the memory cell of the resistive random access memory array and is configured to boost a reset voltage in a boosting period of a reset period according to the resistance value of the memory cell. The boosting period is from beginning of the reset period, and the memory cell is biased with the reset voltage in the reset period to perform the reset operation. A method for a reset operation on a resistive random access memory device is also introduced.

Classes IPC  ?

• G11C 8/08 - Circuits de commande de lignes de mots, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, pour lignes de mots
• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou

Abrégé

An operating method of a resistive memory storage apparatus includes: applying a forming voltage to a memory cell and obtaining a cell current of the memory cell; and determining whether to adjust the forming voltage and apply the adjusted forming voltage to the memory cell according to a magnitude relationship between the cell current and a reference current. The memory cell to which the forming voltage is applied operates in a heavy forming mode and serves as a one-time programmable memory device.

Classes IPC  ?

• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou
• G11C 5/14 - Dispositions pour l'alimentation

Abrégé

A dynamic random access memory (DRAM) and an operation method thereof are provided. The DRAM includes a temperature sensor, a dynamic memory cell array, a control circuit, a plurality of power supply circuits and a power control circuit. The temperature sensor senses an operating temperature of the DRAM. The control circuit is coupled to a dynamic memory cell array, and accesses and manages the dynamic memory cell array. The power supply circuits powers the dynamic memory cell array and the control circuit. The power control circuit controls power outputs of the power supply circuits. When the DRAM enters the self-refresh mode, the power control circuit selectively switches between a low power control state and a normal power control state according to the operating temperature of the DRAM.

Classes IPC  ?

• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G11C 11/4074 - Circuits d'alimentation ou de génération de tension, p. ex. générateurs de tension de polarisation, générateurs de tension de substrat, alimentation de secours, circuits de commande d'alimentation
• G11C 11/4091 - Amplificateurs de lecture ou de lecture/rafraîchissement, ou circuits de lecture associés, p. ex. pour la précharge, la compensation ou l'isolation des lignes de bits couplées

Abrégé

A semiconductor device and a method for manufacturing the same are provided. The method includes forming a plurality of bit line structures on a semiconductor substrate, wherein there is a plurality of trenches between the bit line structures. The method also includes forming a first oxide layer conformally covering the bit line structures and the trenches, and forming a photoresist material layer in the trenches and on the first oxide layer, wherein the photoresist material layer has an etch selectivity that is higher than that of the first oxide layer. The method further includes removing the photoresist material layer to form a plurality of capacitor contact holes between the bit line structures, and forming a capacitor contact in the capacitor contact holes.

Classes IPC  ?

• H01L 27/108 - Structures de mémoires dynamiques à accès aléatoire
• H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques

Abrégé

The disclosure is directed to a memory device and a power reduction method of the same memory device. In an aspect, the disclosure is directed to a memory device which includes not limited to a plurality of memory banks, each having a power switch, a plurality of functional blocks for reading and writing to the plurality of memory banks and include a plurality of power switches as each functional block of the plurality of function blocks has a different power switch which turns on or turns off the functional block, a mode register circuit having a plurality of mode registers which determines whether one or more of the plurality of memory banks would maintain data storage or not, and a control logic circuit for either powering on or powering off each of the plurality of memory banks and each of the plurality of the functional blocks.

Classes IPC  ?

• G06F 1/32 - Moyens destinés à économiser de l'énergie
• G11C 11/4074 - Circuits d'alimentation ou de génération de tension, p. ex. générateurs de tension de polarisation, générateurs de tension de substrat, alimentation de secours, circuits de commande d'alimentation
• G11C 11/409 - Circuits de lecture-écriture [R-W]
• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge

Abrégé

In a control method, external data input to the pseudo static random access memory with a reference clock signal in a write operation are counted to generate a first count value. Data written to a dynamic memory array of the pseudo static random access memory with a built-in clock signal in the write operation are counted to generate a second count value. An initial cycle of the built-in clock signal is smaller than a cycle of the reference clock signal. The first count value is compared with the second count value. When the first count value is equal to the second count value, a write match signal is enabled. When the enabled write match signal is received, the write operation is converted from an asynchronous mode to a synchronous mode to adjust the cycle of the built-in clock signal to be equal to the cycle of the reference clock signal.

Classes IPC  ?

• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p. ex. FAMOS
• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G11C 11/4076 - Circuits de synchronisation
• G11C 11/408 - Circuits d'adressage
• G11C 11/409 - Circuits de lecture-écriture [R-W]
• G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S

Abrégé

A NAND flash memory suppresses an influence caused by FG coupling and has high reliability. The flash memory of the invention includes: a memory array formed with a plurality of NAND strings; a row selection unit selecting rows of the memory array; and a bit line selection circuit (200) selecting even-numbered pages or odd-numbered pages of the selected row. The even-numbered pages (BL0, BL1, BL4, BL5) include a plurality of pairs of adjacent bit line pairs, the odd-numbered pages (BL2, BL3, BL6, BL7) include a plurality of pairs of adjacent bit line pairs, and the bit lines of the even-numbered page and the bit lines of the odd-numbered page are arranged alternately.

Classes IPC  ?

• G11C 16/26 - Circuits de détection ou de lectureCircuits de sortie de données
• G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/34 - Détermination de l'état de programmation, p. ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p. ex. FAMOS
• G11C 7/02 - Dispositions pour écrire une information ou pour lire une information dans une mémoire numérique avec des moyens d'éviter les signaux parasites
• G11C 7/18 - Organisation de lignes de bitsDisposition de lignes de bits

Abrégé

A dynamic random access memory including a memory cell array and a memory controller is provided. The memory cell array includes a plurality of bit lines, a plurality of word lines, and a plurality of memory cells. The memory controller is coupled to the memory cells via the bit lines and the word lines. The memory controller is configured to perform a self-refresh operation on the memory cell array during a self-refresh period. Each of the bit lines includes a switch element. The memory controller controls a part of the switch elements to be conducted and a part of the switch elements not to be conducted during the self-refresh period.

Classes IPC  ?

• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G11C 11/4091 - Amplificateurs de lecture ou de lecture/rafraîchissement, ou circuits de lecture associés, p. ex. pour la précharge, la compensation ou l'isolation des lignes de bits couplées
• G11C 11/4097 - Organisation de lignes de bits, p. ex. configuration de lignes de bits, lignes de bits repliées

Abrégé

A volatile memory storage apparatus including a memory array, a refresh circuit and a pre-programmed circuit is provided. The memory array includes a plurality of memory banks. The refresh circuit is coupled to the memory array. The refresh circuit is configured to refresh the memory banks according to different refresh frequencies. The pre-programmed circuit is coupled to the refresh circuit. The pre-programmed circuit is configured to store the refresh frequencies. In addition, a refresh method of a volatile memory storage apparatus is also provided.

Classes IPC  ?

• G11C 7/00 - Dispositions pour écrire une information ou pour lire une information dans une mémoire numérique
• G11C 11/406 - Organisation ou commande des cycles de rafraîchissement ou de régénération de la charge
• G06F 13/16 - Gestion de demandes d'interconnexion ou de transfert pour l'accès au bus de mémoire
• G11C 11/409 - Circuits de lecture-écriture [R-W]

Abrégé

A column decoder of a memory device includes a first selection circuit, a second selection circuit and a decoding circuit. The first selection circuit and the second selection circuit are electrically connected in cascade with a memory array of the memory device. The decoding circuit receives a column address including a first sub-address and a second sub-address. The decoding circuit generates first decoded data and second decoded data for controlling the first selection circuit and the second selection circuit based on the first sub-address and the second sub-address. A first decoder in the decoding circuit decodes the first sub-address into the first decoded data, and the first decoded data is reversed in response to change of a first predetermined bit of the second sub-address.

Classes IPC  ?

• G11C 8/00 - Dispositions pour sélectionner une adresse dans une mémoire numérique
• G11C 8/10 - Décodeurs
• G11C 7/10 - Dispositions d'interface d'entrée/sortie [E/S, I/O] de données, p. ex. circuits de commande E/S de données, mémoires tampon de données E/S

Abrégé

A monotonic counter includes a plurality of stages respectively corresponding to a plurality of counting bits of the monotonic counter. At least one of the plurality of stages is a non-volatile flip-flop (NVFF) counter that includes a plurality of NVFFs, each NVFF including a pair of non-volatile memory cells.

Classes IPC  ?

• H03K 23/54 - Compteurs en anneau, c.-à-d. compteurs à registre à décalage à rétroaction

Abrégé

Provided is a flash memory device capable of restricting power consumption in an erase operation. The invention includes a plurality of wells, a power supply device, and a coupling device. The power supply device applies erase voltages to the wells for performing an erase operation. The coupling device performs selective coupling between the wells. When performing the erase operation on the wells, the power supply device applies the erase voltage to one of the wells, and applies the erase voltage to the other one of the wells after the coupling device electrically couples the one of the wells to the other one of the wells.

Classes IPC  ?

• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p. ex. FAMOS
• G11C 16/34 - Détermination de l'état de programmation, p. ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
• G11C 16/10 - Circuits de programmation ou d'entrée de données
• G11C 16/14 - Circuits pour effacer électriquement, p. ex. circuits de commutation de la tension d'effacement
• G11C 16/26 - Circuits de détection ou de lectureCircuits de sortie de données

Abrégé

A resistive random-access memory device includes a RRAM array including a plurality of RRAM cells coupled to a source line, a controller, a bit-line decoder, and a sense circuit. Each of the RRAM cells storing a logic state and is selected by the corresponding bit line and word line. The controller selects a selected RRAM cell by a bit-line signal and a selected word line and determines the logic state according to a sense signal. The bit-line decoder couples a data bit line to the selected bit line according to a bit-line signal. The sense circuit is coupled to the data bit line and compares a memory current flowing through the selected RRAM with a reference current to generate the sense signal. The sense circuit sinks the memory current from the data bit line when operating in a reset operation and a reverse read operation.

Classes IPC  ?

• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou

Abrégé

A NAND flash memory achieves low read latency and avoidance of inadvertent programming and program disturb so that the random access and initial page read speeds of the NAND flash memory are generally comparable to that of a NOR flash memory, while preserving the higher memory density and lower power operation characteristics of traditional NAND flash memory relative to NOR flash memory. The reduction in latency is achieved by a NAND memory array architecture which employs a small NAND string, a dual plane interleaved memory architecture, a partitioned NAND array, selectively coupled local bit lines per each global bit line, and a counter-biasing mechanism to avoid inadvertent programming and program disturb.

Classes IPC  ?

• G11C 11/34 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs
• G11C 16/26 - Circuits de détection ou de lectureCircuits de sortie de données
• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p. ex. FAMOS
• G11C 16/08 - Circuits d'adressageDécodeursCircuits de commande de lignes de mots
• G11C 16/10 - Circuits de programmation ou d'entrée de données

Abrégé

A resistive random-access memory (RRAM) device and a method thereof are disclosed. The RRAM device is contains a plurality of bit cells, a plurality of word lines, a plurality of bit lines and a plurality of source lines. Each bit cell includes a transistor and resistive element, the transistor includes a gate, a source and a drain, and the resistive element is coupled to the drain of the transistor. The plurality of word lines are arranged in parallel to one another, and coupled to respective gates of the transistors. The plurality of bit lines are arranged in parallel to one another and being intersected with the plurality of word lines, and coupled to respective drains of the transistors through the resistive elements. The plurality of source lines are arranged in parallel to one another and the plurality of bit lines.

Classes IPC  ?

• G11C 5/06 - Dispositions pour interconnecter électriquement des éléments d'emmagasinage
• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou
• H01L 45/00 - Dispositifs à l'état solide spécialement adaptés pour le redressement, l'amplification, la production d'oscillations ou la commutation, sans barrière de potentiel ni barrière de surface, p.ex. triodes diélectriques; Dispositifs à effet Ovshinsky; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
• H01L 23/528 - Configuration de la structure d'interconnexion
• H01L 27/24 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des composants à l'état solide pour le redressement, l'amplification ou la commutation, sans barrière de potentiel ni barrière de surface

Abrégé

An RRAM circuit includes word lines, bit lines, source lines, memory cells, and a sense module. Each of the memory cells includes a resistor and a transistor. The resistor alternates between a high impedance and a low impedance, and is coupled to one of the bit lines. The transistor is controlled by one of the word lines and coupled between the resistor and one of the source lines. The sense module includes a switch and a sense amplifier. The switch is controlled by an output signal and coupled to one of the bit lines. The sense amplifier compares the data voltage, which is generated by a current flowing through the switch and the resistor, and a reference voltage to generate the output signal. The switch is turned off when the data voltage exceeds the reference voltage, and is turned on otherwise.

Classes IPC  ?

• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou

Abrégé

A memory device includes a memory cell array and a column decoder. The memory cell array includes a plurality of even local bit lines and a plurality of odd local bit lines. The column decoder includes a plurality of even pass transistors, a plurality of even clamp transistors, a plurality of odd pass transistors, and a plurality of odd clamp transistors. Each of the even clamp transistors has a control terminal coupled to an even clamp line, a first terminal coupled to a respective one of the even local bit lines, and a second terminal coupled to a ground voltage. Each of the odd clamp transistors has a control terminal coupled to an odd clamp line, a first terminal coupled to a respective one of the odd local bit lines, and a second terminal coupled to the ground voltage.

Classes IPC  ?

• G11C 8/10 - Décodeurs
• G11C 8/00 - Dispositions pour sélectionner une adresse dans une mémoire numérique
• G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
• G11C 5/06 - Dispositions pour interconnecter électriquement des éléments d'emmagasinage
• G11C 11/4094 - Circuits de commande ou de gestion de lignes de bits
• G11C 16/08 - Circuits d'adressageDécodeursCircuits de commande de lignes de mots
• G11C 16/34 - Détermination de l'état de programmation, p. ex. de la tension de seuil, de la surprogrammation ou de la sousprogrammation, de la rétention
• G11C 13/00 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage non couverts par les groupes , ou
• G11C 16/24 - Circuits de commande de lignes de bits
• G11C 11/408 - Circuits d'adressage

Abrégé

A flash memory device may operate from two supply voltages, one being provided externally, and the other being generated within the flash memory device from the external supply voltage. The flash memory device may be provided with a selectable-level buffer for interfacing with either low supply voltage or high supply voltage integrated circuits. To provide even greater flexibility, the flash memory device may be provided with the capability of receiving a second supply voltage from an external source, which may take precedence over the internally-generated second supply voltage or may be combined with the internally-generated second supply voltage.

Classes IPC  ?

• G11C 11/34 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs
• G11C 16/06 - Circuits auxiliaires, p. ex. pour l'écriture dans la mémoire

Abrégé

A boosting circuit, includes an output circuit including a first transmission circuit, transmitting charges of a first boosting node to a first output node according to a first transmission control signal, a detection circuit, detecting the voltage level of the first output node, and a pre-charge circuit pre-charging the first boosting node according a detection signal of the detection circuit; a first pump circuit includes a second transmission circuit, transmitting charges to a second output node according to a second transmission control signal, and a first capacitance unit, coupled to the first boosting node, boosting the voltage level of the first boosting node according to charges transmitted in the second output node; and a control circuit, coupled to the output circuit and the first pump circuit, controls the second transmission control signal according to the voltage level of the first output node.

Classes IPC  ?

• G11C 7/12 - Circuits de commande de lignes de bits, p. ex. circuits d'attaque, de puissance, de tirage vers le haut, d'abaissement, circuits de précharge, circuits d'égalisation, pour lignes de bits
• G05F 1/46 - Régulation de la tension ou de l'intensité là où la variable effectivement régulée par le dispositif de réglage final est du type continu
• H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande

Abrégé

A random access memory and a refresh controller thereof are provided. The refresh controller includes a write action detector, a latch device, a reset circuit, and a refresh masking device. The write action detector is coupled to an address decoder of the random access memory, and is used to detect a write action in an address corresponding to the address decoder and generate a detection result. The latch device is coupled to the write action detector, and is used to receive and latch the detection result. The reset circuit is coupled to the latch device, receives a reset control signal, and resets the detection result according to the reset control signal. The refresh masking device is coupled to a corresponding word line control circuit and the latch device and is used to mask a refresh action on the word line control circuit according to the detection result.

Classes IPC  ?

• G11C 7/00 - Dispositions pour écrire une information ou pour lire une information dans une mémoire numérique

Abrégé

An optical proximity correction (OPC) photomask is provided. The photomask includes two opening patterns and a pair of scattering bar patterns. The two patterns are arranged on a substrate along a first direction and separated from each other by a predetermined distance. The pair of scattering bar patterns is arranged on the substrate along a second direction perpendicular to the first direction and adjacent to two opposing sides of each opening pattern. Each scattering bar pattern does not overlap with the opening patterns on the first and second directions as viewed from a cross sectional perspective. A phase shift of 180° exists between each opening pattern and each scattering bar pattern.

Classes IPC  ?

• G03F 1/36 - Masques à correction d'effets de proximitéLeur préparation, p. ex. procédés de conception à correction d'effets de proximité [OPC optical proximity correction]

Abrégé

A flash memory 100 capable of reducing electric fields applied to the word lines on a memory array and reducing a chip area, includes a memory array 110, a word line decoder 120 disposed at an end of the memory array on the row direction, selecting a predetermined memory block in the memory array according to an address signal, and outputting a selecting signal to the selected memory block, and a word line drive circuit 130 comprising a switch circuit arranged between the memory arrays 110A and 110B and switching the application of the work voltage to a memory cell according to the selecting signal, and a pump circuit raising the voltage level of the selecting signal. The word line decoder 120 has lines WR(i) to transmit the selecting signals. The lines WR(i) are connected to the switch circuit of the word line drive circuit 130.

Classes IPC  ?

• G11C 11/34 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments électriques utilisant des dispositifs à semi-conducteurs

Abrégé

A semiconductor device and a method for fabricating the same are described. The semiconductor device includes a well of a first conductive type, first doped regions of a second conductive type, gates of the second conductive type, second doped regions of the first conductive type, and isolation structures. The well is disposed in a substrate. The first doped regions are disposed in the well. The first doped regions are arranged in parallel and extend along a first direction. The gates are disposed on the substrate. The gates are arranged in parallel and extend along a second direction different from the first direction. One of the first doped regions is electrically connected to one of the gates. Each of the second doped regions is disposed in the first doped regions between two adjacent gates. Each of the isolation structures is disposed in the substrate between two adjacent first doped regions.

Classes IPC  ?

• H01L 29/808 - Transistors à effet de champ l'effet de champ étant produit par une jonction PN ou une autre jonction redresseuse à jonction PN
• H01L 21/337 - Transistors à effet de champ à jonction PN

Abrégé

A method for determining native threshold voltage of nonvolatile memory includes following steps. A memory cell including a control gate, a charge storage layer, a source region, and a drain region is provided. A programming operation is performed on the memory cell by using F-N tunneling effect to obtain a programming curve of time versus threshold voltage. In the programming operation, a positive voltage is applied to the control gate. An erase operation is performed on the memory cell by using F-N tunneling effect to obtain an erasure curve of time versus threshold voltage. In the erase operation, a negative voltage is applied to the control gate. The absolute values of the positive voltage and the negative voltage are the same. The native threshold voltage of memory cell is determined from the cross point of the programming curve and the erasure curve.

Classes IPC  ?

• G11C 16/04 - Mémoires mortes programmables effaçables programmables électriquement utilisant des transistors à seuil variable, p. ex. FAMOS

Abrégé

A method of operating a memory device adapted for determining a program/erase state of a memory cell in the memory device. The method includes applying a drain operation voltage to a drain of the memory cell so that the memory cell generates a working voltage. The working voltage is a function of the drain operation voltage. Then, the working voltage to the drain operation voltage is differentiated to obtain a slope of the working voltage to the drain operation voltage. The program/erase state of the memory cell is determined according to the slope.

Classes IPC  ?

• G11C 7/02 - Dispositions pour écrire une information ou pour lire une information dans une mémoire numérique avec des moyens d'éviter les signaux parasites

Abrégé

A differential difference amplifier includes a first pair of differential input terminals and a second pair of differential input terminals. The differential difference amplifier has a pair of differential output terminals to output a voltage in relation to a difference between differential voltages at the first pair of differential input terminals and differential voltages at the second pair of differential input terminals.

Classes IPC  ?

• H03F 3/45 - Amplificateurs différentiels

Abrégé

A channel sharing method and device thereof are disclosed. The method starts by providing a plurality of channels, wherein each of the channels comprises a time interval. A time slot having a width being X times of a maximum value of all the time intervals is provided, wherein C is a positive number. Each of the channels is generated by a permutation of at least one repeat time, which is M times of the width of the time slot, wherein M is an integer larger than 0. A first time slot of the repeat time comprises a signal. A maximum time span of the signals in each channel is the time interval of each channel. All the channels are arranged so that at least one of the signals in each channel is not collided with the signals of other channels in a worst time delay.

Classes IPC  ?

• H04J 3/00 - Systèmes multiplex à division de temps
• H04J 3/08 - Dispositions de stations intermédiaires, p. ex. pour connecter et déconnecter
• H04B 7/212 - Accès multiple par répartition dans le temps
• H04L 12/43 - Réseaux en boucle avec commande décentralisée avec transmission synchrone, p. ex. multiplexage à division de temps [TDM], anneaux à tranches de temps

Abrégé

A pin-assignment method is provided for use on an IC package to arrange pin connections. The pin-assignment method can allow an improvement in the electro-static discharge (ESD) protection capability for the IC chip packed in the IC package. Specifically, the pin-assignment method organizes the no-connect pins of the IC package into groups and then assigns each of the two pins that bound each no-connect pin group to be connected to a power bus of the IC chip. This allows for an increased ESD protective capability for the no-connect pins. Moreover, the pin-assignment method can simplify the wiring complexity of the IC package.