The invention relates to a lighting device (1), wherein the lighting device (1) comprises a light source (2) for generating an illumination light (5), a primary hologram (3) which can be illuminated by the illumination light (5) to generate a first lighting function (8), and a secondary hologram (4). The secondary hologram (4) is spaced apart from the primary hologram (3) such that it can be illuminated by a reflected portion (5.1) of the illumination light (5) which is reflected, during illumination of the primary hologram (3), by a Fresnel reflection at a boundary face (3.1) of the primary hologram (3).
F21S 43/20 - Dispositifs de signalisation spécialement adaptés à l’extérieur des véhicules, p. ex. feux de freinage, feux clignotants indicateurs de direction ou feux de recul caractérisés par des réfracteurs, des glaces de fermeture transparentes, des guides ou des filtres de lumière
The invention relates to an optical system (200) for a projection exposure system (1A, 1B), having an optical assembly (100) with an optical element (108), a manipulator frame (202) which supports the optical assembly (100), and a clamping assembly (212, 212A, 212B, 212C, 212D, 212E, 212F, 212G, 214, 216) which is attached to the manipulator frame (202) and which can be brought from a closed state (Z20), in which the clamping assembly (212, 212A, 212B, 212C, 212D, 212E, 212F, 212G, 214, 216) produces a mechanical connection between the optical assembly (100) and the manipulator frame (202), into an open state (Z10), in which the mechanical connection between the optical assembly (100) and the manipulator frame (202) is released, and vice versa, wherein the clamping assembly (212A) has a contact element (250) which is connected to the optical element (108), a groove element (238) which is connected to the manipulator frame (202) and on which the contact element (250) rests, and a locking unit (262) for mechanically connecting the contact element (250) to the groove element (238) in the closed state (Z20) of the clamping assembly (212A); or the contact element (250) is connected to the manipulator frame (202), and the groove element (238) is connected to the optical element (108). The contact element (250) has a spherical cap-shaped contact section (252), and the groove element (238) has a V-shaped groove (242) with two contact surfaces (244, 246) which are oriented diagonally relative to each other. The contact section (252) rests on the contact surfaces (244, 246), or the contact element (250) and the groove element (238) rest against each other at a surface contact or at a tetrahedron-shaped contact. The locking unit (262) has a locking element (266) and a drive element (264) for driving the locking element (266), and the drive element (264) is designed to bring the locking element (266) from a locking state (Z1), in which the locking element (266) engages behind the contact element (250) in order to produce a form-fitting connection between the locking element (266) and the contact element (250), into an unlocking state (Z2), in which the form-fitting connection between the locking element (266) and the contact element (250) is released, and vice versa.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
The invention relates to a lighting device (1), wherein the lighting device (1) comprises a light source (2) for generating an illumination light (7), and a hologram arrangement (4) which can be illuminated by the illumination light (7). The hologram arrangement (4) is designed to separate the illumination light (7) into a first portion (7.1) for generating a holographic image (12) and a second portion (7.2) for generating a lighting function (13).
G03H 1/00 - Procédés ou appareils holographiques utilisant la lumière, les infrarouges ou les ultraviolets pour obtenir des hologrammes ou pour en obtenir une imageLeurs détails spécifiques
F21S 43/20 - Dispositifs de signalisation spécialement adaptés à l’extérieur des véhicules, p. ex. feux de freinage, feux clignotants indicateurs de direction ou feux de recul caractérisés par des réfracteurs, des glaces de fermeture transparentes, des guides ou des filtres de lumière
G02B 5/32 - Hologrammes utilisés comme éléments optiques
G03H 1/22 - Procédés ou appareils pour obtenir une image optique à partir d'un hologramme
Various examples of the disclosure relate to the measurement of the tilt and/or height of a sample to be examined in the case of particle microscope systems, especially electron beam microscopes having an additional column for creating a focused ion beam. Optical detection systems are used, for example according to the autocollimation principle.
A method of calibrating an illumination system for a lithographic system, the method comprising: applying a known misalignment to the illumination system; obtaining measured data representative of a measured illumination pupil generated by the illumination system; and determining an actual misalignment based on the measured data. The determining an actual misalignment may comprise: obtaining estimated data representative of an estimated illumination pupil generated by the illumination system including the known misalignment and calculating a difference between the estimated data and the measured data, wherein the calculated difference is representative of the actual misalignment.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
09 - Appareils et instruments scientifiques et électriques
Produits et services
Applications and instruments in the field of semiconductor
measurement and inspection solutions (term considered too
vague by the International Bureau pursuant to Rule 13 (2)
(b) of the Regulations).
7.
ASSEMBLY FOR SEMICONDUCTOR TECHNOLOGY, AND DEVICE FOR SEMICONDUCTOR TECHNOLOGY
The invention relates to an assembly (30) for semiconductor technology, comprising a module (32) and a module frame (33). The module (32) is connected to the module frame (33) via a bearing element (34) and is positioned by the bearing element (34) relative to the module frame (33). The connection (35) comprises a clamping device (56, 58) which prevents the module (32) from being removed from the module frame (33). According to the invention, the bearing element (34) has a clamping force element (50) for transmitting a clamping force produced by the clamping device (56, 58) and a positioning element (60) for positioning the module (32) relative to the module frame (33). The invention additionally relates to a projection exposure system (1, 101) and a mask inspection device comprising an assembly according to the invention.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
8.
MOBILE DEVICE AND METHOD FOR DETERMINING AN EYE ORIENTATION OF THE EYES OF A PATIENT
The invention relates to a computer-implemented method (200) for determining an eye orientation of the eyes (24) of a patient (22) for execution by a mobile device (10) with a display unit (12) and a camera (14) which is arranged on the same side of the mobile device (10) as the display unit (12). The method (200) comprises outputting (202) instructions (18) to the patient (22) to support the patient (22) in orienting the mobile device (10) relative to the eyes (24) of the patient (22) such that the display unit (12) and the camera (14) are positioned in a predetermined region relative to the eyes (24) of the patient (22) and are facing the eyes (24). The method also comprises determining (204) a position of the eyes (24) relative to the mobile device (10), displaying (206) a light visualisation (16) on the display unit (12), and capturing (208) at least one image of the eye (24) by means of the camera (14) such that in the captured image a cornea reflection (26) of the light visualisation (16) displayed on the display unit (12) can be determined in each of the eyes (24) of the patient (22). Furthermore, the method comprises determining (210) a position of the respective cornea reflection (26) in the eye (24) on the basis of the captured at least one image and determining the eye orientation of both eyes (24) using the position of the respective cornea reflection (26) in the eye (24).
A61B 3/08 - Appareils pour l'examen optique des yeuxAppareils pour l'examen clinique des yeux du type à mesure subjective, c.-à-d. appareils de d’examen nécessitant la participation active du patient pour examen de vision binoculaire ou stéréoscopique, p. ex. pour le contrôle du strabisme
A61B 3/14 - Dispositions spécialement adaptées à la photographie de l'œil
A61B 3/15 - Dispositions spécialement adaptées à la photographie de l'œil avec des moyens d'alignement, d'espacement ou de suppression des réflexions parasites
9.
METHOD AND SYSTEM OF DETERMINING FIELD-DEPENDENT ABERRATIONS
A method of determining field-dependent aberrations in an image field of an optical imaging system based on a measuring operation determining aberration data for a plurality of field points in the image field comprises the following steps: - defining a target grid comprising a plurality of target field points in the image field, wherein a target field point is a field point for which a level of aberration is to be determined; - defining a measuring grid comprising a first subset of the target field points comprising all field points for which a level of aberration is to be determined in a measuring operation; - measuring aberrations at all field points of the measuring grid to generate measured aberration data; - defining an auxiliary grid comprising a second subset of the target field points comprising selected target field points not included in the measuring grid for which a level of aberration is to be determined in an aberration data generating operation, wherein the aberration data generating operation is configured to generate aberration data for target field points of the auxiliary grit based on (iii) knowledge of the optical imaging system and (iv) potential system-specific sources of aberrations.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
Disclosed is a mask inspection device for photomasks of EUV lithography. The mask inspection device comprises here a receiving device for a photomask, a light source for illuminating the photomask with an illumination beam, and a detection unit for recording at least regions of the photomask. Furthermore, the mask inspection device comprises at least one beam-shaping element for adapting the illumination beam and at least one stop in the light path between the photomask and the detection unit. The at least one beam-shaping element and the at least one stop are arranged in a fixed spatial relationship to one another on a common carrier element. Also disclosed is the corresponding carrier element.
G03F 1/22 - Masques ou masques vierges d'imagerie par rayonnement d'une longueur d'onde de 100 nm ou moins, p. ex. masques pour rayons X, masques en extrême ultra violet [EUV]Leur préparation
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
11.
COMPUTER IMPLEMENTED METHOD FOR DEFECT DETECTION IN AN OBJECT COMPRISING INTEGRATED CIRCUIT PATTERNS AND CORRESPONDING COMPUTER-READABLE MEDIUM, COMPUTER PROGRAM AND SYSTEM
The invention relates to a computer implemented method for defect detection in an object comprising integrated circuit patterns comprising: obtaining an imaging dataset and a reference dataset of the object; generating an input representation of a subset of the imaging dataset and a reference representation of a corresponding subset of the reference dataset in a feature space; and detecting defects in the object by comparing the input representation to the reference representation in the feature space. The invention also relates to a corresponding computer-readable medium, computer program product and system for defect detection.
The invention relates to a computer implemented method for defect detection in an imaging dataset of an object comprising integrated circuit patterns, the method comprising: obtaining defect candidates in the imaging dataset; subsequently carrying out at least two stages, each stage comprising the following steps: applying a stage specific defect detection method to the defect candidates; discarding defect-free defect candidates; obtaining detected defects in the imaging dataset from the remaining defect candidates. The invention also relates to a corresponding computer-readable medium, computer program and system.
An actuator for semiconductor lithography comprises an actuator element, a compensation element and a connection element. The actuator element has a first coefficient of thermal expansion and a connection site at its first end for the active adjustment of an optical element along at least one adjustment axis. The compensation element has a second coefficient of thermal expansion. The sign of the second coefficient of thermal expansion corresponds to the sign of the first coefficient of thermal expansion. The compensation element is oriented coaxially in relation to the adjustment axis. The compensation element has a coupling site held stationary in space or stationary in relation to the optical element. The connection element connects the actuator element and the compensation element at positions located remote from the connection site and from the coupling site. A deformation mirror includes a mirror substrate and an actuator.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
14.
ILLUMINATION OPTICAL UNIT FOR PROJECTION LITHOGRAPHY
An illumination optical unit for projection lithography illuminates an object field of a downstream imaging optical unit with illumination light from an EUV light source. A first facet mirror has a plurality of adjacently arranged first facets for specifying partial fields which are transferred into partial sections of the object field using the illumination optical unit. A further facet mirror disposed downstream of the first facet mirror has a plurality of adjacently arranged, individually tiltable further facets. The two facet mirrors serve for reflective, at least partially overlaid guidance of component beams of an overall beam of the illumination light via at least one of the first facets and via at least one of the further facets. A curved transfer mirror is disposed downstream of the further facet mirror and serves for the beam-shaping transfer of the overall beam of the illumination light into the object field.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
15.
TIME MULTIPLEXING FOR THE CORRECTION OF CHROMATIC ABERRATIONS IN A TRANSPARENT SCREEN UNIT
Various examples relate to techniques for the synchronized controlling of a multicolor light source and a multipixel display device of a picture generating unit for a transparent screen unit, e.g. a head-up display system. This allows chromatic aberrations to be reduced, e.g. chromatic aberrations occurring due to the use of holographic optical elements.
An optical homogenization plate (1) is used to illuminate a multipixel display device (10), e.g. a liquid crystal screen. A speckle noise suppression unit (3, 300) is provided for reducing speckle noise before the light is coupled into the homogenization plate (1). Components of this type can be used in a picture generating device of an HUD system.
METHOD FOR IMAGE ENHANCEMENT IN AN IMAGING DATASET OF AN OBJECT COMPRISING INTEGRATED CIRCUIT PATTERNS AND CORRESPONDING COMPUTER PROGRAM, COMPUTER-READABLE MEDIUM AND SYSTEM
The invention relates to a method for defect detection comprising: acquiring an imaging dataset of an object comprising integrated circuit patterns using an imaging system; obtaining a reference dataset corresponding to the acquired imaging dataset; generating an enhanced imaging dataset by filtering the acquired imaging dataset with one or more learned filters, wherein the one or more learned filters are obtained by solving an optimization problem comprising the deviation of the enhanced imaging dataset from the reference dataset; and detecting defects in the acquired imaging dataset by comparing the enhanced imaging dataset to the corresponding reference dataset. The invention also relates to a corresponding computer program, a computer-readable medium and a system for defect detection in objects comprising integrated circuit patterns.
A method for characterizing a lithography apparatus, in particular, a method for characterizing a lithography apparatus configured to cause an obscuration of radiation, as well as a lithography apparatus and a computer program product configured to carry out the methods. A method for characterizing a lithography apparatus; detecting first diffracted radiation of the lithography apparatus, wherein the first diffracted radiation was diffracted at a characterization element; determining a diffraction property of the characterization element based on at least in part the first substantially undiffracted radiation and the first diffracted radiation.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
19.
METHOD FOR MEASURING AN ILLUMINATION ANGLE DISTRIBUTION ON AN OBJECT FIELD AND ILLUMINATION OPTICS UNIT HAVING AN ILLUMINATION CHANNEL ALLOCATION INTENDED THEREFOR
To measure an illumination angle distribution, which is established via a multiplicity of illumination channels of an illumination optics unit, on an object field via an obscured projection optics unit, a setpoint pupil lighting of an illumination pupil of the illumination optics unit is initially established. With the aid of the setpoint pupil lighting, whether splitting of a measurement pupil lighting into a reflection measurement pupil and a diffraction measurement pupil is desired is checked. Depending on the result of the check, a reflection measurement pupil lighting and/or a diffraction measurement pupil lighting of the illumination optics unit is established by establishing corresponding illumination channels. The reflection measurement pupil lighting is measured by inserting a reflective object into the object field and/or the diffraction measurement pupil lighting is measured by inserting a diffractive object into the object field. An actual pupil lighting is reconstructed from the measurement data.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
An optical component (100, 200) for a lithography apparatus (1) includes an optical element (102, 202), produced from a first material (G102) and having an optically effective surface (106, 206); and a carrying element (104, 204), produced from a second material (G104) and carrying the optical element (102, 202). The second material (G104) differs from the first material (G102) and a ratio of the densities of the first and second materials (G102, G104) deviates from 1 by less than 20%, preferably by less than 10% or even less than 5%. The optical element and the carrying element each have principal extension planes (H102, H202, H104, H204) having maximum extents. The maximum extent (D102, A202) of the optical element (102, 202) is less than 90%, preferably less than 80% or even less than 75% of the maximum extent (A104, D204) of the carrying element.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
The invention relates to a method (68) for obtaining measurements of semiconductor structures (18) from a single wedge cut (34) of an inspection volume (10), the method (68) comprising: obtaining the wedge cut (34) by exposing a cross-section surface in the inspection volume (10) by milling into the inspection volume (10) with a FIB column (46) arranged under a slant angle GF, and imaging the cross-section surface with a charged particle beam imaging system (50); determining positions of cross-section features (72) of semiconductor structures (18) in the wedge cut (34); determining reference positions of the cross-section features (72) from at least one reference image (76) of the semiconductor structures (18); obtaining the one or more measurements of the semiconductor structures (18) using lateral displacements (74) between the positions of the cross-section features (72) and the reference positions (78).
A drive device (100) for driving a plurality N of actuator elements (210) for actuating optical elements (310) of an optical system (4, 10), comprising: N driver stages (110-130) controlled by way of a time multiplex signal (ZMD, ZMA) determined by a time multiplexing scheme (Z), wherein the respective driver stage (110-130) of the N driver stages (110-130) is assigned to one of the N actuator elements (210) and a specific time slot (Z1-Z3) of the time multiplex signal (ZMD, ZMA), and has an amplifier (V) that is configured to amplify a signal component of the assigned time slot (Z1-Z3) of the time multiplex signal (ZMD, ZMA) so as to form a drive voltage (U1-U3) for driving the assigned actuator element (210), with N≥2, and a control loop (400), the feedback branch (410) of which has a voltage divider (420) that is able to be connected selectively to one of the N driver stages (110-130) based on the time multiplexing scheme (Z).
The invention provides a method 100 for applying a marking 1, 1a, 1b on a surface 2 of a glass mold 3 suitable for manufacturing a marked spectacle lens blank 4. The method 100 comprises applying a pattern 5 of a masking agent 6 on a preselected part of the surface 2 of the glass mold 3 by inkjet-printing.
B29D 11/00 - Fabrication d'éléments optiques, p. ex. lentilles ou prismes
C03C 15/00 - Traitement de surface du verre, autre que sous forme de fibres ou de filaments, par attaque chimique
C03C 17/28 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement par des matières organiques
An imaging system comprises a waveguide and at least two diffraction-based coupling-in elements, the at least two coupling-in elements being configured to deflect at least some of the light incident on the coupling-in elements within the waveguide, the at least two coupling-in elements being tilted relative to one another at a tilt angle that is not equal to 0°.
A drive device (100) for driving at least one actuator (200) for actuating an optical element (310) of an optical system (300), comprising an end stage (110) which is configured to boost an input voltage (V1) using a quiescent current (I1) of the end stage (110) to a drive voltage (V2) for the actuator (200), and a supply device (120) which is configured to adjust the quiescent current (I1) for the end stage (110) depending on at least one parameter (E1, E2, E3, E4) that is indicative of the power loss in the optical system (300).
H02N 2/06 - Circuits d'entraînementDispositions pour la commande
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H03F 3/217 - Amplificateurs de puissance de classe DAmplificateurs à commutation
Disclosed is a method for determining a location of an object surface (16) in relation to a target location in a measuring device for semiconductor technology, the location being determined on the basis of at least two measured values which represent the location, wherein the determination of the location comprises a probability analysis.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p. ex. automatique
G02B 7/36 - Systèmes pour la génération automatique de signaux de mise au point utilisant des techniques liées à la netteté de l'image
27.
OPTICAL ASSEMBLY FOR AN EUV PROJECTION EXPOSURE APPARATUS, EUV PROJECTION EXPOSURE APPARATUS
Optical assembly (100, 200, 300) for an EUV projection exposure apparatus (400) and an EUV mask metrology apparatus, comprising an optical component (101) designed to reflect an EUV light (102) utilized for the imaging, a housing (104) that at least partly surrounds the optical component (101) and also encapsulates sections of an EUV beam pathway within the EUV projection exposure apparatus (400) or the EUV mask metrology apparatus, at least one particle trap (106, 206, 306) designed to reduce free particle contamination (105), especially by tin particles, within the housing (104) and having an opening (107, 207, 307) in the direction of the EUV beam pathway, characterized in that the particle trap (106, 206, 306) is disposed in the housing (104), where the particle trap (106, 206, 306) has an interior and an inner surface (109) surrounding the interior and takes the form of a channel.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
A method and a dual beam device for three-dimensional volume image generation of semiconductor objects within a wafer are provided. The method and the dual beam device provide higher accuracy and are configured to mitigate drifts between a charge-particle beam imaging system and a wafer stage by monitoring displacement vectors and considering the displacement vectors during 3D pixel interpolation from a plurality of two-dimensional cross section images.
G01N 23/225 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques
09 - Appareils et instruments scientifiques et électriques
Produits et services
X-ray microscopes, x-ray micro imaging and tomography
systems, not for medical purposes, for digital radiography
and computed tomography inspection of samples comprised of a
sample stage, x-ray source, and x-ray detector.
30.
ARRANGEMENT, METHOD AND COMPUTER PROGRAM PRODUCT FOR CALIBRATING FACET MIRRORS
An arrangement (100), a method and a computer program product for system-integrated calibration of facet mirrors (18, 19) of a microlithographic illumination system (20). Beam paths (103) between a radiation source (101) and a radiation detector (102) are created by the facet mirrors (18, 19), with respectively only one pivotable micromirror (18″, 19″) of each facet mirror (18, 19) affecting said beam path. By methodically pivoting one of the micromirrors (18″, 19″) affecting the beam path (10), it is possible, based on the radiation detector (102), to find a specific optimal pivot position, the underlying orientation of the micromirror (18″, 19″) of which can also be calculated geometrically. By comparing the calculated orientation with the orientation ascertained by a tilt sensor on the micromirror (18″, 19″), it is possible to calibrate the tilt sensor or micromirror (18″, 19″) of the facet mirror (18, 19).
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
The invention relates to a mirror system comprising an EUV mirror (M1-M6), a temperature sensor (30), a control unit (29) and a temperature-control module (26), wherein the EUV mirror (M1-M6) has a mirror body (38) and an optical surface (39) which is formed on the mirror body (38). The temperature sensor (30) determines a measured temperature value via the temperature of the mirror body (38) and transmits the measured temperature value to the control unit (29). The control unit (29) evaluates the measured temperature value to determine control commands for the temperature-control module (26). The temperature-control module (26) is actuated by the control commands so that the temperature-control module (26) influences the temperature of the mirror body. In a first operating state of the mirror system, the control unit (29) determines the control commands by processing a first temperature target value for the temperature of the mirror body (38). In a second operating state of the mirror system, the control unit (29) determines the control commands by processing a second temperature target value for the temperature of the mirror body (38). The invention also relates to a method for operating a mirror system, to a projection lens for a microlithographic projection exposure system, and to a computer program product.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
32.
OPTICAL COMPONENT, METHOD FOR INSTALLING THE OPTICAL COMPONENT, PROJECTION EXPOSURE APPARATUS
Optical component (200) for EUV lithography, comprising a media-carrying pipe system (300, 307, 400, 406, 500, 508) for operation in a vacuum environment, wherein the media-carrying pipe system (300, 307, 400, 406, 500, 508) comprises at least one connection region (209) between a metallic section (207) and a section (205) consisting of a silicon-containing substrate material having a coefficient of linear expansion of less than 3 ppm/K, characterized in that the connection region (209) is at least partially enclosed by an externally adjoining sealing device (210), wherein the sealing device (210) comprises a sealing element (211) and a fixing device (212) attaching the sealing element (211) to the connection region (209) and wherein the sealing element comprises an elastomer.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
A measuring apparatus (10; 110; 210; 310; 410; 510; 610; 710) for interferometric determination of a property (50; 52) of a shape (50) of a test surface (12) of an object under test (14) comprises an irradiation device (22) for generating an input wave (24), a splitting module (18; 118; 318; 418; 518) configured to generate, from the input wave, two plane waves (32, 34) with parallel directions of propagation and with an offset from one another across the directions of propagation, a wavefront adaptation module (20; 720) for generating two measurement waves (44, 46) by adapting the respective wavefront of the plane waves with an offset from one another to a target shape of the optical test surface, and a detector (56) for capturing at least one interferogram (64) generated by superposition of the measurement waves (44r, 46r) following their interaction with the test surface.
The invention relates to a method for obtaining at least one measurement (26) of at least one semiconductor structure in a wafer comprising: obtaining a wedge cut (66) of an inspection volume of the wafer by exposing a cross section surface in the inspection volume by milling into the inspection volume with a FIB column at a slant angle GF, and imaging the cross section surface with a charged particle beam imaging system; extracting a region of interest of the wedge cut (66) comprising a cross section of the at least one semiconductor structure; using a trained machine learning model to map the region of interest of the wedge cut (66) to a 3D reconstruction of the region of interest; obtaining at least one measurement (26) from the 3D reconstruction.
This disclosure relates to a reflective optical element for a wavelength in the extreme ultraviolet wavelength range, comprising a substrate and a reflective coating designed as a multi-layer system. The multi-layer system has alternating layers of at least two different base materials different real parts of their refractive indexes in the extreme ultraviolet wavelength range. An electrical field standing wave is formed in the multilayer system by the reflection of extreme ultraviolet wavelength radiation. The multi-layer system has another material at least in a layer at a point of extreme field intensity, wherein the reflective optical element has a material as the other material at at least one point of minimal field intensity, which has greater absorption for the reflected wavelength than the at least partially replaced one.
The invention relates to a MEMS mirror array module (100) for use in projection exposure apparatuses (1) for photolithography. The MEMS mirror array module (100) according to the invention comprises a MEMS mirror array structure (110) located on a rewiring substrate (120), and an interface element (140) for fastening the MEMS mirror array module (100) to a higher-level assembly, which interface element is located on the side of the rewiring substrate (120) remote from the MEMS mirror array structure (110). Between the rewiring substrate (120) and the interface element (140), a cavity (150) is provided, the wall (151) of which is connected heat-conductingly at least to the rewiring substrate (120), and a fluid line (200) for conducting heat transfer fluid extends along the wall (151) in heat-conducting contact therewith, at least one end of which fluid line leads through the interface element (140) and out of the MEMS mirror array module (100).
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
G02B 5/09 - Miroirs à facettes multiples ou polygonales
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
42.
COMPUTER IMPLEMENTED METHOD FOR THE DETECTION OF ANOMALIES IN AN IMAGING DATASET OF A WAFER, AND SYSTEMS MAKING USE OF SUCH METHODS
A computer implemented method for the detection of anomalies comprises: selecting an imaging dataset of a wafer and a hyperparameter value defining a machine learning model for anomaly detection; training and evaluating the machine learning model by computing an objective function value; and selecting one of the trained machine learning models and applying it to detect anomalies. A computer implemented method for the detection of anomalies in an imaging dataset of a wafer comprises: providing samples of a distribution of anomaly detection image values for each defect class; calibrating the anomaly detection image by training a machine learning model for anomaly localization; and applying a threshold to the calibrated anomaly detection image to detect anomalies.
A control device for controlling and measuring an actuator for actuating an optical element of an optical system, comprises a voltage measuring unit, a current measuring unit, a first matched filter unit and a second matched filter unit. A method for controlling and measuring an actuator for actuating an optical element of an optical system comprises: providing a measurement voltage; providing a measurement current; estimating, via a first matched filter unit, a voltage amplitude and an associated phase of a measurement signal component; estimating, via a second matched filter unit, a current amplitude and an associated phase of the measurement signal component; and calculating an impedance of an actuator based on the estimated voltage amplitude, the estimated associated phase, the estimated current amplitude and the estimated associated phase.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
44.
High Resolution Light Valve Detector for Detecting X-Ray
A detection system for an x-ray microscopy system utilizes high bandgap, direct conversion x-ray detection materials. The signal of the x-ray projection is recorded in a spatial light modulator such as a liquid crystal (LC) light valve. The light valve is then read-out by a polarized light optical microscope. This configuration will mitigate the loss of light in the optical system over the current scintillator-optical microscope-camera detection systems.
Disclosed is a method for aligning two components (31, 33) of a projection exposure apparatus (1, 101) for semiconductor lithography, comprising:
inserting at least one mandrel (30, 50) of a first component (33) into a recess (94) in a second component (31) in the z-direction,
preloading the mandrel (30, 50) perpendicular to the z-direction to a predetermined torque for pre-positioning the two components (31,33) in relation to each other in the x-y plane,
positioning the two components (31, 33) in the z-direction until they are in contact with a contact force FA,
bracing the mandrel (30, 50) with the recess (94) with maximum torque,
positioning the two components in the z-direction until the first component (31) rests on the second component (33) with maximum weight force Fmax.
Disclosed is a method for aligning two components (31, 33) of a projection exposure apparatus (1, 101) for semiconductor lithography, comprising:
inserting at least one mandrel (30, 50) of a first component (33) into a recess (94) in a second component (31) in the z-direction,
preloading the mandrel (30, 50) perpendicular to the z-direction to a predetermined torque for pre-positioning the two components (31,33) in relation to each other in the x-y plane,
positioning the two components (31, 33) in the z-direction until they are in contact with a contact force FA,
bracing the mandrel (30, 50) with the recess (94) with maximum torque,
positioning the two components in the z-direction until the first component (31) rests on the second component (33) with maximum weight force Fmax.
Also disclosed is device for aligning the two components (31, 33) comprises the mandrel.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
46.
PROCESS AND DEVICE FOR CHEMICAL PROCESSING OF A SURFACE
A process for chemical processing of a surface, in particular (32) of a substrate (31) of a component (MX, 117) of a projection exposure apparatus (1, 101) for semiconductor lithography. A chemical processing brought about by a reaction fluid (38) is limited to a predetermined region (36) by application of a further fluid (39) to this region (36). Also disclosed is a device (30) for chemical processing of at least one surface (32), wherein the device (30) includes a spray array with at least two spray units (34,35) for applying a fluid (38,39). A first spray unit (34) is embodied such that a first region (36) of the surface (32) is treated with a reaction fluid (38) and a second spray unit (35) is embodied such that a second region (37) of the surface (32) is treated with the further fluid (39).
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/30 - Dépouillement selon l'image utilisant des moyens liquides
47.
3D VOLUME INSPECTION OF SEMICONDUCTOR WAFERS WITH INCREASED THROUGHPUT AND ACCURACY
A system and a method for volume inspection of semiconductor wafers are configured for milling and fast image acquisition of cross-sections surfaces in an inspection volume. High quality images can be obtained by restriction of the imaging to regions of interest or by averaging over several fast image scans. The method and device can be utilized for quantitative metrology, defect detection, process monitoring, defect review, and inspection of integrated circuits within semiconductor wafers.
An actuatable mirror assembly (25) has an actuator device (31) with an actuator base unit (32) fixed to the frame and an actuator-mirror mirror carrier unit (30) which can be displaced with respect to the actuator base unit in an actuator-displacable manner. The mirror assembly (25) has at least one mirror (26) which has a reflective surface (27) and is fixed to the actuator mirror carrier unit (30). A bearing device (29) is used to fix the mirror (26) to the actuator mirror carrier unit (30). The bearing device (29) is designed such that an enclosed fixing region (33), provided hereby, of the mirror (26) on the actuator mirror carrier unit (30) has, along a fixing maximum distance, an extent (A) between maximally spaced fixing points of the bearing device (29) that is at least 15% of a typical extent (B) of the reflective surface (27) of the mirror (26). This results in an actuatable mirror assembly the usage possibilities of which are improved, in particular in the field of projection lithography.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
A drive device for driving and measuring an actuator for actuating an optical element of an optical system comprises a drive unit, a voltage measuring unit and a current measuring unit having a frequency-dependent first transfer function configured to amplify a time-dependent
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
A display device for the interior of a vehicle comprises light sources, light guides, and holograms. The light guides are arranged next to one another and each has an entrance surface and a reflective area. Each light source emanates light that enters the entrance surface of an associated light. At least one of the holograms is arranged at or in each light guide. The light emanated by each light source enters the entrance surface of the associated light guide in a direction of the reflective area of the associated light guide, is reflected by the reflective area of the associated light guide in a direction of the hologram of the associated light guide, and interacts with the hologram of the associated light guide.
B60K 35/21 - Dispositions de sortie, c.-à-d. du véhicule à l'utilisateur, associées aux fonctions du véhicule ou spécialement adaptées à celles-ci utilisant une sortie visuelle, p. ex. voyants clignotants ou affichages matriciels
B60K 35/50 - Instruments caractérisés par leurs moyens de fixation au véhicule ou d’intégration dans celui-ci
52.
APPARATUS AND METHOD FOR THERMALLY TREATING A BODY TO BE THERMALLY TREATED
The invention relates to an apparatus (100) for thermally treating a body (101, 102, 103) to be thermally treated, in particular for thermally connecting a first partial body (101) to a second partial body (102) at a boundary surface (104) formed between the first partial body (101) and the second partial body (102) to form a composite body (103). The apparatus (100) also comprises a casing body (105), a temperature-controllable chamber (108) inside a temperature-control unit (106), and a heating element (109), the casing body (105) being designed to contactlessly surround the body (101, 102, 103) to be thermally treated prior to, during and after the thermal treatment. The invention also relates to a method for thermally treating a body (101, 102, 103) to be thermally treated, and in particular for the high-temperature bonding of a first partial body (101) to a second partial body (102) to form a composite body (103) by means of the apparatus (100). The invention also relates to an optical element (609), in particular a reflective optical element, more particularly for reflecting EUV radiation (610), more particularly an optical element (609) which is temperature controlled via a channel (208) through which a media flows, in particular a temperature-controlled reflective optical element (609). The invention also relates to a semiconductor-technology system (700) having at least one optical element (609), in particular having a temperature-controlled optical element (609), more particularly having a temperature-controlled reflective optical element (609) which is temperature controlled via a channel (208) by means of one of the temperature-control devices (723-733).
C03B 23/22 - Réunion de lentilles de verre, p. ex. pour la fabrication de lentilles bifocales
C03B 32/00 - Post-traitement thermique des produits vitreux non prévu dans les groupes , p. ex. cristallisation, élimination des inclusions gazeuses ou autres impuretés
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
53.
PROJECTOR OR DISPLAY COMPRISING A SCANNING LIGHT SOURCE AND A PIXELATED ARRAY
The invention preferably relates to an image-generating unit with a light source for generating illumination radiation and a light-modulating pixel array for generating an image by pixel-wise modulation of the illumination radiation incident on the pixel array. The image-generating unit is characterized in that the illumination radiation, upon incidence on the light-modulating pixel array, has a lateral extent which is smaller than the pixel array and is guided over the pixel array by means of a scanning unit for generating an image. By a combination of the process of scanning the illumination radiation over the light-modulating pixel array, the speckle signatures of the scanning unit and of the pixel array are superimposed or combined to generate an image point. Advantageously, visible speckle patterns in the resulting image can thus be significantly reduced.
MIRROR ASSEMBLY, ILLUMINATION OPTICAL UNIT HAVING A MIRROR ASSEMBLY, ILLUMINATION SYSTEM HAVING SUCH AN ILLUMINATION OPTICAL UNIT AND PROJECTION EXPOSURE APPARATUS HAVING SUCH AN ILLUMINATION SYSTEM
A mirror assembly (21) has a mirror (27) with a mirror body (25) and a reflection surface (26). A rotational drive device (28) for at least one reflection surface support portion (251) of the mirror body (25) has a first motor (29) and a second motor (30). The first motor (29) has a stationary, first stator portion and a first rotor portion which is rotatable about a first axis of rotation. The second motor (30) has a second stator portion, which is affixed to the first stator portion (33), and a second rotor portion, to which at least one rotor body portion (252) of the mirror body (25) is affixed and which is rotatable about a second axis of rotation. A normal to the reflection surface (26) adopts an angle of greater than 0° with respect to the first and/or second axis of rotation. This results in a flexibly utilizable mirror assembly.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 5/09 - Miroirs à facettes multiples ou polygonales
55.
MIRROR SYSTEM, METHOD FOR OPERATING A MIRROR SYSTEM AND PROJECTION LENS OF A MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS
The invention relates to a mirror system having an EUV mirror (M1-M6), wherein the EUV mirror (M1-M6) comprises a mirror body (38) and an optical surface (32) with high EUV radiation reflectivity formed on the mirror body (38). The mirror system comprises a frame structure (31) which carries the mirror body (38), a fluid channel (37, 58) for a temperature control fluid, said fluid channel extending in a structure body (31, 38) of the mirror system, and a feed line (35) for supplying the temperature control fluid to the fluid channel (37, 58). The feed line (35) is provided with a temperature sensor (42) for the temperature control fluid temperature. The temperature sensor (42) is arranged outside of the cross section of the feed line (35). The invention also relates to a method for operating a mirror system and to a projection lens of a microlithography projection exposure apparatus.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
56.
IMPROVED METHOD AND APPARATUS FOR CHARGE COMPENSATION DURING 3D TOMOGRAPHY
An improved method of operating a dual beam system and a dual beam system for improved mitigation of charging effects during image forming or ion-beam milling. The improved methods and the dual beam system utilize at least one of a generation of temporary conducting zone for a charge drain, parallel de-charging during ion-beam milling, or a decharging with a purge gas enclosed in a local gas purging volume. The improved method and dual beam system can be utilized for wafer inspection with increased accuracy.
G01N 23/225 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques
In a first aspect, the invention relates to a holographic display device for the switchable display of images, wherein a light source, a light guide and at least two holographic diffraction gratings are configured for illumination of the at least two holographic diffraction gratings by light from the light source coupled into the light guide. Each holographic diffraction grating generates an image. Furthermore, a controllable light gate is allocated to each holographic diffraction grating. The light gate is configured to regulate the brightness of the generated image. In a further aspect, the invention relates to an operating device comprising a holographic display device as described and at least one operating element having at least one sensor. The sensor can detect an interaction with the operating element and output a detection signal. Furthermore, a control device is comprised which controls the light gate depending on the detection signal.
G03H 1/02 - Procédés ou appareils holographiques utilisant la lumière, les infrarouges ou les ultraviolets pour obtenir des hologrammes ou pour en obtenir une imageLeurs détails spécifiques Détails
G06F 3/01 - Dispositions d'entrée ou dispositions d'entrée et de sortie combinées pour l'interaction entre l'utilisateur et le calculateur
58.
PROJECTION OBJECTIVE OF A PROJECTION EXPOSURE SYSTEM, AND PROJECTION EXPOSURE SYSTEM
The invention relates to a projection objective (110) of a projection exposure system (1, 101) and to a projection exposure system (1, 101) comprising an optical module (30, 40, 50, 70, 90) with an optical element (M3) and a reinforcing body (35, 45, 55, 751, 75.2), wherein the optical element (M3) and the reinforcing body (35, 45, 55, 75.1, 75.2) are connected together by means of at least one connecting element (36, 46), and the optical element (M3) has at least two segments (31.1,31.2,51.1,51.2, 71.1, 71.2,91).
G02B 7/198 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs avec des moyens pour régler la position du miroir par rapport à son support
The invention relates to an optical module (30, 40, 50) with an optical element (M3), wherein the optical element (M3) has an optical active surface (31) and is connected to a reinforcing body (32) via at least one connecting element (33, 41). The connecting element is characterized in that the connecting element (33, 41) comprises a decoupling region (34, 42.2, 42.3) by means of which a mechanical decoupling of the reinforcing body (32) and of the optical element (M3) parallel to the optical active surface (31) is produced. In the process, the material of the reinforcing body (32) can have an elastic modulus which is greater than that of the material of the optical element (M3) at least by a factor of two, preferably by a factor of three, particularly preferably by a factor of four, and/or the reinforcing body (32) can be made of a ceramic material, in particular a silicon carbide. The invention additionally relates to a projection exposure system (1, 101) for semiconductor lithography, comprising an optical module (30, 40, 50) according to one of the described embodiments.
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
60.
MODULAR, PARTIALLY-REDUNDANT CONVERTER SYSTEM WITH DC/DC CONVERTERS CONNECTED IN SERIES ON THE OUTPUT SIDE
The invention relates to a drive device (100) for driving an actuator (200) for actuating an optical element (310) of an optical system (4, 10), having an amplifier (110) configured to receive a provided supply voltage (V1) at an input node (K1) and to provide a drive voltage (V2) for the actuator (200) at an output node (K2), and a supply device (120) coupled to the input node (K1) for providing the supply voltage (V1), which has a series circuit (130), which can be coupled between the input node (K1) and earth (GND2), of a plurality N, with N ≥ 2, of DC/DC converters (131-133) for providing a respective DC voltage and a number M, with M ≥ 1, of further DC/DC converters (141), which can be connected in series with the series circuit (130), for providing a DC voltage.
H02M 1/32 - Moyens pour protéger les convertisseurs autrement que par mise hors circuit automatique
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
61.
ASSEMBLY IN A MICROLITHOGRAPHIC PROJECTION EXPOSURE SYSTEM
The invention relates to an assembly in a microlithographic projection exposure system, the assembly (100, 200, 300, 400) comprising: an optical element (101, 201, 301, 401); at least one weight-force compensation device (110, 210, 310, 410) having a passive magnetic circuit (111, 211, 311, 411) for generating a magnetic field which causes a force for at least partially compensating for the weight force acting on the optical element and having an active component for generating an actively controllable force transmitted to the optical element, the at least one weight-force compensation device (110, 210, 310, 410) being coupled to the optical element (101, 201, 301, 401) by means of an articulatedly mounted pin (115, 215, 315, 415); and at least three Lorentz actuators (120, 130, 220, 230, 320, 330, 340, 420, 430, 440) each designed to exert a controllable force on the optical element, at least one of said Lorentz actuators being fastened directly to the optical element.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
62.
METHOD FOR CONTROLLING AN OPTICAL MODULE, OPTICAL MODULE AND CONTROL CIRCUIT FOR AN ASSEMBLY OF A PROJECTION EXPOSURE APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY
The invention relates to a method for controlling an optical module (31, 51, 61, 71, 81, 91, 121) of an assembly (30, 50, 60, 70, 80, 90, 120) in an optical system (1, 101) having an optical element (M3), - a first number of position actuators (371, 37.2) for positioning the optical element (M3), - at least one additional actuator (RA, DA, IA) for damping deformations of the optical element (M3) caused by the parasitic mechanical disturbances, - at least one sensor (PS) for determining the pose of the optical element (M3), - a control circuit (32, 52, 62, 72, 82, 92, 122) for controlling the optical element (M3), with the following method steps: - acquiring at least one sensor signal (qPS) relating to the pose of the optical element (M3), - decomposing the at least one acquired sensor signal (qPS) into a signal group (qSK) having at least one pose component and a signal group (qEM) having at least one deformation component, - positioning the optical element (M3) on the basis of the pose compo- nents, and - damping the deformations on the basis of the deformation components. The invention also relates to a control circuit (32, 52, 62, 72, 82, 92, 122) for control- ling an optical element (M3) for an optical module, and to an optical module (31, 51, 41, 61, 71, 81, 91, 121).
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
H02N 2/06 - Circuits d'entraînementDispositions pour la commande
The invention relates to an optical system (300) having a plurality of actuable optical elements (310) and a plurality of actuator/sensor devices (200) for actuating and/or sensing the optical elements (310), which optical system has a supply device (400) for providing a supply voltage (VS) for a number of electrical loads (500, L1-L12) of the optical system (300), which comprises a parallel connection of a plurality N, where N ≥ 3, of supply rails (410-440) to a respective power supply unit (450), wherein the respective power supply unit (450) of the N supply rails (410-440) is set up to provide a predetermined power supply unit output power (P1) on the output side at a supply node (K1-K4) in the error-free operation of the supply device (400), and to provide the -fold (P2) of the predetermined power supply unit output power at the supply node (K1-K4) in the faulty operation.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
H02J 9/00 - Circuits pour alimentation de puissance de secours ou de réserve, p. ex. pour éclairage de secours
H02M 1/00 - Détails d'appareils pour transformation
64.
METHOD FOR DEFINING THE FOCAL PLANE OF A VIRTUAL IMAGE FROM AN OPTICAL ARRANGEMENT WHICH CAN BE WORN IN FRONT OF THE EYES
The invention relates to a method (50) for defining the focal plane (40) of a stereoscopic virtual image from an optical arrangement (20) which can be worn in front of the eyes (1) and which has at least one optical device (25) for radiating a stereoscopic virtual image. The method comprises the following steps: ascertaining the heterophoria of a person (52); based on the ascertained heterophoria, ascertaining a dependency (9) between the vergence distance and the focus distance (53); ascertaining a curve of the minimum relative vergence (11) (54); determining a depth-of-field region (43) (55); ascertaining a first focus distance (41) and a second focus distance (42), wherein the second focus distance (42) has a higher value in dioptres than the first focus distance (41), wherein the focus distance between the first focus distance (41) and the second focus distance (42) corresponds to the determined depth-of-field region (43) and wherein the first focus distance (41) is defined such that it forms an intersection point with the curve of the minimum relative vergence (11), said intersection point having a vergence value of at most 1 dioptre (56); and defining the focal plane (40) (57) of the stereoscopic virtual image in a region between the second focus distance (42) and the first focus distance (41).
The invention relates to a spectacle lens (1) comprising - a spectacle lens rear surface (11) facing towards the eye; - a spectacle lens front surface (13) facing away from the eye; - a Fresnel structure (3) comprising at least two Fresnel zones (3-1 to 3-6) providing a focusing effect, wherein the focusing effect of the Fresnel structure (3) is based at least partially on a refractive index gradient within the Fresnel zones (3-1 to 3-6), and the Fresnel structure (3) has boundary surfaces (5a to 5e) at which a high refractive index of one Fresnel zone (3-1 to 3-6) and a low refractive index of an adjacent Fresnel zone (3-1 to 3-6) adjoin one another. The at least one boundary surface (5a to 5e) has a rear-side intersection line (4a to 4e) with the spectacle lens rear surface (11) and a front-side intersection line (6a to 6e) with the spectacle lens front surface (13). The rear surface region of the spectacle lens rear surface (11) enclosed by the innermost rear-side intersection line (4a) has a rear-side geometric centre of gravity (RS) and the front-side surface region of the spectacle lens front surface (11) enclosed by the innermost front intersection line (6a) has a front-side geometric centre of gravity (VS). The rear-side intersection line (4a to 4e) has a smaller distance from the rear-side geometric centre of gravity (RS) than the front-side intersection line (6a to 6e) from the front-side geometric centre of gravity (VS), for at least 25% of all azimuth angles.
The invention relates to a method for reducing aberrations of an optical element (Mi), in particular an optical element (Mi) in a lithography system, comprising: determining a change over time of an optical property of the optical element (Mi) which is expected over the course of the service life of the optical element (Mi), in particular a change over time of a flatness (P(x,y)) of a surface (24a) of a substrate (24) of the optical element (Mi), wherein the change over time of the optical property causes aberrations which vary over the course of the service life (T) of the optical element (Mi), and reducing the aberrations which vary over the course of the service life of the optical element (Mi) by incorporating an allowance, in particular a flatness allowance (∆PV), which compensates at least for a portion of the total change over time of the optical property (P(x,y)) expected over the course of the service life. The invention also relates to an optical element (Mi) and to a semiconductor lithography system.
The invention relates to an optical system and to a method for operating an optical system, in particular in a microlithography projection exposure system, wherein the optical system has at least one mirror (100) with an optical functional surface (101) and a mirror substrate (110) made of a mirror substrate material, and at least one cooling channel (131-136), through which a cooling fluid with a variably adjustable temperature can flow is provided in the mirror substrate. According to the method, the cooling fluid temperature is adjusted on the basis of the presence of a deviation between the actual value (ZCT2) of the averaged zero crossing temperature of the thermal expansion coefficient of the mirror substrate material and a specified target value (ZCT1) for said averaged zero crossing temperature. The cooling fluid temperature is regulated during the operation of the optical system, and the regulation process is carried out on the basis of a feedforward model.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G02B 7/18 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs
The invention provides a method comprising determining a representative ground truth structure provided in a semiconductor sample having a plurality of structures extending mainly in a thickness direction of the sample in a region of interest containing the plurality of structures. Furthermore at least one adapted image of a milled sample is determined, wherein the at least one adapted image comprises image representations of the structures in the region of interest at different positions in the thickness direction. A transformation is determined by which the image representations at the different positions in the thickness direction of the structures build the ground truth structure, and the transformation is stored for a future application of the transformation to a further sample having the plurality of structures.
G06T 7/33 - Détermination des paramètres de transformation pour l'alignement des images, c.-à-d. recalage des images utilisant des procédés basés sur les caractéristiques
The present invention relates, inter alia, to a method for influencing a charge state of a sample, comprising directing a charged particle beam onto the sample for the purpose of analysing and/or processing the sample, wherein the particles of the particle beam are accelerated onto the sample by a first acceleration voltage and result in charging of the sample, and directing the charged particle beam onto the sample for the purpose of influencing the charging of the sample, wherein the particles of the particle beam are accelerated onto the sample by a second, changed acceleration voltage amounting to at least 15% of the first acceleration voltage.
H01J 37/02 - Tubes à décharge pourvus de moyens permettant l'introduction d'objets ou d'un matériau à exposer à la décharge, p. ex. pour y subir un examen ou un traitement Détails
70.
OPTICAL DEVICE, METHOD FOR MEASURING AN ACTUAL TILT OF AN OPTICAL SURFACE OF AN OPTICAL ELEMENT, AND LITHOGRAPHY SYSTEM
An optical device, such as for a lithography system, comprises: at least one optical element having at least one optical surface; one or more actuators to tilt the optical surface of the optical element; and a measuring device to detect a tilt of the optical surface from an idle position. The measuring device has at least one waveguide which forms a closed measuring section. The waveguide is designed for coupling in and propagating one or more modes of a measuring beam. The waveguide is arranged such that a tilt of the optical surface influences the measuring beam propagating through the waveguide. The measuring device is designed to detect an influencing of the measuring beam caused by the tilt of the optical surface.
G01B 11/26 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
71.
MIRROR SYSTEM, AND MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS COMPRISING A MIRROR SYSTEM
The invention relates to a mirror system, comprising an EUV mirror having an optical surface (32) with high reflectivity for EUV radiation, and comprising a frame structure (39), which carries a system component of the mirror system. The frame structure comprises a structural body (40) and an insert (42), the insert (42) consisting of a material having thermal properties that differ from the thermal properties of the material of the structural body (40). A fluid channel (41) for a temperature-regulating fluid is formed in the structural body. The insert (42) is exposed to a thermal load during operation of the mirror system. The insert (42) spans a contour line (44) transversely with respect to the direction of the fluid channel (41), with the result that a cross-sectional portion (49) of the fluid channel (41) is received within the contour line (44). The invention furthermore relates to a microlithographic projection exposure apparatus comprising such a mirror system.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
72.
HOLDING DEVICE, OPTICAL ASSEMBLY AND OPTICAL SYSTEM
The invention relates to a holding device (28) for a mirror element, in particular for a mirror element (19) for the reflection of EUV radiation (16), which has a ratio of length (L) to breadth (B) of more than 2:1, preferably more than 3:1, particularly preferably more than 4:1, in particular more than 10:1. The holding device (28) has a frame (29) with a plurality of holding elements (30) for laterally clamping the mirror element (19). The holding elements (30) have protruding sprung portions (32) for resiliently supporting the mirror element (19). The invention also relates to an optical assembly (27) having such a mirror element (19) and having a holding device (28), designed as described above, for holding the mirror element (19). The invention also relates to an EUV lithography system having at least one such optical assembly (27).
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
G02B 7/192 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs avec des moyens pour réduire au minimum les contraintes internes du miroir
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
73.
METHOD, DEVICE AND SYSTEM FOR DETECTING A SHAPE DEVIATION
The invention relates to detecting a shape deviation in three dimensions, 3D, of an inspection object (11) of a 3D target geometry (33), in which back projections on the 3D target geometry (33) are determined by at least one processing circuit (34), wherein, for a plurality of 2D images of the inspection object (11), one back projection each is determined on at least one part of the 3D target geometry (33). The determined back projections for the plurality of 2D images are compared by the at least one processing circuit (34) in order to detect the shape deviation.
METHOD FOR INCORPORATING TEMPERATURE-REGULATING HOLLOW STRUCTURES INTO A SUBSTRATE, IN PARTICULAR INTO A SUBSTRATE FOR AN OPTICAL ELEMENT, METHOD AND SUBSTRATE FOR PRODUCING AN OPTICAL ELEMENT, OPTICAL ELEMENT, PROCESSING SYSTEM AND ALSO APPARATUS PERTAINING TO SEMICONDUCTOR TECHNOLOGY AND STRUCTURED ELECTRONIC COMPONENT
In a method for incorporating temperature-regulating hollow structures into a substrate, in particular into a substrate for an optical element, such as a mirror for an EUV projection exposure apparatus, there are the following steps: (A) providing a substrate; (B) progressively focusing a processing light beam on ablation locations at which temperature-regulating hollow structures are intended to arise; (C) a scanning process is carried out in which the processing light beam is guided with a focus in such a way that an ablation focus is moved along a scanning trajectory; (D) the scanning trajectory comprises a plurality of scanning patterns; (E) the scanning positions are spaced apart from one another in a longitudinal direction of the temperature-regulating hollow structure to be produced; and (F) the scanning trajectory additionally comprises pattern jump paths.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
76.
METHOD FOR INCORPORATING TEMPERATURE-CONTROL HOLLOW STRUCTURES IN A SUBSTRATE, IN PARTICULAR IN A SUBSTRATE FOR AN OPTICAL ELEMENT, METHOD AND SUBSTRATE FOR PRODUCING AN OPTICAL ELEMENT, OPTICAL ELEMENT, SEMICONDUCTOR TECHNOLOGY PLANT AND STRUCTURED ELECTRONIC COMPONENT
The invention relates to a method for incorporating temperature-control hollow structures (22) in a substrate (12), in particular in a substrate (12) for an optical element (8), in particular for a mirror (10) for an EUV projection exposure system, said method having the following steps: (A) providing a substrate (12) which consists of a substrate material (12a); (B) generating an intermediate structure (40) which comprises an intermediate layer (42) of modified substrate layer (44) and an intermediate hollow structure (46) which is delimited by the intermediate layer (42) at least in some regions, wherein the modified substrate material (44) has a higher etchability than the substrate material (12a); (C) introducing a treatment medium (90) in the intermediate hollow structure (46), by way of which the intermediate layer (42) is removed from the modified substrate material (44) by way of an etching process, as a result of which the temperature-control hollow structure (22) is produced. The intermediate structure (40) in step (B) is generated by (B.1) successively focusing a modification light beam (56) onto modification locations (66) such that, at the modification locations (66), the modified substrate material (44) is produced; and (B.2) successively focusing a removal light beam (70) onto removal locations (72) such that, at the removal locations (72), material (44; 12a) is removed. The invention also relates to a method and a substrate (12) for producing an optical element (8), and to an optical element (8). Furthermore, the invention relates to a semiconductor technology plant (6) and to a structured electronic component (224).
B23K 26/00 - Travail par rayon laser, p. ex. soudage, découpage ou perçage
B23K 26/142 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet pour l'enlèvement de résidus
B23K 26/146 - Travail par rayon laser, p. ex. soudage, découpage ou perçage en utilisant un écoulement de fluide, p. ex. un jet de gaz, associé au faisceau laserBuses à cet effet l'écoulement de fluide contenant un liquide
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
B23K 26/55 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour créer des vides dans la pièce à travailler, p. ex. pour former des passages ou des configurations de flux
B23K 103/00 - Matières à braser, souder ou découper
77.
METHOD FOR INCORPORATING TEMPERATURE-CONTROLLED HOLLOW STRUCTURES INTO A SUBSTRATE, IN PARTICULAR INTO A SUBSTRATE FOR AN OPTICAL ELEMENT FOR AN EUV PROJECTION EXPOSURE SYSTEM, AND PROCESSING SYSTEM THEREFOR, METHOD AND SUBSTRATE FOR PRODUCING AN OPTICAL ELEMENT, OPTICAL ELEMENT AND SEMICONDUCTOR TECHNOLOGY SYSTEM AND STRUCTURED ELECTRONIC COMPONENT
The invention relates to a method for incorporating temperature-controlled hollow structures (22) into a substrate (12) of a mirror (10) for an EUV projection exposure system, comprising the following steps: (A) providing a substrate (12) consisting of a substrate material 12a; (B) successively focusing a processing light beam (46) onto processing locations (54), where temperature-controlled hollow structures (22) are to be formed, so that the substrate material 12a is removed at the processing locations (54), wherein modified substrate material (58) is formed adjacent the processing locations (54), which has an increased etchability relative to the substrate material 12a; (C) applying a rinsing fluid (82; 82.1) to the processing locations (54), while step (B) is carried out, whereby removed substrate material is rinsed away. In a step (D), an etching medium (80) is applied to the processing locations (54), while step (B) is carried out, wherein the etching medium (80) has an etching effect at the processing locations (54) and removes modified substrate material (58) present there via an etching process. The invention also relates to a processing system (40) for carrying out the method, as well as a method and a substrate (12) for producing an optical element (8), and an optical element (8). The invention further relates to a semiconductor technology system (6) and a structured electronic component (224).
C03C 15/00 - Traitement de surface du verre, autre que sous forme de fibres ou de filaments, par attaque chimique
C03C 17/34 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement avec au moins deux revêtements ayant des compositions différentes
C03C 23/00 - Autres traitements de surface du verre, autre que sous forme de fibres ou de filaments
B23K 26/55 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour créer des vides dans la pièce à travailler, p. ex. pour former des passages ou des configurations de flux
B23K 26/53 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour modifier ou reformer le matériau dans la pièce à travailler, p. ex. pour faire des fissures d'amorce de rupture
78.
METHOD FOR PRODUCING A MIRROR SUBSTRATE OF AN OPTICAL ELEMENT, OPTICAL ELEMENT AND PROJECTION EXPOSURE SYSTEM
The invention relates to a method for producing a mirror substrate (201, 301, (401), (501)) of an optical element for a projection exposure system, in particular an EUV projection exposure system (100), comprising a first (202, (402), (502)) and at least one second component (204, 304, (404), (504)), the first component (202, (402), (502)) and the at least one second component (204, 304, (404), (504)) consisting of silicon at least on a side facing a connection (211, 308, (408), (508)), and the method having the following steps: providing/producing the at least two components (202, (402), (502), (204), 304, (404), (504)) of the mirror substrate (201, 301, (401), (501)), and joining the at least two components (202, (402), (502), (204), 304, (404), (504)) by heating to a joining temperature and applying a joining pressure, preferably perpendicularly to a joining surface (203, (205), (403), (405), (503), (505)).
C03C 27/06 - Liaison verre-verre par des procédés autres que la fusion
C03B 23/22 - Réunion de lentilles de verre, p. ex. pour la fabrication de lentilles bifocales
C03C 27/10 - Liaison verre-verre par des procédés autres que la fusion au moyen d'un adhésif spécialement adapté à ce but
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
C03C 29/00 - Liaison métal-métal au moyen du verre
79.
METHOD FOR MANUFACTURING A PROJECTION LENS, PROJECTION LENS, PROJECTION EXPOSURE SYSTEM, AND PROJECTION EXPOSURE METHOD
The invention relates to a method for manufacturing a projection lens for imaging a pattern arranged in an object plane of the projection lens onto an image plane of the projection lens, said method comprising the following steps: assembling the projection lens by arranging a plurality of optical elements in accordance with a specification in such a way that optical surfaces of the optical elements form a projection beam path through which a pattern arranged in the object plane can be imaged onto the image plane by means of the optical elements, wherein at least one manipulator of a wavefront manipulation system is integrated in order to dynamically influence the wavefront of the projection radiation in response to control signals from a control unit of the wavefront manipulation system, wherein the manipulator comprises at least one manipulator element having at least one manipulator surface arranged in the projection beam path, and comprises an actuating device, which can be controlled by control signals from the control unit, for reversibly altering the optical effect of the manipulator element; measuring the projection lens, involving spatially resolved determination of the wavefront, for the spatially resolved determination of wavefront errors, wherein the manipulator element has a starting configuration during the measurement; calculating a first configuration of the manipulator element, which first configuration is suitable for correcting the wavefront errors; defining a first operating mode of the control unit, wherein, in the first operating mode, the control unit generates first control signals that cause the actuating device to set the manipulator element to the first configuration.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
80.
COMPONENT HAVING A HOLLOW STRUCTURE, AND OPTICAL ASSEMBLY
The invention relates to a component, in particular an optical element (Mi) or a structural component part, comprising: a main body (25), which has a hollow structure through which a fluid can flow, which hollow structure has: a plurality of cooling channels (31); a fluid distributor (33); and a fluid collector; the fluid distributor (33) having connection channels (33b) for supplying the fluid to the cooling channels (31), which connection channels open into a common inlet channel (33a) which is connected to an inlet opening (29), and/or in which the fluid collector has connection channels for draining the fluid from the cooling channels (31), which connection channels open into a common outlet channel which is connected to an outlet opening. In one aspect of the invention, the inlet channel (33a) has a flow cross section (A) which decreases starting from a connection channel (33b') adjacent to the inlet opening, and/or the outlet channel has a flow cross section which decreases starting from a connection channel adjacent to the outlet opening.
G02B 7/00 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
81.
OPTICAL DEVICE FOR PROJECTING A PATTERN ONTO A SURFACE
The invention relates to an optical device (20) for projecting a pattern onto a surface (98), the optical device (20) comprising the following: a slide (30), wherein the slide (30), for generating the pattern, refracts and/or diffracts and/or reflects and/or absorbs some of the light radiated into the optical device (20), and a projection optical unit (60), wherein the projection optical unit (60) is designed to image the pattern onto the surface (98), characterised in that the slide (30) and the projection optical unit (60) are designed in a single piece.
G02B 27/18 - Systèmes ou appareils optiques non prévus dans aucun des groupes , pour projection optique, p. ex. combinaison de miroir, de condensateur et d'objectif
82.
METHOD, DEVICE AND COMPUTER PROGRAM FOR DETERMINING AN ORIENTATION OF A SAMPLE ON A SAMPLE STAGE
The invention relates to a method for determining an orientation of a sample on a sample stage that is rotatable about an axis of rotation. The method comprises: a) positioning the sample relatively at a first position; b) rotating the sample through a first rotary angle relative to a height sensor; and c) repeatedly measuring first heights of the sample using the height sensor during the rotation. In the process, steps a) to c) are furthermore performed for at least one second position for the purpose of measuring second heights.
G03F 1/72 - Réparation ou correction des défauts dans un masque
G03F 1/82 - Procédés auxiliaires, p. ex. nettoyage ou inspection
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p. ex. automatique
83.
LIFETIME STABILIZATION OF COATED OPTICAL SYSTEMS BY MEANS OF ELECTRON BEAM HEATING
The invention relates to a method for stabilizing an optical element, the method comprising: providing an optical element having a substrate and a coating, and subjecting the optical element to heat treatment. The problem of providing a method and an optical element which overcome the disadvantages of the prior art is solved by virtue of the heat treatment of the optical element comprising irradiating the coating of the optical element with electrons. Furthermore, the invention relates to an optical element, to a microlithographic projection lens comprising such an optical element, and to a microlithographic projection exposure apparatus comprising such a projection lens, and also to a device for electron irradiation.
In the case of a method for producing a temperature-controlling hollow structure in a substrate, first of all a substrate consisting of a substrate material is provided. The substrate is surveyed in order to ascertain where inclusions are in the substrate. Then, a temperature-controlling hollow structure is worked into the substrate by focusing a processing light beam with a beam axis aligned along a standard direction successively onto processing locations at which the temperature-controlling hollow structure is to be produced. As a result, the substrate material is modified or removed at the processing locations. If an inclusion is on the beam axis aligned along the standard direction, the direction of the beam axis relative to the mirror substrate is changed such that the beam axis does not intersect the inclusion.
B23K 26/55 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler pour créer des vides dans la pièce à travailler, p. ex. pour former des passages ou des configurations de flux
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
A coated lens has a stamping which contains one or more ring-shaped focusing structures. A method for manufacturing such a coated lens is provided in which a coating composition is stamped. The coating composition includes at least one of an epoxide component and a (meth)acrylate component. The ring-shaped focusing structure(s) provide an additional power compared to the central clear zone of the coated lens.
C09D 163/00 - Compositions de revêtement à base de résines époxyCompositions de revêtement à base de dérivés des résines époxy
B29D 11/00 - Fabrication d'éléments optiques, p. ex. lentilles ou prismes
B29K 75/00 - Utilisation de polyurées ou de polyuréthanes comme matière de moulage
C08G 59/32 - Composés époxydés contenant au moins trois groupes époxyde
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
The present invention relates to methods, to an apparatus and to a computer program for processing of an object for lithography.
The present invention relates to methods, to an apparatus and to a computer program for processing of an object for lithography.
A method of processing an object for lithography comprises: providing a first gas comprising first molecules; providing a particle beam in a working region of the object for removal of a first material in the working region, based at least partly on the first gas. The first material may comprise chromium and nitrogen. In addition, the first material may comprise at least 5 atomic percent of nitrogen, preferably at least 10 atomic percent of nitrogen, especially preferably at least 20 atomic percent of nitrogen.
G03F 1/72 - Réparation ou correction des défauts dans un masque
G03F 1/78 - Création des motifs d'un masque par imagerie par un faisceau de particules chargées [CPB charged particle beam], p. ex. création des motifs d'un masque par un faisceau d'électrons
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
A 3D printing apparatus for manufacturing a workpiece has a first radiation source to carry out a non-linear absorption polymerization and a second radiation source to carry out optical coherence tomography. A first beam path is traversed by the first radiation and a second beam path is traversed by the second radiation. The first and second beam paths are formed completely independently of one another. Further, a 3D printing method for manufacturing a workpiece, another 3D printing apparatus, and methods for analyzing the quality of a raw material of a non-linear absorption polymerization; checking an orientation of a substrate to be printed by non-linear absorption polymerization; determining a spatially resolved degree of conversion of a non-linear absorption polymerization; analyzing a structural sharpness of a structure produced by non-linear absorption polymerization; and for three-dimensional reconstruction of a workpiece manufactured by non-linear absorption polymerization are disclosed.
B29C 64/277 - Agencements pour irradiation utilisant des moyens de rayonnement multiples, p. ex. des micro-miroirs ou des diodes électroluminescentes multiples [LED]
B29C 64/135 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux utilisant des couches de liquide à solidification sélective caractérisés par la source d'énergie à cet effet, p. ex. par irradiation globale combinée avec un masque la source d’énergie étant concentrée, p. ex. lasers à balayage ou sources lumineuses focalisées
B29C 64/268 - Agencements pour irradiation par faisceaux laserAgencements pour irradiation par faisceaux d’électrons [FE]
B29C 64/386 - Acquisition ou traitement de données pour la fabrication additive
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
90.
METHOD FOR PROCESSING DC MARKS FOR REPAIRING LITHOGRAPHY MASKS
The disclosure relates to a method for processing a lithography object. The method comprises using a particle beam and an etching gas to process a marking in order to reduce the volume of the marking, the marking having been deposited on the object and remaining on the object. The invention also relates to a corresponding computer program and a corresponding device.
G03F 1/42 - Aspects liés à l'alignement ou au cadrage, p. ex. marquages d'alignement sur le substrat du masque
G03F 1/74 - Réparation ou correction des défauts dans un masque par un faisceau de particules chargées [CPB charged particle beam], p. ex. réparation ou correction de défauts par un faisceau d'ions focalisé
91.
COMPUTER IMPLEMENTED METHOD FOR THE DETECTION AND CLASSIFICATION OF ANOMALIES IN AN IMAGING DATASET OF A WAFER, AND SYSTEMS MAKING USE OF SUCH METHODS
A computer implemented method detects and classifies anomalies in an imaging dataset of a wafer comprising a plurality of semiconductor structures. The method comprises determining a current detection of a plurality of anomalies in the imaging dataset, and obtaining an unsupervised or semi-supervised clustering of the current detection of the plurality of anomalies. Based on at least one decision criterion at least one cluster of the clustering is selected for presentation and annotation to a user via a user interface. An anomaly classification algorithm is re-trained based on the annotated anomalies. A system for controlling the quality of wafers and a system for controlling the production of wafers are also disclosed.
The disclosure relates to an optical system and to a camera having an optical system and being configured to image an object. The optical system includes a sensor unit, lens units and an immersion unit. When viewed in the light incidence direction, first the first lens unit, then the second lens unit, then the immersion unit, and then the sensor unit are arranged along an optical axis. Further, the immersion unit is arranged both at the second lens unit and at the sensor unit. The second lens unit and the immersion unit together have positive refractive power.
H04N 23/23 - Caméras ou modules de caméras comprenant des capteurs d'images électroniquesLeur commande pour générer des signaux d'image uniquement à partir d'un rayonnement infrarouge à partir du rayonnement infrarouge thermique
G02B 9/04 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant uniquement deux composants
G03B 30/00 - Modules photographiques comprenant des objectifs et des unités d'imagerie intégrés, spécialement adaptés pour être intégrés dans d'autres dispositifs, p. ex. des téléphones mobiles ou des véhicules
A method for processing a workpiece (17) in a processing process, preferably in a photolithographic structuring process. The processing of the workpiece (17) includes controlling the temperature of the workpiece (17). In the process, the temperature of the workpiece (17) is controlled by streaming a fluid (27) through at least one channel (26) formed inside the workpiece (17).
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
95.
METHOD FOR PRODUCING AN OPTICAL ELEMENT, OPTICAL ELEMENT AND COATING PLANT
The invention relates to a method for producing an optical element, to an optical element and to a coating plant. In the method according to the invention, at least one substrate (101, 300, 400, 800, 903) is fed coating material from at least one source (901) for the deposition of in each case one layer system on the substrate, wherein, through targeted spatially resolved selection and/or treatment of the deposited coating material and/or of the substrate, a plurality of zones (111, 112, 121, 122) that are laterally adjacent to one another in at least one predefined direction are formed in each case with a defined layer thickness profile and a defined layer composition, wherein these zones differ from one another in terms of their layer thickness profile and/or their layer composition, wherein the average dimension of the zones in the predefined direction lies in each case in the range from 0.1 mm to 2 cm, wherein the optical element is a mirror array with a plurality of mirror elements, and wherein, for different substrates of this mirror array, mutually different layer thickness profiles and/or layer compositions of the layer system deposited in each case are created.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
96.
METHOD FOR SIMULATING ILLUMINATION AND IMAGING PROPERTIES OF AN OPTICAL PRODUCTION SYSTEM WHEN ILLUMINATING AND IMAGING AN OBJECT BY MEANS OF AN OPTICAL MEASUREMENT SYSTEM
A metrology system having an optical measurement system serves to simulate illumination and imaging properties of an optical production system when an object is illuminated and imaged. The optical measurement system has an illumination optical unit serving to illuminate the object and having a pupil stop in the region of an illumination pupil in a pupil plane, and an imaging optical unit for imaging the object in an image plane. At least one pupil stop for specifying a plurality of measurement illumination settings created by displacing the pupil stop in the pupil plane is provided within the scope of the simulation method. Measurement aerial images are recorded in the image plane for various displacement positions of the object perpendicular to the object plane with the various measurement illumination settings. The various measurement illumination settings are specified by displacing the pupil stop. A complex mask transfer function is reconstructed from the recorded measurement aerial images. A 3-D aerial image of the optical production system is determined from the reconstructed mask transfer function and a given illumination setting of the optical production system as the result of the simulation method. The reconstruction includes the fact that profiles of stop edges of the at least one pupil stop which effectively act to specify the respective measurement illumination setting are changed in a manner going beyond a pure displacement of the stop edge when the respective measurement illumination setting is specified on the basis of the displacement position of the pupil stop. This results in an improvement of the simulation method.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 1/22 - Masques ou masques vierges d'imagerie par rayonnement d'une longueur d'onde de 100 nm ou moins, p. ex. masques pour rayons X, masques en extrême ultra violet [EUV]Leur préparation
97.
METHOD FOR HEAD IMAGE REGISTRATION AND HEAD MODEL GENERATION AND CORRESPONDING DEVICES
Methods and devices for head image registration are provided that use a plurality of combined 2D and depth images, for example RGBD images, of a head recorded from different positions. Landmark points are determined for each of the combined images. The registration is performed as a coarse registration based on the landmark points followed by a fine registration based on full point clouds. Based on the registration, a head model may be generated.
G06T 7/33 - Détermination des paramètres de transformation pour l'alignement des images, c.-à-d. recalage des images utilisant des procédés basés sur les caractéristiques
G06T 7/73 - Détermination de la position ou de l'orientation des objets ou des caméras utilisant des procédés basés sur les caractéristiques
A lightguide structure for illumination, detection and/or holographic representation includes at least one planar lightguide for guiding electromagnetic radiation of at least a first spectrum, at least one illumination arrangement located on the first side face of the lightguide, and at least one holographic outcoupling structure for coupling out electromagnetic radiation guided in the lightguide structure. The light radiated in by the illumination arrangement can have a large angular range, the holographic outcoupling structure having a small angular range. Also provided is a production method for such a lightguide structure and to an operating element comprising a lightguide structure.
A method includes preparing an initial layer of a semiconductor sample., and aligning a surface area of a region of interest volume of the prepared layer with an object field of an SEM. An electron energy of an electron beam of the SEM is adjusted. The region of interest volume is probed with the SEM within the object field. X-rays emanating from the aligned region of interest volume are detected. A detection signal is post-processed to deconvolute the detection signal into structured data attributed to the sample structure within the region of interest volume. A next layer to be investigated is prepared by FIB etching and the steps “preparing” to “post-processing” are repeated until the layer by layer investigation of a superimposed volume of interest of the sample is completed.
G01N 23/2252 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en mesurant l'émission secondaire de matériaux en utilisant des microsondes électroniques ou ioniques en utilisant des faisceaux d’électrons incidents, p. ex. la microscopie électronique à balayage [SEM] en mesurant les rayons X émis, p. ex. microanalyse à sonde électronique [EPMA]
H01J 37/28 - Microscopes électroniques ou ioniquesTubes à diffraction d'électrons ou d'ions avec faisceaux de balayage
100.
APPARATUSES, TEST CARDS AND METHODS FOR TESTING PHOTONIC INTEGRATED CIRCUITS, AND PHOTONIC INTEGRATED CIRCUITS
Apparatuses and test cards for testing photonic integrated circuits, corresponding systems and methods, and photonic integrated circuits are provided. A test card can be imaged via an optical unit onto a photonic integrated circuit to be tested. Parallel illumination of the photonic integrated circuit at different locations is possible in this way.
