There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.
A passage system that can prevent leakage of exhaust gas delivered to an abatement reactor and can ensure safety is disclosed. The passage system includes: an exhaust-gas transfer pipe configured to deliver exhaust gas to an abatement reactor; a first two-way valve attached to the exhaust-gas transfer pipe; a bypass pipe that branches off from the exhaust-gas transfer pipe at a position upstream of the first two-way valve and bypasses the abatement reactor, and a second two-way valve attached to the bypass pipe. The first two-way valve and the second two-way valve are vertically positioned and have flow passages for the exhaust gas extending in a vertical direction.
F16K 1/14 - Soupapes ou clapets, c.-à-d. dispositifs obturateurs dont l'élément de fermeture possède au moins une composante du mouvement d'ouverture ou de fermeture perpendiculaire à la surface d'obturation à corps de soupape en forme de sphère
F16K 27/02 - Structures des logementsMatériaux utilisés à cet effet des soupapes de levage
A substrate is efficiently cleaned.
A substrate is efficiently cleaned.
A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.
C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir
B05B 13/02 - Moyens pour supporter l'ouvrageDisposition ou assemblage des têtes de pulvérisationAdaptation ou disposition des moyens pour entraîner des pièces
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
One object of the present disclosure is to provide a technique of suppressing deterioration of a seed layer of a substrate. There is provided a method of plating, comprising: a process of holding a substrate by a substrate holder, such that a sealed space is formed to protect a contact provided to supply electricity to the substrate, from a plating solution while the substrate holder holds the substrate, and that a contact location between the substrate and the contact is locally covered with a liquid in the sealed space; a process of soaking the substrate held by the substrate holder in the plating solution and placing the substrate to be opposed to an anode; and a process of performing a plating process of the substrate with supplying electric current between the substrate and the anode, in a state that the contact location between the substrate and the contact is covered with a liquid.
A cleaning apparatus for performs a cleaning process on a washing tool for substrate washing by supplying a washing liquid to the washing tool and bringing the washing tool into contact with a cleaning member. The cleaning apparatus includes: a liquid extraction part that extracts a washing liquid remaining inside the washing tool or a washing liquid flowing out from the washing tool during the cleaning process; a fluorescence analysis part that performs fluorescence analysis on the washing liquid extracted by the liquid extraction part and measures a fluorescence intensity of the washing liquid for an excitation light of a predetermined wavelength; and a judgement part that judges, based on the measured fluorescence intensity, whether or not the cleaning of the washing tool has been completed.
B08B 1/14 - LingettesÉléments absorbants, p. ex. écouvillons ou éponges
B08B 1/52 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage utilisant des fluides
B08B 1/54 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage utilisant des outils mécaniques
B08B 3/10 - Nettoyage impliquant le contact avec un liquide avec traitement supplémentaire du liquide ou de l'objet en cours de nettoyage, p. ex. par la chaleur, par l'électricité ou par des vibrations
6.
FILM THICKNESS SIGNAL PROCESSING APPARATUS, POLISHING APPARATUS, AND FILM THICKNESS SIGNAL PROCESSING METHOD
Provided is a film thickness signal processing apparatus that improves in accuracy of a film-thickness distribution within a measurement range. The film thickness signal processing apparatus includes a receiver and a corrector. The receiver receives sensor data output from an eddy current sensor and generates first film thickness data 168 and second film thickness data 172. The corrector corrects the first film thickness data 168 and the second film thickness data 172 generated by the receiver. The corrector obtains corrected film thickness data 166 based on a size of the measurement range 174, 176 on the polishing object as a measurement target in a single measurement by the eddy current sensor, the first film thickness data 168 measured at a first measurement point 146 on the polishing object, and the second film thickness data 172 measured at a second measurement point 148 on the polishing object. A distance between the first measurement point 146 and the second measurement point 148 is equal to or less than the size of the measurement range 174, 176.
B24B 49/02 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
G01B 7/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques électriques ou magnétiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
7.
FREE JOINT STRUCTURE, PUSH-PULL DEVICE, AND SUBSTRATE PROCESSING MODULE
A free joint structure capable of absorbing a misalignment between a piston rod and a shaft is disclosed. The free joint structure includes a push-pull force generating portion and a target load portion.
A state of an elastic film in a substrate holding device for a substrate polishing process is properly or easily determined. An information processing apparatus includes an information acquirer that acquires apparatus operation information including polishing process information showing a state of a polishing process of a substrate, and transfer process information showing a state of a transfer process of the substrate, as an operation state at a time of a substrate processing apparatus being operated, and a state determiner that determines elastic film state information with respect to the apparatus operation information by inputting the apparatus operation information acquired by the information acquirer to a learning model that is caused to learn, by machine learning, a correlation between the apparatus operation information, and the elastic film state information showing a state of the elastic film in a top ring at a time of the polishing process and/or the transfer process shown by the apparatus operation information being performed.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
9.
SUBSTRATE PROCESSING APPARATUS, AND ABNORMALITY DETERMINATION METHOD
Abnormality is determined with respect to delivery of a substrate to a transfer stage from a substrate holding device for a substrate polishing process. A substrate processing apparatus includes an abnormality determiner that determines abnormal delivery of the substrate to the transfer stage from the substrate holding device, based on a time difference between a first timing at which a first sensor detects that the substrate is placed on a placement surface of the transfer stage, and a second timing at which a second sensor detects that the substrate is placed on the placement surface.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
In the present invention, a plating apparatus includes: a substrate transfer chamber 701; a fan filter unit 408 disposed above the substrate transfer chamber 701; a plating chamber 401 disposed lateral to the substrate transfer chamber 701; an exhaust chamber 702 disposed below the substrate transfer chamber 701; a partition member 720 for partitioning between the substrate transfer chamber 701 and the exhaust chamber 702; and a bypass flow path 730 for connecting the substrate transfer chamber 701 and the exhaust chamber 702 by bypassing the partition member 720. The plating chamber 401 has: a supply port 404 for supplying, to the plating chamber 401, gas having been supplied to the substrate transfer chamber 701 by means of the fan filter unit 408; and a discharge port 405 for discharging, to the outside, the gas having been supplied to the plating chamber 401. The exhaust chamber 702 has an exhaust port 703 for discharging, to the outside, the gas having been supplied to the exhaust chamber 702 via the bypass flow path 730.
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japon)
Inventeur(s)
Fujikata, Jumpei
Togawa, Tetsuji
Hori, Masaru
Miyashita, Naoto
Sekine, Makoto
Abrégé
The present invention is provided to maintain the state of an outer peripheral part of a substrate so as not to cause inconvenience in manufacturing through a manufacturing process in a semiconductor manufacturing process. This method for forming a protective film on an outer peripheral part including a bevel part of a substrate includes: a step for performing trim processing over the entire periphery of the outer peripheral part on at least one surface of a front surface and a rear surface of the substrate; and a step for forming a protective film on the outer peripheral part, the protective film being formed on the surface subjected to the trim processing such that the surface of the protective film becomes a surface flush with or recessed, with respect to the surface of the substrate.
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches
A hollow container is provided above a hollow column around a liquefied gas pump. The container includes: an openable and closable lower plate members at a lower part of the container; manual opening/closing devices to be operated to open and close the lower plate members inside the container; glove boxes configured to allow a user to insert his or her hands from outside the container in order to operate the manual opening/closing devices inside the container; and work windows arranged near the glove boxes and the manual opening/closing devices so that the glove boxes and manual opening/closing devices are visible from outside the container.
There is provided an apparatus for polishing, comprising a table configured to support a polishing pad; a polishing head configured to hold a substrate; and a polishing solution supply device configured to supply a polishing solution between the polishing pad and the substrate. The polishing solution supply device comprises a plurality of polishing solution supply ports arrayed in a direction intersecting with a rotating direction of the polishing pad in a state that the polishing solution supply device is placed on an upstream side in rotation of the polishing pad relative to the substrate. The polishing solution supply device supplies the polishing solution, such that the polishing solution supplied from the plurality of polishing solution supply ports has a predetermined flow rate distribution.
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.
C25D 21/10 - Agitation des électrolytesDéplacement des claies
15.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus (5) includes: an information acquisition section (500) configured to acquire polishing conditions including top-ring state information, polishing-table state information, and polishing-fluid-supply-nozzle state information in the chemical mechanical polishing in chemical mechanical polishing of a substrate performed by a substrate processing apparatus including a polishing table configured to rotatably support a polishing pad, a top ring configured to press the substrate against the polishing pad, and a polishing-fluid supply nozzle configured to supply a polishing fluid onto the polishing pad; and a state prediction section (501) configured to predict substrate state information for the substrate on which the chemical mechanical polishing is performed under the polishing conditions by inputting the polishing conditions acquired by the information acquisition section (500) to a learning model (10A) having been generated by machine learning that causes the learning model (10A) to learn a correlation between the polishing conditions and the substrate state information indicating a state of the substrate on which the chemical mechanical polishing is performed under the polishing conditions.
The present invention relates to a substrate processing method and a substrate processing apparatus for processing a substrate, such as a wafer. In the substrate processing method, rollers (11a, 11b) secured to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b) are brought into contact with the periphery of a substrate (W) having a notch (Nw), and further the rollers (11a, 11b) are moved in a circular motion, thereby rotating and circularly moving the substrate (W), and further, processing the substrate (W) by bringing a processing tool (201) into contact with the substrate (W). During processing of the substrate (W), a rotational speed of the substrate (W) is calculated based on measured values of a notch detection sensor (77) which is capable of detecting that the notch (Nw) has passed the movable shaft (13b), and an alarm is issued when the rotational speed of the substrate (W) is out of an allowable range which is set with respect to a theoretical rotational speed of the substrate (W).
B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage
B24B 7/04 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet comportant une table porte-pièce rotative
B24B 27/033 - Autres machines ou dispositifs à meuler pour le meulage d'une surface à des fins de nettoyage, p. ex. pour décalaminer ou corriger par meulage des défauts de la surface
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
The present invention pertains to a polishing device for polishing the surface of a substrate such as a wafer. The polishing device is provided with: an acoustic sensor (30) that is inserted into a first through-hole (15) formed in a polishing table (3), detects a polishing sound during polishing of the substrate, and outputs a signal representing the polishing sound; a support jig (43) that at least includes an elastic member (45) for supporting the acoustic sensor (30) on the polishing table (3), while inhibiting the transmission of the polishing sound from the polishing table (3); and a controller (9) that monitors the polishing state of the substrate, on the basis of the signal outputted from the acoustic sensor (30). A polishing pad (2) has formed therein at least one second through-hole (17) that is in communication with the first through-hole (15), and is filled with liquid, and the acoustic sensor (30) faces the second through-hole (17).
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/12 - Plateaux de rodage pour travailler les surfaces planes
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
A polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; an optical film-thickness measuring system having an optical sensor head mounted to the polishing table; a transparent-liquid inlet passage configured to supply a transparent liquid to the through-hole; and a light-emitting-side transparent-liquid outlet passage and a light-receiving-side transparent-liquid outlet passage communicating with the through-hole. The optical sensor head has a light-emitting surface configured to emit light obliquely upward and a light-receiving surface configured to receive reflected light from the workpiece, and the light-emitting surface faces the light-emitting-side transparent-liquid outlet passage, and the light-receiving surface faces the light-receiving-side transparent-liquid outlet passage.
A polishing apparatus capable of preventing abrasive grains in a polishing liquid and polishing debris of a workpiece from adhering to an optical sensor head and capable of improving a measuring accuracy of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing table configured to support a polishing pad having a through-hole; a polishing head configured to press a workpiece against the polishing pad; an optical film-thickness measuring system having an optical sensor head disposed below the polishing pad; and a sensor-head cleaning nozzle configured to emit a cleaning liquid to the optical sensor head. The sensor-head cleaning nozzle is disposed in the polishing table and points at the optical sensor head.
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
20.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method capable of suppressing corrosion of a conductive material on a surface of a substrate by supplying a liquid having a reduced concentration of dissolved oxygen onto the substrate. The substrate processing method includes: dissolving an inert gas in a liquid at not less than a saturation solubility to replace oxygen dissolved in the liquid with the inert gas; generating bubbles of the inert gas in the liquid by depressurizing the liquid in which the inert gas is dissolved; and processing the substrate while supplying the liquid containing the bubbles to the surface of the substrate.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
A resistor and the like capable of enhancing uniformity of a plating film formed on a substrate are provided. A resistor for a plating apparatus, for adjusting an electric field, the resistor being disposed between an anode and a holder holding a target object to be plated in the plating apparatus, is provided. The resistor for the plating apparatus includes a first resistance member having a first surface and including a plurality of first through holes formed open on the first surface, and a second resistance member having a second surface and including a plurality of second through holes formed open on the second surface, the first resistance member and the second resistance member are arranged with the first surface and the second surface facing each other, and a size of overlap between the plurality of first through holes and the plurality of second through holes is variable.
A plating apparatus includes a plating tank configured to store a plating solution, a substrate holder configured to hold a substrate as a target on which a plating process is performed, a rotation mechanism that rotates the substrate holder, an elevating/lowering mechanism that elevates and lowers the substrate holder, and a control device, and the substrate holder includes a contact member configured to contact the substrate to be able to supply power to the substrate, a sealing member configured to seal a gap between the substrate holder and the substrate, a liquid holding portion including the contact member inside, and being configured to be able to hold liquid when the gap between the substrate holder and the substrate is sealed with the sealing member, and a spout port that is configured to open into the liquid holding portion or a space communicating with the liquid holding portion inside the substrate holder, or that can be disposed on a side of the substrate holder, to spout the liquid.
A substrate processing apparatus includes: a substrate holder (5) having a suction holding surface (5a) configured to hold a first surface (2a) of a substrate (W); a processing head (7) arranged to process an outer circumferential portion of the substrate (W); a hydrostatic plate (9) having a fluid support surface (9a) facing the suction holding surface (5a); and a fluid supply line (10) coupled to the hydrostatic plate (9) and configured to supply fluid to a space between the fluid support surface (9a) and a second surface (2b) of the substrate (W). The second surface (2b) is an opposite side of the substrate (W) from the first surface (2a). The fluid support surface (9a) is larger than the suction holding surface (5a).
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet
B24B 21/04 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet pour meuler des surfaces planes
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
B24B 55/06 - Équipement d'enlèvement des poussières sur les machines à meuler ou à polir
25.
WATER-DISCHARGE PUMP APPARATUS, WATER-DISCHARGE PUMP MANAGEMENT SYSTEM, WATER-DISCHARGE PUMP SUPPORT PLAN CREATING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, WATER-DISCHARGE PUMP SUPPORT PLAN CREATING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
A water-discharge pump apparatus includes: a pump controller configured to control operation of a pump based on a water level detected by a water level detector. The pump controller includes: a weather information acquisition section configured to acquire weather information on the monitoring site; an abnormality determining section configured to determine whether an abnormality has occurred in the water level detector or the pump; a water-level-detector abnormality processing section configured to control operation of the pump based on the weather information when it is determined that an abnormality has occurred in the water level detector; and a pump abnormality processing section configured to output support request information requesting support for water-discharge operation by at least one of the pump vehicle and the worker based on at least one of the water level detected by the water level detector and the weather information when it is determined that an abnormality has occurred in the pump.
To achieve a small-sized pre-wet module that can perform different pre-processes.
To achieve a small-sized pre-wet module that can perform different pre-processes.
A pre-wet module 200 includes a stage 220, a rotation mechanism 224, a cleaning liquid supply member 260, and a deaerated liquid supply member 250. The stage 220 is configured to hold a back surface of a substrate WF with a surface to be processed WF-a facing upward. The rotation mechanism 224 is configured to rotate the stage 220. The cleaning liquid supply member 260 has a nozzle 262 arranged above the stage 220. The cleaning liquid supply member 260 is configured to supply a cleaning liquid in a direction to the stage 220 via the nozzle 262. The deaerated liquid supply member 250 is configured to supply a deaerated liquid to a surface to be processed WF-a of a substrate WF held onto the stage 220. The deaerated liquid supply member 250 is configured to be movable between a supply position and a retracted position. The supply position is located between the nozzle 262 and the surface to be processed WF-a of the substrate WF, and the retracted position is retracted from between the nozzle 262 and the surface to be processed WF-a of the substrate WF.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
27.
SUBSTRATE POLISHING METHOD, SUBSTRATE POLISHING APPARATUS, AND COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM
The present invention relates to a substrate polishing method of polishing a substrate, such as a wafer, by pressing a polishing tape against the substrate. The substrate polishing method includes: storing an actual polishing condition for a substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition in a database (21a), with the actual polishing condition and the actual amount of use associated with each other, searching the database (21a) for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate, determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition; comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use; and when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, polishing the polishing-target substrate by a polishing module (4A, 4B).
B24B 49/05 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage comportant la mesure d'une première pièce déjà travaillée et d'une autre pièce qui est en train d'être travaillée et la comparant avec la première
B24B 7/02 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet comportant une table porte-pièce se déplaçant suivant un mouvement de va-et-vient
The present invention pertains to a slide bearing used for a rotary machine such as a pump and a turbine, and particularly to a slide bearing used in an extremely low temperature environment. The slide bearing is provided with: a sliding contact pad (1) having a shaft support surface (1a) for supporting the outer peripheral surface of a rotating shaft (100); a shell (2) disposed on the radially outer side of the sliding contact pad (1); and a pad pressing mechanism (3) for pressing the sliding contact pad (1) against a pad support surface (2a) of the shell (2) when the sliding contact pad (1) contracts.
F16C 17/02 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement
F16B 5/02 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles par organes de fixation utilisant un filetage
29.
Tilt Pad Journal Bearing with Lubrication Arrangement
A tilt pad journal bearing for supporting a rotating shaft includes an annular support ring and a plurality of arcuate pads tiltably mounted in the annular support ring and circumferentially spaced apart from each other. The tilt pad journal bearing further has a lubrication arrangement disposed between each pair of the plurality of arcuate pads. The lubrication arrangement includes a lubrication manifold connected to the annular support ring and recessed relative to a shaft support surface of adjacent arcuate pads to define an oil mixing cavity, and a plurality of lubrication nozzles protruding from the lubrication manifold into the oil mixing cavity. A cross-sectional flow area of at least one of the plurality of lubrication nozzles positioned toward a center of the lubrication manifold is larger than a cross-sectional flow area of a remainder of the plurality of nozzles.
F16C 17/03 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement avec segments supportés obliquement, p. ex. paliers Michell
F16C 33/10 - Structures relatives à la lubrification
30.
METAL JOINED BODY AND METHOD FOR MANUFACTURING METAL JOINED BODY
This metal joined body comprises: a first plate member made of metal and having a first main surface and a second main surface facing the side opposite the first main surface; and a second plate member made of metal and having a third main surface and a fourth main surface facing the side opposite the third main surface. The first plate member has an embossed part in which the first main surface side forms a protruding section and the second main surface side forms a recessed section. The plate thickness from the third main surface to the fourth main surface of the second plate member is less than that of the embossed part in the plate thickness direction (X-axis direction) of the second plate member, and an end surface of the second plate member, which connects the peripheral edges of the third main surface and the fourth main surface, is joined to the protruding section of the embossed part.
A substrate holding device capable of eliminating a variation in a film thickness of a substrate is disclosed. The substrate holding device includes an offset mechanism configured to offset a carrier with respect to a retaining ring.
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
A load adjusting system includes: a bevel grinding device including a grinding head configured to grind a bevel part of a substrate; and a control device, the control device is configured to: acquire, from a load measuring device that performs measurement of a pressing load applied from the grinding head, measurement data acquired by performing the measurement; calculate, based on the measurement data and based on a set parameter set for the grinding head, an adjustment value used for adjusting the pressing load; and control a pressing operation of the grinding head based on the adjustment value.
The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, and more particularly to a substrate processing method and a substrate processing apparatus for polishing a bevel portion of the substrate and performing CMP processing of a flat portion of the substrate. The substrate processing method includes: polishing a bevel portion (B) of each of the plurality of substrates (W) by a polishing tool such that slope surfaces(S) of bevel portions (B) of the plurality of substrates (W) have the same slope angles (α); and performing CMP processing of a flat portion (P) of each of the plurality of substrates (W) whose bevel portions (B) have been polished.
B24B 9/02 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière propre aux objets à meuler
The disclosure provides a polishing apparatus capable of removing a polishing liquid or polishing debris from a light passing portion of a polishing pad. A polishing apparatus 1 includes a polishing table 3 supporting a polishing pad 2 that has a light passing portion 33; a polishing head 5 pressing a substrate W against a polishing surface 2a of the polishing pad 2; an optical sensor 21 disposed in the polishing table 3, irradiating light to the substrate W through the light passing portion 33, and receiving reflected light from the substrate W through the light passing portion 33; and a cleaning portion 12 forming a cleaning space CS that covers the light passing portion 33 above the light passing portion 33 and supplying a cleaning fluid to the light passing portion 33 through the cleaning space CS.
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 7/02 - Nettoyage par des procédés non prévus dans une seule autre sous-classe ou un seul groupe de la présente sous-classe par distorsion, battage ou vibration de la surface à nettoyer
B24D 7/12 - Meules agglomérées, ou meules comportant des segments abrasifs rapportés, conçues pour travailler autrement que par la périphérie, p. ex. par le côtéBagues ou accessoires pour le montage de ces meules comportant des ouvertures pour examiner la surface à meuler
35.
POLISHING APPARATUS AND TRANSPARENT-LIQUID FILLING METHOD
A polishing apparatus is disclosed. The polishing apparatus can stabilize an optical path in a space between a transparent window of a polishing pad and an optical sensor head, thereby achieving accurate measuring of a film thickness of a workpiece. polishing apparatus includes: a polishing pad having a transparent window configured to allow light to pass therethrough; a polishing table supporting the polishing pad; a polishing head configured to press a workpiece against the polishing pad; and an optical film-thickness measuring system having an optical sensor head disposed below the transparent window, a space formed between the transparent window and the optical sensor head being filled with a transparent liquid.
A substrate processing system capable of supplying a gas-dissolved liquid having a supersaturated amount of dissolved gas without generating large bubbles in a middle of a supply line is disclosed. The substrate processing system includes a control device configured to control an operation of a bubble generation device. The control device is configured to control at least one of a pressure regulator and a boost pump so that a pressure of a gas supplied to a gas-dissolved liquid generation device is smaller than a pressure of a liquid supplied to the gas-dissolved liquid generation device.
B05B 12/14 - Aménagements de commande de la distributionAménagements de réglage de l’aire de pulvérisation pour fournir à un orifice de pulvérisation unique, un liquide ou un autre matériau fluide choisi parmi plusieurs
B05B 1/06 - Buses, têtes de pulvérisation ou autres dispositifs de sortie, avec ou sans dispositifs auxiliaires tels que valves, moyens de chauffage agencés pour produire un jet, un pulvérisat ou tout autre écoulement de forme ou de nature particulière, p. ex. sous forme de gouttes individuelles de forme annulaire, tubulaire ou conique creuse
B05B 7/26 - Appareillages dans lesquels des liquides ou d'autres matériaux fluides en provenance de différentes sources sont mélangés avant de pénétrer dans le dispositif d'évacuation
A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member, a step of stopping the discharging of the liquid, a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid, a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position, and a step of performing the plating process on the substrate after the substrate is attached to the substrate holder.
Hollow containers (3, 4) are provided above a hollow column (2) provided around a liquefied gas pump (P), and a cable (8) for installing and removing the liquefied gas pump (P) is passed through the center of the containers (3, 4) from the bottom towards the top. The containers (3, 4) include: lower plate members (5, 6) having, at the center, cable through-holes (9, 10) allowing the cable (8) to pass; and stuffing box members (12) provided around the cable through-holes (9, 10) at the center of the lower plate members (5, 6), and having, at the center, cable insertion holes (13) through which the cable (8) is inserted. The stuffing box members (12) include opening diameter adjustment mechanisms (14, 20) that adjust the sizes of the opening diameters of the cable insertion holes (13).
Provided is a technique capable of easily controlling the shape of a three-dimensional object. A shaping nozzle 20 is configured to supply powder to be a material of a three-dimensional object to a shaping area 2 in which a three-dimensional object is shaped, and to melt the powder by irradiating the supplied powder with a beam. The shaping nozzle includes an inner cylinder 23 having a beam passage 25 through which a beam Bm passes, an outer cylinder 24 disposed outside the inner cylinder and having a powder passage 26 through which a powder Pd passes between the outer surface of the inner cylinder and the inner surface of the outer cylinder, and a plate member 40 disposed between a tip 29 of the inner cylinder and a tip 30 of the outer cylinder and the shaping area, and having hole 41 configured so that the beam that has passed through the beam passage and the powder that has passed through the powder passage pass therethrough.
B22F 10/25 - Dépôt direct de particules métalliques, p. ex. dépôt direct de métal [DMD] ou mise en forme par laser [LENS]
B29C 64/153 - Procédés de fabrication additive n’utilisant que des matériaux solides utilisant des couches de poudre avec jonction sélective, p. ex. par frittage ou fusion laser sélectif
A polishing method includes: detecting, by an acoustic sensor, an environmental sound including a sound arising from a polishing environment of a substrate to output an environmental sound signal representing the environmental sound from the acoustic sensor; generating an environmental sound spectrum indicating a relationship between a frequency and a sound pressure level from the environmental sound signal; detecting, by the acoustic sensor, a polishing sound of the substrate while pressing the substrate against a polishing pad to polish the substrate, to output a polishing sound signal representing the polishing sound from the acoustic sensor; generating a polishing sound spectrum indicating a relationship between a frequency and a sound pressure level from the polishing sound signal; calculating a difference between the polishing sound spectrum and the environmental sound spectrum to generate a differential spectrum; and monitoring a polishing progress of the substrate based on the differential spectrum.
A substrate is reliably suctioned regardless of a flatness of a surface to be suctioned of the substrate. A substrate suction member 330 includes a porous member 334 including a substrate suction surface 334a for suctioning a substrate WF and a pressure reducer 334b communicating with pressure reducing means, a shielding member 332 including a first shielding member 332-1 configured to shield a surface 334c in an opposite side of the substrate suction surface 334a of the porous member 334 and a frame-shaped second shielding member 332-2 configured to shield at least a part of a side surface 334d of the porous member 334, and a frame-shaped elastic seal member 336 attached to the second shielding member 332-2 so as to surround the porous member 334 and provided with a contact surface 336a in contact with the substrate WF.
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
The present disclosure provides a substrate processing apparatus capable of adjusting a flow rate of a liquid to be ejected from a nozzle. The substrate processing apparatus according to the present disclosure is a substrate processing apparatus including a nozzle configured to supply a liquid to a substrate, and a liquid supplier configured to supply the liquid to the nozzle, in which the liquid supplier includes a supply pipe which is configured to cause a liquid supply source and the nozzle to be in fluid communication and which has a first pipe constituting a first flow channel from a splitting point to a joining point located downstream of the splitting point and a second pipe constituting a second flow channel from the splitting point to the joining point, a first valve attached to the first pipe, a second valve attached to the second pipe, and a fluid resistance element attached to the second pipe and configured to set a pressure loss of the liquid flowing through the second pipe to be larger than a pressure loss of the liquid flowing through the first pipe.
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 5/00 - Nettoyage par des procédés impliquant l'utilisation d'un courant d'air ou de gaz
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The present invention relates to a polishing apparatus and a polishing method. The polishing apparatus includes a holding stage (4), a polishing head (14), and a control device (1). The control device (1) includes a determination section (1d) that determines a removal of the film (F). The determination unit (1d) determines the removal of the film (F) when a rotational torque value is stabilized at a set torque value.
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 9/06 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière propre aux objets à meuler de matière inorganique non métallique, p. ex. de la pierre, des céramiques, de la porcelaine
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
The present invention pertains to a liquid-transporting apparatus. A liquid-transporting apparatus (1) for transporting liquefied gas is provided with a gas-mixing prevention device (20) that recovers bubbles generated from the liquefied gas before the bubbles are sucked into a pump (11).
F04D 29/70 - Grilles d'aspirationFiltresSéparateurs de poussièreNettoyage
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
F04D 13/16 - Installations ou systèmes de pompage avec des réservoirs de stockage
47.
SUBSTRATE CLEANING DEVICE AND SUBSTRATE POLISHING DEVICE
A substrate cleaning device for cleaning a surface of a substrate having been polished is provided in correspondence with a cleaning position of the top ring. The substrate cleaning device includes: a first spray unit that sprays cleaning liquid toward the substrate present in the cleaning position; and a second spray unit that sprays cleaning liquid toward the substrate present in the cleaning position. The second spray unit is provided on either a downstream side or an upstream side of the first spray unit, with respect to a rotation direction of the top ring present in the cleaning position. A spray nozzle structuring the second spray unit is tilted toward the first spray unit. The second spray unit urges the cleaning liquid sprayed from the first spray unit toward the outer circumferential part of the substrate.
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 15/00 - Précautions prises pour empêcher les crasses ou les fumées de s'échapper de la zone où elles sont produitesRamassage ou enlèvement des crasses ou des fumées de cette zone
48.
SUBSTRATE SUPPORTING APPARATUS AND METHOD OF CONTROLLING SUBSTRATE SUPPORTING APPARATUS
Exemplary substrate supporting apparatus and method for attaching and/or detaching substrate are provided. In one aspect, substrate supporting apparatus has a plurality of supporting members 10 that contacts a circumferential part of a substrate W and rotate the substrate W; a pair of driven members 30 on which the plurality of supporting members 10 are provided; a connecting member 20 connecting one driven member 31 and another driven member 32; and a driving device 40 that brings the pair of driven members 30 close to each other or separates the pair of driven members 30 from each other, linearly along a first direction, by moving at least a part of the connecting member 20. Numerous other aspects are provided.
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
H02K 11/24 - Dispositifs pour détecter le couple ou actionnés par des valeurs de cette variable
49.
SUBSTRATE HOLDING DEVICE AND METHOD FOR DETECTING WEAR IN SUBSTRATE HOLDING DEVICE
A substrate holding device includes at least three rotation parts each including a contact gripping part that contacts a periphery portion of a substrate and rotates the substrate, a moving mechanism moving at least one of the at least three rotation parts toward the substrate to cause a plurality of contact gripping parts to grip the substrate, a first sensor detecting a position of a moving rotation part, which is a rotation part moved by a moving mechanism, and a detection unit storing a first initial position, which is a position of the moving rotation part when the plurality of contact gripping parts grip the substrate in a state where the plurality of contact gripping parts are not worn, and detecting occurrence of wear of the contact gripping parts on the basis of a difference between a current position of the moving rotation part and the first initial position.
G01M 99/00 - Matière non prévue dans les autres groupes de la présente sous-classe
B08B 1/14 - LingettesÉléments absorbants, p. ex. écouvillons ou éponges
B08B 1/20 - Nettoyage d'articles en mouvement, p. ex. de bandes en mouvement ou d’objets sur un transporteur
B08B 1/34 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs en rotation autour d'un axe parallèle à la surface
B08B 3/04 - Nettoyage impliquant le contact avec un liquide
50.
FLUID MACHINE SYSTEM, INFORMATION PROCESSING DEVICE, AND INFORMATION PROCESSING METHOD
There are provided an acquirer that acquires a discharge flow rate of a target pump in addition to model identification information of the target pump, or acquires a set of discharge pressure, suction pressure, and a cage height in addition to the model identification information of the target pump, and a determiner that, in a case where the discharge flow rate of the target pump is acquired, specifies a total lift corresponding to the discharge flow rate with reference to characteristic data corresponding to the model identification information of the target pump, and determines an operation frequency of an inverter by performing collation with characteristic data of the total lift and the discharge flow rate for each operation frequency in a case where a synchronous motor operates the pump, such that the discharge flow rate and the lift are obtained.
G05B 19/416 - Commande numérique [CN], c.-à-d. machines fonctionnant automatiquement, en particulier machines-outils, p. ex. dans un milieu de fabrication industriel, afin d'effectuer un positionnement, un mouvement ou des actions coordonnées au moyen de données d'un programme sous forme numérique caractérisée par la commande de vitesse, d'accélération ou de décélération
51.
METHOD FOR FORMING PROTECTIVE FILM ON OUTER PERIPHERAL PART INCLUDING BEVEL PART OF SUBSTRATE
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japon)
Inventeur(s)
Fujikata, Jumpei
Togawa, Tetsuji
Hatakeyama, Masahiro
Tsuji, Kazuhito
Hori, Masaru
Miyashita, Naoto
Sekine, Makoto
Abrégé
The present invention aims to improve the quality of a protective film for protecting an outer peripheral part of a substrate. The present invention provides a method for forming, with use of a plasma, a protective film on an outer peripheral part, including a bevel part, of a substrate, the method comprising: a step in which a second surface of the substrate, which has a first surface and the second surface opposite to each other, is placed on a stage that is smaller than the size of the substrate, in such a manner that the outer peripheral part of the substrate protrudes from the outer edge of the stage; a step in which at least a part of the outer peripheral part of the substrate in the circumferential direction is caused to face an electrode; a step in which a first shielding structure is brought into contact with the first surface of the substrate, the first shielding structure separating the outer peripheral part and the region inside the outer peripheral part from each other, and/or a second shielding structure is brought into contact with the second surface of the substrate, the second shielding structure separating the outer peripheral part and the region inside the outer peripheral part from each other; and a step in which a protective film is formed on the outer peripheral part of the substrate by supplying a film forming gas between the outer peripheral part of the substrate and the electrode.
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches
C23C 16/50 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement au moyen de décharges électriques
A polishing head capable of accurately controlling a thickness profile of a wafer is disclosed. The polishing head includes a plurality of pressure actuators, an actuator operation controller, an actuator support portion, and an clastic holder. The actuator operation controller is mounted on a head main body.
Provided is an eddy current sensor having an improved sensitivity in a detection coil of the eddy current sensor compared with a conventional one. An eddy current sensor (210) includes a magnetic material, a detection coil (34), a correction coil (166), and an excitation coil. The excitation coil is wound to surround the first pillar and/or the external wall of the magnetic material and generates an eddy current in a conductive film. The detection coil (34) and the correction coil (166) are wound to surround the first pillar and/or the external wall and detects a change in the eddy current generated in the conductive film. An amount of change in an output signal of the correction coil (166) when the eddy current generated in the conductive film changes is less than an amount of change in an output signal of the detection coil (34). One end of the correction coil (166) is directly connected to one end of the detection coil (34), and another end of the correction coil and another end of the detection coil are directly connected to an impedance converter (124) or an amplifier.
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
G01N 27/90 - Recherche ou analyse des matériaux par l'emploi de moyens électriques, électrochimiques ou magnétiques en recherchant des variables magnétiques pour rechercher la présence des criques en utilisant les courants de Foucault
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
54.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
The present invention relates to an information processing apparatus, an inference apparatus, a machine-learning apparatus, an information processing method, an inference method, and a machine-learning method. The information processing apparatus (5) includes an information acquisition section (500) configured to acquire alarm generation information including at least alarm-type information and substrate-location information, the alarm-type information indicating a type of alarm that is generated in a substrate processing device (2) including modules and is configured to perform polishing process on substrates, the substrate-location information indicating a location state of the substrates in the modules when the alarm is generated; and a support processing section (501) configured to generate support information corresponding to the alarm by inputting the alarm generation information acquired by the information acquisition section (500) in response to the generation of the alarm to a learning model that has learned by machine learning a correlation between the alarm generation information and the support information for dealing with generation of the alarm.
The present application relates an impeller and a pump. The impeller includes a shaft insertion hole, a fastening hole having a diameter smaller than a diameter of the shaft insertion hole, and a sleeve insertion hole having a diameter larger than a diameter of the shaft insertion hole.
F04D 1/00 - Pompes à flux radial, p. ex. pompes centrifugesPompes hélicocentrifuges
56.
WORK MANAGEMENT DEVICE, WORK MANAGEMENT SYSTEM, INFERENCE DEVICE, MACHINE LEARNING DEVICE, WORK MANAGEMENT METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
[Problem] To provide a work management device capable of automatically storing the work status of a worker with high accuracy and properly checking the work status. [Solution] A work management device 5, which manages a plurality of pieces of work performed by a worker U on a predetermined object, is provided with: an image data acquisition unit 501 that acquires image data 111 captured by an image capture unit 63 that is positioned facing forward from a worker U when the worker U wears a worker device 6 provided with the image capture unit 63; a work information generation unit 502 that generates work information 112 for each piece of work performed by the worker U on a predetermined work object 2, on the basis of the image data 111 acquired by the image data acquisition unit 501; and a storage unit 52 that stores, in time series, the work information 112 generated for each piece of work by the work information generation unit 502.
The present invention provides a technology that makes it possible to illuminate a portion (prescribed portion) which is irradiated with a beam in a state where a cover having a gas passage is provided to a nozzle. An observation device 5 of a beam processing device 1 has: a nozzle 20 configured to emit a beam Bm toward a prescribed portion P1; and a cover 30 provided around the nozzle and having a gas passage 32 configured to supply a purge gas Gs toward the prescribed portion. The observation device 5 comprises at least one light source 40 which is configured to generate light Lt. The at least one light source is configured such that the light generated by the light source passes through the gas passage to reach the prescribed portion.
A polishing apparatus capable of accurately controlling a film thickness profile of a substrate by controlling each of a plurality of pressing actuators without having a complicated mechanism is disclosed. The polishing apparatus includes a polishing structure, a polishing head, and a head rotation mechanism configured to rotate the polishing head within a predetermined rotation angle range. The polishing head includes a plurality of pressing actuators. The polishing structure includes a polishing table or a polishing belt.
B24B 47/16 - Entraînement ou transmission des machines ou dispositifs à meulerÉquipement à cet effet pour entraîner dans leur mouvement de rotation ou de va-et-vient les arbres porte-meules ou les arbres porte-pièces animés d'un mouvement de va-et-vient, p. ex. pendant lequel le sens de rotation de l'arbre de travail est inversé
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
60.
INFORMATION PROCESSING APPARATUS, INFERENCE APPARATUS, MACHINE-LEARNING APPARATUS, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE-LEARNING METHOD
An information processing apparatus (5) includes an information acquisition section (500) configured to acquire crack occurrence state information including crack state information indicating crack state of a substrate that has been cracked and device state information indicating a state of a polishing unit when the substrate processing process is performed on the cracked substrate; and a crack occurrence process identifying section (501) configured to identify a process that causes the crack in the substrate by inputting the crack occurrence state information acquired by the information acquisition section (500) to a learning model (11) in response to the occurrence of the crack in the substrate. The learning model (11) has been generated by machine learning that causes the learning model (11) to learn a correlation between the crack occurrence state information and crack occurrence process information indicating the process that causes the crack in the substrate.
One object is to suppress the surface of a substrate from being scratched in the course of a polishing process. There is provided a method of processing a substrate, comprising: a process of forming a protective film on an outer peripheral part of the substrate including a bevel portion, prior to a process of polishing the substrate, wherein the process of forming the protective film includes applying a protective film material in a liquid form onto the outer peripheral part of the substrate and curing the applied protective film material; and the process of polishing the substrate with the protective film formed on the outer peripheral part thereof.
B05D 1/02 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces réalisés par pulvérisation
B05B 12/12 - Aménagements de commande de la distributionAménagements de réglage de l’aire de pulvérisation sensibles à l'état du liquide ou d'un autre matériau fluide expulsé, du milieu ambiant ou de la cible sensibles à l'état du milieu ambiant ou de la cible, p. ex. à l'humidité, à la température
B05B 12/18 - Aménagements de commande de la distributionAménagements de réglage de l’aire de pulvérisation pour régler l’aire de pulvérisation en utilisant des fluides, p. ex. des courants de gaz
B05C 1/00 - Appareillages dans lesquels un liquide ou autre matériau fluide est appliqué à la surface de l'ouvrage par contact avec un élément portant le liquide ou autre matériau fluide, p. ex. un élément poreux imprégné du liquide à appliquer sous forme de revêtement
B05D 1/28 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par transfert de liquides ou d'autres matériaux fluides, à partir de la surface d'éléments porteurs, p. ex. de pinceaux, tampons, rouleaux
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
62.
SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING DEVICE, AND MAINTENANCE METHOD FOR SUBSTRATE CLEANING DEVICE
A substrate cleaning device (31) includes a roll cleaning member (61) and a rotation holding portion (100). The rotation holding portion (100) includes a non-contact sealing portion (140) that is disposed between a bearing portion (130) and the roll cleaning member (61) to seal a gap between a shaft portion (110) and a housing portion (120). The non-contact sealing portion (140) includes a rotating portion (150) that is attached to the shaft portion (110) and has a plurality of protrusion portions (151) formed on a peripheral surface (150a) of the rotating portion (150) at intervals in an axial direction, and a fixed portion (160) that is attached to the housing portion (120), surrounds the plurality of protrusion portions (151), and has a gas supply hole (161) formed in an inner peripheral surface (160a) of the fixed portion (160) surrounding the plurality of protrusion portions (151), the gas supply hole (161) supplying a compressed gas (200) from a position inward of the protrusion portions (151) in the axial direction, which are disposed at both end portions in the axial direction, among the plurality of protrusion portions (151).
B08B 1/34 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs en rotation autour d'un axe parallèle à la surface
B08B 1/20 - Nettoyage d'articles en mouvement, p. ex. de bandes en mouvement ou d’objets sur un transporteur
B08B 1/40 - Outils de nettoyage avec moyens intégrés de distribution de fluides, p. ex. d'eau, de vapeur ou de détergents
B08B 5/02 - Nettoyage par la force de jets, p. ex. le soufflage de cavités
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
63.
CLEANING AND TRANSFER EQUIPMENT, WAFER TREATMENT EQUIPMENT, TRANSFER EQUIPMENT, AND CLEANING AND TRANSFER METHODS
A cleaning and transfer equipment includes cleaning modules disposed in series, a wafer transport mechanism transporting a wafer between the cleaning modules, and a control device controlling an operation of the wafer transport mechanism. The wafer transport mechanism includes a wafer gripping mechanism gripping the wafer, a vertical moving mechanism vertically moving the wafer gripping mechanism, and an arrangement direction moving mechanism moving the wafer gripping mechanism in an arrangement direction of the cleaning modules. The wafer gripping mechanism includes a pair of hands openable and closeable, a rotation mechanism rotating the hands about a rotation shaft parallel to an opening/closing direction, and a sensor measuring a value corresponding to a weight applied to the hands when the hands are in a closed state. The control device compares measurement data of the sensor with a predetermined threshold value to determine whether the wafer is held on the hands.
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
B65G 47/90 - Dispositifs pour saisir et déposer les articles ou les matériaux
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/677 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le transport, p. ex. entre différents postes de travail
Provided is a technology which enables reduction in influence of electric field shielding caused by a beam member of a paddle, or a technology which enables removal of air bubbles adhering to a hole of an ion resistor. A plating device 1000 comprises a paddle 70 disposed between an anode 11 and a substrate Wf and configured to stir a plating solution Ps by reciprocating in a direction parallel to the substrate, in a first direction and a second direction. The paddle includes a plurality of beam members 71 extending in a direction perpendicular to the reciprocating movement direction of the paddle. The reciprocation movement of the paddle in the first direction and the second direction involves the reciprocation movement of the paddle in a first reciprocation mode. In the first reciprocation mode, the paddle moves in the second direction with a stroke different from a stroke when moving in the first direction, thereby making a difference between the positions of the plurality of beam members when the paddle changes the movement direction from the second direction to the first direction, and the positions of the plurality of beam members when the paddle changes the movement direction from the first direction to the second direction.
Provided is a technique that allows suppressing a film thickness on an outer peripheral edge of a substrate becoming non-uniform.
d. The ionically resistive element is configured to increase in resistivity of the ionically resistive element as approaching the power feeding part in an extending direction of the ionically resistive element.
A polishing method is disclosed, in which a substrate can be released from a substrate holder to pass the substrate to a transfer device without damaging the substrate. The polishing head, which holds the substrate after polishing, is moved above a stage of the transfer device that is in the substrate detection position, and an elastic membrane is inflated until a substrate detection sensor provided in the transfer device detects an approach of the substrate to the stage. After the inflation of the elastic membrane is stopped, the stage is moved from the substrate detection position to a substrate receive position using an elevating device, and then gas is injected from a injection nozzle to a boundary between the substrate and the elastic membrane adhered to the substrate, causing the substrate to be released from a substrate holding surface of the elastic membrane.
The present invention relates to a motor pump. The motor pump (MP) includes a first impeller (1A), and a second impeller (1B) connected to a communication shaft (270). A boss portion (281) of the first impeller (1A) has a larger size than that of the boss portion (282) of the second impeller (1B).
The present invention relates to a substrate processing apparatus and a substrate processing method for processing a laminated substrate manufactured by bonding a plurality of substrates to each other. The substrate processing apparatus has a filler-application module (300) that applies and cures filler (F) to a gap between peripheral portions of adjacent wafers (W1, W2) in a laminated substrate (Ws), a grinding module (400) that grinds an upper surface of the laminated substrate (Ws) to which the filler (F) has been applied, and a polishing module (500) that polishes an upper surface of the laminated substrate (Ws) that has been ground.
B24B 41/06 - Supports de pièces, p. ex. lunettes réglables
B05C 13/02 - Moyens pour manipuler ou tenir des objets, p. ex. des objets individuels pour des objets particuliers
B24B 37/20 - Tampons de rodage pour travailler les surfaces planes
B24B 41/00 - Éléments constitutifs des machines ou dispositifs à meuler, tels que bâtis, bancs, chariots ou poupées
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
69.
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, AND MACHINE LEARNING DEVICE
An information processing device includes: a reference information acquisition part that acquires, as reference information, a reference processing quantity and reference device information in a reference device corresponding to a substrate processing apparatus serving as a reference; a comparison information acquisition part that acquires, as comparison information, a comparison processing quantity and comparison device information in a comparison device corresponding to the substrate processing apparatus serving as a comparison target of the reference device; and a diagnostic processing part that generates diagnostic information including at least one of a cause of a time when a difference occurs between the reference processing quantity and the comparison processing quantity and a countermeasure for eliminating the difference, based on the reference information and the comparison information.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
70.
POLISHING METHOD, COMPUTER-READABLE STORAGE MEDIUM STORING PROGRAM FOR OPERATING COMPUTER, AND POLISHING APPARATUS
A polishing method includes: during polishing of the workpiece, creating a reference spectrum history and a monitoring spectrum history by repeatedly producing a reference spectrum and a monitoring spectrum at two points on the workpiece; calculating a plurality of reference history differences that are differences between a latest monitoring spectrum and a plurality of reference spectra in the reference spectrum history; calculating a plurality of monitoring history differences that are differences between a latest reference spectrum and a plurality of monitoring spectra in the monitoring spectrum history; calculating a film-thickness difference between a monitoring point and a reference point based on a local minimum point of a reference history difference or a monitoring history difference.
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
A purge apparatus is provided. The purge apparatus is capable of preventing air from being entrained when a submersible pump is moved into a pump column, and capable of warming the submersible pump when the submersible pump is removed from the pump column to thereby prevent component of the air from being liquefied, thus preventing the liquefied gas from being emitted in the atmosphere. The purge apparatus includes a hermetic purge container configured to accommodate the submersible pump therein; a vacuum line coupled to the hermetic purge container and coupled to a vacuum source; a purge-gas supply line coupled to the hermetic purge container and coupled to a purge-gas supply source; and a purge-gas supply valve mounted to the purge-gas supply line.
F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
F04D 7/00 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe
F04D 19/04 - Pompes multiétagées spécialement adaptées pour réaliser un vide poussé, p. ex. pompes moléculaires
A pump device (3) is provided with a motor casing (5) having corrosion resistance, and a motor cable (12) is covered with a motor cable protection tube (14) having corrosion resistance. The pump device (3) is provided with an in-tank pipe (15) having corrosion resistance. A purge gas pipe (17) through which a purge gas supplied from a purge gas supply unit (16) flows is connected to the motor cable protection tube (14) and the in-tank pipe (15), and is configured such that the purge gas circulates inside the pump device (3). The purge gas pipe (17) is provided with a pressure adjustment unit (18), a pressure sensor (19), and a flow rate sensor (20).
F04D 7/06 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant chauds ou corrosifs, p. ex. du métal liquide
F04B 15/04 - Pompes adaptées pour travailler avec des fluides particuliers, p. ex. grâce à l'emploi de matériaux spécifiés pour la pompe elle-même ou certaines de ses parties les fluides étant chauds ou corrosifs
A pump device (3) is provided with a motor casing (5) having corrosion resistance, and a sensor (9) installed near a bearing (8) inside the motor casing (5). A motor cable (12) and a sensor cable (13) are covered with a motor cable protection tube (14) and a sensor cable protection tube (15), respectively, which have corrosion resistance. A purge gas pipe (17) through which a purge gas supplied from a purge gas supply unit (16) flows is connected to the motor cable protection tube (14) and the sensor cable protection tube (15), and is configured such that the purge gas circulates inside the pump device (3).
F04D 7/06 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant chauds ou corrosifs, p. ex. du métal liquide
F04B 15/04 - Pompes adaptées pour travailler avec des fluides particuliers, p. ex. grâce à l'emploi de matériaux spécifiés pour la pompe elle-même ou certaines de ses parties les fluides étant chauds ou corrosifs
H02K 7/14 - Association structurelle à des charges mécaniques, p. ex. à des machines-outils portatives ou des ventilateurs
74.
METHOD OF DETECTING A WRONG WORKPIECE WHICH IS NOT AN OBJECT TO BE POLISHED, AND OPTICAL FILM-THICKNESS MEASURING APPARATUS
A method capable of detecting a wrong workpiece (e.g., wafer), which is not an object to be polished, is disclosed. The method includes: creating inspection spectrum data of reflected light from a workpiece before polishing of the workpiece or after beginning of polishing of the workpiece; inputting the inspection spectrum data to an autoencoder; calculating a difference between output data from the autoencoder and the inspection spectrum data; and determining that, when the difference is larger than a threshold value, the workpiece used to create the inspection spectrum data is a wrong workpiece which is not an object to be polished.
A substrate processing apparatus that can quickly transport a polished substrate (e.g., a wafer) to a cleaning module is disclosed. A first processing unit includes: a polishing module configured to polish the substrate W; a cleaning module configured to clean the substrate W; a drying module configured to dry the cleaned substrate W; a substrate transporter extending from one side to opposite side of the first processing unit; an elevating transporter configured to transport the substrate from the substrate transporter to the polishing module and from the polishing module to the cleaning module; and a relay transporter configured to transport the substrate. The relay transporter of the first processing unit is configured to transport the substrate between processing units.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
76.
POWER FEEDING APPARATUS AND POWER FEEDING METHOD FOR SUBMERSIBLE PUMP
The present invention relates to a power feeding apparatus and a power feeding method for supplying electric power to a submersible pump for delivering liquefied gas, such as liquefied ammonia, liquefied natural gas (LNG), or liquid hydrogen. The power feeding apparatus includes a first electrical contact secured to the submersible pump and electrically coupled to an electric motor of the submersible pump; a second electrical contact configured to contact the first electrical contact; and a power cable electrically coupled to the second electrical contact. At least a part of the second electrical contact is located in a pump column in which the submersible pump is arranged.
Provided is a technology which is capable of improving the power of plating solution stirring paddle. This plating apparatus 1000 is provided with a paddle 70 which is arranged between an anode 11 and a substrate Wf, is configured so as to stir a plating solution Ps by reciprocating in a first direction and a second direction, the directions being parallel to the anode, and comprises a honeycomb structure part 71 that has a plurality of polygonal through holes 74. The honeycomb structure part has a shape in which the paddle width in the center in a third direction that is perpendicular to the reciprocating direction of the paddle is wider than the paddle width at an end in the third direction. The honeycomb structure part has a first outer peripheral wall 75 that faces the first direction. The first outer peripheral wall has a first central wall 77 that is located in the center of the first outer peripheral wall in the third direction and extends in the third direction.
A polishing method capable of appropriately controlling a temperature of a polishing surface of a polishing pad during polishing of a workpiece is disclosed. The polishing method includes detecting a surface condition of a sample while polishing the sample on a polishing surface of a polishing pad; creating time-series data representing temporal change in the surface condition of the sample; determining a point in time at which the surface condition of the sample has distinctively changed based on the time-series data; determining a temperature control time based on the determined point in time; and controlling a temperature of the polishing surface of the polishing pad based on the temperature control time, while polishing a workpiece on the polishing surface of the polishing pad.
B24B 49/14 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la température pendant le meulage
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/16 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la pression de travail
79.
FILM THICKNESS MEASUREMENT DEVICE, FILM THICKNESS MEASUREMENT METHOD AND SUBSTRATE POLISHING DEVICE
Provided is a film thickness measurement device, including: a head that holds a substrate to be polished and is capable of moving the substrate, a stage made of transparent material; a liquid supply unit configured to supply liquid onto the stage; a liquid discharge unit configured to discharge the liquid on the stage to the outside; a measurement unit configured to be placed on a side opposite to the head across the stage and to optically measure a film thickness on a surface of the substrate that is placed across the stage; and a control unit configured to move at least one of the stage and the head toward the other, and to irradiate the substrate with light while the surface of the substrate is immersed in the liquid, thereby performing film thickness measurement.
An integrally-transportable purge container capable of preventing entry of air when a submersible pump is carried into a pump column, and capable of warming the submersible pump when it is removed from the pump column to prevent components of the air from being liquefied is provided. The integrally-transportable purge container includes: a container body having an interior space for accommodating a submersible pump therein; an upper lid configured to cover an upper opening of the container body; a lower lid configured to cover a lower opening of the container body; and a purge-gas inlet port and a purge-gas outlet port communicating with the interior space of the container body. The integrally-transportable purge container is detachably coupled to an upper portion of a pump column in which the submersible pump is to be installed. The integrally-transportable purge container is configured to be transportable together with the submersible pump.
The present application relates to a substrate processing apparatus and a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; curing the applied filler; generating, by an infrared imaging device, an image of an edge portion of the laminated substrate to which the filler is applied; and determining a filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate based on the image.
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluideRécupération de l'excès de liquide ou d'un autre matériau fluide
B05C 9/14 - Appareillages ou installations pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par des moyens non prévus dans l'un des groupes , ou dans lesquels le moyen pour déposer le liquide ou autre matériau fluide n'est pas important pour appliquer un liquide ou autre matériau fluide et exécuter une opération auxiliaire l'opération auxiliaire nécessitant un chauffage
B05D 1/00 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces
B05D 3/02 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides par cuisson
82.
CONTROL DEVICE AND CONTROL METHOD FOR EXHAUST GAS TREATMENT SYSTEM
The present invention relates to a control device and a control method for controlling the operation of an exhaust gas treatment system having a plurality of processors. A control device (6) for controlling the operation of an exhaust gas treatment system (1) having a plurality of processors (2A-2C) comprises: a plurality of sub-control devices (8A-8C) that correspond to the plurality of processors (2A-2C) and individually control the operations of the plurality of processors (2A-2C); and a main control device (7) that is electrically connected to the plurality of sub-control devices (8A-8C). The main control device (7) comprises: a power supply (10) that supplies power to the plurality of sub-control devices (8A-8C); and an integrated control unit (11) that integrally controls the operations of the plurality of processors (2A-2C). The plurality of sub-control devices (8A-8C) are respectively provided with individual control units (13) that are electrically connected to devices (3, 4) for operating the corresponding processors (2A-2C).
H01L 21/31 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches
A polishing method and a polishing apparatus that can suppress fluid from remaining on an upper surface of a workpiece, and that can apply an appropriate force to the workpiece to polish the workpiece are disclosed. The polishing method includes: pressurizing a first pressure chamber to move fluid present between an upper surface of the workpiece and the first pressure chamber outward; moving the fluid present between the upper surface of the workpiece and a second pressure chamber outward by pressurizing the second pressure chamber to form a second pressure in the second pressure chamber which is lower than a target pressure when a pressure equal to or higher than the target pressure is formed in the first pressure chamber; and polishing the workpiece after causing the fluid to flow out from the workpiece.
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
84.
SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING METHOD, AND SUBSTRATE POLISHING APPARATUS
A substrate cleaning apparatus that brings a cleaning tool into sliding contact with a substrate surface while rotating the substrate to perform scrub-cleaning includes a cleaning liquid supply unit that ejects cleaning liquid onto the surface of the substrate to perform a rinsing process of the substrate after scrub-cleaning, in which a temperature of the cleaning liquid in the rinsing process is set to 0° C. to 20° C. The cleaning liquid supply unit includes a first cleaning liquid supply unit that supplies the cleaning liquid toward the vicinity of the center of the substrate and a second cleaning liquid supply unit that supplies the cleaning liquid in a spray form toward a region between the center and an edge of the substrate, and a first ejection angle by the first cleaning liquid supply unit is smaller than a second ejection angle by the second cleaning liquid supply unit.
B08B 7/04 - Nettoyage par des procédés non prévus dans une seule autre sous-classe ou un seul groupe de la présente sous-classe par une combinaison d'opérations
B08B 1/14 - LingettesÉléments absorbants, p. ex. écouvillons ou éponges
B08B 1/34 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs en rotation autour d'un axe parallèle à la surface
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
Provided is a double suction impeller which can improve the right-rising characteristic of a pump and can easily be manufactured due to a simple configuration. This double suction impeller comprises: a main plate configured to be fixed to a rotary shaft; a pair of side plates provided on a first side and a second side of the main plate along the rotary shaft; and a plurality of blades arranged in a circumferential direction between each of the pair of side plates and the main plate so as to form a flow passage extending from an inner peripheral part to an outer peripheral part of the double suction impeller. The main plate has an outer diameter larger than the outer diameter of the pair of side plates and the outer diameter of the plurality of blades.
The present invention relates to an exhaust gas treatment device and an exhaust gas treatment method for performing a process for rendering harmless exhaust gas which is discharged from manufacturing devices for manufacturing semiconductor devices, liquid crystals, LEDs, etc. An exhaust gas treatment device (1) treats exhaust gas, said exhaust gas treatment device (1) comprising: a heat generation part (2) which is provided with a heat generation device (5) for generating heat; and a heat treatment part (3) which is connected to the heat generation part (2) and which uses heat to heat-treat exhaust gas, wherein the heat treatment part (3) has a tubular body (20) which forms a flow path (F) for exhaust gas and a water supply structure (30) which supplies water into the tubular body (20) and which forms a water film on the inner surface of the tubular body, and the tubular body (20) has a diameter expansion part (21) in which the diameter expands.
F23G 7/06 - Procédés ou appareils, p. ex. incinérateurs, spécialement adaptés à la combustion de déchets particuliers ou de combustibles pauvres, p. ex. des produits chimiques de gaz d'évacuation ou de gaz nocifs, p. ex. de gaz d'échappement
F23M 5/08 - Refroidissement des armatures, enveloppes ou paroisTubes de parois
A pump device for transferring liquefied gas comprises a suction container (9) and a pump (10). The suction container (9) has a vacuum heat insulation container (18) and a vacuum heat insulation lid (19), and the pump (10) is disposed in a pump chamber (30) formed within the vacuum heat insulation container (18). A gas-layer space (L) for forming a gas heat insulation layer composed of boil-off gas is formed between the inner surface of the vacuum heat insulation container (18) and the outer surface of a sealing structure (25) of the vacuum heat insulation lid (19), the gas-layer space (L) communicating with the pump chamber (30).
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
F17C 13/00 - Détails des récipients ou bien du remplissage ou du vidage des récipients
88.
POLISHING APPARATUS AND POLISHING END POINT DETECTION METHOD IN POLISHING APPARATUS
To accurately detect a polishing end point even if a change in a polishing frictional force is small. A polishing apparatus includes a polishing table for holding a polishing pad, a holder for holding a polishing target object such that the polishing target object faces the polishing pad, and an end point detector that detects, based on a signal indicating a state of polishing of the polishing target object by the polishing pad, a polishing end point indicating an end of the polishing. The end point detector is configured to remove noise of the signal, exponentiate the signal subjected to the noise removal with an exponent greater than 1, and detect the polishing end point based on the exponentiated signal.
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 49/00 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
An elevating apparatus that can eliminate a need for a permanently installed large hoist is provided. The elevating apparatus is used to elevate and lower a submersible pump in a pump column. The submersible pump is used for delivering liquefied gas. The elevating apparatus includes a cable including multiple split cables and multiple coupling links configured to detachably couple the multiple split cables to each other; and a take-up device coupled to the cable.
F04B 15/08 - Pompes adaptées pour travailler avec des fluides particuliers, p. ex. grâce à l'emploi de matériaux spécifiés pour la pompe elle-même ou certaines de ses parties avec des liquides près de leur point d'ébullition, p. ex. à une pression anormalement basse les liquides ayant une température d'ébullition peu élevée
F04D 13/08 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité pour utilisation en position immergée
90.
PURGE CONTAINER AND METHOD OF USING THE PURGE CONTAINER
A purge container (1) has a container body (21) having an interior space (20) for accommodating a submersible pump (2), an upper lid (23) configured to cover an upper opening of the container body (21), a lower lid (24) configured to cover a lower opening of the container body (21), and a purge-gas inlet port (27) and a purge-gas outlet port (28) communicating with the interior space (20) of the container main body (21). The container body (21) is secured to an upper portion of a pump column (3) in which the submersible pump (2) is to be installed.
This underwater electric motor comprises: a rotary shaft (7) that is rotatably supported by a first bearing (3) and a second bearing (5); a first peripheral wall (25) and a second peripheral wall (26) that are disposed on both sides of a motor stator (20) in the axial direction of the rotary shaft (7); and a cylindrical wall (30) that is fixed to the first peripheral wall (25) and the second peripheral wall (26). The motor stator (20) is disposed in a sealed stator chamber (40). The rotary shaft (7) has a shaft hole (52) extending in the axial direction from an end (7a) thereof and a radial hole (55) that is in communication with the shaft hole (52). The radial hole (55) has an outlet (56) that opens on the outer peripheral surface of the rotary shaft (7). The outlet (56) is positioned further outward in the axial direction than the first bearing (3) and the stator chamber (40).
H02K 5/128 - Enveloppes ou enceintes caractérisées par leur configuration, leur forme ou leur construction spécialement adaptées à un fonctionnement dans un liquide ou dans un gaz utilisant des manchons d'entrefer ou des disques à film d'air
92.
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, AND MACHINE LEARNING DEVICE
An information processing device includes: a target processing quantity reception part that receives a target processing quantity of substrates per unit time of a time when a processing action repeating a substrate processing and a transport processing on substrates is performed in a substrate processing apparatus; a device information acquisition part that acquires device information including transport processing information defining an action state of the transport processing of the time when the processing action is performed; and a support information generation part that generates support information including a recipe available time which is available for the substrate processing based on the target processing quantity and the device information.
G05B 19/418 - Commande totale d'usine, c.-à-d. commande centralisée de plusieurs machines, p. ex. commande numérique directe ou distribuée [DNC], systèmes d'ateliers flexibles [FMS], systèmes de fabrication intégrés [IMS], productique [CIM]
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
93.
PAD SURFACE DETERMINING METHOD AND PAD SURFACE DETERMINING SYSTEM
A pad surface determining method that can appropriately determine a surface property of a polishing pad including a condition of recess (e.g., groove or hole) formed in a polishing surface of the polishing pad is disclosed. The pad surface determining method includes: irradiating a target area in the polishing surface with a plurality of lights from a plurality of light sources at different incident angles; receiving a plurality of reflected lights from the target area by an imaging device; generating a plurality of images corresponding to the different incident angles by the imaging device; and determining the surface property of the polishing pad based on at least one of the plurality of images.
H04N 23/10 - Caméras ou modules de caméras comprenant des capteurs d'images électroniquesLeur commande pour générer des signaux d'image à partir de différentes longueurs d'onde
H04N 23/56 - Caméras ou modules de caméras comprenant des capteurs d'images électroniquesLeur commande munis de moyens d'éclairage
94.
SUBSTRATE TRANSFER APPARATUS, AND APPARATUS FOR PROCESSING SUBSTRATE PROVIDED WITH SUBSTRATE TRANSFER APPARATUS
There is provided a substrate transfer apparatus configured to transfer a substrate in a rectangular shape. The substrate transfer apparatus comprises a plurality of first transfer rollers configured to support a lower face of the substrate; a plurality of first roller shafts, wherein at least three first transfer rollers are mounted to each of the first roller shafts; a motor configured to rotate the first roller shafts; a plurality of second transfer rollers configured to support an upper face of the substrate at only a center portion of the substrate in a width direction; a plurality of second roller shafts, wherein one second transfer roller configured to support only the center portion of the substrate in the width direction is mounted to each of the second roller shafts; and a plurality of guide rollers opposed to respective side faces of the substrate and configured to guide transfer of the substrate.
Provided is a technology that can minimize delay in a task of positioning a powder on a build plate, said delay being due to powder that has been scattered by a gas blown by a recoater. A powder supply device 20 comprises: a contactless recoater 30 that is configured so as to position a powder Pd on a build plate 3 by moving while blowing a gas Ga on the powder; and a powder recovery device 40 that is configured so as to move together with the contactless recoater and recover powder that was scattered by the gas blown by the contactless recoater.
B22F 12/60 - Dispositifs de planarisationDispositifs de compression
B29C 64/153 - Procédés de fabrication additive n’utilisant que des matériaux solides utilisant des couches de poudre avec jonction sélective, p. ex. par frittage ou fusion laser sélectif
The present invention relates to a casing for a centrifugal pump, and particularly relates to a casing for a multistage centrifugal pump. A casing (7) comprises a side plate (26) that has an obverse surface facing the reverse surface of a main plate (35) of an impeller (5), and a return blade (16) that has a circular arc shape and is projection-welded to the reverse surface of the side plate (26) at a plurality of welding points (PM1 to PM4) on the upper end surface thereof. The main plate (35) of the impeller (5) has a trim edge part (43) that is recessed radially inward. The weld at the outermost welding point (PM4) that is farthest from a rotary shaft (1) among the plurality of welding points (PM1 to PM4) either at least partially overlaps a projection point (PR1) at which the outermost peripheral part (OM) of the impeller (1) is projected onto the return blade (16), or is positioned radially inward of the projection point (PR1).
A polishing endpoint detecting method capable of accurately detecting a polishing endpoint of a substrate is disclosed. The polishing endpoint detecting method includes: polishing a substrate W; creating a film-thickness profile of the substrate by used of a film-thickness sensor 7 mounted to a polishing table 2; dividing the film-thickness profile into a plurality of measurement zones and selecting a monitoring zone from the plurality of measurement zones for determining a polishing endpoint of the substrate; determining whether or not the monitoring zone is changed to another measurement zone based on changes in the film-thickness profile obtained from start to end of polishing of the substrate; and determining a polishing endpoint of the substrate based on the signals in the monitoring zone.
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
98.
ORIENTATION CONTROL METHOD FOR HULL PART, AND AIRSHIP
The present invention relates to an orientation control method for a hull part, and an airship. This orientation control method for the hull part (3) changes the orientation of the hull part (3) from a horizontal orientation to a vertical orientation.
A liquefied ammonia storage tank comprising: a storage tank body separated from the outside by a partition wall; and a vertical hollow column pipe provided to the storage tank body, and allowing communication between the inside and the outside of the storage tank. An upper opening section of the column pipe is provided with an upper opening of the column pipe and a liquid ammonia discharge pipe that branches from the column pipe. The upper opening is provided with an opening/closing lid that is capable of opening and closing. An ammonia gas recovery device for recovering ammonia gas vaporized from liquefied ammonia together with the atmospheric air when the opening/closing lid is in an open state is connected to the upper opening section of the column pipe.
B65D 90/28 - Moyens destinés à empêcher ou à limiter le dégagement de vapeurs
F17C 9/02 - Procédés ou appareils pour vider les gaz liquéfiés ou solidifiés contenus dans des récipients non sous pression avec changement d'état, p. ex. vaporisation
The present application relates a pump casing and a pump. The pump casing includes a cutter having an upper surface facing a leading edge portion of an impeller when the impeller is housed in the pump casing. The upper surface has a region with at least two angles.
F04D 7/04 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant visqueux ou non homogènes
F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
