Provided is a substrate drying apparatus which prevents a liquid from adhering to the back surface of a substrate in a back surface drying step. The substrate drying apparatus comprises: a substrate holder 1 for holding a substrate W; a disk-shaped cap 55 disposed below the substrate W; a rotation device 5 for rotating the substrate holder 1 and the cap 55; a fluid supply nozzle 31 extending through a through hole 57 formed in the cap 55; a fluid supply line 32 connected to the fluid supply nozzle 31; a vacuum line 43 connected to the fluid supply line 32; and an umbrella 47 attached to the outer surface of the fluid supply nozzle 31 and having an outer diameter larger than the diameter of the through hole 57. A rinse liquid line 34 and a dry gas line 35 for supplying a rinse liquid and a dry gas to the back surface of the substrate W are connected to the fluid supply line 32, and the umbrella 47 has an upper surface 47a that gradually inclines downward toward the outside.
F26B 3/04 - Procédés de séchage d'un matériau solide ou d'objets impliquant l'utilisation de chaleur par convection, c.-à-d. la chaleur étant transférée d'une source de chaleur au matériau ou aux objets à sécher par un gaz ou par une vapeur, p. ex. l'air le gaz ou la vapeur circulant sur ou autour du matériau ou des objets à sécher
F26B 5/08 - Procédés de séchage d'un matériau solide ou d'objets n'impliquant pas l'utilisation de chaleur par traitement centrifuge
The application relates to an exhaust gas treatment apparatus and an exhaust gas treatment method for treating an exhaust gas discharged from a manufacturing apparatus or the like for manufacturing semiconductor devices, liquid crystals, LEDs, or the like, to make the exhaust gas harmless. The exhaust gas treatment apparatus for treating the exhaust gas, includes: a heat generating section including a heat generator-configured to generate heat; and a heat treatment section coupled to the heat generating section and configured to perform heat treatment on the exhaust gas with the heat. The heat treatment section includes: a cylindrical body that forms a flow passage for the exhaust gas; and a water supply structure configured to supply water in the cylindrical body to form a water film on an inner surface of the cylindrical body, and the cylindrical body has a diameter-increasing portion where a diameter of the cylindrical body increases.
B01D 53/76 - Procédés en phase gazeuse, p. ex. utilisant des aérosols
F23G 7/06 - Procédés ou appareils, p. ex. incinérateurs, spécialement adaptés à la combustion de déchets particuliers ou de combustibles pauvres, p. ex. des produits chimiques de gaz d'évacuation ou de gaz nocifs, p. ex. de gaz d'échappement
3.
POLISHING APPARATUS, SUBSTRATE PROCESSING APPARATUS, POLISHING METHOD, AND DETERMINATION DEVICE
Particles that damage a substrate are detected more efficiently or more precisely. A polishing apparatus includes a detector that performs detection of a signal related to at least one of a size, shape, dispersibility, and optical property of particles, from a polishing liquid positioned on a polishing surface, or the polishing liquid positioned in a flow path or a chamber that communicates with a pad opening portion formed in a polishing pad, and a control device is configured to perform particle determination to determine whether the polishing liquid on which the detection is performed contains particles that damage the substrate, based on particle data indicating at least one of the size, shape, dispersibility, and optical property of particles obtained based on the signal detected by the detector, and correspondence information indicating correspondence of the size of the particle of the polishing liquid, and whether the particles are the particles that damage the substrate.
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
To provide a method of training a neural network model based on physics information so that a current density at plating-target surface can be measured with high precision even if a change in plating conditions occurs. This method includes: reading training input data and supervisory data; causing the training input data to be input to a neural network model; outputting, by the neural network model, inference data in accordance with the training input data; calculating, as a first loss metric, a residual between the supervisory data and the output inference data; calculating, as a second loss metric, a residual obtained by substituting the output inference data into an equation describing physics phenomena in a region of a plating solution accommodated between a substrate and an anode in a plating bath; and optimizing parameters of the neural network model by using the first and second loss metrics.
G05B 13/02 - Systèmes de commande adaptatifs, c.-à-d. systèmes se réglant eux-mêmes automatiquement pour obtenir un rendement optimal suivant un critère prédéterminé électriques
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
G05D 5/02 - Commande d'une épaisseur, p. ex. d'un matériau laminé
A washing apparatus includes a housing; a holding part that holds a substrate arranged in the housing; a washing nozzle that supplies a washing liquid to the substrate held by the holding part; a gas nozzle that ejects a gas toward a ceiling of the housing; and a control part that controls the gas nozzle. The control part causes the gas to be ejected from the gas nozzle after the substrate is transported into the housing and before washing of the substrate is performed.
The purpose of the present invention is to improve the attracting properties of a top ring with respect to a substrate. The present invention provides a top ring for holding a substrate, said top ring comprising a base member that is connected to a rotation shaft and an elastic film that is attached to the base member and that has a substrate attracting surface which is for attracting the substrate and at least one suction port through which air between the substrate and the substrate attracting surface is suctioned, wherein: the elastic film has a rubber and a sheet-like member that is covered by the rubber and has higher rigidity than the rubber; an air passage to the suction port is formed on the substrate attracting surface of the elastic film by protrusions and depressions; and the air passage is terminated spaced apart from the outer peripheral edge of a region of the substrate attracting surface in which the substrate is disposed.
An exhaust system for exhausting hydrogen discharged from an EUV exposure apparatus is provided that includes a light-source-unit hydrogen pump module having a vacuum pump unit for sucking hydrogen discharged from a light source unit of the EUV exposure apparatus, a first oxygen sensor module that measures an oxygen concentration of gas discharged from the light-source-unit hydrogen pump module, an exposure-unit hydrogen pump module having a vacuum pump unit for sucking hydrogen discharged from an exposure unit of the EUV exposure apparatus, a second oxygen sensor module that measures an oxygen concentration of gas discharged from the exposure-unit hydrogen pump module, a hydrogen treatment module for treating hydrogen gas discharged from the first and second oxygen sensor modules, a utility module for supplying cooling water and/or nitrogen gas to each module, and a control module for supplying power to each module, and controlling each module.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
B01D 53/76 - Procédés en phase gazeuse, p. ex. utilisant des aérosols
G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes
A substrate processing apparatus includes a substrate processing table, a processing part, a supply line, and a swing mechanism. The processing part applies a predetermined processing to a substrate placed on an upper surface of the substrate processing table. The supply line includes a swing arm and a utility supply part. The swing arm extends toward above the upper surface of the substrate processing table. The utility supply part is inserted through the swing arm from outside the swing arm and supplies a utility to the substrate placed on the upper surface of the substrate processing table. The swing mechanism swings the swing arm about a swing axis. A part of the utility supply part extends along the swing axis and is positioned on the swing axis.
The present invention relates to a pump-operation support method and a pump-operation support apparatus. The pump-operation support method includes: a performance-characteristic acquisition process of acquiring a flow-rate vs. total-pump-head typical performance curve in a rated operation and a rated rotational speed as performance characteristics of a support target device identified by the model number of a pump device; an installation-state acquisition process of acquiring an actual pump head as an installation state of the support target device; an operation-state acquisition process of acquiring operating frequency, suction pressure, and discharge pressure as an operation state of the support target device; and a first operation support process of calculating operating conditions in a reference operation of the support target device when the support target device is operated in the installation state and the operation state, wherein the first operation support process includes calculating flow rate and total pump head in the reference operation based on the performance characteristics, the installation state, and the operation state.
A polishing apparatus capable of determining a state change of a wafer more accurately and with faster responsiveness is disclosed. The polishing apparatus includes a detection device and a control device. The detection device periodically detects a reference position rotating together with a polishing head. The control device determines a state change of a substrate based on the reference position periodically detected by the detection device.
A substrate processing device includes a top ring, a swing cover fixed to the top ring, a turntable to which a polishing pad is attachable and that rotates the polishing pad, and an atomizer that supplies a washing fluid to the polishing pad, in which when a top ring head is at a transfer position for transferring a substrate, the swing cover is positioned between the substrate and the polishing pad, and when the top ring head is at a polishing position for polishing the substrate with the polishing pad, the swing cover does not overlap the polishing pad in a plan view.
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
B24B 37/12 - Plateaux de rodage pour travailler les surfaces planes
A push-pull device includes a free joint structure, an air bearing cylinder, and a fixing bracket that receives a radial load acting on a rod structure.
Provided is a technique that allows removing gas bubbles attached to a hole of an ionically resistive element. A plating method includes: stirring a plating solution by driving a paddle arranged above the ionically resistive element in a state where an anode and the ionically resistive element are immersed in the plating solution (step S20); immersing a substrate as a cathode in the plating solution in a state where the stirring of the plating solution with the paddle is stopped (step S40); resuming the stirring of the plating solution with the paddle arranged above the ionically resistive element and below the substrate in a state where the substrate is immersed in the plating solution (step S50); and performing a plating process on the substrate by flowing electricity between the substrate and the anode in a state where the stirring of the plating solution with the paddle is resumed (step S60).
The application relates to a substrate holding device, a substrate manufacturing apparatus, and a substrate manufacturing method. The substrate holding device includes a holding roller and a fluid blowing device configured to blow a pressurized fluid onto a bevel portion held by the holding roller.
A substrate processing apparatus that can efficiently clean the inside of the apparatus is achieved. A plating apparatus includes a substrate transfer chamber (701), a fan filter unit (408), a plating chamber (401), an exhaust chamber (702), a partition member (720), and a bypass flow channel (730). The substrate transfer chamber (701) houses a transfer device for transferring a substrate. The fan filter unit (408) is disposed above the substrate transfer chamber (701) and configured to supply a gas to the substrate transfer chamber (701). The plating chamber (401) is disposed on a side of the substrate transfer chamber (701) and houses a plating module (400) for performing a plating process on the substrate. The exhaust chamber (702) is disposed below the substrate transfer chamber (701). The partition member (720) is disposed between the substrate transfer chamber (701) and the exhaust chamber (702). The substrate transfer chamber (701) and the exhaust chamber (702) communicate through the bypass flow channel (730) by bypassing the partition member (720). The plating chamber (401) has a supply port (404) for supplying the gas supplied to the substrate transfer chamber (701) by the fan filter unit (408) to the plating chamber (401), and a discharge port (405) for discharging the gas supplied to the plating chamber (401) to outside. The exhaust chamber (702) has an exhaust outlet (703) for discharging the gas supplied to the exhaust chamber (702) via the bypass flow channel (730) to outside.
The present invention relates to a cooling system for use in cooling of semiconductor manufacturing equipment, such as etching equipment. The cooling system (5) includes: at least one heat-exchanging unit (8) configured to generate a cooling liquid for cooling the multiple processing chambers (2A to 2C) arranged in a clean room and supply the cooling liquid to the multiple processing chambers (2A to 2C); a cooling apparatus (10) configured to cool an antifreeze liquid; an antifreeze-liquid circulation line (25) extending between the heat-exchanging unit (8) and the cooling apparatus (10); and an antifreeze-liquid pump (27) configured to circulate the antifreeze liquid, wherein the heat-exchanging unit (8) includes: a cooling-liquid pump (30) configured to circulate the cooling liquid; a heat exchanger (31) configured to perform heat exchange between the cooling liquid and the antifreeze liquid; and a cooling-side buffer tank (33) arranged upstream of the heat exchanger (31) in a circulating direction of the cooling liquid.
F25B 25/00 - Machines, installations ou systèmes utilisant une combinaison des principes de fonctionnement compris dans plusieurs des groupes
F25D 17/02 - Dispositions pour la circulation des fluides de refroidissementDispositions pour la circulation de gaz, p. ex. d'air, dans les enceintes refroidies pour la circulation des liquides, p. ex. de la saumure
The present invention relates to a substrate cleaning method and a substrate cleaning device for cleaning a substrate such as a wafer. The substrate cleaning method comprises: a first cleaning step for cleaning a substrate (W) while forming liquid pools (L) of a cleaning liquid on surfaces (2a, 2b) of the substrate (W) by individually rotating roll cleaning tools (8, 9), which extend in the radial direction of the substrate (W), in a first rotation direction (D1) so that cleaning surfaces (M) of the roll cleaning tools (8, 9) move in a direction opposite to a movement direction (Dw) of the surfaces (2a, 2b) of the substrate (W) while keeping the cleaning surfaces (M) of the roll cleaning tools (8, 9) in contact with the respective surfaces (2a, 2b) of the substrate (W); and a second cleaning step for cleaning the substrate (W) while discharging the cleaning liquid from the surfaces (2a, 2b) of the substrate (W) by individually rotating the roll cleaning tools (8, 9) in a second rotation direction (D2) opposite to the first rotation direction (D1) after the first cleaning step.
A polishing apparatus and a polishing method capable of accurately measuring a film thickness of a workpiece, such as wafer, substrate, or panel, used in manufacturing of semiconductor devices during polishing of the workpiece are disclosed. The processing system is configured to determine a film thickness of the workpiece based on relative reflectance data calculated by a calculation formula expressed as: the relative reflectance data=MD1/[BD1·k], where MD1 represents first intensity measurement data indicating intensity of the reflected light from the workpiece measured by the first spectrometer, BD1 represents the first base intensity data, and k represents a rate of change in second intensity measurement data with respect to the second base intensity data. The second intensity measurement data is indicative of intensity of the light of the light source measured by the second spectrometer during polishing of the workpiece.
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
[Problem] To provide a safety support device capable of improving the work efficiency of the operator while appropriately ensuring the safety of the operator.
[Solution]
[Problem] To provide a safety support device capable of improving the work efficiency of the operator while appropriately ensuring the safety of the operator.
[Solution]
A safety support device 5 supports the safety of an operator U who performs a predetermined task by placing at least a part of their body into a predetermined movable range with respect to a processing device that performs predetermined processing by moving a movable part having the predetermined movable range. The safety support device 5 includes: an image data acquisition unit 500 that acquires image data 110 captured by an image capturing unit 63 disposed in front of the operator U when an operator device 6 is worn by the operator U; and an interlock information generation unit 501 that generates interlock information indicating an interlock state of the movable part based on the image data 110 acquired by the image data acquisition unit 500.
A substrate processing apparatus capable of optimizing a measurement process is disclosed. The substrate processing apparatus includes a load/unload unit arranging load ports side by side adjacent to a front outer wall of a housing, and an upper measurement module and a lower measurement module configured to measure a surface condition of a substrate, and disposed side by side vertically adjacent to a side outer wall of the housing connected to the front outer wall.
A substrate processing system capable of reliably setting parameters without causing setting errors is disclosed. The substrate processing system comprises a communication network connected between a plurality of control devices and configured to transmit and receive parameters related to operating conditions of a device between the control devices.
A polishing device according to the present invention comprises a polishing table for supporting a polishing pad, a polishing head for holding an object, a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object, and a control device for controlling the polishing liquid supply device. The polishing device polishes the object by bringing the polishing pad and the object into contact in the presence of the polishing liquid and causing the polishing pad and the object to rotate relative to each other. The polishing liquid supply device comprises a polishing liquid supply head that has a plurality of polishing liquid supply ports. The control device performs polishing liquid discharge processing that moves the polishing liquid supply head in a straight line above the polishing pad while the polishing liquid is discharged from the plurality of polishing liquid supply ports.
B24B 37/00 - Machines ou dispositifs de rodageAccessoires
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
The present invention relates to a separation device. Provided is a separation device capable of achieving improved performance. This separation device comprises an inner cylinder and an outer cylinder. The outer cylinder has an insertion part extending upward from the bottom part thereof. The upper end of the insertion part is disposed at a position higher than a lower groove among a plurality of circumferential grooves positioned at the lower part of a filtration surface.
B01D 63/16 - Modules rotatifs, vibrants ou à mouvement alternatif
A61M 1/34 - Filtration du sang à travers une membrane pour en éliminer une matière, c.-à-d. hémofiltration, diafiltration
B01D 33/06 - Filtres avec éléments filtrants mobiles au cours de l'opération de filtration à surfaces filtrantes rotatives cylindriques, p. ex. tambours creux
A substrate polishing device includes a turntable having a first adhesive surface, and a polishing pad having a second adhesive surface adhesively fixed to the first adhesive surface. An adhesive region and a first separation assistance region are provided between the first adhesive surface and the second adhesive surface. The first adhesive surface and the second adhesive surface are adhered to each other in the adhesive region. An adhesive force acting between the first adhesive surface and the second adhesive surface in the first separation assistance region is smaller than an adhesive force acting between the first adhesive surface and the second adhesive surface in the adhesive region. The first separation assistance region is positioned on an outer circumferential portion of the polishing pad.
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/20 - Tampons de rodage pour travailler les surfaces planes
27.
SYSTEM, METHOD, AND PROGRAM FOR FACILITATING INTERACTION BETWEEN PLURALITY OF AI AGENTS
This system for promoting interaction between a plurality of AI agents comprises: an imparting means for imparting a score to each AI agent among the plurality of AI agents, the score of the AI agent representing a feature of the AI agent through use of at least one index; an emotion estimation means for estimating an emotion that a first AI agent among the plurality of AI agents can hold when the first AI agent receives a task; and a determination means for determining, on the basis of the score of each of the plurality of AI agents and the emotion of the first AI agent, at least one AI agent that is to interact with the first AI agent.
G06N 3/006 - Vie artificielle, c.-à-d. agencements informatiques simulant la vie fondés sur des formes de vie individuelles ou collectives simulées et virtuelles, p. ex. simulations sociales ou optimisation par essaims particulaires [PSO]
The application relates to a controller and a controlling method for controlling an operation of an exhaust gas treatment system having multiple treatment apparatuses. The controller for controlling an operation of the exhaust gas treatment system having the multiple treatment apparatuses, the controller includes: multiple sub-controllers corresponding to the multiple treatment apparatuses and configured to individually control operations of the multiple treatment apparatuses; and a main controller electrically coupled to the multiple sub-controllers, wherein the main controller includes: a power source configured to supply power to the multiple sub-controllers; and a comprehensive controller configured to comprehensively control the operations of the multiple treatment apparatuses, and each of the multiple sub-controllers includes an individual controller electrically coupled to a device configured to operate a corresponding treatment apparatus.
The present invention relates to a polishing apparatus. The polishing apparatus includes a sensor structure (100) configured to detect a polishing amount of a peripheral portion of a substrate (W). The sensor structure (100) includes a sensor head (102) having a contact surface (102a), and a displacement sensor (101) configured to detect the polishing amount of the peripheral portion of the substrate (W) based on a displacement of the sensor head (102).
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 9/06 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière propre aux objets à meuler de matière inorganique non métallique, p. ex. de la pierre, des céramiques, de la porcelaine
30.
SUBSTRATE POLISHING DEVICE, SUBSTRATE PROCESSING DEVICE, METHOD, STORAGE MEDIUM, AND POLISHING PAD
This substrate polishing device polishes a substrate and comprises: a polishing table that has at least one temperature adjustment unit which adjusts the temperature of the substrate; a position detection unit that detects the rotational phase of the polishing table; and a control unit that controls the temperature adjustment unit in accordance with said rotational phase detected by the position detection unit and the rotational phase of the polishing table corresponding to the position of the substrate.
B24B 37/24 - Tampons de rodage pour travailler les surfaces planes caractérisés par la composition ou les propriétés des matériaux du tampon
B24B 49/14 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la température pendant le meulage
A polishing apparatus capable of accurately determining a position of a measurement point of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing head configured to press a workpiece against a polishing pad on a polishing table to polish the workpiece; a film-thickness sensor configured to measure a film thickness at a measurement point on a surface of the workpiece; an infrared imaging device configured to generate a first image and a second image of a feature region on the surface of the workpiece at a predetermined time interval through a back surface of the workpiece; and a processing controller configured to determine coordinates of the measurement point on the surface of the workpiece based on the first image and the second image.
Provided is a substrate holder for plating on a surface of a substrate, provided with an electrical contact that is easy to replace. A substrate holder 1 includes: a first holding member 2; a second holding member 3 that has an opening portion 3a for exposing the surface of a substrate W and holds the substrate W in a sandwiched manner with the first holding member 2; a plurality of engaging shaft portions 36 each having a head portion 36b in an expanded head shape at a tip end portion, provided in a circumferential direction of the second holding member 3; and an electrical contact 32 having a contact portion 32a to be in contact with an edge portion of the substrate W, and having an engagement reception portion 32b in a notch shape to be engaged with the adjacent engaging shaft portion 36 for arrangement along a circumference of the opening portion 3a of the second holding member 3.
The present invention provides a system for determining an AI agent to be mounted on a robot from among a plurality of AI agents. The system comprises: an imparting means for imparting a score to each AI agent among the plurality of AI agents, the score of the AI agent representing a feature of the AI agent according to at least one index; and a determination means for determining an AI agent to be mounted on the robot on the basis of the score of each of the plurality of AI agents.
G06N 3/008 - Vie artificielle, c.-à-d. agencements informatiques simulant la vie fondés sur des entités physiques commandées par une intelligence simulée de manière à reproduire des formes de vie intelligentes, p. ex. fondés sur des robots reproduisant les animaux ou les humains dans leur apparence ou leur comportement
A substrate is efficiently cleaned. A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.
C25D 17/06 - Dispositifs pour suspendre ou porter les objets à revêtir
B05B 13/02 - Moyens pour supporter l'ouvrageDisposition ou assemblage des têtes de pulvérisationAdaptation ou disposition des moyens pour entraîner des pièces
B08B 3/02 - Nettoyage par la force de jets ou de pulvérisations
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
The liquefied-gas delivery system includes a reciprocating pump apparatus (3) for pressurizing liquefied gas and boil-off gas in a storage tank (1). The reciprocating pump apparatus (3) includes a cylinder (14) having a gas pressurization chamber (10) and a liquid pressurization chamber (11) therein, a piston (17) disposed in the cylinder (14), and an actuator (18) coupled to the piston (17) for reciprocating the piston (17). The piston (17) is located between the gas pressurization chamber (10) and the liquid pressurization chamber (11). The piston (17) has a gas pressurization surface (21) facing the gas pressurization chamber (10) and a liquid pressurization surface (22) facing the liquid pressurization chamber (11).
[Problem] To provide an information processing device capable of appropriately classifying an operating mode of an apparatus by using only operation data in which state quantities of the apparatus are recorded in a time series. [Solution] An information processing device 2 comprises: a diagnostic data generation unit 203 which generates diagnostic data by splitting operation data, in which measurement results obtained by using a sensor provided in an apparatus to be diagnosed (vacuum pump 11) to measure a state quantity that varies according to the operation of the apparatus are recorded in a time series, on the basis of a feature of the operation data at the time of a transition in the operating state of the apparatus; and a classification processing unit 204 which, for each of a plurality of operating modes included in an operating mode group, calculates the degree of similarity between the diagnostic data and a plurality of pieces of classification data serving as references for classifying the operating state according to the operating modes, and which classifies the diagnostic data with respect to the operating mode group on the basis of the degree of similarity for each operating mode.
Provided are a substrate cleaning device and a substrate cleaning method that make it possible to improve the degree to which a substrate is cleaned without causing reverse contamination of the substrate. A substrate cleaning device according to the present invention comprises a substrate holder 31 that holds a substrate W, a liquid supply device 32 that supplies a liquid to an entire cleaning surface of the substrate W, a foreign substance removal material supply device 33 that supplies a foreign substance removal material 35 that includes at least a polymer material that can dissolve in the liquid to the entire cleaning surface as wetted with the liquid, a solidification device 45 that solidifies the polymer material of the foreign substance removal material 35 that has been supplied to the substrate W, and a peeling device 40 that peels the foreign substance removal material 35 at which the polymer material has been solidified from the cleaning surface of the substrate W.
The present invention pertains to a sliding bearing that is used in a rotary machine such as a pump or a turbine, and particularly to a sliding bearing that is used in an extremely low-temperature environment. The sliding bearing comprises: a sliding contact pad (1) that has a shaft support surface (1a) for supporting the outer circumferential surface of a rotary shaft (100); a shell (2) disposed on the radially outer side of the sliding contact pad (1); and a pad pressing mechanism (3) that presses the sliding contact pad (1) against a pad support surface (2a) of the shell (2) when the sliding contact pad (1) has contracted. The sliding contact pad (1) has a circumferential groove formed in the shaft support surface (1a). The circumferential groove (1a) extends in the circumferential direction of the sliding bearing and extends through a center point (CP) of the shaft support surface (1a).
F16C 17/22 - Paliers à contact lisse pour mouvement de rotation exclusivement caractérisés par des particularités sans rapport avec la direction de la charge avec des dispositions pour compenser la dilatation thermique
F16B 5/02 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles par organes de fixation utilisant un filetage
F16C 17/02 - Paliers à contact lisse pour mouvement de rotation exclusivement pour charges radiales uniquement
F16C 33/20 - Surface de glissement principalement constituée de matériaux plastiques
A non-contact pad cleaning apparatus that does not cause a liquid to stay on a polishing surface of a polishing pad and capable of improving a cleaning effect for the polishing surface is disclosed. The polishing-surface cleaning device includes a plurality of two-fluid nozzles each configured to eject a two-fluid jet, and an upstream-side nozzle cover and a downstream-side nozzle cover. The upstream-side nozzle cover is arranged upstream of the plurality of two-fluid nozzles in a rotation direction of the polishing pad, and the downstream-side nozzle cover is arranged downstream of the plurality of two-fluid nozzles in the rotation direction of the polishing pad. A distance from the polishing surface to a lower end of the upstream-side nozzle cover is larger than a distance from the polishing surface to a lower end of the downstream-side nozzle cover.
A powder supply apparatus includes: a storage member including a storage chamber; a discharging member including a discharge port to discharge powder; a feeding member disposed below the storage member and above the discharging member, configured to feed powder in the storage chamber to the discharge port, and including a plurality of feeding chambers having capacities different from one another inside the feeding member such that the feeding chambers are stacked in an up-down direction; an inlet shutter configured to open and close an inlet opening for feeding the powder in the storage chamber to the feeding member; an outlet shutter configured to open and close an outlet opening for feeding powder in the feeding member to the discharge port; and an intermediate shutter configured to open and close an intermediate opening to make one feeding chamber and another feeding chamber adjacent to each other communicate with each other.
An occurrence of a plating failure caused by gas bubbles generated from an anode is reduced and a structure relating to supply of a plating solution is simplified. A plating module 400 includes a plating tank 410 for housing a plating solution, an anode 430 disposed in the plating tank 410, a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, a membrane 420 partitioning an anode region 424 in which the anode 430 is disposed and a cathode region 422 in which the substrate Wf is disposed during a plating process, the membrane 420 having an inclined surface 423a opposed to the anode 430, a supply port 412 for supplying the plating solution to the anode region 424, and a gas-liquid pipe 470 having a first end portion 472 opening at proximity of an upper end of the inclined surface 423a of the membrane 420 and a second end portion 474 opening above the surface to be plated of the substrate during the plating process, the gas-liquid pipe 470 being configured to supply the plating solution supplied to the anode region 424 from the supply port 412 to the cathode region 422 via the second end portion 474.
A substrate processing apparatus includes a plurality of polishing modules polishing a substrate, and a transport unit moving the substrate between the plurality of polishing modules. The plurality of polishing modules include a first module group and a second module group. The transport unit is positioned between the first module group and the second module group in a plan view. The first module group includes a first upper lane and a first lower lane in each of which at least two of the polishing modules are disposed adjacent to each other, The second module group includes a second upper lane and a second lower lane in each of which at least two of the polishing modules are disposed adjacent to each other.
B24B 27/00 - Autres machines ou dispositifs à meuler
B24B 7/22 - Machines ou dispositifs pour meuler les surfaces planes des pièces, y compris ceux pour le polissage des surfaces planes en verreAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler pour meuler de la matière inorganique, p. ex. de la pierre, des céramiques, de la porcelaine
B24B 9/06 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière propre aux objets à meuler de matière inorganique non métallique, p. ex. de la pierre, des céramiques, de la porcelaine
B24B 41/00 - Éléments constitutifs des machines ou dispositifs à meuler, tels que bâtis, bancs, chariots ou poupées
45.
TRANSFER MACHINE AND SUBSTRATE PROCESSING APPARATUS
A transfer machine 80 has an arm 810; a holding part 830 that is provided on the arm 810 and that is configured to hold a substrate W; a turning part 100 that turns the arm 810 about a turning axis A; and a control part 50 that adjusts a position in an in-plane direction of the substrate W by turning the arm 810 by the turning part 100 based on the position in the in-plane direction of the substrate W, which is held by the holding part 830, measured by measurement part 110.
B25J 9/04 - Manipulateurs à commande programmée caractérisés par le mouvement des bras, p. ex. du type à coordonnées cartésiennes par rotation d'au moins un bras en excluant le mouvement de la tête elle-même, p. ex. du type à coordonnées cylindriques ou polaires
A retainer ring provided in a substrate holder is disclosed, which enables a polishing profile of the substrate in its entirety, including an edge portion of the substrate, to be matched to a desired profile. The retainer ring is used in the substrate holder for pressing the substrate against the polishing pad supplied with the polishing liquid to polish the substrate. The retainer ring has a ring shape, and includes a ring body for supporting an outer periphery of the substrate pressed against the polishing pad. The ring body has at least one ring groove formed in a lower surface to be pressed against the polishing pad and extending concentrically with the ring body, and a barrier for preventing the polishing liquid from reaching an interior from an exterior of the ring body.
A reverse rotation prevention device for a canned motor pump includes: a rotor 110 rotating together with a main shaft of a motor; a stator 120 provided to be spaced at a first distance apart from an outer peripheral surface of the rotor 110; a plurality of hinges 130 arranged parallel to the main shaft, positioned between the outer peripheral surface of the rotor 110 and an inner peripheral surface of the stator 120, and placed at a preset interval on a circumference spaced a second distance apart from the outer peripheral surface of the rotor 110, the second distance being half the first distance; and a plurality of wedges 140 rotatably connected to the plurality of hinges 130, and rotating in one direction due to centrifugal force according to a flow direction of fluid F provided in a space formed between the rotor 110 and the stator 120.
A plurality of trench grooves (8) are formed on a first electrode (6) of a gas generation device (1), and a discharge space (12) formed between a first electrode surface (7) and a second electrode surface (11) is connected to a gas introducing space (17) for introducing material gas through a material gas supply inlet (4). A ratio P/D of a pitch P of the trench grooves (8) to a diameter D of the first electrode (6) is set at 0.0020 to 0.0150, and a ratio VT/VG of a volume VT of a trench space formed by the trench grooves (8) to a volume VG of the gas introducing space (17) is set at 0.016 to 0.203.
A technique for widening a range of a plurality of reference spectra for use in estimating a film thickness of a workpiece, such as a wafer to expand a range of film thicknesses that can be estimated is disclosed. A method of producing a reference spectral library generates, by extrapolation, a pre-polishing reference spectrum corresponding to a pre-polishing time which is a time before start of polishing of a reference workpiece and a post-polishing reference spectrum corresponding to a post-polishing time which is a time after end of polishing of the reference workpiece, calculates a plurality of reference film thicknesses corresponding to the pre-polishing reference spectrum, a plurality of actual reference spectra, and the post-polishing reference spectrum, respectively, and creates a reference spectral library by associating the plurality of reference film thicknesses with the pre-polishing reference spectrum, the plurality of actual reference spectra, and the post-polishing reference spectrum, respectively.
The present invention relates to a pump for delivering liquid, and more particularly to a pump for delivering liquid containing foreign object, such as string, fiber, or cloth. The pump includes an impeller (1) and an impeller casing (5) housing the impeller (1) therein. The impeller (1) has a hub (13), a single swept-back blade (2) coupled to the hub (13), and a shroud (25) to which the hub (13) and the swept-back blade (2) are coupled.
A substrate cleaning device includes: a cleaning member, which is a cleaning member that cleans a polished substrate and moves between a cleaning position of cleaning the substrate and a retract position of cleaning the cleaning member; and a measurement part irradiating, at the retract position, the cleaning member with light and receiving scattered light or reflected light from the cleaning member, thereby measuring a residual amount of abrasive particles remaining on the cleaning member.
B08B 1/50 - Nettoyage par des procédés impliquant l'utilisation d'outils impliquant le nettoyage des éléments de nettoyage
B08B 1/34 - Nettoyage par des procédés impliquant l'utilisation d'outils par le mouvement d’éléments de nettoyage sur une surface utilisant des éléments de nettoyage rotatifs en rotation autour d'un axe parallèle à la surface
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
A substrate polishing device polishes a substrate by sliding contact with a polishing member and includes: a dresser that oscillates on the polishing member and adjusts load and rotational speed in multiple scan areas; a height detection unit that measures surface height in multiple monitor areas along the oscillation direction; a dress model matrix production unit that generates a matrix defined by the monitor areas, scan areas, and a dress model; an evaluation index production unit that predicts a height profile using the dress model and dresser oscillation speed or dwell time and produces an evaluation index based on a difference from a target profile; and a calculation unit that determines the load and rotational speed for each scan area based on the evaluation index.
B24B 53/08 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives des meules profilées commandés par des moyens supports d'informations, p. ex. gabarits, patrons, bandes perforées
B24B 53/00 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
B24B 53/06 - Dispositifs ou moyens pour dresser ou remettre en état des surfaces abrasives des meules profilées
53.
FILM-THICKNESS DIFFERENCE ESTIMATING METHOD AND OPTICAL FILM-THICKNESS MEASURING APPARATUS
A method of estimating a film-thickness difference between multiple films constituting a workpiece during polishing of the workpiece is disclosed. The film-thickness difference estimating method includes: producing multiple measurement spectra of reflected light from the workpiece at the same polishing time while polishing the workpiece, the workpiece having a first film and a second film made of different materials; inputting each of the multiple measurement spectra into a classification model; outputting a classification result indicating that each of the multiple measurement spectra has been classified into either a first group or a second group from the classification model; inputting a measurement spectrum classified into the first group and a measurement spectrum classified into the second group into a film-thickness estimation model; outputting an estimated film thickness of the first film and an estimated film thickness of the second film of the workpiece at the polishing time from the film-thickness estimation model; and calculating an estimated film-thickness difference between the first film and the second film of the workpiece at the polishing time by subtracting the estimated film thickness of the second film from the estimated film thickness of the first film.
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
A polishing method capable of detecting a polishing endpoint where an upper layer is polished and a lower layer is exposed, without depending on changes in torque current and polishing rate is disclosed. The polishing method includes: supplying a polishing liquid onto a polishing pad on a polishing table while rotating the polishing table; polishing a workpiece in the presence of the polishing liquid by pressing the workpiece against the polishing pad; irradiating the workpiece with light each time the polishing table makes one rotation, and generating a spectrum of reflected light from the workpiece; calculating an index value indicating similarity between the spectrum of the reflected light and an interface spectrum; and determining a polishing endpoint at which the index value is maximized or minimized. The interface spectrum is a spectrum of reflected light from a reference workpiece generated when a first film is removed and a second film underlying the first film is exposed during polishing of the reference workpiece.
B24B 49/05 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage comportant la mesure d'une première pièce déjà travaillée et d'une autre pièce qui est en train d'être travaillée et la comparant avec la première
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
55.
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
To supply a more stable fine bubble liquid to a device. A substrate processing device includes: a first substrate detection unit that detects a substrate in a first module to be used in a first process; a bubble measurement unit that measures a bubble amount in piping, which supplies a fine bubble liquid to a second module to be used in a second process subsequent to the first process, in response to detection of the substrate by the first substrate detection unit; and a control unit that controls the bubble amount in accordance with a measurement result by the bubble measurement unit.
B08B 13/00 - Accessoires ou parties constitutives, d'utilisation générale, des machines ou appareils de nettoyage
B08B 3/00 - Nettoyage par des procédés impliquant l'utilisation ou la présence d'un liquide ou de vapeur d'eau
G01F 1/661 - Mesure du débit volumétrique ou du débit massique d'un fluide ou d'un matériau solide fluent, dans laquelle le fluide passe à travers un compteur par un écoulement continu en mesurant la fréquence, le déphasage, le temps de propagation d'ondes électromagnétiques ou d'autres types d'ondes, p. ex. en utilisant des débitmètres à ultrasons en utilisant la lumière
A polishing apparatus includes: a polishing pad having a polishing surface; a polishing head that presses a workpiece against the polishing surface; a polishing table that supports the polishing pad; an optical sensor head that guides light to the workpiece through a through-hole formed in the polishing pad and to receive reflected light from the workpiece through the through-hole; a tank that stores a liquid supplied to the through-hole; a liquid circulation line that circulates the liquid between the through-hole and the tank; and an ultraviolet irradiation head that irradiates the liquid flowing through the liquid circulation line with ultraviolet light, thereby sterilizing the liquid.
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
57.
WAFER ROTATION DEVICE, MATERIAL APPLICATION DEVICE, AND WAFER ROTATION METHOD
The present invention relates to a wafer rotation device for rotating a wafer while holding an edge part of the wafer in a chuck. This wafer rotation device comprises a temporary placement stand (28) having a wafer placement surface (25) on which a wafer (W) is temporarily placed before being held by a plurality of wafer chucks (5), and a vertical movement actuator (29) that moves the temporary placement stand (28) between a first height and a second height. The wafer placement surface (25) when the temporary placement stand (28) is at a first height is lower or higher than a plurality of edge holding parts (3) of the plurality of wafer chucks (5), and the wafer placement surface (25) when the temporary placement stand (28) is at a second height is at the same height as the plurality of edge holding parts (3).
Provided are a top ring or a substrate polishing device capable of making the polishing profile of a substrate uniform. Proposed is a top ring for holding a substrate, said top ring comprising: a base member connected to a rotary shaft; a substrate suctioning body that has a substrate suctioning surface for suctioning the substrate and that is in communication with a vacuum module; a shielding member that is configured to shield the surface of the substrate suctioning body on the reverse side from the substrate suctioning surface and that defines at least one cavity in communication with a supply module for supplying vacuum or pressure; and an elastic membrane configured to form, between the base member and the shielding member, a pressurization chamber that is in communication with a fluid supply source.
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/12 - Plateaux de rodage pour travailler les surfaces planes
A polishing apparatus includes: a stationary member; a shaft; a rotary member that is rotatable integrally with the shaft; a first lower cover member attached to the rotary member, extending upward from the rotary member to an upper end thereof, and having a cylindrical shape, the first lower cover member being disposed to surround the central axis; an upper cover member attached to the stationary member, extending downward from the stationary member to a lower end thereof, having a cylindrical shape, and disposed to surround the central axis and the first lower cover member; and a second lower cover member attached to the first lower cover member, extending upward from the first lower cover member to an upper end thereof while branching from the first lower cover member, having a cylindrical shape, and disposed to surround the central axis, the first lower cover member, and the upper cover member.
B24B 37/04 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes
B24B 37/20 - Tampons de rodage pour travailler les surfaces planes
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
60.
SUBSTRATE POLISHING APPARATUS AND FILM THICKNESS CALCULATING METHOD
An object is to accurately measure thickness of a film, which is an object of polishing, during polishing of a substrate. A substrate polishing apparatus comprises: a polishing table which is provided with an eddy current sensor and constructed to be able to rotate; a polishing head which is arranged to face the polishing table, constructed to be able to rotate, and constructed to allow a substrate to be attached to a surface facing the polishing table; and a controller. The controller is constructed to obtain pieces of waveform data of output signals of the eddy current sensor when the eddy current sensor has passed multiple paths on the substrate; identify, in the multiple paths on the substrate, mutually corresponding multiple points that are in positions at same distances from the center of the substrate; compare values of the output signals of the eddy current sensor obtained at the identified multiple points to thereby find a minimum value; correct the pieces of waveform data based on the found minimum values; and calculate thickness of a film on a surface of the substrate, based on the corrected pieces of waveform data.
The present invention relates to a metal interconnect structure containing no barrier metal and a method of manufacturing the metal interconnect structure. The method includes: filling at least a first interconnect trench with an intermetallic compound by depositing the intermetallic compound on an insulating layer having the first interconnect trench and a second interconnect trench formed in the insulating layer, the second interconnect trench being wider than the first interconnect trench; performing a planarization process of polishing the intermetallic compound until the insulating layer is exposed; and then performing a height adjustment process of polishing the intermetallic compound and the insulating layer until a height of the intermetallic compound in the first interconnect trench reaches a predetermined height.
A cleaning method which can obtain highly reproducible cleaning efficiency by forcibly controlling a shape of a wafer using roll cleaning members. The scrub cleaning operation for a wafer includes: a reference cleaning operation of scrubbing the first surface and the second surface of the wafer with the first roll cleaning member and the second roll cleaning member located at a reference cleaning position; a first offset cleaning operation of scrubbing the first surface and the second surface of the wafer with the first roll cleaning member and the second roll cleaning member located at a first offset cleaning position shifted from the reference cleaning position in a direction toward the first roll cleaning member; and a second offset cleaning operation of scrubbing the first surface and the second surface of the wafer with the first roll cleaning member and the second roll cleaning member located at a second offset cleaning position shifted from the reference cleaning position in a direction toward the second roll cleaning member.
A wide area of power supply contacts are cleaned while suppressing the generation of contamination in the interior of a substrate holder. A maintenance substrate MWF for cleaning the power supply contacts of a plating device comprises: a maintenance substrate body 290; and a cleaning member 292 disposed in a contact region 243a of the maintenance substrate body 290 with which the power supply contact comes into contact when the maintenance substrate body 290 is clamped to a substrate holder having the power supply contact. The cleaning member 292 is formed of an elastic body that can hold a cleaning fluid.
The present invention provides a structural component mounting structure that can reduce the likelihood of incorrect mounting of structural components in a substrate processing device. When structural components are attached to the substrate processing device, a plurality of divided bodies combine to function as functional components. In the structural component mounting structure, a divided body has mounting parts 41A, 42A. The plurality of divided bodies differ in shape from one another. The substrate processing device is provided with a first receiving part 51 to which the mounting parts 41A, 42A are detachably attached. A first engagement projection 63A is formed on either the mounting parts 41A, 42A or the first receiving part 51. A first receiving recess 43A is formed in the other of the mounting parts 41A, 42A and the first receiving part 51 and engages with the first engagement projection 63A when a specific divided body from among the plurality of divided bodies is mounted on the first receiving part 51.
The present invention prevents wear of an outer peripheral edge of a retainer and improves the uniformity of the polishing profile of a substrate. A retainer 314 is disposed so as to surround a substrate on a top ring which presses the substrate toward a polishing pad. The retainer 314 includes: a first member 314a that has a sliding surface with the polishing pad; a second member 314b that has a sliding surface with the polishing pad disposed outside of the sliding surface of the first member 314a, and that has higher wear resistance to sliding with the polishing pad than the first member 314a does; and a joining mechanism 320 that joins the first member 314a and the second member 314b.
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
66.
MATERIAL APPLICATION DEVICE AND MATERIAL APPLICATION METHOD
The present invention pertains to technology for measuring an amount of a filler applied to an edge portion of a laminated wafer. A material application device (1) comprises: an application module (3) that applies a filler (F) to an edge portion of a laminated wafer (Ws); a load measuring instrument (21) that measures the weight of the laminated wafer (Ws); and an application amount calculator (22) that acquires a first weight measurement value output from the load measuring instrument (21) before the filler (F) is applied to the laminated wafer (Ws), acquires a second weight measurement value output from the load measuring instrument (21) when the filler (F) is being applied to the laminated wafer (Ws) or after the filler (F) is applied to the laminated wafer (Ws), and calculates an amount of the filler (F) applied to the laminated wafer (Ws) by subtracting the first weight measurement value from the second weight measurement value.
B05C 11/08 - Étalement du liquide ou d'un autre matériau fluide par manipulation de la pièce traitée, p. ex. par inclinaison
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
B05D 7/00 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers
The present invention boosts substrate cleaning power. Provided is a substrate cleaning device comprising: a two-fluid nozzle that supplies two fluids to a rotating substrate; a first rinsing nozzle that supplies a rinsing liquid to the rotating substrate; and a movement mechanism that holds and moves the two-fluid nozzle and the first rinsing nozzle. When the center-side of the rotating substrate is defined as upstream and the outer circumference-side of the substrate is defined as downstream, the first rinsing nozzle supplies the rinsing liquid to a location that is on the upstream side or the downstream side of a location where the two fluids are supplied.
The present application relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: measuring surface shapes of an edge portion of a first substrate and an edge portion of a second substrate; determining an applying condition for the filler to be applied to the laminated substrate based on results of the measuring of the surface shapes; and applying the filler to a gap between the edge portion of the first substrate and the edge portion of the second substrate of the laminated substrate under the determined applying condition.
B32B 37/24 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches avec au moins une couche qui ne présente pas de cohésion avant la stratification, p. ex. constituée de matériau granulaire projeté sur un substrat
B32B 38/00 - Opérations auxiliaires liées aux procédés de stratification
B32B 41/00 - Dispositions pour le contrôle ou la commande des procédés de stratificationDispositions de sécurité
[Problem] To provide an invention assistance system which utilizes generative AI to efficiently create a creative invention. [Solution] An invention assistance system 1 comprises: a problem reception unit 201 that receives problem information D60; a first prompt generation unit 202 that generates, on the basis of the problem information D60, first prompt information D62 for giving an instruction to a generative artificial intelligence model so as to output first answer information D63 comprising one or more invention principles for solving a problem, from among invention principle information D61; a first answer provision unit 203 that provides the first answer information D63 that has been output from the generative artificial intelligence model by inputting the first prompt information D62 into the generative artificial intelligence model; a second prompt generation unit 204 that generates, on the basis of the first answer information D63, second prompt information D64 for giving an instruction to the generative artificial intelligence model so as to output second answer information D65 indicating an invention for solving the problem, while combining the one or more invention principles included in the first answer information D63; and a second answer provision unit 205 that provides the second answer information D65 that has been output from the generative artificial intelligence model by inputting the second prompt information D64 into the generative artificial intelligence model.
An object is to provide a polishing apparatus which is able to monitor, in an efficient manner, film thickness of a to-be-polished object in a various kinds of to-be-polished objects.
An object is to provide a polishing apparatus which is able to monitor, in an efficient manner, film thickness of a to-be-polished object in a various kinds of to-be-polished objects.
The polishing apparatus comprises: a polishing head, a polishing table, and a film thickness measuring system; the film thickness measuring system comprises multiple sensor heads installed in the polishing table, wherein each sensor head comprises an eddy current sensor, and a controller; and the controller comprises an oscillator which creates a common clock signal for driving the eddy current sensors, and multiple control circuits installed to correspond to the multiple sensor heads, respectively, wherein each control circuit is constructed to create, based on the clock signal from the oscillator, a driving signal supplied to an eddy current sensor in a corresponding sensor head and process a measurement signal received from the eddy current sensor in the corresponding sensor head.
The present application relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: measuring surface shapes of an edge portion of a first substrate and an edge portion of a second substrate; determining an applying condition for the filler to be applied to the laminated substrate based on results of the measuring of the surface shapes; and applying the filler to a gap between the edge portion of the first substrate and the edge portion of the second substrate of the laminated substrate under the determined applying condition.
B32B 37/24 - Procédés ou dispositifs pour la stratification, p. ex. par polymérisation ou par liaison à l'aide d'ultrasons caractérisés par les propriétés des couches avec au moins une couche qui ne présente pas de cohésion avant la stratification, p. ex. constituée de matériau granulaire projeté sur un substrat
B32B 38/00 - Opérations auxiliaires liées aux procédés de stratification
B32B 41/00 - Dispositions pour le contrôle ou la commande des procédés de stratificationDispositions de sécurité
Provided is technology enabling film thickness to be made uniform. This plating method includes: supply processing (S5) in which a substrate is supplied to a plating bath in which an anode and an intermediate member are disposed. The substrate is supplied to a location not in contact with the intermediate member. The substrate has a pattern formation region where a plurality of patterns are formed. The contour shape of the pattern formation region is non-circular. The intermediate member includes, in plan view, a hole formation region where a plurality of holes through which a plating liquid can pass are formed, and an electric field shielding region disposed around the hole formation region. The contour shape of the hole formation region corresponds to the contour shape of the pattern formation region. The plating method also includes: alignment processing (S10) in which the position of the substrate is adjusted so that the contour shape of the pattern formation region and the contour shape of the hole formation region are spatially aligned; and first energization processing (S20) in which the anode and the substrate are energized while the substrate is made to move in a swinging rotational motion.
The present invention pertains to a heat medium supply device for supplying a heat medium used for adjusting the temperature of a semiconductor production device such as an etching device, a CVD device, or a PVD device. This heat medium supply device (1) comprises: a cooling device (3) that cools a heat medium; a heat medium feed line (10) that conveys the heat medium which is cooled by the cooling device (3) and used to adjust the temperatures of a plurality of processing chambers (100); and an operation control unit (5) that controls the operation of the cooling device (3) in a manner such that the temperature of the heat medium measured by a heat medium supply temperature measurement device (58) is kept at a prescribed temperature. The cooling device (3) is provided with: an evaporator (35) for generating a refrigerant vapor by evaporating a refrigerant liquid via the heat of the heat medium; a plurality of compressors (36) for compressing the refrigerant vapor; and a condenser (38) for generating a refrigerant liquid by condensing the compressed refrigerant vapor.
F25B 1/00 - Machines, installations ou systèmes à compression à cycle irréversible
F25B 1/053 - Machines, installations ou systèmes à compression à cycle irréversible à compresseur rotatif du type à turbine
F25B 5/00 - Machines, installations ou systèmes à compression, avec plusieurs circuits d'évaporateurs, p. ex. pour faire varier la puissance frigorifique
F25B 41/20 - Disposition des soupapes, p. ex. de soupapes marche-arrêt ou de soupapes de régulation de débit
F25B 49/02 - Disposition ou montage des dispositifs de commande ou de sécurité pour machines, installations ou systèmes du type à compression
74.
SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
A substrate cleaning apparatus (18) starts supply of a first rinse liquid to a surface (W1) of a substrate (W) from a rinse liquid nozzle (75). After formation of a liquid film for particle detachment on the surface (W1) of the substrate (W) with the first rinse liquid, dispensing of a jet flow of the cleaning liquid to the surface (W1) of the substrate (W) from the jet flow nozzle (72) is started, and movement of the cleaning arm (73) is started. Furthermore, after the movement of the cleaning arm (73) is started, supply of the second rinse liquid to the surface (W1) of the substrate (W) from the rinse liquid nozzle (75) is started, forming a liquid film for particle discharge on the surface (W1) of the substrate (W) with the second rinse liquid.
The present invention forms a plurality of bumps at a uniform height on a substrate. A plating device for forming a plating film on a substrate includes: a substrate holder for holding the substrate; a plating tank for storing a plating solution together with the substrate holder; an anode disposed in the plating tank so as to face the substrate held by the substrate holder; a power supply for supplying a plating current between the substrate and the anode; and a control unit. The control unit causes the power supply to output a plating current that repeats a forward current period in which a forward current for causing a metal to be deposited on the substrate from the plating solution is supplied, a reverse current period in which a reverse current pulse flowing in the opposite direction to the forward current is supplied, and a current pause period in which the supply of current is paused partway during a transition from the reverse current pulse to the forward current. The control unit controls the length of the current pause period such that the width of fluctuation of the plating voltage after the reverse current pulse is supplied falls within a predetermined range.
The present invention improves the uniformity of the thickness distribution of a plating film at a peripheral edge section of a substrate. A plating module 400 includes: a plating tank 410 for accommodating a plating liquid; an anode 430 that is positioned in the plating tank 410; a substrate holder 440 that is for holding a substrate Wf in a condition in which a surface Wf-a for plating is facing downward; a rotation mechanism 447 that is configured so as to rotate the substrate holder 440; a thief electrode 481 that is positioned in a retreat position, said retreat position being separated from an adjustment position between the anode 430 and the substrate Wf; and an adjustment member 485 that is configured so as to move the thief electrode 481 between the adjustment position and the retreat position.
Disclosure relates to a substrate processing apparatus that can quickly transport a substrate to a cleaning module after surface processing of the substrate is performed. The substrate processing apparatus includes processing units each for processing a substrate and a relay transporter that transports the substrate between the processing units. Each processing unit includes a surface-processing module, a cleaning module, a drying module, a substrate transporter extending from one side to opposite side of each processing unit, and a processing transporter that transports the substrate from the substrate transporter to the surface-processing module and from the surface-processing module to the cleaning module.
The present invention appropriately shields a non-pattern area according to a chip arrangement pattern on a substrate. This resistor mask is disposed between an anode and a substrate in a plating apparatus, and is used for a resistor having a cross-shaped pattern area formed by two overlapping rectangles. The resistor mask comprises: first to fourth mask pieces provided in correspondence with the respective corners of one of the two rectangles; and fifth and sixth mask pieces provided for a pair of projection portions extending outward from two sides opposing each other in said one of the rectangles.
There is provided a method of liquid management in an anode chamber. The method comprises providing a plating tank that comprises an anode; a barrier membrane placed to come into contact with or to be brought into close contact with an upper face of the anode; a cathode chamber on an upper side and an anode chamber on a lower side parted by the barrier membrane; and an exhaust path provided to communicate with the anode chamber and configured to discharge bubbles from the anode chamber to outside of the plating tank; storing a plating solution in the anode chamber and in the cathode chamber, such that a liquid level of the plating solution in the exhaust path that is a liquid level of the plating solution in the anode chamber is lower than a liquid level of the plating solution in the cathode chamber; determining whether the liquid level of the plating solution in the exhaust path is lower than a predetermined height, based on an output of a liquid level sensor placed in the exhaust path; and supplying pure water or an electrolytic solution to the anode chamber, when it is determined that the liquid level of the plating solution in the exhaust path is lower than the predetermined height.
A substrate cleaning apparatus includes: first and second cleaning units including first and second cleaning nozzles spraying cleaning solutions toward a substrate at a cleaning position, respectively, the second cleaning nozzle having a smaller spray port diameter; first and second valves switching between spraying and not spraying the cleaning solution from the first cleaning nozzle and between spraying and not spraying the cleaning solution from the second cleaning nozzle, respectively; and a control unit controlling the first and second valves to spray the cleaning solutions from the respective cleaning units. The control unit executes first self-cleaning where the cleaning solution exits from the first valve and second self-cleaning in which the cleaning solution exits from the second valve when the substrate is not at the cleaning position, and executes the first self-cleaning before the second self-cleaning.
Provided is a technique with which it is possible to suppress deterioration in plating quality of a substrate caused by air bubbles. This air bubble removal method for a plating device includes: performing a first process for making the pressure of an anode chamber higher than the pressure of a cathode chamber, thereby causing a diaphragm to protrude upward, and collecting air bubbles onto the lower surface of the portion of the diaphragm protruding upward; performing a second process for making the pressure of the cathode chamber higher than the pressure of the anode chamber, thereby causing the diaphragm to protrude downward, and moving the air bubbles to the outer peripheral edge of the diaphragm; and performing a third process for causing the air bubbles moved to the outer peripheral edge of the diaphragm to be suctioned into an anolyte discharge port disposed in the anode chamber, and discharged from the anode chamber.
Forming plural bumps on a substrate in such a manner that the bumps have uniform heights. A plating apparatus for forming bumps on a substrate is provide. The plating apparatus comprises: a substrate holder constructed to hold the substrate; a plating tank constructed to store plating liquid and the substrate holder; an anode arranged in the inside of the plating tank in such a manner that the anode faces the substrate held by the substrate holder; an electric power source constructed to supply electric current flowing between the substrate and the anode; and a controller; wherein the controller is constructed to make the electric power source output electric current that comprises a first period during that positive-direction electric current is supplied for depositing metal on the substrate from the plating liquid, a second period during that at lest one reverse-current pulse, that flows in a direction opposite to a direction of the positive-direction electric current, is supplied, and a third period during that supplying of electric current is stopped, wherein the third period is a period in the middle of a transition from the reverse-current pulse to the positive-direction electric current.
The present invention relates to a technique for polishing a workpiece while adjusting the surface temperature of a polishing pad. This polishing apparatus comprises: a pad temperature adjustment system (10) that adjusts the temperature of a polishing surface (3a) by selectively supplying a heating fluid or a cooling fluid to the polishing surface (3a); a polishing liquid temperature adjustment system (40) that adjusts the temperature of a polishing liquid before the polishing liquid is supplied to the polishing surface (3a); and an operation control unit (37) that imparts commands to the pad temperature adjustment system (10) and the polishing liquid temperature adjustment system (40), and causes the polishing liquid temperature adjustment system (40) to adjust the temperature of the polishing liquid while causing the pad temperature adjustment system (10) to supply either the heating fluid or the cooling fluid to the polishing surface (3a).
B24B 37/00 - Machines ou dispositifs de rodageAccessoires
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/12 - Plateaux de rodage pour travailler les surfaces planes
B24B 49/14 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage tenant compte de la température pendant le meulage
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
An information processing apparatus (3) executes, on substrate processing units and a substrate transport unit, first mathematical optimization for determining a start timing of each process on a substrate without setting an exclusive processing condition for selecting one of two processes as a constraint condition of the mathematical optimization, and determines whether there is a substrate processing unit or a substrate transport unit executing processes that are not simultaneously executable based on a result. The apparatus (3) executes second mathematical optimization of determining a start timing of each process on the substrate on the substrate processing unit or the substrate transport unit determined to execute the processes that are not simultaneously executable by adding an exclusive processing condition for determining which process is prioritized between the two processes that are not simultaneously executable among the processes on the substrate to the constraint condition of the first mathematical optimization.
G06Q 10/0631 - Planification, affectation, distribution ou ordonnancement de ressources d’entreprises ou d’organisations
G06Q 10/04 - Prévision ou optimisation spécialement adaptées à des fins administratives ou de gestion, p. ex. programmation linéaire ou "problème d’optimisation des stocks"
The present invention relates to a pump apparatus for delivering cryogenic liquefied gas, such as liquid hydrogen or liquefied natural gas, and in particular to a pump apparatus having an electric motor as a driving source for a pump. The pump apparatus includes a pump (1) having an impeller (2), a rotational shaft (5) to which the impeller (2) is fixed, and an electric motor (7) for rotating the rotational shaft (5) and the impeller (1). A rotor assembly (21) of the electric motor (7) includes a motor rotor (40) fixed to the rotational shaft (5), side rings arranged at both sides of the motor rotor (40), and a hermetic cover (42) fixed to outer circumferential surfaces of the side rings The hermetic cover (42) is made of glass fiber.
This gas generation apparatus (1) comprises: a first electrode (7); a second electrode (9); a discharge space (12) which is formed between the first electrode (7) and the second electrode (9) and in which a generated gas is generated from a material gas when a voltage is applied; a base member (3) for holding the second electrode (9); a cable insertion path (13) through which a cable (C) for supplying power to the second electrode (9) is inserted; and a refrigerant flow path (14) through which a cooling medium for cooling the second electrode (9) held by the base member (3) is supplied. The refrigerant flow path (14) is disposed inside the base member (3) so as to sandwich the cable insertion path (13) from both sides in the thickness direction of the base member (3).
A gas solution production device (8) is provided with a gas solution module (80) and a condensed water discharge mechanism (81). The condensed water discharge mechanism (81) comprises: a drain pipe (83) for draining condensed water; a first liquid level sensor (84) provided on the upstream side of the drain pipe (83); a second liquid level sensor (85) provided on the downstream side of the drain pipe (83); an on-off valve (86); and a controller (88). The controller (88) performs an opening control for opening the on-off valve (86) when the first liquid level sensor (84) detects condensed water, and performs a closing control for closing the on-off valve (86) when the second liquid level sensor (85) no longer detects condensed water.
B01D 61/00 - Procédés de séparation utilisant des membranes semi-perméables, p. ex. dialyse, osmose ou ultrafiltrationAppareils, accessoires ou opérations auxiliaires, spécialement adaptés à cet effet
B01F 23/23 - Mélange de gaz avec des liquides en introduisant des gaz dans des milieux liquides, p. ex. pour produire des liquides aérés
The present invention relates to technology for preventing idling of a submersible pump used for transferring liquefied gas, such as liquid hydrogen, liquid nitrogen, liquefied ammonia, liquefied natural gas, liquefied ethylene gas, and liquefied petroleum gas. This flow path switching device (5) comprises a valve body (42) that selectively causes an outlet flow path (35) to communicate with either a first inlet flow path (31) or a second inlet flow path (32). The first inlet flow path (31), the second inlet flow path (32), the outlet flow path (35), and a pressurizing chamber (38) communicate with a valve chamber (37). When the valve body (42) is in an open position, the pressurizing chamber (38) communicates with the second inlet flow path (32). The pressurizing chamber (38), the valve chamber (37), and the first inlet flow path (31) are arranged along the direction in which the valve body (42) moves. The valve body (42) in the open position is positioned between the pressurizing chamber (38) and the first inlet flow path (31).
F16K 11/02 - Soupapes ou clapets à voies multiples, p. ex. clapets mélangeursRaccords de tuyauteries comportant de tels clapets ou soupapesAménagement d'obturateurs et de voies d'écoulement spécialement conçu pour mélanger les fluides dont toutes les faces d'obturation se déplacent comme un tout
F04D 7/02 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge
Provided is a novel substrate detection technique different from inventions described in the background. Provided is a substrate detection device comprising: at least one radar device having a transmitter that transmits radio waves to a substrate held by a substrate holding unit, and a receiver that receives radio waves reflected by the substrate; and a detector that detects the presence or absence of the substrate on the basis of the radio waves received by the receiver.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
The present invention suitably removes, in water polishing after polishing using a polishing liquid, the polishing liquid or polishing debris. This polishing device comprises a water supply mechanism configured to supply water to a supply position located in a central region of a polishing surface of a polishing pad. The polishing device, after performing a first polishing of polishing an object to be polished by pressing the object to be polished against the polishing pad while supplying a polishing liquid from a polishing liquid supply mechanism, stops the supply of the polishing liquid, and performs a second polishing of pressing the object to be polished against the polishing pad while supplying water from the water supply mechanism to the supply position at a flow rate of 5 L/min to 15 L/min.
B24B 53/017 - Dispositifs ou moyens pour dresser, nettoyer ou remettre en état les outils de rodage
B24B 37/00 - Machines ou dispositifs de rodageAccessoires
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 55/06 - Équipement d'enlèvement des poussières sur les machines à meuler ou à polir
B24B 57/02 - Dispositifs pour l'alimentation, l'application, le triage ou la récupération de produits de meulage, polissage ou rodage pour l'alimentation en produits de meulage, polissage ou rodage à l'état fluide, vaporisés, pulvérisés ou liquéfiés
The present invention relates to a reciprocating pump device for increasing the pressure of liquefied gas such as liquid hydrogen, liquefied natural gas, liquefied ammonia, liquid nitrogen, liquefied ethylene gas, and liquefied petroleum gas. The reciprocating pump device for liquefied gas is provided with: a cylinder (1); a piston (2) disposed in the cylinder (1); a pump shaft (41) coupled to the piston (2); a ball screw nut (42) fixed to the pump shaft (41); a screw shaft (45) screwed to the ball screw nut (42); and an electric motor (48) coupled to the screw shaft (45) and rotating the screw shaft (45).
F04B 15/08 - Pompes adaptées pour travailler avec des fluides particuliers, p. ex. grâce à l'emploi de matériaux spécifiés pour la pompe elle-même ou certaines de ses parties avec des liquides près de leur point d'ébullition, p. ex. à une pression anormalement basse les liquides ayant une température d'ébullition peu élevée
92.
VACUUM PUMP WITH ABATEMENT FUNCTION AND CONTROL METHOD THEREFOR
The present invention reduces the period during which a vacuum pump with an abatement function cannot be operated. Provided is a vacuum pump with an abatement function, comprising a dry pump for evacuating exhaust gas from a tool, and an abatement section for abating the exhaust gas evacuated by the dry pump, wherein the dry pump comprises: a pedestal; a booster pump disposed on the pedestal and connected to the tool; a first main pump disposed at the side of the pedestal and connected to the booster pump; and a second main pump disposed at the side of the pedestal and connected to the booster pump.
In the present invention, the operation status of a plating device is accurately ascertained. Provided is a plating device for forming a plating film on a substrate, said plating device comprising: a substrate holder configured to hold the substrate; a plating tank configured to accommodate a plating solution together with the substrate holder; an anode disposed in the plating tank so as to face the substrate held by the substrate holder; a film thickness measurement unit configured to measure the film thickness of the plating film formed on the substrate at points on the substrate; and a control unit for controlling the plating device. The control unit includes: an imaging sub-unit configured to generate, on the basis of a film thickness measurement value at each of the points on the substrate, an image map representing a film thickness distribution on the substrate; a machine learning model trained to output an estimated status related to a plating process of the plating device when the image map is input; and a diagnosis sub-unit configured to diagnose the plating device on the basis of the estimated status output from the machine learning model.
The present application relates to a buffer gate for use in isolating inside and outside of a pump column when a submersible pump for pressurizing liquefied gas, such as liquid hydrogen, is carried into the pump column and when the submersible pump is pulled up from the pump column. The buffer gate is configured to isolate the inside and the outside of the pump column in which the submersible pump is disposed, the submersible pump being for delivering the liquefied gas. The buffer gate includes a buffer box having a buffer chamber therein, a first partition wall configured to close an upper opening of the buffer box, a second partition wall configured to close an upper opening of the pump column, and a purge-gas inlet port communicating with the buffer chamber. The buffer box is fixed to an upper end of the pump column.
B67D 7/02 - Appareils ou dispositifs pour transférer des liquides à partir de récipients ou de réservoirs de stockage en vrac vers des véhicules ou des récipients portables, p. ex. pour la vente au détail pour transférer des liquides autres que des carburants ou des lubrifiants
The present invention relates to a motor pump. The motor pump (MP) includes a rotor holder (200) holding a rotor (2) and an impeller (1) which is a press-molded product, and the rotor holder (200) is fixed to the impeller (1).
A pump casing capable of preventing clogging of a pump caused by foreign matter is disclosed. The pump includes: an impeller; and a pump casing that houses the impeller therein. The pump casing has a cutter that faces a leading edge of the impeller. The cutter has a front-side surface that forms a front side of the cutter in a rotation direction of the impeller. An angle formed between the front-side surface of the cutter and the leading edge of the impeller as viewed from a direction of a rotation axis of the impeller gradually decreases with rotation of the impeller. A maximum value of the angle is less than 90 degrees.
F04D 7/04 - Pompes adaptées à la manipulation de liquides particuliers, p. ex. par choix de matériaux spéciaux pour les pompes ou pièces de pompe du type centrifuge les fluides étant visqueux ou non homogènes
F04D 29/42 - Carters d'enveloppeTubulures pour le fluide énergétique pour pompes radiales ou hélicocentrifuges
97.
Mechanical reverse rotation prevention device for canned motor pump
A reverse rotation prevention device for a canned motor pump includes: a rotor 110 rotating together with a main shaft of a motor; a stator 120 provided to be spaced at a first distance apart from an outer peripheral surface of the rotor 110; a plurality of hinges 130 arranged parallel to the main shaft, positioned between the outer peripheral surface of the rotor 110 and an inner peripheral surface of the stator 120, and placed at a preset interval on a circumference spaced a second distance apart from the outer peripheral surface of the rotor 110, the second distance being half the first distance; and a plurality of wedges 140 rotatably connected to the plurality of hinges 130, and rotating in one direction due to centrifugal force according to a flow direction of fluid F provided in a space formed between the rotor 110 and the stator 120.
F16D 41/07 - Roues libres ou embrayages à roue libre avec organes d'accouplement intermédiaires d'arrêt entre une surface intérieure et une surface extérieure les organes intermédiaires d'arrêt agissant en pivotant ou basculant, p. ex. cales entre deux surfaces cylindriques
F16D 66/00 - Dispositions pour la surveillance des conditions de fonctionnement des freins, p. ex. de l'usure ou de la température
F04D 13/06 - Ensembles comprenant les pompes et leurs moyens d'entraînement la pompe étant entraînée par l'électricité
The cooling-down method includes introducing liquefied gas into suction containers (2A, 2B) simultaneously through introduction lines (121, 122) extending from a liquefied-gas storage tank (105), passing the liquefied gas through a flow-path switching device (5A) in the suction container (2A) while the liquefied gas bypasses a submerged pump (1A) in the suction container (2A), and passing the liquefied gas through a flow-path switching device (5B) in the suction container (2B) while the liquefied gas bypasses a submerged pump (1B) in the suction container (2B), and discharging the liquefied gas from the suction container (2A) and the suction container (2B) through the flow-path switching device (5A) and the flow-path switching device (5B).
A monitoring system according to the present invention is for monitoring a vacuum pump device that comprises one or more vacuum pumps and one or more sensors that measure the amounts of powder included in gas sucked into the one or more vacuum pumps near intake ports and/or near exhaust ports of the one or more vacuum pumps. The monitoring system comprises an acquisition unit that acquires output values that are outputted from the one or more sensors and an estimation unit that finds estimated values for the amounts of powder accumulated at the one or more vacuum pumps on the basis of the output values.
NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY (Japon)
Inventeur(s)
Koshino, Ryota
Yasuda, Hozumi
Honjo, Keiji
Masuya, Koichi
Aida, Hideo
Abrégé
A new evaluation method for a work-affected layer using an eddy current sensor is provided. A polishing device for polishing a workpiece having a work-affected layer is provided. This polishing device comprises: a first holder configured to hold and rotate the workpiece; a second holder configured to hold and rotate a polishing tool for polishing the workpiece so as to face the workpiece; at least one eddy current sensor provided at one of the first holder and the second holder; and a controller. The controller is configured to acquire an output signal of the eddy current sensor during polishing of the workpiece, calculate an electric resistance value of a polished layer in the workpiece on the basis of the output signal of the eddy current sensor, and determine the thickness of the work-affected layer in the workpiece on the basis of a deviation of the calculated electric resistance value of the polished layer from a predetermined reference.
B24B 37/013 - Dispositifs ou moyens pour détecter la fin de l'opération de rodage
B24B 37/005 - Moyens de commande pour machines ou dispositifs de rodage
B24B 37/10 - Machines ou dispositifs de rodageAccessoires conçus pour travailler les surfaces planes caractérisés par le déplacement de la pièce ou de l'outil de rodage pour un rodage simple face
B24B 37/30 - Supports de pièce pour rodage simple face de surfaces planes
B24B 49/04 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage comparant la cote instantanée de la pièce travaillée à la cote cherchée, la mesure ou le calibrage étant continus ou intermittents impliquant la mesure de la cote de la pièce sur le lieu du meulage pendant l'opération de meulage
B24B 49/10 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs électriques
