An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p. ex. d'air
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
2.
TEMPERATURE CONTROL SYSTEM INCLUDING CONTACTOR ASSEMBLY
A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.
H01L 23/367 - Refroidissement facilité par la forme du dispositif
F25B 45/00 - Dispositions pour l'introduction ou l'évacuation du frigorigène
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
G05D 23/30 - Commandes automatiques avec un dispositif de chauffage auxiliaire affectant l'élément sensible, p. ex. pour prévoir les variations de température
H01L 23/38 - Dispositifs de refroidissement utilisant l'effet Peltier
3.
Temperature control system including contactor assembly
A method for controlling temperature in a temperature control system. The method includes providing a temperature control system including a controller, a first contactor assembly having a first channel system, a plurality of first contacts, each of the first contacts including a portion that is disposed within the first channel system, and one or more of a first exhaust valve or a first inlet valve, and a second contactor assembly having a second channel system, a plurality of second contacts, each of the second contacts including a portion that is disposed within the second channel system, and one or more of a second exhaust valve or a second inlet valve. The method also includes receiving, by the first contactor assembly, a fluid at a first temperature. The method also includes receiving, by the second contactor assembly, the fluid at the first temperature.
G01R 31/02 - Essai des appareils, des lignes ou des composants électriques pour y déceler la présence de courts-circuits, de discontinuités, de fuites ou de connexions incorrectes de lignes
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
4.
INTEGRATED CIRCUIT TESTING DEVICE WITH COUPLED CONTROL OF THERMAL SYSTEM
A system includes a plurality of thermally-coupled zones and a plurality of thermal control devices, each controllable to thermally control one of the plurality of zones, and a plurality of temperature sensors, each configured to measure temperature of one of the plurality of zones. The system includes a control circuit configured to receive a temperature measurement for each of the plurality of zones, collect the temperature measurements in a temperature vector in a real coordinate system, and transform the temperature vector to a normal coordinate system that provides a plurality of uncoupled equations. The control circuit is configured to determine, based on the plurality of uncoupled equations and a desired temperature gradient, a desired power vector in the normal coordinate system, transform the desired power vector to the real coordinate system to generate a power vector, and control the plurality of heaters in accordance with the power vector.
A system includes a plurality of thermally-coupled zones and a plurality of thermal control devices, each controllable to thermally control one of the plurality of zones, and a plurality of temperature sensors, each configured to measure temperature of one of the plurality of zones. The system includes a control circuit configured to receive a temperature measurement for each of the plurality of zones, collect the temperature measurements in a temperature vector in a real coordinate system, and transform the temperature vector to a normal coordinate system that provides a plurality of uncoupled equations. The control circuit is configured to determine, based on the plurality of uncoupled equations and a desired temperature gradient, a desired power vector in the normal coordinate system, transform the desired power vector to the real coordinate system to generate a power vector, and control the plurality of heaters in accordance with the power vector.
An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
F28F 7/00 - Éléments non couverts par les groupes , ou
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p. ex. d'air
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.
An assembly for controlling the temperature of a device includes: a heat sink configured to be maintained at a temperature below a desired set point temperature; a heater element having a surface configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
An assembly (50) for controlling the temperature of a device includes: a heat sink (56) configured to be maintained at a temperature below a desired set point temperature; a heater element (62) having a surface (64) configured to be thermally coupled to a surface of the device; and a thermally conductive pedestal (54) interposed between the heat sink and the heater element. The heater is configured to apply heat to the device when the temperature of the device falls below the set point temperature, and heat is transferable to the heat sink through the pedestal and heater element when the temperature of the device is above the set point temperature.
A thermal control method and assembly uses an expansion chamber structured to receive liquid nitrogen and expand the liquid to nitrogen gas having a first temperature. The nitrogen gas having the first temperature is provided to a system. A pump is configured to receive the nitrogen gas at a second temperature and a second pressure from the system. The pump is further configured to pump the nitrogen gas at a third temperature and third pressure. A sump is structured to receive the nitrogen gas at the third temperature and the third pressure from the pump, and recirculate at least a portion of the nitrogen gas to the expansion chamber.
F25B 9/02 - Machines, installations ou systèmes à compression dans lesquels le fluide frigorigène est l'air ou un autre gaz à point d'ébullition peu élevé utilisant l'effet Joule-ThompsonMachines, installations ou systèmes à compression dans lesquels le fluide frigorigène est l'air ou un autre gaz à point d'ébullition peu élevé utilisant l'effet vortex
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
A thermal control method and assembly uses an expansion chamber structured to receive liquid nitrogen and expand the liquid to nitrogen gas having a first temperature. The nitrogen gas having the first temperature is provided to a system. A pump is configured to receive the nitrogen gas at a second temperature and a second pressure from the system. The pump is further configured to pump the nitrogen gas at a third temperature and third pressure. A sump is structured to receive the nitrogen gas at the third temperature and the third pressure from the pump, and recirculate at least a portion of the nitrogen gas to the expansion chamber.
A system includes: a bottom contactor assembly; a top contactor assembly; and a contactor vision alignment system located separate from a test site of an integrated circuit device testing system. The contactor vision alignment system includes: a downward-looking camera, an upward-looking camera, an adjustment mechanism configured to move the top contactor assembly, and a controller configured to: determine a first offset between a bottom side integrated circuit device contact array and a bottom contactor contact array, cause the adjustment mechanism to align the bottom side integrated circuit device contact array with the bottom contactor contact array based on the determined first offset, determine a second offset between the top contactor contact array and a top side integrated circuit device contact array, and cause the adjustment mechanism to align the top contactor with respect to the top side device contact array based on the determined second offset.
A thermal control head for a semiconductor device handler includes: a heater configured to heat a semiconductor device; a cold manifold; and a cooling mass that is movable between: a first position at which a first surface of the cooling mass contacts a surface of the cold manifold, and a second position at which the first surface of the cooling mass is separated from the cold manifold, and a second surface of the cooling mass contacts a surface of the heater.
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device testing system further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.
An integrated circuit device testing system includes a socket configured to receive an integrated circuit device, wherein the socket comprises at least one conductive trace made of a material with a resistivity that is a function of temperature, and wherein the socket is configured such that, when the integrated circuit device is located in the socket, the at least one conductive trace extends along a surface of the integrated circuit device. The integrated circuit device further includes a controller or active circuit configured to determine a temperature at the surface of the integrated circuit device based on a measured resistance of the at least one conductive trace.
An offline vision assisted calibration system includes: a bottom side socket assembly that is mountable in an integrated circuit device handler and comprises: a socket plate that comprises a hole grid array; and a top contactor assembly that is mountable in an integrated circuit device handler and comprises: a guide plate, a plurality of fiducials located on a lower side surface of the guide plate, a contact holder plate comprising a top contactor contact array, and a plurality of adjustment actuators configured to move the contact holder plate with respect to the guide plate; and a calibration jig comprising an array of contacts on a bottom side thereof, wherein the calibration jig is configured to be placed in the socket plate such that the contacts engage with the hole grid array of the socket plate.
A test head for a semiconductor device handler includes a plunger; and a funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert. The plunger includes a projecting portion that extends through the channel of the funnel insert. When the spring is in an uncompressed state, a distal end of the funnel insert extends past a distal end of the projecting portion of the plunger.
A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.
G01S 17/02 - Systèmes utilisant la réflexion d'ondes électromagnétiques autres que les ondes radio
G01S 17/46 - Détermination indirecte des données relatives à la position
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
19.
Light line imager-based IC tray pocket detection system
A system for detecting a status of a pocket of a tray includes a tray having a plurality of pockets that hold an integrated circuit device, a vision mechanism, a light line generator, a reflective device, and a controller. The vision mechanism images the tray along a first optical axis. The light line generator emits a light line along a second optical axis. The reflective device reflects the light line onto the tray along a third optical axis. The third optical axis has a different angle relative to the first optical axis than an angle between the first optical axis and the second optical axis. The controller receives an image of the tray from the vision mechanism, detects the light line reflected onto the tray along the third optical axis, and determines a status of a pocket based on the detected light line along the third optical axis.
G01S 17/46 - Détermination indirecte des données relatives à la position
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
G01N 21/956 - Inspection de motifs sur la surface d'objets
A vision alignment system for a test handler system includes a transfer mechanism that transfers a device from an input side to a test side, a contactor array positioned at the test side, and a pick- and-place device that moves the device from the transfer mechanism to the contactor array. An engagement mechanism on the pick-and-place device engages with alignment devices on the transfer mechanism and contactor array. To avoid positioning the vision alignment system in the test side, a first vision mechanism is positioned away from the test socket and determines the position of the device in a common local coordinate system, a second vision mechanism is positioned at an output side and determines a position of the contactor array in the local coordinate system, and the correction mechanism corrects a position of the device based on an offset between the positions in the coordinate system.
An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
G01S 17/46 - Détermination indirecte des données relatives à la position
G01B 11/27 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes pour tester l'alignement des axes
22.
IC DEVICE-IN-POCKET DETECTION WITH ANGULAR MOUNTED LASERS AND A CAMERA
An apparatus includes a device holder including a device placement area configured to hold an electronic device, and a shoulder extending peripherally around the device placement area; a laser line generator configured to generate a laser line that includes (i) a device placement area laser line portion, and (ii) a shoulder area laser line portion; a camera configured to obtain an image of at least the laser line; and a processor configured to: receive the image from the camera, determine (i) an angle of the device placement area laser line portion, and/or (ii) an offset between the location of the device placement area laser line portion and the location of the shoulder area laser line portion, and determine whether an electronic device is positioned in the device placement area or positioned incorrectly in the device holder.
G01S 17/46 - Détermination indirecte des données relatives à la position
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
23.
CONTINUOUS FLUIDIC THERMAL INTERFACE MATERIAL DISPENSING
A temperature control system for controlling a temperature of an electronic device during testing of the electronic device includes a thermal head having a device contact face configured to contact the electronic device during testing; a fluidic thermal interface material (TIM) dispenser configured to dispense a fluidic TIM to a location between a face of the electronic device and the device contact face of the thermal head; and a fluidic TIM dispenser controller configured to control the TIM dispenser such that the TIM dispenser dispenses the fluidic TIM during a test cycle of the electronic device.
A cooling system for at least one thermal unit includes a tank assembly that includes: a sump chamber, a purge chamber that is located above the sump chamber, and a reservoir chamber that is located above the purge chamber; a cooling circuit that includes a pump, a heat exchanger, and conduits, the cooling circuit being configured to circulate a liquid coolant through the at least one thermal unit, the sump chamber, the pump, the heat exchanger, and the reservoir chamber; a first valve located externally of the tank assembly and configured such that, when the first valve is open, (i) the liquid coolant is flowable from the purge chamber to the sump chamber via the first valve, and (ii) air is simultaneously flowable from the sump chamber to the purge chamber via the first valve; and a second valve located externally of the tank assembly and configured such that, when the second valve is open, (i) the liquid coolant is flowable from the reservoir chamber to the purge chamber via the second valve, and (ii) air is simultaneously flowable from the purge chamber to the reservoir chamber via the second valve.
A cooling system for at least one thermal unit includes a tank assembly that includes: a sump chamber, a purge chamber that is located above the sump chamber, and a reservoir chamber that is located above the purge chamber; a cooling circuit that includes a pump, a heat exchanger, and conduits, the cooling circuit being configured to circulate a liquid coolant through the at least one thermal unit, the sump chamber, the pump, the heat exchanger, and the reservoir chamber; a first valve located externally of the tank assembly and configured such that, when the first valve is open, (i) the liquid coolant is flowable from the purge chamber to the sump chamber via the first valve, and (ii) air is simultaneously flowable from the sump chamber to the purge chamber via the first valve; and a second valve located externally of the tank assembly and configured such that, when the second valve is open, (i) the liquid coolant is flowable from the reservoir chamber to the purge chamber via the second valve, and (ii) air is simultaneously flowable from the purge chamber to the reservoir chamber via the second valve.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
26.
Micro-vision alignment system with guiding rings for IC testing
A vision alignment system for an integrated circuit device testing handler includes a head guiding ring configured to be attached to a pick-and-place device, the head guiding ring having an opening in which a device-under-test having a device contact array is locatable; a socket apparatus including: a fixed mounting frame, a moveable socket guiding ring, and a plurality of actuators configured to move the moveable socket guiding ring relative to the fixed mounting frame; and a visualization device configured to provide data relating to a position of the device contact array relative to the contactor pin array. The socket apparatus is configured to adjust a position of the head guiding ring by moving the moveable socket guiding ring while the head guiding ring is located in an opening of the moveable socket guiding ring to align the device contact array to the contactor pin array.
A semiconductor handler subassembly is provided. The semiconductor handler subassembly includes an adjustment apparatus with a floating lock that is configured to adjust and lock in place to a desired position, and a tip attached to the floating lock and configured to engage a part.
H01B 1/02 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement de métaux ou d'alliages
H01B 1/04 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement soit de compositions à base de carbone-silicium, soit de carbone soit de silicium
C09K 5/14 - Substances solides, p. ex. pulvérulentes ou granuleuses
B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.
An acceleration device includes an actuator configured to displace a mass in a reciprocating motion at a desired frequency, a mount configured to hold a device, such as an accelerometer device, and at least one spring connecting the mount to the mass. The actuator is used to apply a force to achieve resonance. The actuator may comprise a voice coil motor, wherein the voice coil motor includes a permanent magnet and an armature and wherein said armature comprises part of said mass. The actuator applies a periodic force to the mass. The periodic force may be a sinusoidal force. Preferably, the applied force is aligned with a resulting velocity of the mass. The mount may include a test socket to which the device is electrically connected. The spring may comprises one or more flexure elements. The acceleration device may be used with a handler device to connect and disconnect the device to and from the mount. Optionally, the handler device includes an environmental chamber surrounding the mount.
A method of pick-and-place alignment comprises (a) determining a pick location of a device from a tray of devices; (b) determining place location of the device using an up-looking camera; and (c) determining offset error for the device by comparing the pick location and the place location. The method may further comprise repeating steps (a)-(c) for additional devices on the tray of devices; and generating an offset map for alignment of devices on the tray. The method further uses the offset map to make pick and place corrections during runtime.
H04N 7/18 - Systèmes de télévision en circuit fermé [CCTV], c.-à-d. systèmes dans lesquels le signal vidéo n'est pas diffusé
G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
H01L 23/46 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation
H01L 23/473 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de liquides
H01L 23/467 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température impliquant le transfert de chaleur par des fluides en circulation par une circulation de gaz, p. ex. d'air
33.
SIDE GRIPPING MECHANISM AND DEVICE HANDLERS HAVING SAME
An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position.
Method and devices are provided that integrate various internal channels and inlet and outlet ports, configured to operate with air or fluidics, with electrical circuitry. The devices comprise internal channels and outlet/inlet ports that are integrated into multiple layers of printed circuit boards. A multi-layer printed circuit board assembly is produced by laminating the plurality of layers together. The multi-layer printed circuit board assembly can accommodate a variety of off-the-shelf components, as well as electrical circuits and electronic components.
An apparatus comprises a cavity coupled to a pneumatic controller configured to control pressure in the cavity; a piston configured to be pulled into the cavity when pressure in the cavity is below atmospheric pressure and to be pushed outward when pressure in the cavity is greater than atmospheric pressure; and a gripper arm mechanically coupled to the piston. The gripper arm may be configured to support a device under test. The gripper arm may be coupled to the piston through a pusher bar. The apparatus may further comprise a pneumatic control port; and a pneumatic bleed port. The pneumatic control port is coupled to the cavity, and the pneumatic bleed port is configured to bleed pneumatic pressure to atmosphere if the piston over-travels a predetermined position.
B25B 11/00 - Porte-pièces ou dispositifs de mise en position non couverts par l'un des groupes , p. ex. porte-pièces magnétiques, porte-pièces utilisant le vide
B23Q 3/08 - Moyens de fixation de la pièce autres que les moyens actionnés mécaniquement
36.
Temperature measurement using a diode with saturation current cancellation
Various embodiments provide systems and methods measuring the temperature of a device using a semiconductor temperature sensor, such as a diode. This invention allows the use of an uncalibrated diode to be used as a temperature sensor by applying a sinusoidally varying forcing current to the diode and measuring the rate of change of the voltage across the diode. Embodiments advantageously provide for a rapid, responsive temperature measuring, substantially eliminating the effect of lead resistance associated with the temperature sensor.
G01K 7/01 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments semi-conducteurs à jonctions PN
37.
Pick and place handler with a floating lock device
A semiconductor handler subassembly is provided. The semiconductor handler subassembly includes an adjustment apparatus with a floating lock that is configured to adjust and lock in place to a desired position, and a tip attached to the floating lock and configured to engage a part.
A vision alignment system and method is provided. The vision alignment system includes one or more grouped alignment plates with guiding inserts configured to receive multiple devices, and groups of three actuators, configured to actuate the alignment plates to correct the position offsets of multiple devices as a group. The position offsets between the device and contactor are determined by a device-view camera during runtime and a contactor-view camera during calibration time. The vision alignment system also includes a pick-and-place handler, configured to transport devices.
A guiding plate based vision alignment system for a test handler includes cameras, configured to view the position difference between a tested device and the corresponding contactor. A pick-and-place handler is configured to move the device. A guiding plate is configured to actuate guiding plate with one translation alignment feature and one rotation alignment feature to correct the position offset between the tested device and the corresponding contactor.
A vision alignment system and method is provided. The vision alignment system includes one or more grouped alignment plates with guiding inserts configured to receive multiple devices, and groups of three actuators, configured to actuate the alignment plates to correct the position offsets of multiple devices as a group. The position offsets between the device and contactor are determined by a device-view camera during runtime and a contactor- view camera during calibration time. The vision alignment system also includes a pick-and- place handler, configured to transport devices.
A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms.
A method for soaking a device in an automated testing system, includes setting a temperature control device to a first temperature, exposing the device to the temperature control device, and driving the temperature control device to a second temperature. The temperature transition rate from the first temperature to the second temperature is derived from a first natural decay rate. The first natural decay rate is based on a first-order thermal response of the device when the device is suspended in free air. The second temperature of the temperature control device is relative to a set point temperature so that when the device is socketed for testing, the temperature of the device settles at the set point temperature.
A method for soaking a device in an automated testing system, includes setting a temperature control device to a first temperature, exposing the device to the temperature control device, and driving the temperature control device to a second temperature. The temperature transition rate from the first temperature to the second temperature is derived from a first natural decay rate. The first natural decay rate is based on a first-order thermal response of the device when the device is suspended in free air. The second temperature of the temperature control device is relative to a set point temperature so that when the device is socketed for testing, the temperature of the device settles at the set point temperature.
A system and method for cleaning a contactor device is presented. The cleaning system includes an automated testing handler and a handler controller for controlling the operation of the handler and facilitating user interaction with the handler. The handler further includes a contactor having a plurality of pins for establishing an electrical connection with one or more input devices. The handler is configured to house one or more input devices and one or more surrogate cleaning devices. The surrogate cleaning devices are configured to clean the pins of the contactor. A pick and place mechanism positioned in the handler is configured to transport both the input devices and the surrogate cleaning devices to the contactor.
A method of automatically carrying IC-chips, on a planar array of vacuum nozzles, to a variable target in a chip tester uses a set of laser distance sensors to align the vacuum nozzles with the target. Alignment occurs when certain combinations of distance and distance changes are sensed.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
46.
CAMERA BASED PIN GRID ARRAY (PGA) INSPECTION SYSTEM WITH PIN BASE MASK AND LOW ANGLE LIGHTING
An inspection system (1), for inspecting pin grid arrays (15) on integrated circuit devices (10) includes a pin base mask (30) configured to receive a device having a pin grid array (15) . A dark-field, low-angle lighting system (40) emits light onto the pin grid array (15) . The pin base mask (30) and low-angle lighting system (40) provide for a clear and definitive image of the pin grid array (15) . A camera (50) captures the image of the pin grid array (15). A processor (90) , coupled to the camera (50) , analyzes the images captured by the camera (50) . Based on the captured image, the processor (90) determines whether any pins on the pin grid array (15) are bent (13, 14) or missing, or whether there are extra pins present.
A machine vision alignment system (1) for aligning a device to be tested (60) includes an alignment camera (50) positioned above an alignment portion (2) of the alignment system (1) . A lighting system (80) for emitting light onto the device to be tested (60) is located in proximity to the alignment camera (50) . An alignement (10) target is used to define an alignement (10) target coordinate system. Three actuators (30) are positioned in a testing portion (3) of the vision alignment system(l) , for correcting an offset (70) between the alignement (10) target and the device to be tested (60) . A pick and place handler (100) transports the alignement target (10) and the device to be tested (60) between the testing portion(3) and the alignment portion(2).
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
B23Q 3/18 - Dispositifs permettant de maintenir, supporter ou positionner les pièces ou les outils, ces dispositifs pouvant normalement être démontés de la machine pour positionner uniquement
G01B 11/27 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes pour tester l'alignement des axes
48.
APPARATUS AND METHOD FOR CONTROLLING DIE FORCE IN A SEMICONDUCTOR DEVICE TESTING ASSEMBLY
A semiconductor device test assembly includes a heat sink having a surface configured to support a device under test, an inner bellow, an outer bellow at least partially surrounding the inner bellow, and a fluid channel within the inner bellow for providing a fluid to the heat sink. The semiconductor device test assembly can further include an air adjustment unit for adjusting an air pressure in the outer bellow, so as to adjust a contact force between the heat sink and the device under test.
A machine vision based scanner system for an offline binning handler including a line scan camera capable of scanning a full tray- width image of a media tray, a camera controller operatively connected to the line scan camera, a tray transport mechanism positioned below the line scan camera, a tray transport mechanism controller operatively connected to the tray transport mechanism and the camera controller and processing software for using the images captured by the line scan camera to identify and sort a plurality of semiconductor devices.
A method for sorting devices (21) in automated handling equipment, including placing a plurality of input trays containing a plurality of devices and a plurality of empty trays into a handler (30) ; sorting the plurality of devices in the plurality of input trays into the plurality of empty trays according to a category of each of the plurality of devices, dynamically assigning categories (7-14) to each of the plurality of empty trays for each category of the plurality of devices, dynamically assigning categories to the plurality of input trays and placing the sorted plurality of devices into the plurality of input trays, removing the empty trays housing the plurality of sorted devices from the handler (30) and determining whether the sorting is completed.
A LED lighting system for reading multiple data matrix codes on device populated transport media with a line scan camera, includes a light housing, a plurality of LED circuit bars, having a plurality of LEDs, mounted to an inner surface of the light housing arranged to provide high angle lighting and low angle lighting and a light controller operatively connected to the light housing to selectively control the light intensity, the light distribution and the angle of the LEDs on each of the plurality of LED array bars, whereby the LED lighting system can reduce texture noise and detect contrast in color or contrast in texture on the device populated transport media. The LED lighting system includes a device cooling system having an air compressor for cooling the LEDs such that they can operate at an optimal level.
G06K 7/10 - Méthodes ou dispositions pour la lecture de supports d'enregistrement par radiation électromagnétique, p. ex. lecture optiqueMéthodes ou dispositions pour la lecture de supports d'enregistrement par radiation corpusculaire
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