An electronic device includes a first semiconductor chip on a first substrate and a second semiconductor chip on a second substrate separated from the first substrate, with both semiconductor chips arranged between the first substrate and the second substrate. The first semiconductor chip includes a drain coupled to the first substrate and located on a side of the first semiconductor chip, with a gate and a source located on an opposite side of the first semiconductor chip. The second semiconductor chip has a drain coupled to the second substrate and located on a side of the second semiconductor chip, with a gate and a source located on an opposite side of the second semiconductor chip. A first connection structure couples the source of the first semiconductor chip to the second substrate. A second connection structure couples the source of the second semiconductor chip to the first substrate.
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 25/00 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
2.
Semiconductor Structures and Manufacturing Methods Thereof
Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask on a protective layer that is on an epitaxial layer, which includes an opening exposing a portion of the protective layer and surrounded by side surfaces of the first patterned hard mask. A first doped region and a second doped region are formed in a portion of the epitaxial layer below the opening via a first implantation and a second implantation, respectively, through the first patterned hard mask. A second patterned hard mask is formed on the side surfaces of the first patterned hard mask, through which a third doped region is formed in the portion of the epitaxial layer by performing a third implantation. The second doped region at least partially overlaps with the first doped region. The third doped region is surrounded by the second doped region.
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
3.
Semiconductor Structures and Manufacturing Methods Thereof
Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask on a protective layer that is disposed on an epitaxial layer. The first patterned hard mask includes an opening exposing a portion of the protective layer and surrounded by side surfaces of the first patterned hard mask. A second patterned hard mask is formed on the side surfaces of the first patterned hard mask. A first doped region is formed in the portion of the epitaxial layer below the opening using a first implantation through the second patterned hard mask. With the second patterned hard mask removed, a second doped region surrounding the first doped region, and a third doped region are formed in the portion of the epitaxial layer using respective second implantation and third implantation through the first patterned hard mask.
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
4.
Semiconductor Structures and Manufacturing Methods Thereof
Various methods for manufacturing semiconductor structures are provided. A first patterned hard mask is formed on a protective layer, which includes an opening exposing a portion of the protective layer and surrounded by side surfaces of the first patterned hard mask. A second patterned hard mask is formed on the side surfaces of the first patterned hard mask. A first doped region is formed in a portion of an epitaxial layer below the opening by implantation through the second patterned hard mask. The second patterned hard mask is removed. A second doped region surrounding the first doped region is then formed in the portion of the epitaxial layer by implantation through the first patterned hard mask. The first patterned hard mask is trimmed to form a third patterned hard mask, through which a third doped region is formed along a sidewall of the second doped region by implantation.
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
5.
Semiconductor Structures and Manufacturing Methods Thereof
Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask on a protective layer that is on an epitaxial layer, which includes an opening exposing a portion of the protective layer and surrounded by side surfaces of the first patterned hard mask. A first doped region is formed in a portion of the epitaxial layer below the opening through the first patterned hard mask. A second patterned hard mask is formed on the side surfaces of the first patterned hard mask, through which a second doped region is formed in the portion of the epitaxial layer with the first doped region located along a sidewall of the second doped region. A third patterned hard mask is formed surrounding the second patterned hard mask, through which a third doped region is formed in the second doped region.
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
6.
Semiconductor Structures and Manufacturing Methods Thereof
A semiconductor structure manufacturing method includes forming, on a protective layer that is disposed on an epitaxial layer, a first patterned hard mask including an opening surrounded by side surfaces of the first patterned hard mask and exposing a first portion of the protective layer. A first doped region is formed in a portion of the epitaxial layer below the opening through the first patterned hard mask. A second patterned hard mask is formed on the side surfaces of the first patterned hard mask, through which a second doped region is formed in the first doped region. The second patterned hard mask and a portion of the first patterned hard mask are removed, and a remaining portion of the first patterned hard mask forms a third patterned hard mask, through which a second portion of the protective layer is removed.
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
7.
Vertical Power Semiconductor Device and Manufacturing Method Thereof
A semiconductor device includes a substrate comprising a first surface and a second surface positioned on an opposite side of the substrate. A first gate structure is located above the first surface of the substrate and a second gate structure is located above the first surface of the substrate, adjacent to the first gate structure. A first dielectric layer covers the first gate structure, the second gate structure, and the first surface of the substrate. The first dielectric layer has a first opening between the first gate structure and the second gate structure. A current spreading layer is located at a bottom of the first opening. The current spreading layer has a first width approximately equal to a width of the bottom of the first opening. A conductive plug is located between the first gate structure and the second gate structure and in contact with the current spreading layer.
H10D 30/66 - Transistors FET DMOS verticaux [VDMOS]
H10D 62/00 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 62/13 - Régions semi-conductrices connectées à des électrodes transportant le courant à redresser, amplifier ou commuter, p. ex. régions de source ou de drain
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
An electrostatic discharge protection structure in a semiconductor device includes a first trench structure including a first polysilicon structure and a first oxide layer surrounding the first polysilicon structure. A second trench structure includes a second polysilicon structure and a second oxide layer surrounding the second polysilicon structure. A first diode string is disposed between the first trench structure and the second trench structure and adjoins the first polysilicon structure and the second polysilicon structure. A first spacing oxide layer is disposed on the first diode string. A second diode string is disposed on the first spacing oxide layer and connected in parallel with the first diode string. Each of the first and the second diode strings includes first doped regions and second doped regions disposed alternately. A PN junction is formed at an interface between each first doped region and an adjacent second doped region.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H10D 89/60 - Dispositifs intégrés comprenant des dispositions pour la protection électrique ou thermique, p. ex. circuits de protection contre les décharges électrostatiques [ESD].
9.
SWTICHING MODE POWER CONVERTER WITH PULSE SKIPPING AND CONTROL METHOD THEREOF
INOUTININOUTOUTINOUTOUT) when the PWM signal is low. α is a pre-configured constant. The control circuit is configured to trigger the PWM controller to skip pulses when a voltage across the capacitor decreases to be less than a threshold before a present switching cycle of the power converter ends.
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
10.
Switching Mode Power Converter with Pulse Skipping and Control Method Thereof
A control circuit is coupled to a power converter having an input voltage VIN and an output voltage VOUT. The control circuit includes a capacitor connected between a current source and a ground. The current source is configured to charge the capacitor with a current αVIN or α(VIN−VOUT) when a pulse width modulate (PWM) signal of a PWM controller of the power converter is high, and to discharge the capacitor with a current α(−VOUT) or α(VIN−VOUT) when the PWM signal is low. α is a pre-configured constant. The control circuit is configured to trigger the PWM controller to skip pulses when a voltage across the capacitor decreases to be less than a threshold before a present switching cycle of the power converter ends.
H02M 1/08 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
11.
VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
The present application relates to a vertical semiconductor device and a manufacturing method therefor. The vertical semiconductor device comprises: a semiconductor material layer; a first shielding structure, located on the semiconductor material layer and comprising a first shielding dielectric layer and a first shielding electrode surrounded by the first shielding dielectric layer; a first doped region, located on the semiconductor material layer, the first doped region having a first conductivity type; and a first gate structure, adjacent to the first doped region. The depth of the first gate structure is smaller than the depth of the first shielding structure and greater than the depth of the first doped region. The first shielding dielectric layer region is divided into an upper part and a lower part by taking the bottom of the first gate structure as a boundary line, and the first gate structure is adjacent to the upper part. The upper part has a first thickness at a first surface of the semiconductor material layer, the first thickness is smaller than a second thickness of the lower part, and the sum of the first thickness of the upper part and a third thickness of the first gate structure at the first surface is greater than the second thickness of the lower part.
A semiconductor structure includes a substrate comprising a first surface and a second surface positioned on an opposite side of the substrate. A first trench structure extends from the first surface toward the second surface, wherein the first trench structure comprises a first polysilicon structure and a first oxide layer surrounding the first polysilicon structure. A shielding metal layer is located on the first surface of the substrate and covers the first trench structure. A first conductive layer is disposed on the shielding metal layer, and a second conductive layer is disposed on the second surface of the substrate. The substrate comprises a first doped region located between the first surface and the second surface, adjacent to the first oxide layer and separated from the first polysilicon structure.
A trench-type semiconductor power device includes: a substrate; an epitaxial layer; a body doped region located in the epitaxial layer; a source doped region located in the body doped region; and a trench structure comprises a first semiconductor layer extending in a second direction. The first semiconductor layer includes: a first part that abuts against the body doped region and the source doped region, and serves as a gate electrode having a first conductivity type; and a second part that extends in the second direction and away from the source doped region, and comprises a plurality of first doped regions having the first conductivity type and a plurality of second doped regions having a second conductivity type. The plurality of first doped regions and the plurality of second doped regions are staggered to form a diode string having back-to-back diodes.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
14.
Power semiconductor apparatus and bonding method thereof
An apparatus includes a backside supporting layer having a first thickness, an adhesive layer over the backside supporting layer, a metal layer over the adhesive layer, wherein the metal layer functions as a backside connector, a semiconductor substrate layer over the metal layer, wherein the semiconductor substrate active layer has a second thickness, and a plurality of front side connectors, wherein active circuits in the semiconductor substrate layer over are electrically coupled between the plurality of front side connectors and the metal layer.
An apparatus includes a secondary controller coupled to a secondary circuit of a power conversion system, and a primary controller coupled to a primary circuit of the power conversion system, the primary controller being coupled to the secondary controller through an isolation interface, wherein the secondary controller is configured to detect whether a load is coupled to the power conversion system, in response to the load being disconnected from the power conversion system, communicate with the primary controller through pulling down a secondary feedback node in the secondary circuit and a primary feedback node in the primary circuit for a first predetermined time, provide a high impedance at the secondary feedback node to reduce power consumption, and in response to the load being reconnected to the power conversion system, communicate with the primary controller through pulling down the secondary feedback node in the secondary circuit for a second predetermined time.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
16.
Apparatus and Method for Reducing Stand-by Power Consumption in Isolated Power Conversion System
An apparatus includes a secondary controller coupled to a secondary circuit of a power conversion system, and a primary controller coupled to a primary circuit of the power conversion system, the primary controller being coupled to the secondary controller through an isolation interface, wherein the secondary controller is configured to detect whether a load is coupled to the power conversion system, in response to the load being disconnected from the power conversion system, communicate with the primary controller through pulling down a secondary feedback node in the secondary circuit and a primary feedback node in the primary circuit for a first predetermined time, provide a high impedance at the secondary feedback node to reduce power consumption, and in response to the load being reconnected to the power conversion system, communicate with the primary controller through pulling down the secondary feedback node in the secondary circuit for a second predetermined time.
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
17.
METHOD OF MANUFACTURING A TRENCH MOS RECTIFIER WITH A TERMINATION STRUCTURE
A method of manufacturing a semiconductor structure includes forming on a substrate, at intervals in a first direction, a first trench, a second trench, and a third trench, forming a first oxide layer in the first trench, forming a second oxide layer in the second trench, and forming a third oxide layer in the third trench. The method also includes forming a first semiconductor material layer in the first trench, forming a second semiconductor material layer in the second trench, and forming a third semiconductor material layer in the third trench. The method further includes forming a mask layer, performing a first etching process on the mask layer to form a first opening and a second opening, performing a second etching process at the second opening to form a third surface on the substrate, and forming a first doped region adjacent to the third surface exposed by the second opening.
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 84/00 - Dispositifs intégrés formés dans ou sur des substrats semi-conducteurs qui comprennent uniquement des couches semi-conductrices, p. ex. sur des plaquettes de Si ou sur des plaquettes de GaAs-sur-Si
18.
Clock Signal Skew Calibration Apparatus and Control Method
An apparatus includes a clock skew calibration circuit configured to be coupled to a multi-phase clock generator through a plurality of delay lines, wherein a first clock skew calibration unit of the clock skew calibration circuit comprises a frequency doubler configured to receive a plurality of multi-phase clock signals and generate a clock signal, a frequency divider configured to receive the clock signal and generate a reduced frequency signal indicative of a skew of a first multi-phase clock signal, and a delay line control circuit configured to adjust the skew of the first multi-phase clock signal by comparing the reduced frequency signal with a predetermined duty cycle, and generating a control signal to modify a delay applied to the first multi-phase clock signal.
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
09 - Appareils et instruments scientifiques et électriques
16 - Papier, carton et produits en ces matières
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Custom manufacture of semiconductor devices; Custom manufacturing of integrated circuits for others Semiconductor devices; Integrated circuits Printed instructional and teaching materials in the field of semiconductor devices; Printed manuals in the field of electronic components; Printed brochures about electronic components Design of semiconductor chips; Design of integrated circuits; Engineering services in the field of electronic components; Software development consulting in the field of electronic design
20.
DYNAMIC CONTROL OF OUTPUT DRIVER IN A SWITCHING AMPLIFIER
A switching amplifier circuit includes an output transistor, a current direction detection circuit, and a slew control circuit. The output transistor includes a control terminal coupled to a switching input signal; a drain node coupled to an output node coupled to a first end of a load device having the first end and a second end; and a source node coupled to a reference voltage. The current direction detection circuit is coupled to the output node and configured to detect a direction signal corresponding to an output current at the output node. The slew control circuit is configured to adjust a slew rate of the output transistor at the output node. The slew control circuit is coupled to the control terminal of the output transistor and is activated only during turnoff of the output transistor and operates in response to the direction signal.
An apparatus includes a drain and a source on opposing sides of an epitaxial layer, a plurality of gates formed in the epitaxial layer, a source contact connected to the source, a gate contact connected to the plurality of gates, a gate-source electrostatic discharge (ESD) diode connected between the gate contact and the source contact, and a breakdown voltage enhancement and leakage prevention structure formed underneath the gate-source ESD diode structure.
H10D 30/66 - Transistors FET DMOS verticaux [VDMOS]
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 64/27 - Électrodes ne transportant pas le courant à redresser, à amplifier, à faire osciller ou à commuter, p. ex. grilles
H10D 89/60 - Dispositifs intégrés comprenant des dispositions pour la protection électrique ou thermique, p. ex. circuits de protection contre les décharges électrostatiques [ESD].
An alignment device (100) for use in a wafer processing system is described. The device (100) comprises a subustrate (105) configured to be handled by the wafer processing system, a sensor (160) mounted on the substrate, and a transmitter. Further a method of aligning a wafer handling robot in a semiconductor processing tool is described. The method comprises inserting the alignment device into the wafer handling robot, using the sensor to capture information relating to a position of the alignment device relative to the semiconductor processing tool, and wirelessly transmitting the captured information to a receiver.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
23.
LED Color and Brightness Control Apparatus and Method
A system includes a plurality of lighting modules, and a plurality of MOSFET devices connected in parallel and coupled between one of the plurality of lighting modules and ground, wherein the plurality of MOSFET devices comprises a first MOSFET device group configured to provide a bleed current flowing through the one of the plurality of lighting modules, a second MOSFET device group configured to provide a delay compensation current flowing through the one of the plurality of lighting modules, a third MOSFET device group configured to provide a PWM current flowing through the one of the plurality of lighting modules, and a fourth MOSFET device group configured to adjust a current flowing through the one of the plurality of lighting modules.
A method of manufacturing a semiconductor structure is provided. A substrate including a first silicon carbide layer and a second silicon carbide layer under the first silicon carbide layer is formed. The substrate includes a unit region and a termination region surrounding the unit region. A first guard ring structure is formed in the termination region and the first silicon carbide layer, adjoining a top surface of the first silicon carbide layer. A second guard ring structure is formed in the termination region and the second silicon carbide layer. Second guard ring well regions of the second guard ring structure correspond one-on-one to first guard ring well regions of the first guard ring structure. Each of the second guard ring well regions overlaps with a corresponding one of the first guard ring well regions in a vertical direction perpendicular to the top surface of the substrate.
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
25.
Semiconductor structures and manufacturing methods thereof
Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask and epitaxial layer on a semiconductor substrate, and forming a first doped region in the epitaxial layer by performing a first implantation through the first patterned hard mask. A second doped region is formed in the epitaxial layer by performing a second implantation through the first patterned hard mask, with the first doped region at least partially overlapping the second doped region. A second patterned hard mask is formed, which surrounds the first patterned hard mask and covers at least a portion of the first doped region. A third doped region is formed in the epitaxial layer by performing a third implantation through the first patterned hard mask and the second patterned hard mask.
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H10D 62/832 - Corps semi-conducteurs, ou régions de ceux-ci, de dispositifs ayant des barrières de potentiel caractérisés par les matériaux étant des matériaux du groupe IV, p. ex. Si dopé B ou Ge non dopé étant des matériaux du groupe IV comprenant deux éléments ou plus, p. ex. SiGe
26.
Semiconductor Manufacturing Tool Alignment Device And Method
An alignment device for aligning a wafer handling robot in a wafer processing system includes a substrate having a through-hole. A sensor is mounted on a first surface of the substrate, and configured to capture, via the through-hole, information relating to a position of the alignment device in the wafer processing system. A transmitter is mounted on the first surface of the substrate and coupled to the sensor. The transmitter is configured to wirelessly transmit the information captured by the sensor. The transmitted information enables to determine whether the alignment device is within a threshold distance from a target position in the wafer processing system and to adjust the position of the alignment device. A method of aligning the wafer handling robot utilizing the alignment wafer, and a frame and method for calibrating the alignment wafer are also provided.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
G01B 11/27 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des angles ou des cônesDispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes pour tester l'alignement des axes
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
27.
Manufacturing method for a power MOSFET with gate-source ESD diode structure
A method includes growing an epitaxial layer over a substrate, forming a plurality of gates in the epitaxial layer, forming a source in the epitaxial layer, forming a breakdown voltage enhancement and leakage prevention structure comprising a body ring structure in the epitaxial layer, forming a gate-source Electrostatic Discharge (ESD) diode structure over the epitaxial layer, forming a source contact connected to the source and a first terminal of the gate-source ESD diode structure, forming a gate contact connected to the plurality of gates and a second terminal of the gate-source ESD diode structure.
H10D 30/66 - Transistors FET DMOS verticaux [VDMOS]
H10D 62/10 - Formes, dimensions relatives ou dispositions des régions des corps semi-conducteursFormes des corps semi-conducteurs
H10D 64/27 - Électrodes ne transportant pas le courant à redresser, à amplifier, à faire osciller ou à commuter, p. ex. grilles
H10D 89/60 - Dispositifs intégrés comprenant des dispositions pour la protection électrique ou thermique, p. ex. circuits de protection contre les décharges électrostatiques [ESD].
28.
DATA CORRECTION AND PHASE OPTIMIZATION IN HIGH-SPEED RECEIVERS
Methods and systems for performing data correction and phase optimization are disclosed herein. In some implementations, a system for performing data correction comprises: an analog to digital converter (ADC) configured to receive differential data from a continuous time linear equalizer (CTLE) and generate a bitstream comprising a plurality of data bits and a corresponding plurality of data sign bits; a decision feedback equalization (DFE) block configured to receive the bitstream from the ADC and provide data to a clock and data recovery (CDR) block; and data correction circuitry. In some implementations, the data correction circuitry is configured to: receive the bitstream from the ADC; determine whether to correct a data sign bit; responsive to determining the data sign bit is to be corrected, flip the data sign bit; and provide the plurality of data sign bits, including the flipped data sign bits, to the DFE.
Diodes Technology (Chengdu) Company Limited (Chine)
Shanghai Kaihong Electronic Company Limited (Chine)
Inventeur(s)
Zhang, Huaigang
Wang, Chris
Abrégé
A connector for connecting a gas pipe and a heating component of a wire bonder includes a first connection end for connecting the connector to the heating component, and a second connection end for connecting the connector to the gas pipe. A heat-insulation tube is connected between the first connection end and the second connection end. The heat-insulation tube is made of a heat-insulation material and configured to insulate or reduce heat transfer between the first connection end and the second connection end. The connector may further include a first fastening sleeve for fastening the connection between the first connection end and the heat-insulation tube, and a second fastening sleeve for fastening the connection between the second connection end and the heat-insulation tube.
F16L 59/18 - Dispositions spécialement adaptées aux nécessités localisées telles qu'à l'endroit des brides, des jonctions, des soupapes ou d'autres éléments similaires adaptées aux raccords
An apparatus includes a capacitive device configured to provide bias power for a high-side switch, a gate drive path connected between the capacitive device and a gate of the high-side switch, wherein the gate drive path comprises a controllable switch and a first resistive device coupled in parallel between the capacitive device and the gate of the high-side switch, and a control switch connected between the gate of the high-side switch and ground.
H03K 17/693 - Dispositifs de commutation comportant plusieurs bornes d'entrée et de sortie, p. ex. multiplexeurs, distributeurs
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
31.
SEMICONDUCTOR RECTIFIER DEVICE AND MANUFACTURING METHOD THEREFOR
The present application relates to a semiconductor rectifier device and a manufacturing method therefor. The semiconductor rectifier device comprises: an epitaxial layer having a top surface and a bottom surface opposite to each other; a first doped region located in the epitaxial layer and having a first conductivity type; a first trench structure located in the first doped region and extending from the top surface to the bottom surface; a second trench structure located in the first doped region, extending from the top surface to the bottom surface, and adjacent to the first trench structure; a second doped region located in the epitaxial layer between the first trench structure and the second trench structure, extending from the top surface to the bottom surface, and having a second conductivity type, the depth of the second doped region being less than the depth of the first trench structure; and a metal layer located on the top surface of the epitaxial layer, covering the first trench structure, the second trench structure and the second doped region, and in contact with the top surface of the epitaxial layer to form a Schottky junction surface.
An apparatus includes a drain and a source on opposing sides of an epitaxial layer, a plurality of gates formed in the epitaxial layer, a source contact connected to the source, a gate contact connected to the plurality of gates, a drain contact on opposing sides of the epitaxial layer of the source contact, a gate-source electrostatic discharge (ESD) diode connected between the gate contact and the source contact, and a breakdown voltage enhancement and leakage prevention structure formed underneath the gate-source ESD diode structure, wherein the breakdown voltage enhancement and leakage prevention structure comprises a body ring structure.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
33.
Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a silicon carbide layer, which has a unit region and a termination region surrounding the unit region. A first guard ring structure is located in the termination region of the silicon carbide layer, and adjoins a top surface of the silicon carbide layer. The first guard ring structure may include at least one first guard ring well region. A second guard ring structure is located in the silicon carbide layer and below the first guard ring structure. The second guard ring structure may include at least one second guard ring well region, which corresponds to the at least one first guard ring well region in a vertical direction. A method for manufacturing the semiconductor structure is also provided.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 21/04 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives les dispositifs ayant des barrières de potentiel, p. ex. une jonction PN, une région d'appauvrissement ou une région de concentration de porteurs de charges
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
A semiconductor structure includes: a substrate, having a cell region and a terminal region, and having a first surface, a second located in the terminal region, and a third surface located in the cell region, the second surface and the third surface being located at different levels; a first trench structure, located in the cell region, traversing the third surface to extend towards the first surface, including a first semiconductor material layer and a first oxide layer partially protruding from the third surface, and extending in a first direction parallel to the third surface; and a second trench structure, located in the cell region, including a second semiconductor material layer and a second oxide layer partially protruding from the third surface, and extending parallel to the first direction, wherein the third surface is provided with a doped region between the first trench structure and the second trench structure.
H01L 23/58 - Dispositions électriques structurelles non prévues ailleurs pour dispositifs semi-conducteurs
H01L 27/102 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration répétitive comprenant des composants bipolaires
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/66 - Types de dispositifs semi-conducteurs
35.
Apparatus and Method for Unpacking Components in Tape-and-Reel
A device is provided for unpackaging components encased between a first tape body and a second tape body of a sealed tape. The device includes a component collection device including a cavity for receiving components falling out of the sealed tape being de-taped. A de-taping device is attached to the component collection device. The de-taping device includes a support base held over the cavity, and a shaft on one side of the support base. The support base with the shaft is configured to enable one of the first tape body and the second tape body to be extendable around the shaft and the support base and to be pullable, such that the first tape body and the second tape body are separated and the components fall out of the sealed tape. The support base may include a through-hole configured for sealed tapes to pass through and to be held.
An apparatus includes a clock skew calibration circuit configured to be coupled to a multi-phase clock generator through a plurality of delay lines, wherein a first clock skew calibration unit comprises a frequency doubler configured to receive a plurality of multi-phase clock signals and generate a clock signal based on the plurality of multi-phase clock signals, a frequency divider configured to receive the clock signal and generate a reduced frequency signal based on the clock signal, and a delay line control circuit configured to compare the duty cycle of the reduced frequency signal with a predetermined duty cycle, and generate a first control signal to adjust the skew of the first multi-phase clock signal through adjusting a first delay applied to the first multi-phase clock signal until a calibrated signal of the first multi-phase clock signal is achieved.
H03K 5/156 - Dispositions dans lesquelles un train d'impulsions est transformé en un train ayant une caractéristique désirée
H04L 7/033 - Commande de vitesse ou de phase au moyen des signaux de code reçus, les signaux ne contenant aucune information de synchronisation particulière en utilisant les transitions du signal reçu pour commander la phase de moyens générateurs du signal de synchronisation, p. ex. en utilisant une boucle verrouillée en phase
37.
SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR
The present invention relates to a semiconductor chip package and a manufacturing method therefor. The semiconductor chip package comprises: a lead frame, having a first side and a second side opposite to each other, wherein the lead frame has a first recess recessed from the first side of the lead frame; an adhesive, filling the first recess; and a semiconductor chip, provided on the first side of the lead frame and the adhesive, wherein the width of the first recess is not greater than the width of the semiconductor chip.
H01L 23/50 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes pour des dispositifs à circuit intégré
38.
Clock signal skew calibration apparatus and control method
An apparatus includes a clock skew calibration circuit configured to be coupled to a multi-phase clock generator through a plurality of delay lines, wherein a first clock skew calibration unit comprises a frequency doubler configured to receive a plurality of multi-phase clock signals and generate a clock signal based on the plurality of multi-phase clock signals, a frequency divider configured to receive the clock signal and generate a reduced frequency signal based on the clock signal, and a delay line control circuit configured to compare the duty cycle of the reduced frequency signal with a predetermined duty cycle, and generate a first control signal to adjust the skew of the first multi-phase clock signal through adjusting a first delay applied to the first multi-phase clock signal until a calibrated signal of the first multi-phase clock signal is achieved.
A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A width of the groove is not greater than a width of the semiconductor chip. A semiconductor chip may be disposed over the groove and affixed to the lead frame through the adhesive in the groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.
H01L 23/498 - Connexions électriques sur des substrats isolants
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
BCD SHANGHAI MICRO-ELECTRONICS COMPANY LIMITED (Chine)
Inventeur(s)
Zou, Cong
Dou, Sen
Peng, Shaohua
Abrégé
A switching power supply includes a secondary control circuit coupled to a secondary side of a transformer of the switching power supply, and a primary control circuit coupled to a primary side of the transformer. The secondary control circuit is configured to receive a power request signal of a load device, and encode the power request signal to generate encoded information. The primary control circuit is configured to receive, by use of the transformer, a feedback signal reflecting an output voltage of the switching power supply, decode the encoded information based on a change of the feedback signal, and based thereon, control the switching power supply to supply power to the load device.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/088 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques pour la commande simultanée de dispositifs à semi-conducteurs connectés en série ou en parallèle
H02M 1/36 - Moyens pour mettre en marche ou arrêter les convertisseurs
41.
Semiconductor Molding System and Foreign Object Detection Method
Diodes Technology (Chengdu) Company Limited (Chine)
Shanghai Kaihong Electronic Company Limited (Chine)
Inventeur(s)
Wang, Desen
Feng, Zhigang
Abrégé
A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device. The controller is configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image. A method for detecting foreign objects of a to-be-molded lead frame is also provided.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
42.
Trench Schottky barrier rectifier and method for fabricating same
A semiconductor rectifier device includes: an epitaxial layer, having a top surface and a bottom surface; a first doped region having a first conductivity type, located in the epitaxial layer; a first trench structure, located in the first doped region; a second trench structure adjacent to the first trench structure, located in the first doped region; a second doped region having a second conductivity type, located in the epitaxial layer between the first trench structure and the second trench structure, wherein a depth of the second doped region is less than a depth of the first trench structure; and a metal layer, located on the top surface of the epitaxial layer, covering the first trench structure, the second trench structure, and the second doped region, wherein the metal layer is in contact with the top surface, forming a Schottky interface.
A semiconductor rectifier device comprises: an epitaxial layer having a top surface and a bottom surface; a first trench comprising a first side wall, a second side wall, and a first bottom surface; a second trench adjacent to the first trench, the second trench comprising a third side wall, a fourth side wall, and a second bottom surface; a first doped region abutting against the first side wall and at least a part of the first bottom surface of the first trench; a second doped region adjacent to and separated from the first doped region, wherein the second doped region abuts against the third side wall, the fourth side wall and the second bottom surface of the second trench; a gate structure disposed on the top surface between the first trench and the second trench; and a contact metal layer disposed on the top surface of the epitaxial layer.
H01L 29/86 - Types de dispositifs semi-conducteurs commandés uniquement par la variation du courant électrique fourni, ou uniquement par la tension électrique appliquée, à l'une ou plusieurs des électrodes transportant le courant à redresser, amplifier, faire osciller, ou commuter
H01L 21/308 - Traitement chimique ou électrique, p. ex. gravure électrolytique en utilisant des masques
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
44.
SEMICONDUCTOR RECTIFYING DEVICE AND METHOD FOR MANUFACTURING SAME
The present application relates to a semiconductor rectifying device and a method for manufacturing same. The semiconductor rectifying device comprises: an epitaxial layer, having a top surface and a bottom surface; a first groove, extending from the top surface to the bottom surface and comprising a first side wall and a second side wall opposite to each other, and a first bottom surface connected to the two side walls; a second groove, being adjacent to the first groove and comprising a third side wall and a fourth side wall opposite to each other, and a second bottom surface connected to the two side walls; a first doped region, extending from the top surface to the bottom surface and being adjacent to the first side wall and at least part of the first bottom surface of the first groove; a second doped region, being adjacent to the first doped region and separated from the first doped region, extending from the top surface to the bottom surface, and being adjacent to the third side wall, the fourth side wall, and the second bottom surface of the second groove; a gate structure, being disposed on the portion of the top surface between the first groove and the second groove, wherein the bottom surface of the gate structure is adjacent to the first doped region and the second doped region; and a contact metal layer.
The power semiconductor device comprises a base that includes a substrate and an epitaxial layer located above the substrate, with the base comprising a unit area and a peripheral area surrounding the unit area. A junction layer is located within the peripheral area and above the epitaxial layer. A barrier layer is located within the unit area and above the epitaxial layer. A first electrode is located on the junction layer and a second electrode is located on the barrier layer. The epitaxial layer includes a doped channel located within the peripheral area, extending between the junction layer and the base substrate. Current flows from the substrate through the doped channel and the junction layer to the first electrode.
H01L 31/0336 - Matériaux inorganiques comprenant, à part les matériaux de dopage ou autres impuretés, des matériaux semi-conducteurs couverts par plusieurs des groupes dans des régions semi-conductrices différentes, p.ex. des hétéro-jonctions Cu2X/CdX, X étant un élément du groupe VI de la classification périodique
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/08 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode transportant le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/739 - Dispositifs du type transistor, c.à d. susceptibles de répondre en continu aux signaux de commande appliqués commandés par effet de champ
46.
Manufacturing method for a power MOSFET with gate-source ESD diode structure
A method includes growing an epitaxial layer over a substrate, forming a plurality of gates in the epitaxial layer, forming a breakdown voltage enhancement and leakage prevention structure in the epitaxial layer comprising a body ring structure, forming a source and a body region in the epitaxial layer, forming an interlayer dielectric layer over the epitaxial layer, forming a gate-source Electrostatic Discharge (ESD) diode structure in the interlayer dielectric layer, forming a source contact connected to the source, and a first terminal of the gate-source ESD diode structure, forming a gate contact connected to the plurality of gates and a second terminal of the gate-source ESD diode structure, and forming a drain contact underneath the substrate.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
47.
Semiconductor rectifier and manufacturing method of the same
A semiconductor rectifier device comprises: an epitaxial layer having a top surface and a bottom surface; a first trench comprising a first side wall, a second side wall, and a first bottom surface; a second trench adjacent to the first trench, the second trench comprising a third side wall, a fourth side wall, and a second bottom surface; a first doped region abutting against the first side wall and at least a part of the first bottom surface of the first trench; a second doped region adjacent to and separated from the first doped region, wherein the second doped region abuts against the third side wall, the fourth side wall and the second bottom surface of the second trench; a gate structure disposed on the top surface between the first trench and the second trench; and a contact metal layer disposed on the top surface of the epitaxial layer.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/86 - Types de dispositifs semi-conducteurs commandés uniquement par la variation du courant électrique fourni, ou uniquement par la tension électrique appliquée, à l'une ou plusieurs des électrodes transportant le courant à redresser, amplifier, faire osciller, ou commuter
48.
RECONFIGURABLE POWER CONVERSION APPARATUS AND CONTROL METHOD
An apparatus includes a plurality of high-side switching elements connected in parallel between a first voltage bus and a switching node, wherein each high-side switching element of the plurality of high-side switching elements is controlled by a corresponding high-side driver, and a plurality of low-side switching elements connected in parallel between the switching node and a second voltage bus, wherein each low-side switching element of the plurality of low-side switching elements is controlled by a corresponding low-side driver, and wherein based on at least one operating parameter, the plurality of high-side switching elements and the plurality of low-side switching elements are controlled such that the plurality of high-side switching elements and the plurality of low-side switching elements form a reconfigurable power stage of a power converter.
H02M 1/00 - Détails d'appareils pour transformation
H02M 1/088 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques pour la commande simultanée de dispositifs à semi-conducteurs connectés en série ou en parallèle
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H03K 17/00 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts
49.
Reconfigurable Power Conversion Apparatus and Control Method
An apparatus includes a plurality of high-side switching elements connected in parallel between a first voltage bus and a switching node, wherein each high-side switching element of the plurality of high-side switching elements is controlled by a corresponding high-side driver, and a plurality of low-side switching elements connected in parallel between the switching node and a second voltage bus, wherein each low-side switching element of the plurality of low-side switching elements is controlled by a corresponding low-side driver, and wherein based on at least one operating parameter, the plurality of high-side switching elements and the plurality of low-side switching elements are controlled such that the plurality of high-side switching elements and the plurality of low-side switching elements form a reconfigurable power stage of a power converter.
H02M 3/157 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation avec commande numérique
H02M 1/00 - Détails d'appareils pour transformation
H02M 1/088 - Circuits spécialement adaptés à la production d'une tension de commande pour les dispositifs à semi-conducteurs incorporés dans des convertisseurs statiques pour la commande simultanée de dispositifs à semi-conducteurs connectés en série ou en parallèle
50.
STANDBY METHOD FOR SWITCHING POWER SUPPLY, SWITCHING POWER SUPPLY, AND PRIMARY AND SECONDARY CONTROL CIRCUITS
A standby method for a switching power supply may be applied to a switching power supply provided with an optical coupler circuit. The method includes: upon detecting a mode control signal indicating that a load device power supply demand is greater than a preset value, entering a first mode, and controlling output voltage of the switching power supply by means of an optical coupler circuit; and upon detecting a mode control signal indicating that the load device power supply demand is less than or equal to the preset value, entering a second mode, turning off a bias current of the optical coupler circuit, and controlling the output of the switching power supply by means of a driving pulse signal, so as to reduce bias currents of a primary side and a secondary side of the switching power supply, and reduce standby power consumption of the switching power supply.
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
There is provided a semiconductor device and a method of manufacturing the same. The method includes depositing an epitaxial layer on a semiconductor substrate of a first conductivity type. The epitaxial layer is of a second conductivity type opposite to the first conductivity type. Depositing the epitaxial layer includes depositing a first epi-layer of a first doping concentration, a second epi-layer of a second doping concentration and a third epi-layer of a third doping concentration, with the semiconductor substrate and the first epi-layer forming a first P-N junction at their interface, and the second epi-layer arranged between the first and third epi-layers. The second doping concentration is higher than the first and third doping concentrations. A doped region of the first conductivity type is formed at a surface of the third epi-layer. The doped region and the third epi-layer form a second P-N junction at their interface.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
An apparatus includes a drain and a source on opposing sides of an epitaxial layer, a plurality of gates formed in the epitaxial layer, a source contact connected to the source, a gate contact connected to the plurality of gates, a gate-source electrostatic discharge (ESD) diode connected between the gate contact and the source contact, and a breakdown voltage enhancement and leakage prevention structure formed underneath the gate-source ESD diode structure.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
53.
Manufacturing method for a power MOSFET with gate-source ESD diode structure
A method includes growing an epitaxial layer over a substrate, forming a plurality of gates in the epitaxial layer, forming a breakdown voltage enhancement and leakage prevention structure in the epitaxial layer, comprising a body ring structure, forming a source in the epitaxial layer and a gate-source Electrostatic Discharge (ESD) diode structure over the epitaxial layer, forming a source contact connected to the source and a first terminal of the gate-source ESD diode structure, forming a gate contact connected to the plurality of gates and a second terminal of the gate-source ESD diode structure, and forming a drain contact on the opposing side of the epitaxial layer from the source contact.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
54.
Electronic component package and manufacuring method thereof
The present invention relates to an electronic component package and a manufacturing method therefor. In an embodiment, the electronic component package comprises: a first metal layer, a high-voltage transistor semiconductor die, a first molding compound layer, a second metal layer, a first vertical connection structure, a second vertical connection structure, a control circuit bare chip, and a second molding compound layer. In the electronic component package of the present invention, a lead frame and electrical leads are replaced with the metal layers and the vertical connection structures, so that the position of the electrical connection of the chip is more flexible and the heat dissipation effect is better. Compared with the lead frames and the electrical leads, the electronic component package of the present disclosure is more suitable for packaging high-voltage or high-current chips.
H01L 25/10 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs ayant des conteneurs séparés
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
Aa switching power supply is provided. The switching power supply may include: a protocol circuit disposed on a secondary side of the switching power supply and configured to detect a power supply demand of a load device connected to the protocol circuit; a synchronous rectifier circuit disposed on the secondary side of the switching power supply and configured to control a rectifier power tube; and a signal transmission circuit disposed between the protocol circuit and the synchronous rectifier circuit and configured to transmit a signal between the protocol circuit and the synchronous rectifier circuit.
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
56.
System and method for automatic height adjustment for chip testing
A method includes configuring a preset reference pulse number, and controlling a test contact piece for testing chip leads to move toward a target chip lead, using a control signal corresponding to the preset reference pulse number. First data is continuously obtained and used to determine whether the test contact piece is in contact with the target chip lead. When the test contact piece is in contact with the target chip lead, the test contact piece is controlled to stop moving. Second data is obtained characterizing movement of the test contact piece from a time when the test contact piece initially contacts the target chip lead to a time when the test contact piece stops moving. The preset reference pulse number is adjusted based on the second data. A system and device, and a computer-readable storage medium are also provided for implementing the method.
A circuit for supplying power to a switching power supply control circuit based on an auxiliary winding includes: an auxiliary winding, a switching transistor, a low dropout voltage regulator (LDO), a first diode, a second diode, a forward energy storage capacitor, and a flyback energy storage capacitor, where the auxiliary winding, the flyback energy storage capacitor, and the switching transistor form a flyback energy storage loop to charge the flyback energy storage capacitor, and the auxiliary winding, the flyback energy storage capacitor, and the switching transistor form a flyback energy storage loop to charge the flyback energy storage capacitor. In a forward state, if the voltage of the forward energy storage capacitor is less than the voltage at an output terminal of the LDO, the flyback energy storage capacitor supplies power, or if the voltage of the forward energy storage capacitor is greater, the forward energy storage capacitor supplies power.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
58.
OVERTEMPERATURE PROTECTION OF SWITCHING POWER SUPPLY
An overtemperature protection circuit used for a switching power supply having a power switch includes a control circuit coupled to the power switch and configured to control, by a control terminal, on and off of the power switch, the control circuit having a sampling terminal for sampling a demagnetization signal of the switching power supply; and a temperature measurement circuit coupled between the control terminal and the sampling terminal. While the power switch is on, the control circuit clamps voltages at the control terminal and the sampling terminal to form a potential difference, thereby performing overtemperature protection of the switching power supply by a change in a current flowing through the temperature measurement circuit. While the power switch is off, a direction of a current flowing through the temperature measurement circuit is unidirectional from the control terminal to the sampling terminal.
H02H 5/04 - Circuits de protection de sécurité pour déconnexion automatique due directement à un changement indésirable des conditions non électriques normales de travail avec ou sans reconnexion sensibles à une température anormale
H02H 7/12 - Circuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour convertisseursCircuits de protection de sécurité spécialement adaptés aux machines ou aux appareils électriques de types particuliers ou pour la protection sectionnelle de systèmes de câble ou de ligne, et effectuant une commutation automatique dans le cas d'un changement indésirable des conditions normales de travail pour redresseurs pour convertisseurs ou redresseurs statiques
59.
Semiconductor Structure and Manufacturing Method Thereof
A semiconductor structure includes a substrate including a first surface and a second surface opposite to each other, and a unit region and a terminal region adjacent to each other. An electrode structure in the substrate extends from the first surface toward the second surface in the unit region. A trench structure in the substrate extends from the first surface toward the second surface in the unit region and adjoins the terminal region. The trench structure includes a semiconductor material layer extending to the first surface. A capacitive structure on the first surface of the substrate in the terminal region adjoins the trench structure. The capacitive structure has a material the same as the semiconductor material layer, and has a capacitive electrode connected to the semiconductor material layer. A method for manufacturing the semiconductor structure is also provided.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
H01L 29/66 - Types de dispositifs semi-conducteurs
H01L 29/808 - Transistors à effet de champ l'effet de champ étant produit par une jonction PN ou une autre jonction redresseuse à jonction PN
60.
Semiconductor chip package including lead frame and manufacturing method thereof
A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A semiconductor chip may be disposed over the first groove and affixed on the first surface of the lead frame through the adhesive in the first groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/49 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées du type fils de connexion
H01L 23/498 - Connexions électriques sur des substrats isolants
61.
Vertical Power Semiconductor Device and Manufacturing Method Thereof
A vertical power semiconductor device includes a semiconductor material layer having a first surface and a second surface opposite each other. A first electrode structure and a second electrode structure are arranged in the semiconductor material layer, extending from the first surface to the second surface. A first doped region having a first conductivity type is arranged between the first and second electrode structures. A second doped region having a second conductivity type is in the first doped region. The second doped region is close to the bottom of the first doped region and separated from the first surface. A third doped region having the second conductivity type is between the bottom of the first doped region and the second surface. A conductive plug is between the first and second electrode structures and separated from the third doped region. A method for manufacturing the semiconductor device is also provided.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/08 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode transportant le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/10 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices avec des régions semi-conductrices connectées à une électrode ne transportant pas le courant à redresser, amplifier ou commuter, cette électrode faisant partie d'un dispositif à semi-conducteur qui comporte trois électrodes ou plus
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
H01L 29/66 - Types de dispositifs semi-conducteurs
A method for calibrating a tray shield used for holding a wafer for processing is provided. The tray shield is in a ring shape. The method includes determining whether a first calibration ring is placeable into an inner chamber of the tray shield. When the first calibration ring is placeable into the inner chamber, the tray shield is determined to be usable for wafer processing. The first calibration ring is moved around inside the inner chamber to remove metal particles or burrs on the inner chamber, and thereafter, a wafer is loaded in the inner chamber. When the first calibration ring is not placeable into the inner chamber, the tray shield may be discarded. The method may also include assembling the tray shield utilizing a second calibration ring having an outer diameter equal to an inner diameter of the ring shape.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
63.
SEMICONDUCTOR DEVICE AND PROCESSES FOR MAKING SAME
The disclosure provides a semiconductor package having an isolation structure comprising an isolation trench filled with dielectric material, where the isolation structure traverses the thickness of the isolated semiconductor dies.
H01L 27/08 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant uniquement des composants semi-conducteurs d'un seul type
H01L 21/822 - Fabrication ou traitement de dispositifs consistant en une pluralité de composants à l'état solide ou de circuits intégrés formés dans ou sur un substrat commun avec une division ultérieure du substrat en plusieurs dispositifs individuels pour produire des dispositifs, p.ex. des circuits intégrés, consistant chacun en une pluralité de composants le substrat étant un semi-conducteur, en utilisant une technologie au silicium
H01L 29/66 - Types de dispositifs semi-conducteurs
A method includes providing a substrate having a first conductivity type, and having a first surface and a second surface opposite to the first surface, diffusing impurities into the substrate to form a first diffusion layer having the first conductivity type and a second diffusion layer having a second conductivity type, forming a plurality of diffusion regions having the first conductivity in the second diffusion layer having the second conductivity type, forming a square groove ring in the substrate, forming a glass layer over the square groove ring, forming a first electrode layer on the first diffusion layer, and forming a second electrode layer on the second diffusion layer, wherein the second electrode layer is in contact with the plurality of diffusion regions.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/04 - Corps semi-conducteurs caractérisés par leur structure cristalline, p.ex. polycristalline, cubique ou à orientation particulière des plans cristallins
H01L 29/66 - Types de dispositifs semi-conducteurs
An inverse voltage-to-current conversion circuit for providing a current that is inversely related to an input voltage of a protected device is disclosed. A first input terminal for receiving a first input voltage signal and a second input terminal for receiving a second input voltage signal. A voltage-to-time converter circuit provides a time indicator pulse signal with a pulse width related to inverse of a difference between the first and second input voltage signals. A time-to-voltage converter circuit provides a voltage indicator signal having a magnitude based on the pulse width of the time indicator pulse signal. A voltage-to-current converter circuit provides a current indicator signal having a magnitude proportional to the voltage indicator signal and inversely related to the difference between the first and second input voltage signals.
H03K 17/082 - Modifications pour protéger le circuit de commutation contre la surintensité ou la surtension par réaction du circuit de sortie vers le circuit de commande
G01R 19/255 - Dispositions pour procéder aux mesures de courant ou de tension ou pour en indiquer l'existence ou le signe utilisant une méthode de mesure numérique utilisant des convertisseurs analogiques/numériques du type comptant des impulsions, délivrées par un générateur d'impulsions à fréquence fixe, pendant une durée proportionnelle à la tension ou au courant
H03K 5/24 - Circuits présentant plusieurs entrées et une sortie pour comparer des impulsions ou des trains d'impulsions entre eux en ce qui concerne certaines caractéristiques du signal d'entrée, p. ex. la pente, l'intégrale la caractéristique étant l'amplitude
H03K 5/26 - Circuits présentant plusieurs entrées et une sortie pour comparer des impulsions ou des trains d'impulsions entre eux en ce qui concerne certaines caractéristiques du signal d'entrée, p. ex. la pente, l'intégrale la caractéristique étant la durée, l'intervalle, la position, la fréquence ou la séquence
66.
Lead Frame, Packaging Structure and Packaging Method
A lead frame includes a base comprising a bearing surface for bearing a chip. The bearing surface includes a soldering region, with a solder layer arranged in the soldering region. The solder layer is configured for fixing the chip on the bearing surface. The lead frame includes a groove provided on the bearing surface in a thickness direction of the base. The groove is located outside the soldering region and surrounds at least part of the soldering region along the outer periphery of the soldering region for receiving solder paste overflowed from the soldering region. A depth of the groove is based on a thickness of the base. A packaging structure including the lead frame and a packaging method using the lead frame are also provided.
An audio speaker system includes: an amplifier, where a positive input terminal of the amplifier is configured to be coupled to a first reference voltage node; and a piezo diaphragm including: a metal plate; a first piezo film attached to the metal plate, where the first piezo film is configured to function as a speaker during operation of the audio speaker system; and a second piezo film attached to the metal plate and spaced apart from the first piezo film, where the second piezo film is configured to function as a microphone during operation of the audio speaker system, where an output terminal of the amplifier is coupled to the first piezo film, and where a negative input terminal of the amplifier is coupled to the second piezo film.
An audio speaker system includes: an amplifier, where a positive input terminal of the amplifier is configured to be coupled to a first reference voltage node; and a piezo diaphragm including: a metal plate; a first piezo film attached to the metal plate, where the first piezo film is configured to function as a speaker during operation of the audio speaker system; and a second piezo film attached to the metal plate and spaced apart from the first piezo film, where the second piezo film is configured to function as a microphone during operation of the audio speaker system, where an output terminal of the amplifier is coupled to the first piezo film, and where a negative input terminal of the amplifier is coupled to the second piezo film.
H10N 30/30 - Dispositifs piézo-électriques ou électrostrictifs à entrée mécanique et sortie électrique, p. ex. fonctionnant comme générateurs ou comme capteurs
H04R 7/06 - Membranes planes comportant plusieurs sections ou couches
A quartz crystal resonator including a quartz crystal obtained from a quartz bar is provided. The quartz bar has a light axis, an electrical axis along a length of the quartz bar, and a mechanical axis that are perpendicular to one another. The quartz crystal has a major face cut from the quartz bar along a cutting plane. The cutting plane has a first angle of about 35° to about 36° with the light axis and has a second angle with the electric axis. The first angle is obtained by rotation about the electric axis, and the second angle is obtained by rotation about the light axis, such that the quartz crystal has a vibration frequency deviation inflection point in a range from about 30° C. to about 45° C. Methods for making the quartz crystal are also provided.
H03H 9/19 - Détails de réalisation de résonateurs se composant de matériau piézo-électrique ou électrostrictif ayant un résonateur unique en quartz
H03H 3/02 - Appareils ou procédés spécialement adaptés à la fabrication de réseaux d'impédance, de circuits résonnants, de résonateurs pour la fabrication de résonateurs ou de réseaux électromécaniques pour la fabrication de résonateurs ou de réseaux piézo-électriques ou électrostrictifs
70.
Vertical Semiconductor Power Device and Method for Manufacturing the Same
A vertical semiconductor power device is provided, which includes a substrate having a first surface and a second surface opposite to each other. A trench extends from the second surface toward the first surface. An in-trench dielectric layer is disposed along an inner surface of the trench. A shield electrode is disposed in the trench and is surrounded by the in-trench dielectric layer. A gate electrode is disposed in the in-trench dielectric layer and surrounds the shield electrode. The gate electrode is surrounded by the in-trench dielectric layer without adjoining the shield electrode and the substrate. A method for making the vertical semiconductor power device is also provided.
A power converter includes a voltage transformer, a clamp capacitor, a main switch, a clamp switch, and a control circuit. The clamp capacitor is coupled to the primary winding of the voltage transformer, and the main switch is coupled in series between the primary winding and a ground terminal. The clamp switch is coupled in series between the clamp capacitor and the main switch, and the clamp switch, the main switch, and the primary winding are coupled to a common node. The control circuit turns on the main switch periodically, and turns on the clamp switch before turning on the main switch. After turning off clamp switch and before turning on the main switch, the control circuit determines a length of time that the clamp switch should be turned on next time according to a voltage of the common node sensed right before the main switch is turned on and a threshold voltage.
H02M 1/00 - Détails d'appareils pour transformation
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
An apparatus includes a clamping circuit configured to provide a predetermined voltage at an output of the clamping circuit, a clamping switch coupled to the output of the clamping circuit, and a pass device connected between the clamping switch and an input/output terminal of a controller.
H05B 45/54 - Circuits pour faire fonctionner des diodes électroluminescentes [LED] réagissant aux dysfonctionnements des LED ou à un comportement indésirable des LEDCircuits pour faire fonctionner des diodes électroluminescentes [LED] sensibles à la vie des LEDCircuits de protection dans un ensemble sériel de LED
G01R 31/26 - Test de dispositifs individuels à semi-conducteurs
H05B 45/325 - Modulation de la largeur des impulsions [PWM]
73.
POWER FACTOR CORRECTION CONVERTER AND OPERATION METHOD THEREOF
A power factor correction (PFC) converter comprises an inductor, a main switch, a voltage divider, a diode, and a controller. The main switch controls the inductor performing magnetization and demagnetization, wherein a voltage difference between two ends of the main switch is a switch voltage. The voltage divider divides the switch voltage and generates a division voltage. The controller performs the following operations periodically in general mode: turning on the main switch; turning off the main switch after the main switch is turned on for a period of time; obtaining the switch voltage according to the division voltage, and determining the period of time for which the main switch is turned on next time according to the switch voltage and a predetermined output voltage of the PFC converter; and obtaining an output voltage according to the switch voltage during a period of time after the main switch is turned off.
H02M 1/42 - Circuits ou dispositions pour corriger ou ajuster le facteur de puissance dans les convertisseurs ou les onduleurs
H02M 3/156 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation
74.
Power Diode Device and Method of Manufacturing the Same
A power diode device includes a substrate. The substrate includes a core layer of a first conductive type, a first diffusion layer of the first conductive type, a second diffusion layer of a second conductive type, and a heavily doped region of the second conductive type. The core layer is located between the first diffusion layer and the second diffusion layer. A thickness of the core layer is greater than that of the second diffusion layer. The heavily doped region is located in the second diffusion layer and extends toward the core layer to form a PN junction between the heavily doped region and the core layer. A method for manufacturing the power diode device is also provided.
A circuit for Flyback switching power supply includes a transformer having a primary winding, a secondary winding and an auxiliary winding, a power switch coupled to a dotted terminal of the primary winding, and a switch. A first terminal of the switch is connected to a non-dotted terminal of the auxiliary winding through a capacitor, a second terminal of the switch and a dotted terminal of the auxiliary winding are connected, respectively, to a ground. A common node of the capacitor and the auxiliary winding is configured to connect to a non-dotted terminal of the primary winding. A control circuit is configured to generate, based on a voltage at the common node of the capacitor and the auxiliary winding, a control signal to control the switch in order to achieve zero voltage switch (ZVS) of the power switch.
H02M 3/335 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu avec transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrodes de commande pour produire le courant alternatif intermédiaire utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs
H02M 1/00 - Détails d'appareils pour transformation
A method of manufacturing a semiconductor structure forming a first diffusion layer on a first electrode layer and forming a core layer over the first diffusion layer. A second diffusion layer is formed over the core layer. A plurality of diffusion regions are formed in the second diffusion layer. A second electrode layer is formed over the second diffusion layer and in contact with the plurality of diffusion regions. The second diffusion layer is coupled to the plurality of diffusion regions through the second electrode layer. The substrate is sandwiched between the first electrode layer and the second electrode layer.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/04 - Corps semi-conducteurs caractérisés par leur structure cristalline, p.ex. polycristalline, cubique ou à orientation particulière des plans cristallins
H01L 29/66 - Types de dispositifs semi-conducteurs
An apparatus includes a capacitive device configured to provide bias power for a high-side switch, a gate drive path having variable resistance connected between the capacitive device and a gate of the high-side switch, wherein the gate drive path having variable resistance is of a first resistance value in response to a turn-on of the high-side switch, and the gate drive path having variable resistance is of a second resistance value in response to a turn-off of the high-side switch, and wherein the second resistance value is greater than the first resistance value, and a control switch connected between the gate of the high-side switch and ground.
H03K 17/693 - Dispositifs de commutation comportant plusieurs bornes d'entrée et de sortie, p. ex. multiplexeurs, distributeurs
H03K 17/687 - Commutation ou ouverture de porte électronique, c.-à-d. par d'autres moyens que la fermeture et l'ouverture de contacts caractérisée par l'utilisation de composants spécifiés par l'utilisation, comme éléments actifs, de dispositifs à semi-conducteurs les dispositifs étant des transistors à effet de champ
78.
ELECTRONIC ASSEMBLY PACKAGE MEMBER AND MANUFACTURING METHOD THEREFOR
Provided are an electronic assembly package member (1) and a manufacturing method therefor. The electronic assembly package member (1) comprises: a first metal layer, a high-voltage transistor semiconductor die (10), a first molding compound layer (11), a second metal layer, a first vertical connection structure, a second vertical connection structure, a control circuit die (12), and a second molding compound layer (13). According to the electronic assembly package member (1), a lead frame and a wire are replaced with the metal layers and the vertical connection structures, so that the electrical connection position of chips is flexible, and a heat dissipation effect is good. The present invention is suitable for packaging high-voltage or high-current chips.
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
There is provided a semiconductor device and a method of manufacturing the same. The method comprises: depositing an epitaxial layer on a semiconductor substrate, wherein the semiconductor substrate is of a first conductivity type, and the epitaxial layer is of a second conductivity type that is opposite to the first conductivity type, wherein depositing the epitaxial layer comprises depositing a first epi-layer of a first doping concentration, a second epi-layer of a second doping concentration and a third epi-layer of a third doping concentration, and wherein the semiconductor substrate and the first epi-layer form a first P-N junction at their interface, and the second epi-layer is arranged between the first and third epi-layers and the second doping concentration is higher than each of the first doping concentration and the third doping concentration; and forming a doped region of the first conductivity type at a surface of the third epi-layer, such that the doped region 8 and the third epi-layer form a second P-N junction at their interface.
H01L 27/02 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface
80.
LED color and brightness control apparatus and method
An apparatus includes a bandgap voltage reference configured to generate a current reference for controlling a plurality of light emitting diode channels, a plurality of MOSFET devices connected in parallel and coupled between a cathode of a light emitting diode channel and ground, wherein the plurality of MOSFET devices is configured to control a current flowing through the light emitting diode channel, and a control circuit configured to generate gate drive signals for the plurality of MOSFET devices, wherein the gate drive signals are configured to adjust the current flowing through the light emitting diode channel based on a predetermined color and a predetermined brightness level of the light emitting diode channel.
Signal transmission cables and serial interfaces with built-in signal boosting are provided. In some implementations, a signal transmission cable or interface for boosting signals comprises boosting circuitry. The boosting circuitry may comprise at least one boosting capacitor configured to be operatively coupled to a voltage supply during a charging phase and configured to be operatively coupled to the at least one line of a signal transmission cable or interface during a discharging phase, wherein, during the discharging phase, the at least one boosting capacitor boosts a voltage of the one or more signals transmitted on the at least one line. The boosting circuitry may comprise switching circuitry configured to switch the at least one boosting capacitor between from being operatively coupled to the voltage supply to being operatively coupled to the at least one line of the signal transmission cable or interface.
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
G06F 13/42 - Protocole de transfert pour bus, p. ex. liaisonSynchronisation
A switched mode power supply (SMPS) includes a first switch, a second switch connected, at a switching node, in series with the first switch, and an inductor coupled between the switching node and an output node for providing an inductor current, at the output node. The SMPS also includes an oscillator circuit for providing a clock signal characterized by an oscillating frequency, an adaptive minimum duty-cycle circuit configured to receive an error voltage signal and to generate a current signal to vary the oscillating frequency of the clock signal in response to the error voltage signal, wherein the error voltage signal is based on an output signal at the output node, and a pulse-width modulation (PWM) circuit configured to receive the error voltage signal and the clock signal and to provide a switching control signal to control the first switch and the second switch.
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H03K 3/017 - Réglage de la largeur ou du rapport durée période des impulsions
83.
Dynamic control of output driver in a switching amplifier
An output driver with slew rate control includes an output transistor that includes a control terminal coupled to a switching input signal, a drain node coupled to the output node for coupling to a load device, and a source node coupled to a reference voltage. The output driver also has a slew control circuit including a current source coupled in series at a connection node with parallelly connected first switch transistor and second switch transistor. The connection node is coupled to the control terminal of the output transistor. The first switch transistor has a control terminal coupled to the switching input signal. The second switch transistor has a control terminal that is coupled to either the switching input signal or a dynamically modulated switching input signal, depending on a current direction at the output node.
An apparatus includes a plurality of MOSFET device groups connected in parallel, wherein a first common node of the plurality of MOSFET device groups is coupled to a cathode of a light emitting diode channel of a plurality of light emitting diode channels, and a second common node of the plurality of MOSFET device groups is connected to ground, and a control circuit configured to generate gate drive signals for the plurality of MOSFET device groups, wherein the gate drive signals are configured to adjust a current flowing through the light emitting diode channel based on a predetermined color and a predetermined brightness level of the light emitting diode channel, and under different duty cycles, the control circuit is configured to control the current flowing through the light emitting diode channel to be proportional to a corresponding duty cycle.
A method for forming a semiconductor Schottky rectifier device includes providing a semiconductor substrate, forming a hard mask for trench etch including openings for guard rings, an anode region, and a cathode region, and etching semiconductor epitaxial material layer to form a plurality of trenches. The method also includes forming a first dielectric layer and depositing a polysilicon layer, performing an anisotropic etch of the polysilicon layer to form polysilicon elements on sidewalls of the trench, and depositing and etching a second dielectric layer to expose a Schottky diode region and a bottom region of the trench in the cathode region. The method further includes depositing a first metal layer and performing a thermal treatment to form metal silicide in the Schottky diode region and the cathode region and forming a second metal layer and separating the second metal layer into an anode electrode and a cathode electrode.
H01L 29/417 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative transportant le courant à redresser, à amplifier ou à commuter
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
Methods and systems for performing data correction and phase optimization are disclosed herein. In some implementations, a system for performing data correction comprises: an analog to digital converter (ADC) configured to receive differential data from a continuous time linear equalizer (CTLE) and generate a bitstream comprising a plurality of data bits and a corresponding plurality of data sign bits; a decision feedback equalization (DFE) block configured to receive the bitstream from the ADC and provide data to a clock and data recovery (CDR) block; and data correction circuitry. In some implementations, the data correction circuitry is configured to: receive the bitstream from the ADC; determine whether to correct a data sign bit; responsive to determining the data sign bit is to be corrected, flip the data sign bit; and provide the plurality of data sign bits, including the flipped data sign bits, to the DFE.
A leadframe includes a peripheral frame, a plurality of lead pads, and a die attach pad (DAP). Each lead pad is physically connected to the peripheral frame by a respective connecting portion. The DAP is surrounded by the plurality of lead pads. The DAP includes a first protruding portion coupled to a first lead pad on a first side of the DAP and a second protruding portion coupled to a second lead pad on a second side of the DAP opposite the first side. The DAP does not comprise direct connections to the peripheral frame. The leadframe further includes two or more of the lead pads disposed on either side of the first lead pad on the first side of the DAP; and two or more of the lead pads disposed on either side of the second lead pad on the second side of the DAP.
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
A lead frame includes a plurality of lead frame units. An upper surface of each of the plurality of lead frame units includes a soldering region and a non-soldering region outside of the soldering region. The non-soldering region includes a rough surface, and the soldering surface includes no rough surface. Each of the plurality of lead frame units may include a base island and a plurality of pins arranged around the base island, and the soldering region may be arranged on the base island and/or on the plurality of pins. The soldering region my include a wire-bonding soldering portion that connects to a chip via a bonding wire. Each of the plurality of lead frame units may include a plurality of pins, and the soldering region and the non-soldering region are arranged on the plurality of pins.
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
Systems and methods for signal boosting in serial interfaces are provided. In some implementations, a system for boosting signals comprises boosting circuitry. The boosting circuitry may comprise at least one boosting capacitor configured to be operatively coupled to a voltage supply during a charging phase and configured to be operatively coupled to the at least one line of a signal transmission line during a discharging phase, wherein, during the discharging phase, the at least one boosting capacitor boosts a voltage of the one or more signals transmitted on the at least one line. The boosting circuitry may comprise switching circuitry configured to switch the at least one boosting capacitor between from being operatively coupled to the voltage supply to being operatively coupled to the at least one line of the signal transmission line.
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
G06F 13/42 - Protocole de transfert pour bus, p. ex. liaisonSynchronisation
A semiconductor structure includes a substrate having a first surface and a second surface opposite to the first surface. The semiconductor structure also includes a first diffusion layer disposed in the substrate and adjacent to the first surface, and a first electrode layer disposed on the first diffusion layer. The semiconductor structure further includes a second diffusion layer disposed in the substrate and adjacent to the second surface, and a plurality of diffusion regions disposed in the second diffusion layer. The semiconductor structure further includes a second electrode layer disposed on the second diffusion layer and in contact with the plurality of diffusion regions. The second diffusion layer is coupled to the plurality of diffusion regions through the second electrode layer. The substrate is sandwiched between the first electrode layer and the second electrode layer.
H01L 29/06 - Corps semi-conducteurs caractérisés par les formes, les dimensions relatives, ou les dispositions des régions semi-conductrices
H01L 29/04 - Corps semi-conducteurs caractérisés par leur structure cristalline, p.ex. polycristalline, cubique ou à orientation particulière des plans cristallins
H01L 29/66 - Types de dispositifs semi-conducteurs
A semiconductor device and a lead frame. The semiconductor device comprises at least one semiconductor chip that is attached to a surface of a base island in a first plane, wherein a connecting rib is connected to the base island, and has a first part which is obliquely connected to the base island; the connecting rib has a second part, and the second part has a surface in a second plane; the second plane is parallel to the first plane and is a plane different from the first plane; the connecting rib has a branch part divided from the second part and the branch part has, in the second plane, a surface used for receiving a lead connected to the semiconductor chip; and the branch part has an edge which is distant from a first edge of the base island by a first distance.
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
93.
PACKAGING SUBSTRATE, GRID ARRAY PACKAGE, AND PREPARATION METHOD THEREFOR
Disclosed are a packaging substrate, a grid array package, and a preparation method therefor. The packaging substrate comprises a plurality of packaging units, and each packaging unit is defined by a closed packaging line. The packaging substrate comprises: a base substrate having a first surface and a second surface that are opposite to each other, a plurality of solder pads provided on the first surface, and a metal layer provided on the second surface. In a given packaging unit, the metal layer comprises a plurality of lead pads, at least one lead pad extending from an inner side of the packaging unit defined by the packaging line to an outer side. The lead pad is connected to one solder pad by means of a connecting member penetrating through the base substrate, and an orthographic projection of the connecting member on the base substrate at least partially covers the packaging line.
A split-gate trench device chip has an active region in which a plurality of active trenches are disposed. The active region is enclosed by termination trenches disposed in a termination region, which extends to the edges of the chip. A gate metal lead is disposed on the device surface. The gate metal lead makes contact to gate electrodes in the active trenches through contact holes disposed in the active region. A source or a drain metal lead is also disposed on the surface. The source or the drain metal lead makes contact to the field plate electrodes through contact holes disposed outside the active region. Each active trench in the active region has a first end merge into a first termination trench and a second end separated from an adjacent second termination trench.
H01L 29/78 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée
H01L 29/423 - Electrodes caractérisées par leur forme, leurs dimensions relatives ou leur disposition relative ne transportant pas le courant à redresser, à amplifier ou à commuter
A method for a switched mode power supply (SMPS) includes providing an error voltage signal based on a difference between a sampled output voltage of the SMPS and a target voltage, and generating a clock signal characterized by an oscillating frequency; generating a switching control signal based on the error voltage signal and the clock signal using pulse-width modulation (PWM). The method further includes varying the oscillating frequency of the clock signal according to the error voltage signal in a current generating circuit, and applying the switching control signal to control the power switches of the SMPS.
H02M 3/158 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des tubes à décharge avec électrode de commande ou des dispositifs à semi-conducteurs avec électrode de commande utilisant des dispositifs du type triode ou transistor exigeant l'application continue d'un signal de commande utilisant uniquement des dispositifs à semi-conducteurs avec commande automatique de la tension ou du courant de sortie, p. ex. régulateurs à commutation comprenant plusieurs dispositifs à semi-conducteurs comme dispositifs de commande finale pour une charge unique
H02M 3/07 - Transformation d'une puissance d'entrée en courant continu en une puissance de sortie en courant continu sans transformation intermédiaire en courant alternatif par convertisseurs statiques utilisant des résistances ou des capacités, p. ex. diviseur de tension utilisant des capacités chargées et déchargées alternativement par des dispositifs à semi-conducteurs avec électrode de commande
H03K 3/017 - Réglage de la largeur ou du rapport durée période des impulsions
Disclosed are some examples of Phase interpolator circuitry used in retimer systems. The phase interpolator circuitry includes a phase interpolator configured to: receive the phase control signal, generate, based on the phase control signal, an output clock signal, and provide the output clock signal to the transmitter to track a plurality data packets. Phase interpolator circuitry is coupled with clock data recovery circuitry. In some implementations, clock data recovery circuitry is coupled between a receiver and a transmitter. The clock data recovery circuitry is configured to: extract a data component from an input data signal associated with the receiver, provide the data component to the transmitter, and generate a phase control signal.
H04L 7/033 - Commande de vitesse ou de phase au moyen des signaux de code reçus, les signaux ne contenant aucune information de synchronisation particulière en utilisant les transitions du signal reçu pour commander la phase de moyens générateurs du signal de synchronisation, p. ex. en utilisant une boucle verrouillée en phase
H04L 7/00 - Dispositions pour synchroniser le récepteur avec l'émetteur
