Provided is an electrolytic silver-germanium alloy plating solution that exhibits excellent bath stability and is capable of forming a plating film that can maintain high hardness and low contact resistance even when subjected to heat. Specifically provided is an electrolytic silver-germanium alloy plating solution containing: (1) a total of 1-100 g/L of one or both of silver cyanide and a silver cyanide salt in terms of Ag; (2) 1-30 g/L of a water-soluble germanium compound in terms of Ge; (3) a total of 0.1-50 g/L of one or both of polyethylenimine and polyacrylic acid; and (4) 3 g/L or more of a β-naphthalenesulfonic acid-formalin condensate.
C25D 3/64 - Dépôt électrochimiqueBains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'argent
C25D 7/00 - Dépôt électrochimique caractérisé par l'objet à revêtir
2.
PRIMER RESIN SOLUTION FOR ELECTROLESS PLATING, METHOD FOR PLATING THROUGH HOLE-INCLUDING GLASS SUBSTRATE USING SAID PRIMER RESIN SOLUTION, AND GLASS INTERPOSER SUBSTRATE
The present invention pertains to a primer resin solution for forming a primer resin layer that imparts adhesion to a metal film formed on a glass substrate such as TGV. A primer resin solution according to the present invention comprises a resin component and a solvent component. In the present invention, the resin component includes a resin I that is a main agent component, a resin II that is a crosslinking agent component, and a resin III that is an adhesive component. The resin III is a thermosetting resin having a bisphenol skeleton, and the content of III in the resin component is 10-48 mass%. In order to form a primer resin layer on a through hole-including substrate, the viscosity and the surface tension of a primer resin solution according to the present invention are optimized. Specifically, a primer resin solution according to the present invention has a viscosity of not more than 10 mPa·s at 25°C and a surface tension of not more than 40 mN/m at 22°C as measured by the Young-Laplace method.
C23C 18/20 - Pré-traitement du matériau à revêtir de surfaces organiques, p. ex. de résines
C03C 17/38 - Traitement de surface du verre, p. ex. du verre dévitrifié, autre que sous forme de fibres ou de filaments, par revêtement avec au moins deux revêtements ayant des compositions différentes un revêtement au moins étant un métal un revêtement au moins étant une substance organique
Provided is a resin liquid and a method of forming a shaped object suitable for producing a shaped object including a three-dimensional metal structure. The resin liquid contains a photo-radical curable resin; a thermosetting resin; and an acid catalyst. The thermosetting resin contains a melamine crosslinking agent or a benzoguanamine crosslinking agent. The thermosetting resin content of the resin liquid is 3 wt % to 60 wt %.
C08J 3/24 - Réticulation, p. ex. vulcanisation, de macromolécules
B29C 64/135 - Procédés de fabrication additive n’utilisant que des matériaux liquides ou visqueux, p. ex. dépôt d’un cordon continu de matériau visqueux utilisant des couches de liquide à solidification sélective caractérisés par la source d'énergie à cet effet, p. ex. par irradiation globale combinée avec un masque la source d’énergie étant concentrée, p. ex. lasers à balayage ou sources lumineuses focalisées
B29K 33/00 - Utilisation de polymères d'acides non saturés ou de leurs dérivés comme matière de moulage
B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
The present invention relates to a substrate, for electroless plating, comprising a primer layer compatible with an electroless plating process. This substrate for electroless plating is constituted of a base material and a primer layer formed on one or both surfaces of the base material. The primer layer includes a thermoplastic resin I that constitutes a main agent component, and a resin II that constitutes a crosslinking agent component, and further includes a thermosetting resin III that has a bisphenol skeleton and constitutes an adhesive agent component. The resin III is preferably a bisphenol A type epoxy resin or a bisphenol F type epoxy resin. The content of the resin III in the primer layer is set to be 10% by mass to 48% by mass with respect to all of the resins constituting the primer layer. The substrate for electroless plating in the present invention exhibits good adhesion of a plating film via the primer layer.
The present invention relates to a substrate for electroless plating, which comprises a primer layer that is capable of coping with an electroless plating process. This substrate for electroless plating is composed of a base material and a primer layer that is formed on one surface or both surfaces of the base material. The primer layer contains a thermoplastic resin I which is a main agent component and a resin II which is a crosslinking agent component, and additionally contains a thermosetting resin III which is an adhesive component and has a bisphenol skeleton, and a titanium element or a zirconium element which is a reinforcing agent component. The resin III is preferably a bisphenol A type epoxy resin or a bisphenol F type epoxy resin. The titanium element or the zirconium element, which is a reinforcing agent component, is derived from a titanium alkoxide or the like, or a zirconium alkoxide or the like, each of which is contained in a primer liquid for forming the primer layer. The substrate for electroless plating according to the present invention can suppress deterioration of the base material, which is caused by diffusion of metal ions, by the action of the primer layer.
The present invention relates to a plating solution for forming a black rhodium plating film. A black rhodium plating solution according to the present invention includes: a rhodium salt that has a rhodium metal concentration of 1 g/L to 20 g/L inclusive; 10 mL/L to 100 mL/L inclusive of sulfuric acid; 2 mM to 100 mM inclusive of a phosphonic acid derivative or a salt thereof; and a magnesium salt that has a magnesium metal concentration of 0.1 g/L to 10 g/L inclusive. According to the present invention, the phosphonic acid derivative or the salt thereof acts as a blackening agent for a rhodium plating film. This blackening agent makes it possible to obtain the black rhodium plating film that has little change in appearance even after film formation.
C25D 3/52 - Dépôt électrochimiqueBains utilisés à partir de solutions de métaux du groupe du platine caractérisé par les constituants organiques utilisés pour le bain
A cyanide-free gold electroplating solution for forming gold deposits contains bismuth and compact-packed via-filling deposit with a U-shaped stacked structure in cross section inside drilled holes. A gold electroplating solution includes 15 g/L of gold (I) sodium sulfite (as gold element), 15 g/L of sodium sulfate, 50 g/L of sodium sulfite, 10 mg/L of thallium formate (as thallium element), 50 mg/L of bismuth nitrate (as bismuth element) and 1 g/L of sodium phosphate.
Provided are: a resinous liquid suitable for producing shaped objects including three-dimensional metallic structures; and a method for forming a shaped object. The resinous liquid comprises a radical photocurable resin, a heat-curable resin, and an acid catalyst, wherein the heat-curable resin contains a melamine-based crosslinking agent or a benzoguanamine-based crosslinking agent and the heat-curable resin is contained in an amount of 3-60 wt%.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08L 33/04 - Homopolymères ou copolymères des esters
C08L 61/20 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des composés contenant de l'hydrogène lié à l'azote
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
The present invention provides a cyanide-based silver alloy electroplating solution characterized by containing 10 to 100 g/L of silver cyanide complex in terms of silver, 5 to 300 g/L of electroconductive salt, 0.1 to 10 g/L of germanium compound in terms of germanium, and 1 to 100 g/L of a coordinating polymer additive.
NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY (Japon)
Inventeur(s)
Okutsu, Tetsuo
Ito, Masahiro
Takura, Akihiro
Abrégé
B>1), thereby forming a more moderate electric field region. A reduced gold fine particle group (average particle size: 20 nm) was self-assembled on a transparent polyester resin film and half-submerged and fixed. This base material was repeatedly immersed in an electroless gold plating solution so that gold particles were deposited on the gold fine particles. 10 microliters of a protein solution was added dropwise to this nanostructured substrate, and crystallized by a hanging drop vapor diffusion method.
B01J 19/12 - Procédés utilisant l'application directe de l'énergie ondulatoire ou électrique, ou un rayonnement particulaireAppareils à cet usage utilisant des radiations électromagnétiques
C07K 1/30 - ExtractionSéparationPurification par précipitation
C30B 7/00 - Croissance des monocristaux à partir de solutions en utilisant des solvants liquides à la température ordinaire, p. ex. à partir de solutions aqueuses
C30B 30/04 - Production de monocristaux ou de matériaux polycristallins homogènes de structure déterminée, caractérisée par l'action de champs électriques ou magnétiques, de l'énergie ondulatoire ou d'autres conditions physiques spécifiques en utilisant des champs magnétiques
B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
A nanostructure substrate includes groups of composite particles in which a reduced and deposited coating layer shows cohesive polarization action and/or electromagnetic polarization action. Also, to provide a nanostructure substrate, such active sites are dramatically increased to allow a medium to react homogenously over the entire nanostructure substrate. On a transparent semi-curable polyester resin film, groups of gold fine particles (average particle diameter: 20 nm) are reduced and deposited from an aqueous solution and self-aggregated. A half of the lower part of the groups of gold fine particles is submerged in the polyester resin film, and embedded in the front surface side of the transparent resin base body. Then, this transparent substrate is immersed in an electroless gold-plating solution repeatedly to deposit gold crystal grains on the fixed groups of gold fine particles.
A laminate structure of metal coating is laminated on a base material, and includes a primer layer, a catalyst layer and a plating deposited layer. The primer layer is a resin layer with a glass transition temperature (Tg) of 40 to 430° C. The catalyst layer is a metal nanoparticle group arranged in a plane on the primer layer, wherein the metal nanoparticle group is a metal in Group 11 or Groups 8, 9 and 10 in a periodic table, and the metal nanoparticles are surrounded by the primer layer. Ends of the metal nanoparticles are attached to the plating deposited layer.
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
B32B 15/01 - Produits stratifiés composés essentiellement de métal toutes les couches étant composées exclusivement de métal
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C23C 28/00 - Revêtement pour obtenir au moins deux couches superposées, soit par des procédés non prévus dans un seul des groupes principaux , soit par des combinaisons de procédés prévus dans les sous-classes et
C25D 5/54 - Dépôt électrochimique sur des surfaces non métalliques
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
13.
Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating solution including same
Electrolytic hard gold plating solution substitution inhibitors containing at least one compound selected from the group consisting of an imidazole compound having a mercapto group, a triazole compound having a mercapto group, and an aliphatic compound having a sulfonic acid group and a mercapto group are provided. Electrolytic hard gold plating solutions containing at least one electrolytic hard gold plating solution substitution inhibitor, a gold salt, a soluble cobalt salt and/or a soluble nickel salt, an organic acid conducting salt, and a chelating agent are also provided.
The present invention provides a non-cyanide based Au—Sn alloy plating solution capable of performing a Au—Sn alloy plating treatment by a plating solution composition that is neutral and does not contain cyanide. In the present invention, a non-cyanide soluble gold salt, a Sn compound composed of tetravalent Sn, and a thiocarboxylic acid-based compound are contained. The non-cyanide based Au—Sn alloy plating solution of the present invention can further contain sugar alcohols, and, in addition, can further contain a dithioalkyl compound.
The pretreatment solution for electroless plating of the present invention is composed of noble metal colloidal nanoparticles, a sugar alcohol, and water. The colloidal nanoparticles are gold, platinum, or palladium, have an average particle diameter of 5 to 80 nm, and are contained in the pretreatment solution in an amount of 0.01 to 10 g/L as metal mass. The sugar alcohol is at least one selected from the group consisting of tritol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, or pentaerythritol and is contained in the pretreatment solution in an amount of 0.01 to 200 g/L in total. The electroless plating method of the present invention uses the pretreatment solution and performs the electroless plating in an electroless plating bath.
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.
C25D 3/50 - Dépôt électrochimiqueBains utilisés à partir de solutions de métaux du groupe du platine
C25D 3/60 - Dépôt électrochimiqueBains utilisés à partir de solutions d'alliages contenant plus de 50% en poids d'étain
C25D 3/56 - Dépôt électrochimiqueBains utilisés à partir de solutions d'alliages
C23C 16/00 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD]
brevets
