Eeja Ltd.

Japon

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Quantité totale PI 15
Rang # Quantité totale PI 104 955
Note d'activité PI 2,1/5.0    17
Rang # Activité PI 50 176

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Dernier brevet 2026 - Primer resin solution for electr...
Premier brevet 2007 - Palladium plating solution

Derniers inventions, produits et services

2025 Invention Primer resin solution for electroless plating, method for plating through hole-including glass su...
Invention Substrate for electroless plating, electroless plating structure, and electroless plating method....
Invention Substrate for electroless plating, electroless plated structure, and electroless plating method. ...
2024 Invention Black rhodium plating solution and plating method for black rhodium plating film. The present inv...
2023 Invention Gold electroplating solution. A cyanide-free gold electroplating solution for forming gold deposi...
Invention Resin liquid and method of forming shaped object. Provided is a resin liquid and a method of for...
Invention Resinous liquid and method for forming shaped object. Provided are: a resinous liquid suitable fo...
2021 Invention Cyanide-based silver alloy electroplating solution. The present invention provides a cyanide-base...
2020 Invention Biopolymer concentration method, crystallization method, and nanostructured substrate. B>1), ther...
Invention Nanostructure substrate. A nanostructure substrate includes groups of composite particles in whi...
2017 Invention Laminate structure of metal coating. A laminate structure of metal coating is laminated on a base...
Invention Non-cyanide based au—sn alloy plating solution. The present invention provides a non-cyanide base...
2016 Invention Electrolytic hard gold plating solution substitution inhibitor and electrolytic hard gold plating...
2015 Invention Pretreatment solution for electroless plating and electroless plating method. The pretreatment so...
2007 Invention Palladium plating solution. The invention provides a plating solution capable of forming a pallad...