Topologic Inc.

Japon

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Type PI
        Brevet 33
        Marque 1
Juridiction
        International 26
        États-Unis 8
Date
Nouveautés (dernières 4 semaines) 8
2026 août (MACJ) 2
2026 juillet 7
2026 (AACJ) 11
2025 8
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Classe IPC
H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen 8
G01K 17/00 - Mesure d'une quantité de chaleur 7
H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM] 7
H10N 50/10 - Dispositifs magnéto-résistifs 6
G01N 21/3504 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge pour l'analyse des gaz, p. ex. analyse de mélanges de gaz 2
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Classe NICE
09 - Appareils et instruments scientifiques et électriques 1
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau 1
42 - Services scientifiques, technologiques et industriels, recherche et conception 1
Statut
En Instance 8
Enregistré / En vigueur 26

1.

COOLING CONTROL DEVICE, COOLING SYSTEM, COOLING CONTROL METHOD, AND PROGRAM

      
Numéro d'application JP2025003773
Numéro de publication 2026/167772
Statut Délivré - en vigueur
Date de dépôt 2025-02-05
Date de publication 2026-08-13
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

[Problem] To provide a cooling control device and the like that make it possible to achieve more suitable cooling costs. [Solution] One aspect of the present invention provides a cooling control device that acquires measurement results for heat flow from a heat flow sensor that is provided near a heat source and, on the basis of the acquired measurement results for heat flow, controls the behavior of a cooling means that is provided to cool the heat source.

Classes IPC  ?

  • F25B 1/00 - Machines, installations ou systèmes à compression à cycle irréversible

2.

MEASURING DEVICE, INFORMATION PROCESSING SYSTEM, AND MEASURING METHOD

      
Numéro d'application 19153091
Statut En instance
Date de dépôt 2024-02-07
Date de la première publication 2026-08-06
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

A measuring apparatus comprises a thermoelectric conversion circuit, a heat flow measuring unit, and a temperature measuring unit. The thermoelectric conversion circuit includes an element configured to generate an electromotive force by a temperature gradient generated through heat exchange with an object being measured. The heat flow measuring unit measures heat flow generated in the object being measured on the basis of an electrical signal generated in the thermoelectric conversion circuit by the electromotive force. The temperature measuring unit causes a second current to flow along a pathway through which a first current resulting from the electromotive force flows in at least a portion of the thermoelectric conversion circuit, measures electrical resistance of the portion, and measures temperature of the object being measured on the basis of the electrical resistance. The apparatus measures heat flow and temperature at the same location.

Classes IPC  ?

  • G01K 7/18 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance linéaire, p. ex. un thermomètre à résistance de platine
  • G01K 3/14 - Thermomètres donnant une indication autre que la valeur instantanée de la température fournissant des différences de valeursThermomètres donnant une indication autre que la valeur instantanée de la température fournissant des valeurs différenciées par rapport à l'espace
  • G01K 17/00 - Mesure d'une quantité de chaleur
  • G01R 19/10 - Mesure d'une somme, d'une différence, ou d'un rapport

3.

GAS DETECTOR, GAS DETECTION MODULE, GAS DETECTION DEVICE, AND GAS DETECTION METHOD

      
Numéro d'application 19140260
Statut En instance
Date de dépôt 2023-12-20
Date de la première publication 2026-07-30
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

A gas detector is provided. The gas detector comprises: a thin-film type heat flow sensor provided in a position to receive electromagnetic waves irradiated with a prescribed intensity; and a detecting unit which, if a measured value from the heat flow sensor changes due to a change in the received intensity of the electromagnetic waves, detects an amount of gas in a space through which the electromagnetic waves pass, on the basis of the change in the measured value.

Classes IPC  ?

  • G01N 21/3504 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge pour l'analyse des gaz, p. ex. analyse de mélanges de gaz

4.

MEASURING SYSTEM

      
Numéro d'application 19142677
Statut En instance
Date de dépôt 2023-12-21
Date de la première publication 2026-07-23
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

An embodiment of the present invention provides a measuring system. The measuring system comprises a heat flow sensor and a housing. The heat flow sensor comprises an electrically insulating substrate and a thermoelectric conversion part that is provided on the substrate. The thermoelectric conversion part is configured so that an electromotive force occurs on the basis of a temperature gradient along a gradient direction that is the direction from the substrate to the thermoelectric conversion part. The housing is configured to be capable of accommodating the heat flow sensor, and comprises a first wall part and a second wall part. The first wall part is configured so as to exchange heat with the thermoelectric conversion part via the substrate. The second wall part is configured so as to exchange heat with the thermoelectric conversion part not via the same substrate or a different substrate.

Classes IPC  ?

5.

SIGNAL PROCESSING METHOD, SIGNAL PROCESSING SYSTEM, AND SIGNAL PROCESSING PROGRAM

      
Numéro d'application 19143301
Statut En instance
Date de dépôt 2023-12-21
Date de la première publication 2026-07-23
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

A signal processing method in a measuring system is provided. The measurement system in this signal processing method is provided with a thermoelectric conversion unit. The thermoelectric conversion unit is configured to convert a temperature gradient, which is caused by heat exchange with a measurement target, to an electric signal on the basis of an anomalous Nernst effect. The signal processing method includes the following steps. In a modulation step, a modulation including a prescribed modulation frequency is introduced to an electric signal output by the thermoelectric conversion unit to generate a modulation signal. The modulation frequency is a different frequency from the frequency band of the thermoelectric conversion unit. In an extraction step, a signal of a component of the modulation frequency is extracted from the modulation signal.

Classes IPC  ?

  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen
  • G01K 7/02 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments thermo-électriques, p. ex. des thermocouples

6.

MEASUREMENT SYSTEM

      
Numéro d'application 19142852
Statut En instance
Date de dépôt 2023-12-25
Date de la première publication 2026-07-23
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

According to an aspect of the present invention, a measurement system is provided. This measurement system comprises a heat flow sensor and a housing. The heat flow sensor includes a substrate having electrical insulation and a thermoelectric conversion unit provided on the substrate. The thermoelectric conversion unit is configured to generate an electromotive force on the basis of a temperature gradient along a gradient direction towards the thermoelectric conversion unit from the substrate. The housing is configured to be capable of accepting the heat flow sensor and includes a first wall and a second wall. The first wall is configured to face the substrate. The second wall is configured to cover the heat flow sensor by extending along the gradient direction from the first wall and includes an opening. The opening is configured to pass through the second wall so that at least a portion of the thermoelectric conversion unit is continuous with the outside of the housing without passing through the substrate.

Classes IPC  ?

  • G01K 17/04 - Calorimètres utilisant des méthodes de compensation
  • G01K 1/08 - Dispositifs de protection, p. ex. étuis
  • G01K 1/16 - Dispositions particulières pour conduire la chaleur de l'objet à l'élément sensible
  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen
  • H10N 19/00 - Dispositifs intégrés ou ensembles de plusieurs dispositifs comprenant au moins un élément thermoélectrique ou thermomagnétique couvert par les groupes

7.

INFORMATION PROCESSING METHOD, RECORDING MEDIUM, AND CALCULATION METHOD

      
Numéro d'application 19133161
Statut En instance
Date de dépôt 2023-12-14
Date de la première publication 2026-07-16
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

An information processing method, a recording medium, and a calculation method are provided that make it possible to evaluate level of comfort according to individual differences. The information processing method comprises an acquisition step, a calculation step, and an output step. In the acquisition step, heat balance information that relates to the heat balance of a user is acquired. The heat balance information includes the flow of heat in the user. In the calculation step, the level of comfort of the user is calculated on the basis of the heat balance information and first reference information. The first reference information indicates the relationship between the heat balance information and the level of comfort. In the output step, information relating to the level of comfort is outputted.

Classes IPC  ?

  • F24F 11/64 - Traitement électronique utilisant des données mémorisées au préalable
  • F24F 11/52 - Aménagements pour l’indication, p. ex. écrans
  • F24F 11/89 - Aménagements ou montage des dispositifs de commande ou de sécurité
  • F24F 120/14 - Activité des occupants

8.

HEAT FLOW MEASURING APPARATUS AND HEAT FLOW MEASURING METHOD

      
Numéro d'application 19134032
Statut En instance
Date de dépôt 2023-12-21
Date de la première publication 2026-07-16
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

A heat flow measuring apparatus is provided. This heat flow measuring apparatus comprises: a thermoelectric conversion unit that is configured to convert, on the basis of the anomalous Nernst effect, a heat gradient generated by heat exchange with an object to be measured into an electric signal; and a magnetic field application unit that is configured to apply a magnetic field in a given direction to the thermoelectric conversion unit.

Classes IPC  ?

  • G01K 17/00 - Mesure d'une quantité de chaleur
  • H10N 19/00 - Dispositifs intégrés ou ensembles de plusieurs dispositifs comprenant au moins un élément thermoélectrique ou thermomagnétique couvert par les groupes

9.

INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM

      
Numéro d'application 19131800
Statut En instance
Date de dépôt 2023-12-21
Date de la première publication 2026-07-09
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

An information processing system for a sensor unit is provided in which the sensor unit comprises at least one concentration sensor configured to come into contact with fluid and output an electromotive force having a correlation with a concentration of target particles contained in the fluid, the concentration sensor comprises a first thermoelectric conversion part; an interaction portion; and a first temperature adjustment part, and the information processing system comprises at least one control circuit configured to execute: an acquisition step of acquiring, from the sensor unit, at least a measurement result and a value related to the temperature of the interaction portion; and an output step of outputting a concentration of the target particles contained in the fluid corrected by using a correction value, based on the correction value specified based on a value related to the temperature of the interaction portion and the measurement result.

Classes IPC  ?

  • G01N 25/32 - Utilisation d'éléments thermo-électriques
  • G01N 25/34 - Utilisation d'éléments mécaniques réagissant à la chaleur, p. ex. un bimétal

10.

HEAT FLUX MEASUREMENT SYSTEM AND HEAT FLUX MEASUREMENT METHOD

      
Numéro d'application JP2025032028
Numéro de publication 2026/058906
Statut Délivré - en vigueur
Date de dépôt 2025-09-10
Date de publication 2026-03-19
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

One embodiment of the present invention provides a heat flux measurement system that is mountable on an insulating substrate. The insulating substrate comprises: a main surface on which an element can be disposed; and a conductive pattern having electrical conductivity on the main surface. The heat flux measurement system comprises: a transmission part and at least one heat flux sensor. The transmission part comprises: a connection section that is thermally connectable to the conductive pattern of the insulating substrate; and an extension section that extends from the connection section along the main surface. The heat flux sensor is thermally connected to the extension section, and is configured to output an electrical signal on the basis of a component along a plane-perpendicular direction perpendicular to the main surface among heat fluxes generated through heat exchange with the extension section.

Classes IPC  ?

  • G01K 17/20 - Mesure d'une quantité de chaleur transportée par des milieux en écoulement, p. ex. dans les systèmes de chauffage basée sur la mesure d'une différence de température de part et d'autre d'une surface radiante, combinée avec une détermination du coefficient de transmission de la chaleur

11.

HEAT CONTROL DEVICE, CONTROL METHOD, AND RECORDING MEDIUM

      
Numéro d'application JP2024025670
Numéro de publication 2026/018346
Statut Délivré - en vigueur
Date de dépôt 2024-07-17
Date de publication 2026-01-22
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

[Problem] To provide: a heat control device which can be easily installed on a manufacturing line; a control method for controlling the operation of the heat control device; a recording medium; and the like. [Solution] One embodiment of the present invention provides a heat control device which is equipped with a heat control member, a sensor, wiring, and a power source. The heat control member heats or cools an object, the sensor outputs heat information related to the heat acting on the object, the wiring electrically connects the heat control member and the sensor, and the power source applies a voltage to the heat control member and the sensor through the wiring.

Classes IPC  ?

  • H05B 3/00 - Chauffage par résistance ohmique

12.

SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE

      
Numéro d'application JP2025013473
Numéro de publication 2025/211391
Statut Délivré - en vigueur
Date de dépôt 2025-04-02
Date de publication 2025-10-09
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Oishi Tsukasa

Abrégé

Provided is a semiconductor storage device with which it is possible, in an MRAM, to reduce the circuit area and achieve high density. A semiconductor storage device 1000 comprises a memory cell array 10 in which a plurality of memory cells 100 are arranged in a matrix. Each memory cell 100 includes a topological antiferromagnetic body to which data can be written by spin inflow caused by a write current, a first electrode provided so as to supply the write current to the topological antiferromagnetic body, and a switch element SW00 for opening and closing a write current supply path leading to the topological antiferromagnetic body. The topological antiferromagnetic body exhibits an abnormal Hall effect due to a write current in a prescribed direction. Data is read by detecting a difference in potential resulting from the abnormal Hall effect.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • H10D 48/40 - Dispositifs commandés par des champs magnétiques

13.

TopoLogic

      
Numéro d'application 1866076
Statut Enregistrée
Date de dépôt 2025-05-01
Date d'enregistrement 2025-05-01
Propriétaire TopoLogic Inc. (Japon)
Classes de Nice  ?
  • 09 - Appareils et instruments scientifiques et électriques
  • 40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
  • 42 - Services scientifiques, technologiques et industriels, recherche et conception

Produits et services

Thermoelectric conversion elements; heat flow sensors; heat flow sensors using semiconductors; heat flow sensing apparatus; analysing apparatus and instruments; measuring or testing machines and instruments; remote monitoring device of operation condition of factory equipment using heat flow sensors; remote monitoring device of operation condition of factory equipment; computer hardware and software for remote monitoring of operation condition of factory equipment using heat flow sensors; computer hardware and software for remote monitoring and analysis; downloadable computer software for remote monitoring of operation condition of factory equipment using heat flow sensors; downloadable computer software for remote monitoring and analysis; laboratory apparatus and instruments; computer servers; computers; computer hardware; semiconductors; semi-conductor memories; semi-conductor memory devices; data storage media for computers; data storage apparatus; data processing apparatus; computer memory devices; computer peripheral devices; solid-state drives; integrated circuits; circuit boards; biological information monitoring apparatus, not for medical purposes; telecommunication machines and apparatus; electric or magnetic meters and testers; electrical cells; electronic circuits, not including those recorded with computer programs; computer programs; electronic publications; temperature gauges; diagnostic apparatus to identify abnormalities in batteries; gas detecting apparatus and instruments. Metal treating; custom manufacture of semiconductor devices; rental of chemical processing machines and apparatus; providing material treatment information; assembly or packaging of semiconductor integrated circuits; custom assembling of integrated circuits, circuit boards and semiconductors; providing information relating to the manufacture, processing or assembly of semiconductor memories; rental of semiconductor manufacturing apparatus. Design of integrated circuits; computer software design, computer programming, or maintenance of computer software; technological advice relating to computers, automobiles and industrial machines; providing temporary use of on-line non-downloadable software; cloud computing; providing computer programs on data networks; software as a service [SaaS]; rental of computers; designing of machines, apparatus, instruments [including their parts] or systems composed of such machines, apparatus and instruments; design of semiconductors; advice and consultancy services relating to the design of semiconductors; design services; design of electronic circuits, semi-conductor elements, integrated circuits and large scale integrated circuits; advice and consultancy services relating to the design of electronic circuits, semi-conductor elements, integrated circuits and large scale integrated circuits; computer programming; scientific research; research in the fields of chemistry, biology and physics; testing or research on computer software; testing or research on semiconductors; testing or research on machines, apparatus and instruments; research in the field of thin film technology; research in the field of materials science; rental of measuring apparatus; rental of laboratory apparatus and instruments; rental of technical drawing instruments; remote monitoring of computer networks for facility management; remote monitoring of computer networks for managing the operation condition of factory equipment using heat flow sensors; remote monitoring of computer systems for managing the operation condition of factory equipment using heat flow sensors; remote monitoring of computer systems; remote monitoring of computer networks.

14.

SEMICONDUCTOR STORAGE DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE, METHOD FOR WRITING STORAGE DATA, METHOD FOR READING STORAGE DATA, AND STORAGE SYSTEM

      
Numéro d'application JP2024040246
Numéro de publication 2025/105382
Statut Délivré - en vigueur
Date de dépôt 2024-11-13
Date de publication 2025-05-22
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Oishi Tsukasa

Abrégé

Provided is a semiconductor storage device for STT-MRAM in which the circuit area is reduced to achieve high density. A semiconductor storage device 1000 comprises a memory cell array 10 in which a plurality of memory cells 100 are arranged in rows and columns. Each memory cell 100 includes: a magnetic tunnel junction element capable of data writing by spin transfer torque due to write current; a first electrode of a topological antiferromagnetic material provided so as to supply the write current to the magnetic tunnel junction element; and a switch element SW00 for opening and closing a supply path of the write current to the magnetic tunnel junction element. The semiconductor storage device 1000 further comprises a plurality of first wires WL0, WL1 provided in the row direction of the memory cell array to control the opening/closing of the switch element SW00. The switch element SW00 is a transistor, and an active layer continuously provided in memory cells adjacent to each other in the column direction includes a channel region of each of a plurality of transistors.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • H10N 50/10 - Dispositifs magnéto-résistifs

15.

MEASUREMENT SYSTEM AND METHOD FOR ADJUSTING TEMPERATURE DISTRIBUTION IN WAFER

      
Numéro d'application JP2024035438
Numéro de publication 2025/094582
Statut Délivré - en vigueur
Date de dépôt 2024-10-03
Date de publication 2025-05-08
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

According to one aspect of the present invention, there is provided a measurement system comprising a wafer and at least one heat flow sensor provided to the wafer, the heat flow sensor being configured to exchange heat with the wafer and thereby measure heat flow from a specific position on the wafer.

Classes IPC  ?

  • G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
  • G01K 17/00 - Mesure d'une quantité de chaleur

16.

METHOD AND PROGRAM FOR ESTIMATING POWER LOSS BY DEVICE

      
Numéro d'application JP2024035439
Numéro de publication 2025/079495
Statut Délivré - en vigueur
Date de dépôt 2024-10-03
Date de publication 2025-04-17
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

A method according to one aspect of the present invention relates to a method for estimating power loss caused by a device which includes a switching element capable of changing a resistance value, the method comprising the following steps: a heat flow measurement step for, by using a first heat flow sensor configured to exchange heat with a device in which a resistance value of the switching element is changed in a prescribed switching pattern, measuring a heat flow generated from the device, the switching pattern including a first pattern and a second pattern different from the first pattern; and an estimation step for estimating power loss by comparing, from among heat flow measurement results, a first contribution which is a contribution of the heat flow in the first pattern with a second contribution which is a contribution of the heat flow in the second pattern.

Classes IPC  ?

  • H01L 23/34 - Dispositions pour le refroidissement, le chauffage, la ventilation ou la compensation de la température
  • G01K 17/00 - Mesure d'une quantité de chaleur
  • G01N 25/20 - Recherche ou analyse des matériaux par l'utilisation de moyens thermiques en recherchant la production de quantités de chaleur, c.-à-d. la calorimétrie, p. ex. en mesurant la chaleur spécifique, en mesurant la conductivité thermique
  • H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
  • H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou

17.

MAGNETIC MEMORY ELEMENT

      
Numéro d'application JP2024036724
Numéro de publication 2025/079734
Statut Délivré - en vigueur
Date de dépôt 2024-10-15
Date de publication 2025-04-17
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Ohmori, Hiroyuki

Abrégé

An embodiment of the present invention provides a magnetic memory element comprising a fixed layer and a storage layer, wherein: the fixed layer is configured to have spontaneous magnetization along a lamination direction; the magnetization direction of the fixed layer is configured to be fixed regardless of data written to the magnetic memory element; the storage layer is laminated on the fixed layer along the lamination direction, with a barrier layer having electric insulation properties interposed therebetween, and comprises a first ferromagnetic layer and an antiferromagnetic layer; the first ferromagnetic layer is configured to have spontaneous magnetization along the lamination direction; the magnetization direction of the first ferromagnetic layer is configured to be invertible in accordance with data written to the magnetic memory element by using a tunnel current via the fixed layer and the storage layer; the antiferromagnetic layer includes an antiferromagnetic material that exhibits an abnormal Hall effect by forming a non-collinear or non-coplanar magnetic order in an ab plane defined by an a-axis and a b-axis, which are perpendicular to a c-axis serving as the easy axis of magnetization; and the antiferromagnetic material includes at least a domain in which the c-axis follows the lamination direction.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • H10N 50/10 - Dispositifs magnéto-résistifs

18.

SEMICONDUCTOR STORAGE DEVICE, STORAGE SYSTEM, AND WRITING METHOD

      
Numéro d'application JP2024035250
Numéro de publication 2025/075033
Statut Délivré - en vigueur
Date de dépôt 2024-10-02
Date de publication 2025-04-10
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Oishi Tsukasa

Abrégé

Provided is a semiconductor storage device that is capable of stably reading and writing data at high speed. A semiconductor storage device 1000 comprises a memory cell array in which a plurality of memory cells 100 are arranged in a matrix. Each memory cell 100 includes a pair of magnetic tunnel junction elements that are neighboring in the row direction of the memory cell array, and each of the magnetic tunnel junction elements has a first node and an internal node. Each memory cell 100 further includes a first electrode that is provided so as to connect to the internal nodes of the pair of magnetic tunnel junction elements, and has a second node and a third node that are for conducting write currents. The semiconductor storage device 1000 further comprises a writing control circuit that supplies write currents to the first electrodes so as to cause the resistance conditions of the magnetic tunnel junction elements in each pair to differ from each other.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • G11C 11/16 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments magnétiques utilisant des éléments dans lesquels l'effet d'emmagasinage est basé sur l'effet de spin
  • H10N 50/10 - Dispositifs magnéto-résistifs
  • H10N 50/80 - Détails de structure

19.

SEMICONDUCTOR STORAGE DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR STORAGE DEVICE, WRITING METHOD, READING METHOD, AND STORAGE SYSTEM

      
Numéro d'application JP2024033217
Numéro de publication 2025/063191
Statut Délivré - en vigueur
Date de dépôt 2024-09-18
Date de publication 2025-03-27
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Oishi Tsukasa

Abrégé

Provided is an SOT-MRAM capable of achieving high density by reducing circuit area. A memory cell array 10 of a semiconductor storage device 1000 includes memory cells 100 arranged in a matrix and each having a magnetic tunnel junction element. The semiconductor memory device 1000 includes: a shared read source line SRSL which is arranged in a column direction and to which terminals of read transistors of memory cells adjacent to each other in a row direction are connected; and bit lines BL0, BL1 which are arranged in a column direction and connected to the other electrodes of the magnetic tunnel junction elements. Read word lines RWL0, RWL1 are activated, either the bit lines or the shared read source line is activated, and a sense amplifier reads out stored data on the basis of a change in a current value of the lines/line which are/is not activated among the bit lines or the shared read source line.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • G11C 11/16 - Mémoires numériques caractérisées par l'utilisation d'éléments d'emmagasinage électriques ou magnétiques particuliersÉléments d'emmagasinage correspondants utilisant des éléments magnétiques utilisant des éléments dans lesquels l'effet d'emmagasinage est basé sur l'effet de spin
  • H01L 29/82 - Types de dispositifs semi-conducteurs commandés par la variation du champ magnétique appliqué au dispositif
  • H10N 50/10 - Dispositifs magnéto-résistifs
  • H10N 50/20 - Dispositifs à courant commandé à polarisation de spin

20.

SEMICONDUCTOR MODULE, ABNORMALITY DETERMINATION SYSTEM, AND ABNORMALITY DETERMINATION METHOD

      
Numéro d'application JP2024020529
Numéro de publication 2024/253130
Statut Délivré - en vigueur
Date de dépôt 2024-06-05
Date de publication 2024-12-12
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

According to one embodiment of the present invention, a semiconductor module is provided. This semiconductor module is provided with: a circuit board on which a semiconductor element is mounted; and a heat-flow sensor which is disposed at a location where a heat-flow is generated as a consequence of the semiconductor element generating heat.

Classes IPC  ?

  • H10N 10/00 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier
  • H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
  • H01L 25/18 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant de types prévus dans plusieurs différents groupes principaux de la même sous-classe , , , , ou
  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen

21.

THERMOELECTRIC CONVERSION DEVICE, POWER SUPPLY SYSTEM, AND POWER SUPPLY METHOD

      
Numéro d'application JP2024015693
Numéro de publication 2024/219507
Statut Délivré - en vigueur
Date de dépôt 2024-04-22
Date de publication 2024-10-24
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

One aspect of the present invention provides a thermoelectric conversion device. The thermoelectric conversion device comprises at least one thermoelectric conversion element, a first electrode, and a second electrode. The thermoelectric conversion element is configured to generate a thermoelectromotive force induced by a temperature gradient along a first direction. The thermoelectromotive force includes Seebeck electromotive force generated along the first direction by the Seebeck effect based on the temperature gradient, and Nernst electromotive force generated so as to have a component along a second direction perpendicular to the first direction by the anomalous Nernst effect based on the temperature gradient. The first electrode is connected to a first connection region of the thermoelectric conversion element. The second electrode is connected to a second connection region of the thermoelectric conversion element. The first connection region and the second connection region are separated from each other in the first direction, and are separated from each other in the second direction.

Classes IPC  ?

  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen
  • H02N 11/00 - Générateurs ou moteurs non prévus ailleursMouvements dits perpétuels obtenus par des moyens électriques ou magnétiques
  • H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif

22.

ELEMENT AND ELEMENT MANUFACTURING METHOD

      
Numéro d'application JP2024007789
Numéro de publication 2024/181562
Statut Délivré - en vigueur
Date de dépôt 2024-03-01
Date de publication 2024-09-06
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Ohmori, Hiroyuki

Abrégé

According to one aspect of the present invention, an element is provided. The element comprises a storage layer, an insulating layer, and a fixed layer. Each of the storage layer and the fixed layer is configured to have a spontaneous magnetization. The insulating layer is disposed between the storage layer and the fixed layer, and is thereby configured to form a tunnel magnetic junction between the storage layer and the fixed layer. The magnetization direction of the fixed layer is configured to be fixed regardless of data that is written to the element. The magnetization direction of the storage layer is configured to be reversible in accordance with the data written to the element. At least one of the storage layer and the fixed layer is an anomalous Hall layer composed of an antiferromagnet that exhibits an anomalous Hall effect. The sign of the anomalous Hall coefficient of the antiferromagnet is configured to be reversible in accordance with the data written to the element. At least a part of the anomalous Hall layer is configured to contain a contaminating element which is at least one selected from the group consisting of H, B, C, and N.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • H10N 50/10 - Dispositifs magnéto-résistifs

23.

MEMORY ELEMENT

      
Numéro d'application JP2024007787
Numéro de publication 2024/181561
Statut Délivré - en vigueur
Date de dépôt 2024-03-01
Date de publication 2024-09-06
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s)
  • Ohmori, Hiroyuki
  • Higo, Tomoya

Abrégé

According to one aspect of the present invention, a memory element is provided. The memory element comprises a fixed layer and a storage layer. The fixed layer is composed of a first ferromagnet having a spontaneous magnetization, and is configured such that the magnetization direction of the first ferromagnet is fixed regardless of data that is written to the memory element. The storage layer is configured to include an antiferromagnet and a second ferromagnet having a spontaneous magnetization. The antiferromagnet is configured to exhibit an anomalous Hall effect, wherein the sign of the anomalous Hall coefficient of the antiferromagnet is reversible in accordance with the data written to the memory element. The second ferromagnet is configured such that the magnetization direction thereof is reversible in conjunction with the sign of the anomalous Hall coefficient of the antiferromagnet in accordance with the data written to the memory element.

Classes IPC  ?

  • H10B 61/00 - Dispositifs de mémoire magnétique, p. ex. dispositifs RAM magnéto-résistifs [MRAM]
  • H10N 50/10 - Dispositifs magnéto-résistifs
  • H10N 50/20 - Dispositifs à courant commandé à polarisation de spin

24.

MEASURING DEVICE, INFORMATION PROCESSING SYSTEM, AND MEASURING METHOD

      
Numéro d'application JP2024004206
Numéro de publication 2024/166968
Statut Délivré - en vigueur
Date de dépôt 2024-02-07
Date de publication 2024-08-15
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

[Problem] To provide a device, etc., for measuring a heat flow and a temperature at the same location. [Solution] One aspect of the present invention provides a measuring device. The measuring device comprises a thermoelectric conversion circuit, a heat flow measuring unit, and a temperature measuring unit. The thermoelectric conversion circuit includes an element configured to generate an electromotive force by means of a temperature gradient generated as a result of heat exchange with an object being measured. The heat flow measuring unit is configured to measure a heat flow generated in the object being measured, on the basis of an electrical signal generated in the thermoelectric conversion circuit by means of the electromotive force. The temperature measuring unit is configured to: cause a second current to flow along a pathway through which a first current resulting from the electromotive force flows, in at least a portion of the thermoelectric conversion circuit, to measure an electrical resistance of the at least a portion of the thermoelectric conversion circuit; and measure the temperature of the object being measured, on the basis of the electrical resistance.

Classes IPC  ?

  • G01K 17/06 - Mesure d'une quantité de chaleur transportée par des milieux en écoulement, p. ex. dans les systèmes de chauffage

25.

MEASUREMENT SYSTEM AND METHOD FOR PRODUCING MEASUREMENT SYSTEM

      
Numéro d'application JP2023045896
Numéro de publication 2024/143142
Statut Délivré - en vigueur
Date de dépôt 2023-12-21
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s)
  • Takahashi, Arata
  • Sato, Taiki
  • Nakatsuji, Satoru

Abrégé

One aspect of the present invention provides a measurement system. The measurement system comprises: at least one substrate configured to exchange heat with an object being measured; at least one first thermoelectric conversion device; and at least one second thermoelectric conversion device. The substrate has at least one mounting surface. Each of the thermoelectric conversion devices is provided on the substrate in such a way that a temperature gradient is caused by heat exchange, through the mounting surface, with the object being measured, and a thermoelectric power is generated due to the temperature gradient. The thermoelectric power includes a first electromotive force due to a first thermoelectric conversion effect based on a vertical component of the temperature gradient with respect to the mounting surface, and a second electromotive force due to a second thermoelectric conversion effect based on an in-plane component of the temperature gradient with respect to the mounting surface. The second thermoelectric conversion device is configured such that the sign of only one of the first electromotive force and the second electromotive force is reversed with respect to a temperature gradient in substantially the same direction as the temperature gradient in the first thermoelectric conversion device.

Classes IPC  ?

  • H10N 10/13 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par les moyens d'échange de chaleur à la jonction
  • H10N 10/01 - Fabrication ou traitement
  • H10N 10/17 - Dispositifs thermoélectriques comportant une jonction de matériaux différents, c.-à-d. dispositifs présentant l'effet Seebeck ou l'effet Peltier fonctionnant exclusivement par les effets Peltier ou Seebeck caractérisés par la structure ou la configuration de la cellule ou du thermocouple constituant le dispositif

26.

INFORMATION PROCESSING SYSTEM, INFORMATION PROCESSING METHOD, AND PROGRAM

      
Numéro d'application JP2023045901
Numéro de publication 2024/143147
Statut Délivré - en vigueur
Date de dépôt 2023-12-21
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

This information processing system is for a concentration sensor which is provided with: a first thermoelectric conversion part that is configured to generate an electromotive force resulting from a temperature gradient and that includes a first measurement surface; an interaction part that is configured, when being activated, to change the heat quantity during heat exchange resulting from the degree of interaction caused by contact with target particles included in a fluid, and that performs heat exchange with the first thermoelectric conversion part via the first measurement surface; and a first temperature adjustment part that performs temperature adjustment so as to set the drive temperature to be higher than the minimum temperature at which the interaction part can be activated. The information processing system comprises a control circuit configured to execute: an acquisition step for acquiring, from a sensor unit, a measurement result relating to the concentration of the target particles and a value relating to the temperature of the interaction part; and an output step for outputting, at least in a portion of a period in which the temperature of the interaction part reaches the drive temperature from the initial temperature and on the basis of the measurement result and a correction value identified on the basis of the value relating to the temperature of the interaction part, the concentration of the target particles included in the fluid, the concentration having been corrected by using the correction value.

Classes IPC  ?

  • G01N 25/34 - Utilisation d'éléments mécaniques réagissant à la chaleur, p. ex. un bimétal
  • G01N 25/22 - Recherche ou analyse des matériaux par l'utilisation de moyens thermiques en recherchant la production de quantités de chaleur, c.-à-d. la calorimétrie, p. ex. en mesurant la chaleur spécifique, en mesurant la conductivité thermique sur l'oxydation par combustion ou par catalyse, p. ex. des constituants des mélanges gazeux

27.

MEASUREMENT SYSTEM

      
Numéro d'application JP2023046313
Numéro de publication 2024/143244
Statut Délivré - en vigueur
Date de dépôt 2023-12-25
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

According to an aspect of the present invention, a measurement system is provided. This measurement system comprises a heat flow sensor and a housing. The heat flow sensor includes a substrate having electrical insulation and a thermoelectric conversion unit provided on the substrate. The thermoelectric conversion unit is configured to generate an electromotive force on the basis of a temperature gradient along a gradient direction towards the thermoelectric conversion unit from the substrate. The housing is configured to be capable of accepting the heat flow sensor and includes a first wall and a second wall. The first wall is configured to face the substrate. The second wall is configured to cover the heat flow sensor by extending along the gradient direction from the first wall and includes an opening. The opening is configured to pass through the second wall so that at least a portion of the thermoelectric conversion unit is continuous with the outside of the housing without passing through the substrate.

Classes IPC  ?

  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen

28.

HEAT FLOW MEASURING DEVICE AND HEAT FLOW MEASURING METHOD

      
Numéro d'application JP2023045897
Numéro de publication 2024/143143
Statut Délivré - en vigueur
Date de dépôt 2023-12-21
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

One embodiment of the present invention provides a heat flow measuring device. This heat flow measuring device comprises: a thermoelectric conversion unit that is configured to convert, on the basis of the anomalous Nernst effect, a heat gradient generated by heat exchange with a measurement target into an electric signal; and a magnetic field application unit that is configured to apply a unidirectional magnetic field to the thermoelectric conversion unit.

Classes IPC  ?

  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen
  • G01K 17/00 - Mesure d'une quantité de chaleur

29.

SIGNAL PROCESSING METHOD, SIGNAL PROCESSING SYSTEM, AND SIGNAL PROCESSING PROGRAM

      
Numéro d'application JP2023045898
Numéro de publication 2024/143144
Statut Délivré - en vigueur
Date de dépôt 2023-12-21
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

According to an embodiment of the present invention, a signal processing method in a measuring system is provided. The measurement system in this signal processing method is provided with a thermoelectric conversion unit. The thermoelectric conversion unit is configured to convert a temperature gradient, which is caused by heat exchange with a measurement target, to an electric signal on the basis of an anomalous Nernst effect. The signal processing method includes the following steps. In a modulation step, a modulation including a prescribed modulation frequency is introduced to an electric signal output by the thermoelectric conversion unit to generate a modulation signal. The modulation frequency is a different frequency from the frequency band of the thermoelectric conversion unit. In an extraction step, a signal of a component of the modulation frequency is extracted from the modulation signal.

Classes IPC  ?

  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen
  • G01K 17/00 - Mesure d'une quantité de chaleur

30.

MEASURING SYSTEM

      
Numéro d'application JP2023045899
Numéro de publication 2024/143145
Statut Délivré - en vigueur
Date de dépôt 2023-12-21
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

An embodiment of the present invention provides a measuring system. The measuring system comprises a heat flow sensor and a housing. The heat flow sensor comprises an electrically insulating substrate and a thermoelectric conversion part that is provided on the substrate. The thermoelectric conversion part is configured so that an electromotive force occurs on the basis of a temperature gradient along a gradient direction that is the direction from the substrate to the thermoelectric conversion part. The housing is configured to be capable of accommodating the heat flow sensor, and comprises a first wall part and a second wall part. The first wall part is configured so as to exchange heat with the thermoelectric conversion part via the substrate. The second wall part is configured so as to exchange heat with the thermoelectric conversion part not via the same substrate or a different substrate.

Classes IPC  ?

  • H10N 15/00 - Dispositifs thermoélectriques sans jonction de matériaux différentsDispositifs thermomagnétiques, p. ex. utilisant l'effet Nernst-Ettingshausen

31.

MEASURING DEVICE AND MEASURING UNIT

      
Numéro d'application JP2023045900
Numéro de publication 2024/143146
Statut Délivré - en vigueur
Date de dépôt 2023-12-21
Date de publication 2024-07-04
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

One aspect of the present invention provides a measuring device. The measuring device comprises a base, a temperature adjusting portion, and at least one heat flow sensor. The base includes a measuring surface that faces a fluid. The temperature adjusting portion is provided in the base. The measuring device is configured to heat or cool the fluid, which can move along the measuring surface, on the basis of an external signal. Each of the at least one heat flow sensor is provided on the measuring surface and is configured to generate an electromotive force as a result of a temperature gradient that includes a component in a normal line direction of the measuring surface. The at least one heat flow sensor includes a first heat flow sensor. The first heat flow sensor is disposed in a position on the measuring surface that is separated from the temperature adjusting portion in a first in-plane direction, which is one in-plane direction of the measuring surface.

Classes IPC  ?

  • G01P 5/10 - Mesure de la vitesse des fluides, p. ex. d'un courant atmosphériqueMesure de la vitesse de corps, p. ex. navires, aéronefs, par rapport à des fluides en mesurant des variables thermiques

32.

GAS DETECTOR, GAS DETECTING MODULE, GAS DETECTING DEVICE, AND GAS DETECTING METHOD

      
Numéro d'application JP2023045762
Numéro de publication 2024/135739
Statut Délivré - en vigueur
Date de dépôt 2023-12-20
Date de publication 2024-06-27
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

[Problem] To provide a gas detector and the like capable of detecting an amount of gas in a short time period. [Solution] One aspect of the present invention provides a gas detector. The gas detector comprises: a thin-film type heat flow sensor provided in a position to receive electromagnetic waves irradiated with a prescribed intensity; and a detecting unit which, if a measured value from the heat flow sensor changes due to a change in the received intensity of the electromagnetic waves, detects an amount of gas in a space through which the electromagnetic waves pass, on the basis of the change in the measured value.

Classes IPC  ?

  • G01N 21/3504 - CouleurPropriétés spectrales, c.-à-d. comparaison de l'effet du matériau sur la lumière pour plusieurs longueurs d'ondes ou plusieurs bandes de longueurs d'ondes différentes en recherchant l'effet relatif du matériau pour les longueurs d'ondes caractéristiques d'éléments ou de molécules spécifiques, p. ex. spectrométrie d'absorption atomique en utilisant la lumière infrarouge pour l'analyse des gaz, p. ex. analyse de mélanges de gaz

33.

INFORMATION PROCESSING METHOD, RECORDING MEDIUM, AND CALCULATION METHOD

      
Numéro d'application JP2023044749
Numéro de publication 2024/128271
Statut Délivré - en vigueur
Date de dépôt 2023-12-14
Date de publication 2024-06-20
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

The purpose of the present invention is to provide an information processing method, a recording medium, and a calculation method that make it possible to evaluate level of comfort according to individual differences. One embodiment of the present invention provides an information processing method. This information processing method comprises an acquisition step, a calculation step, and an output step. In the acquisition step, heat balance information that relates to the heat balance of a user is acquired. The heat balance information includes the flow of heat in the user. In the calculation step, the level of comfort of the user is calculated on the basis of the heat balance information and first reference information. The first reference information indicates the relationship between the heat balance information and the level of comfort. In the output step, information relating to the level of comfort is outputted.

Classes IPC  ?

  • F24F 11/63 - Traitement électronique
  • A61B 5/01 - Mesure de la température de parties du corps
  • A61B 5/16 - Dispositifs pour la psychotechnieTest des temps de réaction
  • G06Q 10/04 - Prévision ou optimisation spécialement adaptées à des fins administratives ou de gestion, p. ex. programmation linéaire ou "problème d’optimisation des stocks"
  • F24F 120/00 - Entrées de commandes relatives aux utilisateurs ou aux occupants

34.

INFORMATION PROCESSING SYSTEM AND INFORMATION PROCESSING METHOD

      
Numéro d'application JP2023015905
Numéro de publication 2024/100916
Statut Délivré - en vigueur
Date de dépôt 2023-04-21
Date de publication 2024-05-16
Propriétaire TOPOLOGIC INC. (Japon)
Inventeur(s) Takahashi, Arata

Abrégé

One embodiment of the present invention provides an information processing system. This information processing system comprises a thermoelectric conversion unit and a signal processing unit. The thermoelectric conversion unit is configured so as to generate a thermal gradient by exchanging heat with a device and is configured so as to generate thermoelectric power on the basis of the thermal gradient. The signal processing unit comprises an acquiring unit and a detection unit. The acquiring unit is configured so as to acquire the thermoelectric power. The detection unit is configured so as to detect, on the basis of the thermoelectric power, an abnormal operation of the device accompanied by heat generation.

Classes IPC  ?

  • H02J 7/00 - Circuits pour la charge ou la dépolarisation des batteries ou pour alimenter des charges par des batteries
  • G01R 31/00 - Dispositions pour tester les propriétés électriquesDispositions pour la localisation des pannes électriquesDispositions pour tests électriques caractérisées par ce qui est testé, non prévues ailleurs
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte