The present invention provides excellent visibility of a printed part formed by laser marking. This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a coloring material, wherein the absorbance measured under the following absorbance measurement conditions using a photometer is 3.5 or more. (Absorbance measurement conditions) Measurement sample: a cured product obtained by curing the liquid compression molding material through a heat treatment at 150°C for 60 minutes. Thickness of measurement sample: 260 μm Measurement wavelength: 1064 nm
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
B29C 43/02 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés
The present invention addresses the problem of providing: a curable resin composition capable of reducing misalignment and separation of a cured product from an adherend; an adhesive or sealing material containing same; a cured product thereof; and a semiconductor device and an electronic component containing said cured product. Provided are: a curable resin composition which contains (A) a (meth)acrylate compound, (B) a polythiol compound, and (C) a photo-radical polymerization initiator that generates a methyl radical or a phenyl radical as an active species, and in which the content of component (C) is 0.01-10 mass% relative to the total mass of the curable resin composition, the curable resin composition may contain (D) a thermal polymerization initiator, and the content of the thermal polymerization initiator (D) is 0-10 mass% relative to the total mass of the curable resin composition; an adhesive or sealing material containing same; a cured product thereof; and a semiconductor device and an electronic component containing said cured product.
A material includes sulfur, and a quantum dot component. The quantum dot component is at least one component selected from the group consisting of: a quantum dot-nanotube composite, a quantum dot-graphene composite, carbon quantum dots consisting essentially of carbon, and hybrid quantum dots comprising carbon and at least one metal oxide. Another material includes sulfur, a carbon quantum dot composite material and an electrically conductive component. The carbon quantum dot composite material includes a carbon source, carbon nanotubes and at least one metal and/or metalloid selected from the group consisting of tungsten, molybdenum, ruthenium, niobium, tantalum, germanium, iron, silver, manganese, titanium, tin, antimony, bismuth, gold, silicon, nickel, cobalt, chromium, zirconium, and vanadium; or oxide thereof; and combinations thereof. The material may be used in a lithium-sulfur battery. This may overcome or partially overcome the shuttle effect.
B82B 3/00 - Fabrication ou traitement des nanostructures par manipulation d’atomes ou de molécules, ou d’ensembles limités d’atomes ou de molécules un à un comme des unités individuelles
Provided is a resin composition capable of suppressing bleeding on a ceramic substrate during thermal curing. This resin composition comprises: (A) an epoxy resin; (B) a curing agent; and (C) a rheology controlling agent, the component (C) satisfying the feature (1). Feature (1): When 1 μL of a composition containing 99 g of a bisphenol F epoxy resin and 1 g of the component (C) is formed at the tip of a Cathelin needle at room temperature, and the contact angle θ1 measured 6 seconds after droplet deposition on a ceramic substrate is taken as 100%, the contact angle θ3 measured 5 minutes after the droplet deposition is 88%-100%.
A material may include sulfur and a quantum dot component. The quantum dot component may be a quantum dot-nanotube composite, a quantum dot-graphene composite, carbon quantum dots consisting essentially of carbon, hybrid quantum dots comprising carbon and at least one metal oxide, or any combination. A method of making the material may involve making the quantum dot component by a sol-gel process and combining the quantum dot component with the sulfur. The material may serve as a cathode material for a battery, particularly a lithium-sulfur battery. The lithium-sulfur battery may overcome or partially overcome the shuttle effect.
Provided are a resin composition which cures at low temperatures to give cured objects having low electrical resistance, an adhesive including the resin composition, cured objects, and a semiconductor device and an electronic component which include these cured objects. The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a hardener or a free-radical polymerization initiator, (C) electroconductive particles, and (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides; an adhesive including the resin composition; cured objects; and a semiconductor device and an electronic component which include these cured objects.
C08F 20/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et un seul étant terminé par un seul radical carboxyle ou un sel, anhydride, ester, amide, imide ou nitrile
C08F 22/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone, l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la moléculeLeurs sels, anhydrides, esters, amides, imides ou nitriles
C08F 292/00 - Composés macromoléculaires obtenus par polymérisation de monomères sur des substances inorganiques
C08K 9/04 - Ingrédients traités par des substances organiques
C08L 51/10 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des substances inorganiques
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
The present invention addresses the problem of providing: a novel substance which is capable of solving the problems of conventional bismaleimides each having a dimer acid skeleton; a high-concentration composition of the substance; a curable composition which contains the composition; an adhesive agent or a sealing material; a cured article obtained by curing the composition or the like; and a semiconductor device or an electronic component which includes the cured article. Provided are: a dimer acid-modified N-substituted (meth)acrylamide; a high-concentration composition of the dimer acid-modified N-substituted (meth)acrylamide; a curable composition which contains the composition; an adhesive agent or a sealing material; a cured article obtained by curing the composition or the like; and a semiconductor device or an electronic component which includes the cured article.
To provide a resin composition capable of forming a cured product having excellent flame retardancy, small relative permittivity and dielectric loss tangent values at 25°C in a high frequency band, and small temperature dependence of the dielectric loss tangent. A resin composition contains a flame retardant containing a cyclic phosphazene compound having an oxaphospholine ring-containing structure represented by formula (A1), and a cured product of the resin composition has a relative permittivity of 3.5 or less at 10 GHz and 25°C, a dielectric loss tangent of 0.003 or less at 10 GHz and 25°C, and a dielectric loss tangent at 120°C which is 30% or less with respect to the dielectric loss tangent at 10 GHz and 25°C. [In formula (A1), n is an integer of 3-8; a and b are each an integer of 0-4; and R1and R2 (i) are either an alkyl group or an alkoxy group, and an aryl group or an aryloxy group or (ii) have a structure formed therebetween by saturated or unsaturated cyclic structures.]
Provided is a resin composition having excellent embeddability with respect to an electronic substrate and the periphery of an electronic element and excellent slittability for a B-stage film. The resin composition contains (A) a thermosetting resin, (B) a compound that has a butadiene skeleton having a 1,2 vinyl group, and (C) a compound that has an isocyanuric ring structure and has one or two double bonds at a molecular terminal. The number average molecular weight of the component (B) is 1,000-10,000. Preferably, the minimum melt viscosity is 500-5,000. Preferably, the component (B) is a compound that has a styrene skeleton.
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION (Japon)
NAMICS CORPORATION (Japon)
Inventeur(s)
Yanai Nobuhiro
Uji Masanori
Nagata Rieko
Iwaya Kazuki
Saito Nobuo
Otsubo Kodai
Abrégé
The present invention addresses the problem of providing a photocurable resin composition for curing using a photon upconversion mechanism and a method for using such a photocurable resin composition, with which it is possible to achieve a favorable cure degree by prolonging a photon upconversion emission lifetime, while also providing an adhesive, sealant, or coating agent including same, a cured product thereof, a semiconductor device or electronic component including said cured product, and a curing method, bonding method, sealing method, and coating method using the photocurable resin composition. Provided is a photocurable resin composition comprising (A) a polymerizable compound and (B) triplet-triplet annihilation photon upconversion particles, and satisfying at least one of: feature (a) in which the polymerizable compound (A) includes a maleimide compound; and feature (b) in which the photocurable resin composition includes (C) a photopolymerization initiator. Also provided are: an adhesive, sealant, or coating agent including said photocurable resin composition; a cured product thereof; a semiconductor device or electronic component including the cured product; and a curing method, bonding method, sealing method, and coating method using the photocurable resin composition.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09D 201/00 - Compositions de revêtement à base de composés macromoléculaires non spécifiés
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
11.
CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT COMPRISING EXTERNAL ELECTRODE FORMED USING SAME
Provided is a conductive paste having high heat resistance making it possible to withstand heat from solder with a high melting temperature, while also having flexibility making it possible to relax stress even against rapid expansion of a moisture absorbing material. This conductive paste for an external electrode contains (A) conductive particles, (B) epoxy resin, (C) a curing agent, and (D) a bismaleimide compound.
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01C 1/142 - Bornes ou points de prise spécialement adaptés aux résistancesDispositions de bornes ou points de prise sur les résistances les bornes ou points de prise étant constitués par un revêtement appliqué sur l'élément résistif
The present invention addresses the problem of providing: a thiol-based curing agent composition which can be used in a two-part or multi-part thermally curable composition for a semiconductor device or an electronic component; a container in which the thiol-based curing agent composition is accommodated; a thermally curable composition kit; a method for producing a thermally curable composition; a cured product of a thermally curable composition; and a method for transporting and storing a thiol-based curing agent composition. Provided are: a curing agent composition containing (A) a thiol compound having no ester bond, (B) a thermally latent curing catalyst, and (C) water, wherein the content of the water (C) in the curing agent composition is 10-15,000 ppm; a container in which the curing agent composition is accommodated; a thermally curable composition kit; a method for producing a thermally curable composition; a cured product of a thermally curable composition; and a method for transporting and storing a curing agent composition.
A resin composition that can cure at a relatively low temperature and has a long pot life, a cured product, and a semiconductor device and an electronic component including a cured product are provided. The resin composition includes (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor having sublimability. The resin composition further includes (D) electrically conductive particles as necessary.
Provided is a conductive paste that makes it possible to suppress cracking at an external electrode even when a thermal fatigue–resistant solder is used. A conductive paste according to the present invention includes (A) metal particles and (B) a thermosetting resin. When the surface of a cured product obtained by thermally curing the conductive paste for 30 minutes at 180°C is observed using a scanning electron microscope, the area percentage of metal as given by expression (1) is at least 50%. The flexural modulus of a cured product obtained by thermally curing the conductive paste for 30 minutes at 180°C is no more than 6.0 GPa. (1) Area percentage (%) of metal=(area occupied by metal÷measurement area)×100.
Provided is an epoxy resin composition which is less apt to form voids caused by air inclusion. Also provided are a cured object formed from the epoxy resin composition, a semiconductor device including the cured object, and a method for producing the semiconductor device. The epoxy resin composition comprises an epoxy resin (A), a hardener (B), and an inorganic filler (C), wherein the inorganic filler (C) includes an inorganic filler (C1) surface-treated with a silane coupling agent having a C4-C15 hydrocarbon group.
Provided is an epoxy resin composition in which a void is less likely to be generated after molding. Moreover, provided are: a cured product of said epoxy resin composition; a semiconductor device comprising said cured product; and a method for manufacturing said semiconductor device. This epoxy resin composition comprises an epoxy resin (A), a curing accelerator (B), and an inorganic filling material (C), and satisfies expression (V). Expression (V): Viscosity (1)×viscosity (2)≤500 The viscosity (1) is the viscosity (Pa∙s) of the epoxy resin composition at 25ºC. The viscosity (2) is the viscosity (Pa∙s) of the epoxy resin composition at 150ºC.
Provided is an optical component bonding composition which yields a cured product exhibiting excellent yellowing resistance. Also provided are: a cured product having a good appearance due to excellent yellowing resistance; and an optical fiber array comprising the cured product. The optical component bonding composition contains a siloxane compound (A) having a reactive functional group, a polymerization initiator (B), a filler (C), and an antioxidant (D).
An objective of the present invention is to provide a composition having excellent curability. Another objective of the present invention is to provide an optical fiber array in which a cured product of the composition is used. The optical component bonding composition contains a siloxane compound (A) having a reactive functional group, a polymerization initiator (B), a filler (C), and a photosensitizer (D).
The present invention addresses the problem of providing: a photocurable resin composition that is cured only by light irradiation and does not require full curing by heat; an adhesive, a sealant or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, a bonding method, a sealing method, and a coating method using the photocurable resin composition. Provided are: a photocurable resin composition containing (A) a maleimide compound, and (B) a photon upconversion material; an adhesive, a sealant, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, a bonding method, a sealing method, and a coating method using the photocurable resin composition.
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
20.
CURING METHOD FOR PHOTOCURABLE RESIN COMPOSITION, BONDING, SEALING, AND COATING METHOD USING SAME, AND CURED PRODUCT THEREOF
The present invention addresses the problem of providing: a curing method for a photocurable resin composition under atmospheric conditions by using a photon up-conversion mechanism, which achieves both surface curability and curability in deep portions of the photocurable resin composition; a bonding, sealing, and coating method using the curing method; and a cured product thereof. Provided are: a curing method for a photocurable resin composition, the method including a step for simultaneously or sequentially irradiating a photocurable resin composition that contains a polymerizable compound with light having a wavelength of 500 nm or less and light having a wavelength of more than 500 nm, and polymerizing the polymerizable compound using at least a photon up-conversion mechanism under atmospheric conditions; a bonding, sealing, and coating method using the curing method; and a cured product thereof.
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
21.
PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, ADHESION, SEALING, AND COATING METHODS EACH USING PHOTOCURABLE RESIN COMPOSITION
The present invention addresses the problem of providing a photocurable resin composition in which curing is completed without performing a curing treatment using heat and in which emission of volatile organic compounds is suppressed, an adhesive, a sealing material, or a coating agent containing the same, a cured product of the same, a semiconductor device or an electronic component containing said cured product, and a curing method, an adhesion method, a sealing method, and a coating method each using a curable resin composition. Provided is a photocurable resin composition comprising a polymerizable compound (A) and a phosphor (B) that emits light at a wavelength of not more than 500 nm upon X-ray irradiation in a state in which the phosphor is mixed with the polymerizable compound, wherein at least one of the following characteristics (a) and (b) is satisfied: (a) the polymerizable compound (A) includes a maleimide compound; and (b) the photocurable resin composition contains an oxime ester-based photopolymerization initiator (C). Also provided are an adhesive, a sealing material, or a coating agent containing the same, a cured product of the same, a semiconductor device or an electronic component containing said cured product, and a curing method, an adhesion method, a sealing method, and a coating method each using a photocurable resin composition.
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C09D 4/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
22.
EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition which hardly causes warpage of a wafer after molding. Also provided are: a cured product of the epoxy resin composition; a semiconductor device comprising the cured product; and a method for producing the semiconductor device. More specifically, the epoxy resin composition contains: an epoxy resin (A); a compound (B) containing a carbonate group (-O-(C = O)-O-) and/or an ether group (- O -) in the molecule; an inorganic filler (C); and a curing accelerator (D).
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 69/00 - Compositions contenant des polycarbonatesCompositions contenant des dérivés des polycarbonates
C08L 71/00 - Compositions contenant des polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleCompositions contenant des dérivés de tels polymères
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
23.
EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition which hardly causes warpage of a wafer after molding. Also provided are: a cured product of the epoxy resin composition; a semiconductor device comprising the cured product; and a method for producing the semiconductor device. More specifically, the epoxy resin composition contains: an epoxy resin (A); a compound (B) having a polytetramethylene ether structure in the molecule; an inorganic filler (C), and a curing agent (E).
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 69/00 - Compositions contenant des polycarbonatesCompositions contenant des dérivés des polycarbonates
C08L 71/00 - Compositions contenant des polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleCompositions contenant des dérivés de tels polymères
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
24.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Provided is an epoxy resin composition that is unlikely to undergo delamination. Also provided are a cured product of the epoxy resin composition, a semiconductor device provided with the cured product, and a method for producing the semiconductor device. This epoxy resin composition contains an epoxy resin (A), a curing accelerator (B), and an inorganic filler (C). The epoxy resin (A) contains an aminophenol-type epoxy resin (A1) and a low-shrinkage epoxy resin (A2).
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
25.
ELECTROCONDUCTIVE PASTE AND STRETCHABLE CONDUCTOR BASE MATERIAL
This electroconductive paste contains electroconductive particles in which the tap density measured in accordance with ISO 3953:2011 is 2.5 g／mL or greater and the BET specific surface area is 2.5 m2/g or greater, (B) a thermoplastic resin, and (C) a solvent. Provided are: an electroconductive paste, an electroconductive film or an electroconductive pattern having exceptional low-resistance properties even when continuously caused to expand and contract; a cured article of said electroconductive paste, electroconductive film or electroconductive pattern; and a wearable device containing said electroconductive film or electroconductive pattern.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
A61B 5/266 - Électrodes bioélectriques à cet effet caractérisées par les matériaux des électrodes contenant des électrolytes, gels ou pâtes conducteurs
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
H01B 7/06 - Conducteurs ou câbles extensibles, p. ex. cordon torsadant automatiquement
26.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Provided is a liquid compression molding material which has excellent injectability and forms a cured product containing few aggregates. This liquid compression molding material comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a curing catalyst, and is used for at least sealing a gap between an element and a substrate, wherein the initial viscosity at 25ºC is 10-250 Pa∙s, and a cured product obtained by curing the liquid compression molding material under condition (1) satisfies condition (2). (1) The molding temperature is 150ºC, the molding time is 700 seconds, the curing temperature is 180ºC, and the curing time is 60 minutes. (2) When a region of 250 μm×180 μm in length and width on a cross section of the cured product is observed with a scanning electron microscope (magnification: 500 times), the area ratio of aggregates, which have a circle equivalent diameter of at least 1 μm and are present in said region, is at most 1.0%.
The present invention provides a resin composition that has excellent adhesive strength at room temperature and excellent wire bonding properties in a temperature range suitable for Cu wire bonding. This resin composition contains: (A) a phenoxy resin having a glass transition temperature Tg1 of 50°C or less; (B) a curing agent; (C) a filler; and (D) at least one resin selected from the group consisting of a phenoxy resin having a glass transition temperature Tg2 of 100°C or more, a trifunctional or higher epoxy resin, and a naphthalene-type epoxy resin. The resin composition has a glass transition temperature Tg3 of 130°C or more, and the cured product thereof has a modulus of elasticity of 0.5 GPa or more at 200°C.
Provided is an epoxy resin composition having a low viscosity and a short gap filling time. This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) core-shell rubber particles, wherein the shell layer of the core-shell rubber particles (D) contains (meth)acrylic acid and butyl (meth)acrylate as constituent units.
C08L 51/04 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des caoutchoucs
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
123412344 represents an aryl group having 6-14 carbon atoms.) and of a counter cation, and also satisfying at least one of the following characteristics (a) and (b); an adhesive agent or a sealing material including the same; a cured product thereof; and a semiconductor device and an electronic component including the cured product. (a) (D) A filler is further included. (b) The content of (A) the epoxy compound is 100-1300 parts by weight with respect to 100 pats by weight of (B) the oxetane compound.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
123412344 represents an aryl group having 6 to 14 carbon atoms) and a counter cation other than an iodonium cation; an adhesive agent or a sealing material which contains the resin composition; a cured product of the resin composition; a semiconductor device which comprises the cured product; and an electronic component.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
The present invention addresses the problem of providing at least a photocurable or thermosetting polymerizable composition and adhesive capable of suppressing a bleeding phenomenon. Provided are a polymerizable composition and an adhesive that contain (A) a cationically polymerizable compound, (B) an acid generator, and (C) a modified polydimethylsiloxane that satisfies at least one of the following features (a), (b), and (c): (a) an organic substituent containing a COOH group is bonded to the polydimethylsiloxane directly or via a linker; (b) an organic substituent containing an OH group and optionally an ether group is bonded to the polydimethylsiloxane directly or via a linker, and when the organic substituent contains an ether group, the ratio of the number of polypropylene glycol repeating units to the number of polyethylene glycol repeating units in the organic substituent is less than 0.3; and (c) the modified polydimethylsiloxane has a specific signal in a 1H NMR spectrum measured in deuterated chloroform and satisfies a specific formula.
The present invention addresses the problem of providing: a curable resin composition which can be applied with a narrow line width (for example, 1,000 μm or less) and a high coating height; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component. Provided are: a curable resin composition which contains (A) a polymerizable compound, (B) a polymerization initiator, (C) an inorganic thixotropy-imparting agent, and (D) a modified polydimethylsiloxane, wherein the content of (C) the inorganic thixotropy-imparting agent is 10-70 parts by mass with respect to 100 parts by mass of the curable resin composition, and the content of (D) the modified polydimethylsiloxane is 0.01-15 parts by mass with respect to 100 parts by mass of (C) the inorganic thixotropy-imparting agent; an adhesive composition; a cured product of the same; a semiconductor device which comprises the cured product; and an electronic component.
The present invention provides a conductive paste capable of forming an electrode having a relatively low specific resistance even when conductive particles having a relatively low silver content are used. Provided is a conductive paste containing (A) conductive particles, (B) an epoxy resin, and (C) a curing agent, wherein the (A) conductive particles include silver-coated copper particles, and in the particle size distribution of the silver-coated copper particles obtained by particle size distribution measurement using a laser diffraction scattering method, when the silver-coated copper particle content is set as 100 vol%, the amount of silver-coated copper particles having a particle diameter of less than 5.0 μm is 50 vol% or less.
R120R120 obtained by measuring solid content in the insulating composition at 120°C and 100 rpm using a rheometer is 28 mPa·s or more. The insulating composition preferably further contains a solvent (D).
Provided is a film for an adhesive layer, which is capable of suppressing breakage of a plating layer that is disposed on the inner surface of a through hole which is formed in a multilayer wiring board. Specifically provided is a film 10A for an adhesive layer, which is used for the production of a multilayer wiring board 100. The multilayer wiring board 100 comprises a fluororesin substrate 20 and the film 10A for an adhesive layer. The film 10A for an adhesive layer has a thickness of 10-35 μm. The film 10A for an adhesive layer has a thermal expansion coefficient in the thickness direction of 110 ppm/°C or less after curing, and satisfies the following relational expression (1). (1): X + Y ≤ 14,000 (In the relational expression (1), X is a value obtained by multiplying the thickness (μm) of the film 10A for an adhesive layer by the thermal expansion coefficient (ppm/°C) in the thickness direction after curing, Y is a value obtained by multiplying the thickness (μm) of the fluororesin substrate 20 by the thermal expansion coefficient (ppm/°C) in the thickness direction, and the thickness of the fluororesin substrate 20 is 50 μm or more.)
The present invention provides: a resin composition that has excellent low gloss properties even when a specific trithiol compound is contained therein; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition. Provided are: a resin composition containing (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), and (C) a thermally latent curing catalyst that is solid at room temperature; and an adhesive or sealing material, a cured product, and a semiconductor device or electronic component which contain said resin composition.
The present invention addresses the problem of providing: a resin composition having favorable storage stability and low-temperature curability even when a specific trithiol compound is contained; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component. Provided are: a resin composition comprising (A) a (meth)acrylate compound, (B) a thiol compound represented by chemical formula (I), (C) a thermally latent curing catalyst, and (D) an inorganic filler having a specific surface area of at least 4 m2/g; an adhesive or sealing material comprising the same; a cured product; and a semiconductor device or electronic component.
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 81/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement du soufre, avec ou sans azote, oxygène ou carboneCompositions contenant des polysulfonesCompositions contenant des dérivés de tels polymères
The present invention provides: a thermosetting insulating film which is capable of achieving excellent insulating properties when used for the production of a multilayer substrate; and a multilayer insulating sheet which uses this thermosetting insulating film. Provided are: a thermosetting insulating film which contains at least a solid epoxy resin as an epoxy resin, wherein the area change rate R expressed by formula (1) is 222% or less; and a multilayer insulating sheet which uses this thermosetting insulating film. Formula (1): R = 100 × Sp/Si (In formula (1), Sp represents the area (cm2) of a square film after being subjected to vacuum pressure pressing under conditions of a pressing temperature of 175°C, a pressing pressure of 2.5 MPa, and a pressing time of 30 minutes, the square film having a thickness of 100 μm and a horizontal and vertical size of 160 mm × 160 mm, and Si represents the area (cm2) of the film before the vacuum heating pressing is performed.)
The present invention addresses the problem of providing a novel latent polymerization initiator which is excellent in terms of storage stability and enables thermal curing of a resin composition at a low temperature. The present invention also addresses the problem of providing a resin composition and an adhesive or a sealing material, which are excellent in terms of storage stability and can be thermally cured at a low temperature. The present invention provides: a thermal latent polymerization initiator in which a thermal radical initiator is supported by inorganic ion exchanger particles; a resin composition which contains (A) a radically polymerizable compound and (B) the thermal latent polymerization initiator; and an adhesive or a sealing material which contains the resin composition.
11) of a shape when an electrode formed using the conductive paste is extended or contracted in one cycle with a length of 115% with respect to the length before the extension of the electrode is 8.0% or less.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H01B 1/24 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des compositions à base de carbone-silicium, du carbone ou du silicium
41.
CONDUCTIVE PASTE, CONDUCTIVE FILM, CERAMIC CIRCUIT SUBSTRATE, AND ELECTRONIC COMPONENT
Provided are: a conductive paste capable of forming a circuit pattern by a screen printing method and forming a conductive film having high adhesion to a ceramic substrate; a conductive film; a ceramic circuit substrate; and an electronic component. The conductive paste includes (A) a conductive powder, (B) a glass frit, and (C) an organic vehicle. The (B) glass frit may be a glass frit in which, when the glass frit is disposed on a ceramic substrate and is melted under the condition of 900°C in a nitrogen atmosphere, the contact angle of the molten glass frit with respect to the ceramic substrate measured in conformance with JIS R3257 is 40 degrees or less.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
42.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
The present invention provides an epoxy resin composition wherein running on the surface of a BSM-treated silicon chip is less likely to occur. This epoxy resin composition contains an epoxy resin (A), a curing agent (B), and an inorganic filler (C). The epoxy resin composition has a surface tension of 30-40 mN/m as measured at 110°C using a plate method.
The present invention addresses the problem of providing at least a thermosetting resin composition and an adhesive agent that can suppress the bleeding phenomenon. Provided is a resin composition comprising (A) a polymerizable compound having a carbon-carbon double bond, (B) a polythiol compound, (C) a polymerization initiator, and (D) a modified polydimethylsiloxane satisfying at least one of features (a) and (b): (a) an organic substituent group including a COOH group or an OH group is bound to a polydimethylsiloxane directly or via a linker; and (b) an 122O.
The present invention addresses the problem of providing: a curable resin composition that can be rapidly cured at a low temperature (for example, cured at 70°C-80°C within 30 minutes), exhibits high adhesive strength after curing at a low temperature for a short time, and has a long pot life; a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product. Provided are: a curable resin composition comprising (A) a radically polymerizable curable compound, (B) a radical polymerization initiator, (C) a polymerization inhibitor, and (D) inorganic particles, wherein the content of the (C) polymerization inhibitor in the curable resin composition falls within the range of 0.1-3.0 parts by mass with respect to 100 parts by mass of the radical polymerization initiator (B); a method for producing the curable resin composition; an adhesive or sealing material including the curable resin composition; a cured product thereof; and a semiconductor device and electronic component including the cured product.
A copper member, comprising a copper material and a protrusion formed on the surface of the copper material. The protrusion contains copper and/or a copper oxide. When the copper member is measured using a nanoindenter under a prescribed measurement condition, the copper member satisfies at least one of (1) indentation creep (CIT) of 80% or greater, (2) indentation hardness (GPa) of 1 or less, and (3) an indentation elastic modulus (GPa) of 120 or less. The copper member is excellent in adhesion to a resin base material and heat-resistance reliability.
Provided is a liquid compression molding material including an epoxy resin composition containing an epoxy resin (A), a curing accelerator (B), a filler (C), and an elastomer (D), in which blending ratio of the filler (C) to the epoxy resin composition is 73.0 mass % or more, and blending ratio of the elastomer (D) to a total of components excluding the filler (C) from the epoxy resin composition is 7.0 mass % or more.
B29C 43/00 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 43/36 - Moules pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés
B29K 21/00 - Utilisation de caoutchouc non spécifié ou élastomères non spécifiés comme matière de moulage
B29K 63/00 - Utilisation de résines époxy comme matière de moulage
B29K 105/00 - Présentation, forme ou état de la matière moulée
This invention prevents the occurrence of peeling failure during lamination processing using a multilayer sheet. A multilayer sheet 100 is formed by laminating a first base material film 12, an adhesive film 14, a second base material film 16, and a third base material film 18 in this order, and satisfies the following formula (1). Formula (1): P1 < P2 < P3 [In the formula, P1 represents a peel strength between the first base material film and the adhesive film, P2 represents a peel strength between the adhesive film and the second base material film, and P3 represents a peel strength between the second base material film and the third base material film.]
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
This invention makes it possible to achieve a semiconductor device demonstrating excellent electrical connection reliability despite a narrow pitch between electrodes. There is provided an adhesive film which is used for bonding a semiconductor element with a semiconductor element or bonding a semiconductor element with a circuit board, the film having: a width of 40°C or more and less than 110°C of a temperature range indicative of a melt viscosity of 50000 Pa･s or less in a temperature range of more than 90°C and less than 200°C; and a ratio (V2/V1) exceeding 1.0 of a melt viscosity V2 at 200°C to a minimum melt viscosity V1 in a temperature range of more than 90°C and less than 200°C.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
50.
CONDUCTIVE PASTE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT COMPRISING EXTERNAL ELECTRODE FORMED USING SAME
The prevent invention is a conductive paste comprising (A) conductive particles, (B) a thermosetting resin, and (C) rubber particles. The rubber particles (C) include a carbon-carbon bond in the main chain skeleton thereof. Rubber particles having an average particle size less of than 1 μm are included. The present invention makes it possible to provide a conductive paste having improved adhesion to a copper base material.
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
A resin composition includes (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) below:
and a molecular weight of 230˜1,000, and (B) fumed silica having an average primary particle size of 1 nm˜50 nm and a specific surface area of 50 m2/g˜250 m2/g.
The present invention provides a resin composition which has a low refractive index and good heat resistance such as good reflow resistance. Disclosed is a resin composition which contains (A1) a cyclic siloxane compound that has a reactive functional group, (A2) a linear siloxane compound that has a reactive functional group, and (B) a polymerization initiator. It is preferable that the cyclic siloxane compound (A1) that has a reactive functional group is an epoxy-modified cyclic siloxane compound that has 2 or 4 epoxy groups. It is also preferable that the linear siloxane compound (A2) that has a reactive functional group has a glycidyl ether structure at both ends.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
Provided is a resin composition for an adhesive, the composition having a low refractive index and a low weight reduction rate after a reflow step is performed. The resin composition for an adhesive comprises: (A) a siloxane compound that has a reactive functional group; and (B) a polymerization initiator. The (B) polymerization initiator contains at least one onium salt selected from the group consisting of onium borate salts and onium gallate salts. The onium salt preferably contains at least one cation selected from the group consisting of iodonium and sulfonium.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
This invention provides a resin composition having low viscosity and high transparency. The resin composition comprises (A) an organic substance, (B) a polymerization initiator, and (C) inorganic particles, wherein the (C) inorganic particles include inorganic particles which have a median diameter (D50) of 0.05-3.0 μm and for which D90/D10 is 1-4, D90/D10 being the ratio of a cumulative volume 90% value (D90) to a cumulative volume 10% value (D10) in particle size distribution. It is preferable that the (C) inorganic particles include silica particles.
OPTICAL FIBER ARRAY, OPTICAL WAVEGUIDE MODULE, METHOD FOR REDUCING REFRACTIVE INDEX OF ADHESIVE LAYER, AND METHOD FOR MANUFACTURING OPTICAL FIBER ARRAY
Provided is an optical fiber array (1) comprising an adhesive layer (20) that exhibits a low refractive index and excellent transparency. This optical fiber array comprises an optical fiber (10) and an adhesive layer (20), wherein the optical fiber (10) is optically coupled to an optical waveguide element (30) by the adhesive layer (20) and the content of the adhesive layer (20) in terms of the element Si is at least 10%. The adhesive layer (20) preferably has a transmittance of at least 90% at a wavelength of 1310 nm. The adhesive layer (20) preferably has a refractive index of not greater than 1.47 at a wavelength of 1310 nm. The adhesive layer (20) preferably contains a cured product of (A) a siloxane compound having a reactive functional group and (B) a polymerization initiator.
G02B 6/30 - Moyens de couplage optique pour usage entre fibre et dispositif à couche mince
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 11/06 - Additifs non macromoléculaires organiques
The present invention provides a novel method for manufacturing a hybrid quantum dot, a novel hybrid quantum dot, a novel energy storage device, a novel energy generation device, and a novel paste for forming a varistor. The present invention relates to a method for producing a hybrid quantum dot. The hybrid quantum dot contains elemental carbon and an elemental metal. The method includes: a gelling step in which a composition containing elemental carbon precursor and an elemental metal precursor is gelled to obtain a gelled product; a supercritical drying step in which the gelled product is dried by supercritical drying to obtain an aerogel powder; and a pyrolysis step in which the aerogel powder is pyrolyzed to obtain the hybrid quantum dot.
B82B 3/00 - Fabrication ou traitement des nanostructures par manipulation d’atomes ou de molécules, ou d’ensembles limités d’atomes ou de molécules un à un comme des unités individuelles
The present invention addresses the problem of providing: an epoxy resin composition with which it is possible to suppress the discoloration of an object having the composition applied thereto even when the composition contains a specific trithiol compound; an adhesive agent or a sealing material containing the composition; a cured article; and a semiconductor device or an electronic component. Provided are: an epoxy resin composition containing (A) an epoxy resin having a halogen content of 1600 ppm or less, (B) a thiol compound represented by chemical formula (I), and (C) a basic curing catalyst; an adhesive agent or a sealing material containing the epoxy resin composition; a cured article; and a semiconductor device or an electronic component.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
The present invention addresses the problem of providing: an epoxy resin composition which exhibits good low temperature curability even if a specific trithiol compound is contained therein; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition. Provided are: an epoxy resin composition that contains (A) a thiol compound represented by chemical formula (I), (B) a thiol compound having an isocyanuric acid skeleton, (C) an epoxy resin and (D) a latent thermal curing catalyst; and an adhesive, a sealing material, a cured product, a semiconductor device and an electronic component that contain the epoxy resin composition.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09K 3/10 - Substances non couvertes ailleurs pour sceller ou étouper des joints ou des couvercles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
59.
PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION
The present invention addresses the problem of providing: a photocurable resin composition that does not require full curing by heat; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition. Provided are: a photocurable resin composition containing (A) a polymerizable compound, (B) a photopolymerization initiator, and (C) a photon upconversion material; an adhesive, a sealing material, or a coating agent containing the photocurable resin composition; a cured product thereof; a semiconductor device or an electronic component containing the cured product; and a curing method, an adhesion method, a sealing method, and a coating method using a photocurable resin composition.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
C08F 20/20 - Esters des alcools polyhydriques ou des phénols polyhydriques
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08K 3/01 - Emploi de substances inorganiques en tant qu'adjuvants caractérisées par leur fonction
An object of the present invention is to provide a liquid epoxy resin composition suitable for use as a mold underfill material for TSV, which composition may provide an electronic component having high wiring density, satisfactorily releasing heat generated during its driving and having high reliability. The liquid epoxy resin composition of the present invention comprises an epoxy resin (A), a curing agent (B), an inorganic filler (C) consisting of a silica filler and an alumina filler and carbon black (D); the epoxy resin (A) comprises a specific aliphatic epoxy resin, the alumina filler has a specific particle size distribution, and the liquid epoxy resin composition gives a cured product having a thermal conductivity within a predetermined range. The liquid epoxy resin composition of the present invention gives a cured product having high thermal conductivity. Thus, in a semiconductor device that includes electronic components manufactured using the composition as a mold underfill material for TSV, deterioration of performance due to heat is suppressed. Furthermore, an electronic component manufactured using the liquid epoxy resin composition of the present invention as a mold underfill material for TSV exhibits sufficient reliability. Thus, the liquid epoxy resin composition of the present invention is highly suitable for use as a mold underfill material for TSV.
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
61.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
The present invention suppresses the occurrence of a mold flash at the time of compression molding. Provided are: a liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl polymer; an electronic component and a semiconductor device manufactured using the same; and a method for manufacturing an electronic component using the same.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
C08G 59/02 - Polycondensats contenant plusieurs groupes époxyde par molécule
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 57/00 - Compositions contenant des polymères non spécifiés obtenus par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
62.
ELECTRICALLY CONDUCTIVE PASTE, USE OF ELECTRICALLY CONDUCTIVE PASTE, SOLAR CELL, AND METHOD FOR PRODUCING SOLAR CELL
GFGFGF of the glass frit (C) and the content G of the glass frit (C) in terms of parts by weight in the electrically conductive paste, if the content of the electrically conductive particles (A) in the electrically conductive paste is taken to be 100 parts by weight, falls within the range 0.25-1.45.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01L 31/068 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails adaptés comme dispositifs de conversion photovoltaïque [PV] caractérisés par au moins une barrière de potentiel ou une barrière de surface les barrières de potentiel étant uniquement du type homojonction PN, p.ex. cellules solaires à homojonction PN en silicium massif ou cellules solaires à homojonction PN en couches minces de silicium polycristallin
63.
LIQUID COMPRESSION MOLDING MATERIAL, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE
The present invention suppresses warping of a sealed article and has excellent rapid curing properties. A liquid compression molding material according to the present invention comprises a resin composition containing (A) an epoxy resin, (B1) a phenolic curing agent, (B2) an acid anhydride curing agent, and (C) an inorganic filler, wherein a glass transition temperature Tg of a cured product of the resin composition is in a range of 50°C to 120°C.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 43/34 - Alimentation en matière à mouler des moules ou des moyens de pressage
C08G 59/00 - Polycondensats contenant plusieurs groupes époxyde par moléculeMacromolécules obtenues par réaction de polycondensats polyépoxydés avec des composés monofonctionnels à bas poids moléculaireMacromolécules obtenues par polymérisation de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08G 59/42 - Acides polycarboxyliquesLeurs anhydrides, halogénures ou esters à bas poids moléculaire
[Problem to be solved] To provide an epoxy resin composition that is excellent in injectability and thermal conductivity of the cured product and can also be used for manufacturing a semiconductor device having high operation reliability. [Solution] An epoxy resin composition including an epoxy resin (A), a curing agent (B), a curing catalyst (C), and a filler (D), in which the filler (D) contains an aluminum nitride filler (D-1), the aluminum nitride filler (D-1) has an average particle size of 10.0 μm or less, the aluminum nitride filler (D-1) has a uranium content of 20 ppb or less, and a blending ratio of the aluminum nitride filler (D-1) to a total amount of the filler (D) is 70% by mass or more.
Provided are a resin composition for a semiconductor device of a wafer level chip size package type, which exhibits excellent high-frequency properties, and can form a coating film which has a thickness that has less unevenness, and is unlikely to cause warpage of the semiconductor substrate, a semiconductor device using the same, and a method for producing a semiconductor device. A resin composition for a semiconductor device of a wafer level chip size package type, the resin composition comprising (A) a modified polyphenylene ether resin having an unsaturated double bond at the end thereof, (B) an elastomer having a butadiene skeleton, and optionally (C) a solvent, a semiconductor device using the same, and a method for producing a semiconductor device.
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
The purpose of the present invention is to provide a novel metal member. A metal member according to the present invention includes a layer containing Ni and Zn on at least one surface of a metal material, wherein the Zn adhesion amount in the layer containing Ni and Zn is 1.0 mg/dm2to 7.5 mg/dm2 (exclusive of 7.5), and the Zn content in the layer containing Ni and Zn is 55 mass% to 100 mass% (exclusive of 100 mass%).
The objective of the present invention is to provide a novel metal member. A metal member according to the present invention comprises a metal material which is a non-magnetic body, and a layer formed on the surface of the metal material and containing a magnetic metal and a non-magnetic metal. The metal member has a peak having a peak height of 0.7 to 1.2 times a reference value and/or a phase width of 0.8 to 1.5 times a reference value in a histogram obtained by measuring a magnetic field using a magnetic force microscope (MFM), wherein the peak height is a measured peak maximum value (hmax) of the histogram, the phase width is a range in which h/hmax is 0.01 or more, and the reference value is a value obtained by using the metal member yet to be processed.
The present invention addresses the problem of providing: a novel substance capable of solving the problem of conventional bismaleimides having a dimer acid skeleton; a curable composition, adhesive, or sealing material containing same and having excellent photo-curability and adhesive strength; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product. Provided are: a dimer acid-modified acrylamide; a composition mainly containing the dimer acid-modified acrylamide; a curable composition, adhesive, or sealing material containing the dimer acid-modified acrylamide and a radical polymerization initiator; a cured product obtained by curing same; and a semiconductor device or electronic component including the cured product.
To provide: an epoxy resin composition capable of suppressing small pores generated when the surface of a cured product thereof is polished; an electronic component using the epoxy resin composition; a semiconductor device using the epoxy resin composition; and a method for manufacturing the semiconductor device. The epoxy resin composition contains an epoxy resin, a curing accelerator, a filler, and an elastomer. The elastomer is at least one selected from a solid elastomer and a liquid elastomer. The solid elastomer has a structure in which a double bond is not included in the main chain.
Provided are: a semiconductor device comprising an interlayer insulating film having a high tensile elongation; and a resin composition. The semiconductor device comprises: a semiconductor chip; an encapsulation material for covering the semiconductor chip; wiring for electrically connecting the semiconductor chip to an external terminal; and a rewiring layer including an interlayer insulating film that surrounds the wiring, wherein the rewiring layer has an area larger than that of the semiconductor chip in a plan view, and the interlayer insulating film has a tensile elongation of at least 15% at 25°C.
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
C08L 71/00 - Compositions contenant des polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
71.
RESIN COMPOSITION, ELECTRICALLY CONDUCTIVE ADHESIVE, CURED OBJECT, AND SEMICONDUCTOR DEVICE
There are provided: a resin composition that has low elasticity, is curable at low temperature, and has a long pot life; an electrically conductive adhesive that contains the resin composition; a cured product of the resin composition; and a semiconductor device that contains the electrically conductive adhesive or the cured product of the resin composition. The resin composition contains (A) a radically polymerizable curable resin, (B) a radical polymerization initiator, and (C) a radical polymerization inhibitor. The (C) component contains (C1) a nitrosamine compound. The (A) component contains (A1) a urethane acrylate oligomer. The (A1) component has a mass average molecular weight of 1,600 or more and 20,000 or less. The resin composition is useful as an electrically conductive adhesive, a material for mounting components or a sealing material for protecting components, and an insulating material for reinforcement which are used in the FHE field.
Provided is a resin composition with low dielectric characteristics while having good ability to permeate into circuit boards. This composition comprises (A) a thermosetting resin comprising vinylbenzyl groups and/or maleimide groups, and (B) a compound with a butadiene backbone that has a 1,2-vinyl group, and the number average molecular weight of component (B) is 1000-10000.
C08L 9/00 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures à diènes conjugués
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C09J 4/00 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
Provided are: a curable resin composition which can be cured at low temperatures, from which a cured product having a low Tg can be obtained, and which has excellent conformability to an adherend; an adhesive; a sealing material; a cured product having a low Tg; a semiconductor apparatus including the cured product; and an electronic device including the cured product. The curable resin composition comprises (A) a cationic curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxydicarbonate-type organic peroxide. The component (A) includes at least one selected from the group consisting of (A1) an epoxy resin having a ring skeleton in a molecule, and (A2) an oxetane resin.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
Provided are: a curable resin composition which can be cured at a low temperature and which has excellent pot life; an adhesive; a sealing material; a cured product; a semiconductor device; and an electronic device. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) a peroxy dicarbonate-type organic peroxide represented by formula (1). The peroxycarbonate-type organic peroxide represented by formula (1) includes an alkyl group represented by R1and an alkyl group represented by R2, the alkyl groups each having at least 10 carbon atoms.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
Provided are: a curable resin composition which can be cured through heating at a low temperature and/or ultraviolet ray irradiation and with which corrosion of an adherend is suppressed; an adhesive; a sealing material; a cured product obtained by curing same; and a semiconductor device and electronic device including the cured product. This curable resin composition comprises (A) a cation-curable resin, (B) an acid generator including an iodonium salt, and (C) an ion trapping agent including at least one kind of atom selected from the group consisting of Zr, Mg, and Al.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/00 - Adhésifs à base de polyéthers obtenus par des réactions créant une liaison éther dans la chaîne principaleAdhésifs à base de dérivés de tels polymères
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
76.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Provided are: an epoxy resin composition that yields a cured product that can prevent warping of a board and peeling from a chip; a cured product using the same; and a semiconductor device. The epoxy resin composition contains an epoxy resin, a filler, and at least one selected from a curing agent and a curing catalyst. The epoxy resin contains a flexible epoxy resin, and the content of flexible epoxy resin is from 8.0 mass% to 25.0 mass% relative to the epoxy resin.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
77.
RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, DIE ATTACHMENT MATERIAL, CURED PRODUCT AND ELECTRONIC DEVICE
The present invention provides: a resin composition which has a low viscosity and enables the achievement of a cured product that has a high Tg; an adhesive and a sealing material, each of which comprises this resin composition; a die attachment material; a cured product; and an electronic device. This resin composition is characterized by containing (A) a pentaerythritol tetraglycidyl ether and (B) an epoxy resin other than the component (A), and is also characterized in that the amount of the component (A) is less than 30% by mass in 100% by mass of organic matters that include the component (A) and the component (B).
The present invention is directed to provide novel methods for manufacturing laminates. The method includes the steps of: bonding the insulating substrate layer and a copper component having protrusions on a surface thereof; transferring the protrusions to a surface of the insulating substrate layer by peeling off the copper component to form a seed layer; forming a resist on a predetermined area of a surface of the seed layer; plating, with copper, the surface of the seed layer in an area where the resist has not been layered to laminate the copper; removing the resist; and removing the seed layer that has been exposed by the removal of the resist.
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
C23C 18/16 - Revêtement chimique par décomposition soit de composés liquides, soit de solutions des composés constituant le revêtement, ne laissant pas de produits de réaction du matériau de la surface dans le revêtementDépôt par contact par réduction ou par substitution, p. ex. dépôt sans courant électrique
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/16 - Procédés de couchageAppareillages à cet effet
G03F 7/26 - Traitement des matériaux photosensiblesAppareillages à cet effet
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
79.
INSULATIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND ELECTRONIC COMPONENT
The present invention addresses the problem of providing an insulative resin composition suitable for aerosol-jet printing technologies. Provided is an insulative resin composition which contains (A) inorganic particles having a mean particle diameter (D50) of 0.02-0.5 μm, (B) a polyfunctional thermosetting compound, and (C) a curing agent, and which has a viscosity of 400 mPa·s or less as measured using a type-E viscometer at a condition of 25°C and 50 rpm.
The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less.
G01N 23/20058 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffraction de la radiation par les matériaux, p. ex. pour rechercher la structure cristallineRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffusion de la radiation par les matériaux, p. ex. pour rechercher les matériaux non cristallinsRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la réflexion de la radiation par les matériaux en mesurant la diffraction des électrons, p. ex. la diffraction d’électrons lents [LEED] ou la diffraction d’électrons de haute énergie en incidence rasante [RHEED]
G01N 23/20091 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffraction de la radiation par les matériaux, p. ex. pour rechercher la structure cristallineRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la diffusion de la radiation par les matériaux, p. ex. pour rechercher les matériaux non cristallinsRecherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en utilisant la réflexion de la radiation par les matériaux en mesurant le spectre de dispersion d’énergie [EDS] du rayonnement diffracté
G01N 33/00 - Recherche ou analyse des matériaux par des méthodes spécifiques non couvertes par les groupes
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
Provided is a highly efficient crystalline silicon solar cell which has a high open-circuit voltage (Voc) and fill factor (FF). A solar cell comprising a crystalline silicon substrate (1) which contains an impurity diffusion layer, a passivation film (2) positioned on at least the impurity diffusion layer of the substrate (1), and an electrode (20) which contains silver (Ag) and is positioned on at least part of the passivation film (2), wherein: one or more AgSi regions (30) are further included in the solar cell and positioned in at least part of the interval between the electrode (20) and the substrate (1); the AgSi regions (30) include one or more AgSi regions (30) which have a depth of at least 100nm; and the residual rate of the passivation film (2), which is the proportion of the residual length of the passivation film (2) in a scanning electron micrograph of a cross-section which is 5.7µm×3.9µm and includes the AgSi regions (30) of the solar cell, is 10-90%.
The present invention provides an electrically conductive paste which is suitable for the formation of an electrode by a laser process for the production of a crystalline silicon solar cell. This electrically conductive paste is used for the purpose of forming an electrode on a passivation film which is disposed on the surface of a p-type semiconductor layer that is disposed on the surface of an n-type semiconductor substrate; and this electrically conductive paste contains (A) silver particles, (B) an organic vehicle and (C) glass frit. This electrically conductive paste additionally contains 0.5 part by weight or less of (D) aluminum particles relative to 100 parts by weight of the (A) silver particles; or alternatively, this electrically conductive paste does not contain the (D) aluminum particles.
The present invention further suppresses the occurrence of recess defects which are formed in a polished surface when a surface of a cured product of an epoxy resin composition is polished. Provided is an epoxy resin composition comprising (A) an epoxy resin, B) at least one component selected from the group consisting of curing agents and curing accelerators, and (C) a filler, wherein the average presence density of recesses which have a diameter of not less than 0.5 μm and which are observed in a polished surface of a cured product of the epoxy resin composition is not more than 1.00/mm2. Also provided are an electronic component mounting structure using the epoxy resin composition, and a method for producing the electronic component mounting structure.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08K 3/013 - Charges, pigments ou agents de renforcement
C08K 7/22 - Particules expansibles, poreuses ou creuses
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 23/12 - Supports, p. ex. substrats isolants non amovibles
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
85.
Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body
A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.
The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive. Provided is a resin composition comprising: (A) a polyfunctional epoxy compound having an epoxy equivalent of less than 215 g/eq; (B) a polyfunctional epoxy compound having an epoxy equivalent of at least 215 g/eq; (C) a polyfunctional thiol compound; (D) a curing catalyst; and (E) a monofunctional compound having one group (e), which includes an unsaturated double bond and an electron-withdrawing group adjacent thereto, in a molecule.
C09J 4/06 - Adhésifs à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
The object of the present invention is to provide a resin composition and an adhesive that cure under a low temperature condition, provide a cured product with an excellent stress relaxation property, and have a low self-exothermic temperature during a curing reaction. The present invention provides a resin composition comprising (A) a polyfunctional epoxy compound, (B) a polyfunctional thiol compound, (C) a monofunctional compound having one group (c) containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule, and (D) a curing catalyst.
C08G 59/06 - Polycondensats contenant plusieurs groupes époxyde par molécule de composés polyhydroxylés avec l'épihalohydrine ou ses précurseurs de polyphénols
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
88.
RESIN COMPOSITION, ADHESIVE, SEALANT, CURED PRODUCT AND SEMICONDUCTOR DEVICE
The object of the present invention is to provide a resin composition and an adhesive that can reduce odor derived from thiol curing agents and provide a cured product with reduced odor. The present invention provides a resin composition comprising (A) a thiol curing agent having two or more thiol groups, (B) a main agent having two or more groups (b) each of which is reactive with a thiol group, (C) an odor masking agent having one group (c) reactive with a thiol group, and (D) a heat latent curing catalyst, wherein the amount of the (A) thiol curing agent is 10 to 60% by weight of the total weight of the resin composition, and the component (C) is a monofunctional compound having one group containing an unsaturated double bond and an electron-withdrawing group adjacent thereto in its molecule.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C08G 75/045 - Polythioéthers à partir de composés mercapto ou de leurs dérivés métalliques à partir de composés mercapto et de composés insaturés
89.
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
To suppress the bias of the distribution of a filler dispersed in a sealing material (cured product) covering an electrode connection portion, provided is an epoxy resin composition, including: (A) an epoxy resin; (B) a curing agent; (C) a filler; and (D) an ionic compound in which at least one of a cation or an anion is organic matter.
Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device. The epoxy resin composition contains a polyalkylene glycol epoxy resin, a heterocyclic compound including a nitrogen atom, and a filler. The content of the filler is 55 mass% or more and less than 77 mass% with respect to the total amount of the epoxy resin composition.
The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device. This epoxy resin composition contains a polytetramethylene glycol-type epoxy resin, a heterocyclic compound that contains a nitrogen atom, and a filler; the filler is surface-treated with at least one of 3-methacryloxypropyltrimethoxysilane and N-phenyl-3-aminopropyltrimethoxysilane; and the content of the filler is not less than 55% by mass but less than 77% by mass relative to the total mass of this epoxy resin composition.
The problem addressd by this invention is to provide a conductive composition that can be sintered at low temperature and has low resistance, the composition forming a conductive film having excellent flexibility and bend resistance. Provided is a conductive composition comprising (A) surface-modified silver nanoparticles in which the surface is coated with a lower carboxylic acid, (B) a binder resin, and (C) an organic solvent, wherein the lower carboxylic acid of (A) the surface-modified silver nanoparticles present in the conductive composition starts desorption from the silver nanoparticles at 40 to 130 °C.
The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device. That is, provided is a resin composition containing a polyfunctional epoxy resin, a monofunctional epoxy resin, and a latent curing agent. The polyfunctional epoxy resin contains a polyfunctional epoxy resin having an epoxy equivalent weight of 400 g/eq. or greater, and the resin composition satisfies the following conditions. Conditions: Given X as the content of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater / the epoxy equivalent weight of the polyfunctional epoxy resin with an epoxy equivalent weight of 400 g/eq. or greater, Y as the content of the monofunctional epoxy resin / the epoxy equivalent weight of the monofunctional epoxy resin, and Z as the content of all polyfunctional epoxy resin / the epoxy equivalent weight of all polyfunctional epoxy resin, X/Z is 0.3 to 1.0 and Y/Z is 0.35 to 1.20.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
G02B 1/16 - Revêtements optiques obtenus par application sur les éléments optiques ou par traitement de la surface de ceux-ci ayant un effet antistatique, p. ex. revêtements conducteurs électriques
The present invention provides: a resin composition which is curable at a relatively low temperature and which has a long pot life; a cured product; and a semiconductor device and an electronic component which include the cured product. Provided are: a resin composition comprising (A) a radically polymerizable curable resin, (B) an organic peroxide, and (C) a polymerization inhibitor that can be sublimated, said resin composition further comprising (D) conductive particles as necessary; a cured product obtained by curing the resin composition; and a semiconductor device and an electronic component which comprise the cured product.
C08L 101/02 - Compositions contenant des composés macromoléculaires non spécifiés caractérisées par la présence de groupes déterminés
C08F 20/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an end and (B) a thermoplastic elastomer having a number average molecular weight of 60,000 or more.
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
This conductive paste contains (A) conductive particles and (B) a binder resin. The (A) conductive particles include surface-treated metal particles. The surface-treated metal particles each contain a metal particle and a surface-treated layer disposed on at least a portion of the surface of the metal particle. The conductive paste has high sulfidization resistance, and an electrode can be formed therefrom at relatively low cost.
An electroconductive paste comprising (A) electroconductive particles and (B) a binder resin, wherein the electroconductive particles (A) include surface-treated metal particles, the surface-treated metal particles comprising metal particles and a surface treatment layer disposed on at least some of the surfaces of the metal particles, the surface treatment layer including a zinc compound. The electroconductive paste has high sulfurization resistance and can form relatively inexpensive electrodes.
Provided is a conductive paste comprising conductive particles (A) and a binder resin (B), wherein the conductive particles (A) have metal particles and a surface treatment layer containing a palladium compound, the surface treatment layer being placed on at least a part of the surface of the metal particles. This conductive paste contains the conductive particles (A) in an amount of 80 parts by weight or more with respect to 100 parts by weight of the conductive paste. The conductive paste exhibits high sulfidation resistance, and can achieve excellent printing characteristics even with an increased content of conductive particles.
Provided is a conductive paste comprising conductive particles (A), binder resin (B), and glass frits (C), wherein the conductive particles (A) have metal particles and a surface treatment layer containing a palladium compound, the surface treatment layer being placed on at least a part of the surface of the metal particles. The softening point of the glass frits (C) is 800 °C or below. Even when containing glass frits with a low softening point, this conductive paste can suppress outflow of glass components from an electrode during firing, and exhibits excellent sulfidation resistance.
An alumina composite sol composition includes (A) an alumina sol containing an alumina hydrate, (B) an alkoxysilane compound, (C) a polyvalent organic acid, and (D) a solvent, wherein the amount of the alumina hydrate in the alumina sol (A) is 3 to 11% by mass.
