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2021
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Invention
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Stretchable electroconductive material, method for manufacturing the same, and device using the s... |
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Invention
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Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic dev... |
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Invention
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Method for manufacturing self-healing composition, self-healing composition, and self-healing fil... |
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2020
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Invention
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Circuit board using low dielectric resin composition. A circuit board includes an insulating made... |
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Invention
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Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing... |
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Invention
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Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and me... |
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Invention
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Method for manufacturing thick polyimide film. A method for manufacturing a thick polyimide film ... |
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Invention
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Polyimide film and method for manufacturing same.
A polyimide film with improved dielectric and ... |
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Invention
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Fluorine-containing dispersion and method of manufacturing the same, and fluorine-containing comp... |
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Invention
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Method for manufacturing electromagnetic shielding film. A method for manufacturing an electromag... |
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Invention
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Polyimide component, polyimide film, and polyimide copper clad laminate.
A polyimide component b... |
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Invention
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Conductive ink and conductive element able to be stretched.
A conductive ink able to be stretche... |
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Invention
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Method for manufacturing a block copolymer of polyamide acid. A block copolymer of polyamide acid... |
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Invention
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Liquid crystal polymer composition, copper substrate, and method for manufacturing the copper sub... |
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2019
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Invention
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Conductive composition, conductive film, and circuit board using the same.
A durable but thin-fi... |
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Invention
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Polyamic acid composition, polyimide film, and copper clad laminate.
A polyamic acid composition... |
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Invention
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Modified polyimide compound, resin composition and polyimide film. A resin composition comprises ... |
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Invention
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Elastic conductive composite fabric capable of detecting and providing electrical signals accordi... |
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2018
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Invention
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Modified liquid crystal polymer, polymeric film, and method for manufacturing the modified liquid... |
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Invention
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Photosensitive resin composition, and polymer film made therefrom. A photosensitive resin composi... |
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Invention
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Package substrate. A package substrate includes a dielectric layer, a first circuit layer, a seco... |
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Invention
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Low dielectric resin composition, film and circuit board using the same. A low dielectric resin c... |
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2017
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Invention
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Inorganic shell, resin composition, and method for making inorganic shell. An inorganic shell is ... |
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Invention
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Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using th... |
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Invention
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Package structure. A chip packaging structure includes a flexible circuit board, a first built-up... |
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Invention
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Water soluble photosensitive resin composition and film using same. A non-toxic water soluble pho... |
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Invention
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Resin composition, polyimide film and method for manufacturing polyimide film. A resin compositio... |
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Invention
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Resin composition, method for making resin composition and film for circuit board, and circuit bo... |
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Invention
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Polyamic acid, polyimide, polyimide film and copper clad laminate using the same.
A polyamic aci... |
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Invention
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Photosensitive resin composition, and film and printed circuit board using same. A non-reactive p... |
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|
Invention
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Photosensitive resin composition, method for making photosensitive resin composition, and method ... |
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2016
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Invention
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Resin composition and adhesive film and circuit board made of the same.
A resin composition suit... |
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Invention
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Flexible circuit board and method for manufacturing same.
A flexible circuit board includes a fi... |
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2015
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Invention
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Multi-layer circuit board.
A multi-layer circuit board includes a plurality of circuit substrate... |
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Invention
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Method of manufacturing a package substrate. A circuit board includes a dielectric layer, a first... |
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Invention
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Chip package and method for manufacturing same.
A chip package can include a chip, a plurality o... |
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Invention
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Substrate, chip package with same and method for manufacturing same.
A substrate includes a base... |
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Invention
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Circuit board for radio transceiving and method for manufacturing same.
A circuit board for radi... |
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Invention
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Package structure and method for manufacturing same. The present disclosure relates to a method f... |
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|
Invention
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Method for manufacturing package structure. A method for manufacturing a package structure carrie... |
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Invention
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Packaging substrate, method for manufacturing same, and chip packaging structure having same.
A ... |
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Invention
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Part-embedded circuit structure and method for manufacturing same.
A method for manufacturing a ... |
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Invention
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Packaging substrate and method for manufacturing same. A method for manufacturing a packaging sub... |
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Invention
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Heat sink, method for making the same, and electronic device having the same. A heat sink include... |
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Invention
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Hybrid circuit board and method for making the same, and semiconductor package structure.
A hybr... |
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2014
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Invention
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Flexible printed circuit board and method for manufacturing same.
A flexible printed circuit boa... |
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Invention
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Printed circuit board and method for manufacturing same.
A printed circuit board (PCB) and a met... |
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Invention
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Interposer and method for manufacturing same. An interposer includes an insulating substrate, a p... |
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2013
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Invention
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Substrate, chip package and method for manufacturing substrate. A substrate includes a first wiri... |
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2010
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P/S
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Printed circuit boards |
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P/S
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Printed circuit board. |
