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2023
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Invention
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Method for manufacturing a biocompatible wire.
The disclosure relates to a method for manufactur... |
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2022
|
Invention
|
Coated round wire.
A round wire comprising a wire core with a surface, the wire core having a co... |
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Invention
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Coated round wire. A round wire comprising a wire core with a surface, the wire core having a coa... |
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2021
|
Invention
|
Ball-bond arrangement.
A ball-bond arrangement comprising a bond pad of a semiconductor device a... |
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Invention
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Ball-bond arrangement. A ball-bond arrangement comprising a bond pad of a semiconductor device an... |
|
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Invention
|
Coated wire. A3) 20 to 70% of the crystal grains of the wire core are oriented in <100> direction... |
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Invention
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Coated wire. A wire comprising a silver-based wire core having a double-layer coating comprised o... |
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Invention
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Method for increasing the straightness of a thin wire. A method for producing a further wire, whe... |
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Invention
|
Coated wire.
A wire comprising a wire core with a surface, the wire core having a coating layer ... |
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Invention
|
Coated wire. A wire comprising a wire core with a surface, the wire core having a coating layer s... |
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2020
|
Invention
|
Process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconduct... |
|
|
Invention
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Manufacturing and tape transfer method for a patterned preform. The invention relates to a manufa... |
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2018
|
Invention
|
Process for electrically connecting contact surfaces of electronic components. A process for elec... |
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|
Invention
|
Composite wire.
One aspect relates to a coil comprising at least two composite wires. The compos... |
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|
Invention
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Method for manufacturing a composite wire.
One aspect relates to a method for manufacturing a co... |
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|
Invention
|
Method for manufacturing a cable.
One aspect relates to a method for manufacturing a cable. The ... |
|
|
Invention
|
Method for manufacturing a passivated product.
One aspect relates to a method for manufacturing ... |
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2017
|
Invention
|
Coated wire. wherein the coating layer is a double-layer comprised of a 1 to 1000 nm inner layer ... |
|
|
Invention
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Process for electrically connecting the contact surfaces of electronic components by a bonding wi... |
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2016
|
Invention
|
Sputtering target of ruthenium-containing alloy and production method thereof. The present invent... |
|
|
Invention
|
Silver alloyed copper wire. A silver alloyed copper wire comprising a wire core, the wire core it... |
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|
Invention
|
Alloyed silver wire. An alloyed silver wire comprising or consisting of a wire core, the wire cor... |
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|
Invention
|
Co-based alloy sputtering target having boride and method for producing the same. The present inv... |
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2015
|
Invention
|
Coated copper (cu) wire for bonding applications. The invention relates to a wire and a method of... |
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|
Invention
|
Copper based bonding wire for a semiconductor device. The present invention relates to a wire, co... |
|
|
Invention
|
Improved coated copper wire for bonding applications. The present invention relates to a wire com... |
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|
Invention
|
Corrosion and moisture resistant copper based bonding wire comprising nickel. A wire comprising a... |
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|
Invention
|
Metal sintering preparation and the use thereof of the connecting of components. A metal sinterin... |
|
|
Invention
|
Ball-bond arrangement. A ball-bond arrangement comprising an aluminum bond pad of a semiconductor... |
|
|
Invention
|
Epoxy resin-based electroconductive composition. An electrically conductive composition comprisin... |
|
|
Invention
|
Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying... |
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2014
|
Invention
|
Copper bond wire and method of making the same. The invention is related to a bonding wire, compr... |
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|
Invention
|
Palladium coated copper wire for bonding applications. The invention is related to a bonding wire... |
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1998
|
Invention
|
Composite noble metal wire. Composite wires in which a noble metal annulus is welded to an electr... |
