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2020
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Invention
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Heat sink, semiconductor package and semiconductor module. 2: Cu—Mo composite layer thickness, th... |
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Invention
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Heat dissipation plate, semiconductor package and semiconductor module. 111222/T ≤ 0.36/(((number... |
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2018
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Invention
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Heat sink and method for manufacturing same. Provided is a heat sink that has a clad structure of... |
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Invention
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Heat dissipation plate and manufacturing process therefor. The present invention provides a heat ... |
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Invention
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Sintered friction material for brake. Provided is a sintered friction material for a brake which ... |
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2017
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Invention
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Heat sink and method for manufacturing same. Provided is a low thermal expansion rate, high therm... |
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2016
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Invention
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Method of manufacturing soft magnetic dust core and soft magnetic dust core.
Provided is a soft ... |
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Invention
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Method for producing soft magnetic dust core, and soft magnetic dust core. Provided is a soft mag... |
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2010
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Invention
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Heat sink for electronic device and process for production thereof. A heat sink for an electronic... |
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Invention
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Heat sink for electronic device, and process for production thereof. Disclosed is a heat sink for... |
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2008
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Invention
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Heat radiating component for electronic component, case for electronic component, carrier for ele... |
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2007
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Invention
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Cr-cu alloy, method for producing the same, heat-release plate for semiconductor, and heat-releas... |
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Invention
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Cr-cu alloy, process for producing the same, heat sink for semiconductor, and heat dissipating co... |
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2005
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Invention
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Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufa... |
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Invention
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Alloy material for dissipating heat from semiconductor device and method for production thereof. ... |
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Invention
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Vibration generator and method for manufacturing the same. A vibration generator ensuring high bo... |
