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2025
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P/S
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Chemicals for use in plating processes, namely, chemical
compositions used to form protective co... |
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P/S
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Chemicals for use in plating processes, namely, chemical compositions used to form protective coa... |
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P/S
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Chemical compositions for use in metal deposition processes and addition agents therefor, namely,... |
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Invention
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Composition and method for fabrication of nickel interconnects.
A nickel electrodeposition compo... |
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2024
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Invention
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Method for improving adhesion between metallization layers and ozone-etched plastics. A method of... |
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Invention
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Suppression of manganese dioxide formation in manganese (iii)-based etching solutions. A.method i... |
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Invention
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Bendable nickel plating on flexible substrates. A method of producing a flexible nickel phosphoru... |
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Invention
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Boric acid-free satin nickel. A nickel electrolyte for depositing a satin nickel layer that inclu... |
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Invention
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Gold plating bath and gold plated final finish.
An autocatalytic gold bath capable of depositing... |
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Invention
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Electrodeposition of thin copper films on conductive substrates. A copper electrolyte comprising ... |
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2023
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Invention
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Method for improving adhesion between metallization layers and ozone-etched plastics.
A method o... |
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Invention
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Treatment and recycling of wastewater from trivalent chromium plating processes. A method of trea... |
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Invention
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Suppression of manganese dioxide formation in manganese (iii)-based etching solutions.
A method ... |
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Invention
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Compositions and methods for the electrodeposition of nanotwinned copper.
A copper electroplatin... |
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Invention
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Boric acid-free satin nickel.
A nickel electrolyte for depositing a satin nickel layer that incl... |
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Invention
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Composition and method for nanotwinned copper formation. A copper electrolyte comprising a copper... |
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Invention
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Bendable nickel plating on flexible substrates.
A method of producing a flexible nickel phosphor... |
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Invention
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Copper electrodeposition in microelectronics.
An electrolytic plating composition for superfilli... |
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Invention
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Method and wet chemical compositions for diffusion barrier formation. A method of forming a diffu... |
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Invention
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Electrolyte comprising an accelerator agent for bottom-up copper electroplating.
The present inv... |
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Invention
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Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor device... |
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Invention
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Method of metallization by a nickel or cobalt alloy for the manufacture of semiconductor devices.... |
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2022
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Invention
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Compositions and methods for the eletrodeposition of nanotwinned copper.
A copper electrolyte co... |
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Invention
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Compositions and methods for the electrodeposition of nanotwinned copper. A copper electrolyte co... |
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Invention
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Compositions and methods for the electrodeposition of nanotwinned copper. A copper electroplating... |
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Invention
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Complex waveform for electrolytic plating. A method of copper electroplating in the manufacture o... |
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Invention
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Single step electrolytic method of filling through-holes in printed circuit boards and other subs... |
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Invention
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Single step electrolytic method of filling through holes in printed circuit boards and other subs... |
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Invention
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Silver/tin electroplating bath and method of using the same. An electroplating bath for depositin... |
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2021
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Invention
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Cobalt chemistry for smooth topology. An electroplated cobalt deposit and a method of electrodepo... |
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Invention
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Process for fabricating a 3d-nand flash memory.
The invention relates to a process for fabricati... |
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Invention
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High elongation electroless copper process. An electroless copper deposition composition, compris... |
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Invention
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Copper deposition in wafer level packaging of integrated circuits. An electrodeposition compositi... |
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Invention
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Electrolyte and deposition of a copper barrier layer in a damascene process.
The present inventi... |
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Invention
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Leveler compositions for use in copper deposition in manufacture of microelectronics. An aqueous ... |
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Invention
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Gold plating bath and gold plated final finish. An autocatalytic gold bath capable of depositing ... |
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Invention
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Cobalt filling of interconnects. Compositions and methods of using such compositions for electrop... |
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Invention
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Cobalt filling of interconnects in microelectronics. Processes and compositions for electroplatin... |
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Invention
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Carbon-based direct plating process.
A method of preparing a non-conductive substrate to allow m... |
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2020
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Invention
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High elongation electroless copper process.
An electroless copper deposition composition, compri... |
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Invention
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Composition and method for fabrication of nickel interconnects. A nickel electrodeposition compos... |
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2018
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Invention
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Copper electrodeposition in microelectronics. An electrolytic plating method and composition for ... |
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2017
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P/S
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Chemicals for use in the plating process. |
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2015
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P/S
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Chemicals used in polymer fields of science and electrochemical industries for use in the manufac... |
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P/S
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chemicals for use in metal plating processes and fabrication of semiconductor wafers |
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2014
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P/S
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chemical compositions used to prepare plastic and metal substrates for subsequent base and precio... |
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2013
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P/S
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Chemical additives for use with plating solutions. |
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2012
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P/S
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Chemical compositions for activating, treating and sealing metallic products; Chemical compositio... |
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2011
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P/S
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Downloadable software used by customers to manage and analyze the chemical composition of functio... |
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P/S
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Chemicals for use in the plating of zinc and zinc alloys. |
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2010
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P/S
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Electroforming chemicals used for manufacturing fine gold jewelry and watches, and other decorati... |
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P/S
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Chromium plating compositions for electroplating, namely, chemical products, salts, brighteners a... |
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2009
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P/S
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Chemical compositions. |
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P/S
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[ chemical compositions for use in metal deposition processes and addition agents therefor, namel... |
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P/S
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Purification equipment. |
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2008
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P/S
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Metal plating chemical compositions, namely, electrolytic acid copper solution |
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P/S
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Electrolytic acid copper plating chemicals. |
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2007
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P/S
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Electrolytic plating chemicals that are plated over nickel that produces satin and matte finishes... |
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P/S
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Electroplating chemicals used in the manufacture of electronic devices, namely, inductive phone c... |
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P/S
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Chemicals used for plating magnesium. |
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P/S
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Electroless plating chemicals used for semiconductor manufacturing. |
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P/S
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Electroplating chemicals used for manufacturing solar cells and photovoltaic arrays. |
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P/S
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Chemicals for use in metal plating processes and for manufacture of semiconductor plates/wafers. |
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P/S
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chemicals used for electroplating during the manufacture of solar cells and photovoltaic arrays |
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2006
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P/S
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Electroplating compositions and solutions. |
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P/S
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Chemicals and chemical preparations for surface conditioning of metal substrates, including chemi... |
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P/S
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Electroplating compositions. |
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P/S
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Chemicals except chemicals for use in cosmetics and fragances. |
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P/S
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Chemicals. |
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P/S
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Chemical plating solutions and addition agents for use in the electrodeposition of metals. |
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P/S
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Chemicals used in industry, science and photography;
unprocessed artificial resins; unprocessed ... |
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2005
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P/S
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Chemical compositions for use in metal deposition process and as addition agents therefore. |
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P/S
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Chemicals used in industry, science and photography, as well as in agriculture, horticulture and ... |
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P/S
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Chemical compositions for the protection of metal surfaces. Inhibitors against opacification and ... |
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P/S
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Chemicals used in industry, science and photography; unprocessed artificial resins, unprocessed p... |
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P/S
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Chemical products for galvanotechnic purposes, electrolyte for use in gold plating processes. |
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P/S
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Chemicals and chemical additives for zinc plating processes. |
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P/S
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Chemical compositions for use in the deposition of alloys consisting of copper and tin. |
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P/S
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Silver process chemistry, namely silver plating compositions, used in the manufacture of printed ... |
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2004
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P/S
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Electrolyte for use in gold plating process. |
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P/S
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Salts and other reagents, used in the forming of electrolytes in the electrodeposition of preciou... |
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P/S
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Chemicals for forming passivate coatings on metallic surfaces, particularly, zinc. |
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P/S
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Chemical compositions to brighten and prevent tarnishing of metal surfaces. |
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P/S
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Silver process chemistry, namely silver plating compositions used in the manufacture of printed c... |
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P/S
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Chemical products, namely a chemical solution for the surface treatment of printed circuit boards... |
