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2008
|
P/S
|
Water-soluble chemical cutting agent for use in the manufacture of electronic components Water-so... |
|
|
P/S
|
Water-soluble cutting agent. |
|
2007
|
Invention
|
Support board for perforation processing and method of perforation processing.
The support board... |
|
|
Invention
|
Support board for perforation processing and method of perforation processing. Support board for ... |
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2003
|
Invention
|
Entry boards for use in drilling small holes. An entry board for use in drilling small holes in b... |
|
2001
|
Invention
|
Entry boards for use in drilling small holes. An entry board (1) for use in drilling small holes ... |
|
1999
|
Invention
|
Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and c... |
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1997
|
Invention
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Recovery of coolant and abrasive grains used in slicing semiconductor wafers. A system for reusin... |
