- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 103/00 - Materials to be soldered, welded or cut
Patent holdings for IPC class B23K 103/00
Total number of patents in this class: 1866
10-year publication summary
|
256
|
267
|
243
|
213
|
174
|
189
|
138
|
84
|
88
|
74
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1855 |
124 |
| Corning Incorporated | 10257 |
113 |
| Hamamatsu Photonics K.K. | 4413 |
43 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
36 |
| SCHOTT AG | 1712 |
35 |
| Seurat Technologies, Inc. | 159 |
31 |
| Samsung Display Co., Ltd. | 34641 |
27 |
| Applied Materials, Inc. | 18589 |
26 |
| Siltectra GmbH | 88 |
25 |
| IPG Photonics Corporation | 529 |
19 |
| Agc, Inc. | 4827 |
19 |
| Saint-Gobain Glass France | 3757 |
18 |
| Rtx Corporation | 9360 |
17 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42636 |
14 |
| Apple Inc. | 54773 |
13 |
| Levi Strauss & Co. | 330 |
13 |
| AGC Glass Europe | 1128 |
12 |
| General Electric Company | 13767 |
11 |
| ArcelorMittal | 2280 |
11 |
| LPKF Laser & Electronics AG | 91 |
11 |
| Other owners | 1248 |