- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 103/00 - Materials to be soldered, welded or cut
Patent holdings for IPC class B23K 103/00
Total number of patents in this class: 1904
10-year publication summary
|
256
|
267
|
243
|
213
|
176
|
190
|
145
|
88
|
92
|
88
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1869 |
127 |
| Corning Incorporated | 10300 |
115 |
| Hamamatsu Photonics K.K. | 4446 |
44 |
| SCHOTT AG | 1712 |
37 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
36 |
| Seurat Technologies, Inc. | 160 |
31 |
| Samsung Display Co., Ltd. | 35171 |
28 |
| Applied Materials, Inc. | 18861 |
26 |
| Siltectra GmbH | 88 |
25 |
| IPG Photonics Corporation | 539 |
19 |
| Agc, Inc. | 4913 |
19 |
| Rtx Corporation | 9437 |
17 |
| Saint-Gobain Glass France | 3254 |
16 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43258 |
14 |
| AGC Glass Europe | 1137 |
14 |
| Apple Inc. | 55387 |
13 |
| Levi Strauss & Co. | 319 |
13 |
| General Electric Company | 13845 |
11 |
| ArcelorMittal | 2319 |
11 |
| LPKF Laser & Electronics AG | 91 |
11 |
| Other owners | 1277 |