- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3606
10-year publication summary
|
219
|
228
|
282
|
338
|
300
|
348
|
336
|
313
|
262
|
214
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1885 |
122 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
120 |
| Hamamatsu Photonics K.K. | 4478 |
102 |
| Samsung Display Co., Ltd. | 35888 |
81 |
| Corning Incorporated | 10372 |
79 |
| Panasonic Intellectual Property Management Co., Ltd. | 32244 |
63 |
| Mitsubishi Electric Corporation | 46765 |
56 |
| General Electric Company | 13859 |
52 |
| IPG Photonics Corporation | 555 |
42 |
| Applied Materials, Inc. | 19119 |
40 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6119 |
39 |
| Precitec GmbH & Co. KG | 197 |
34 |
| Electro Scientific Industries, Inc. | 369 |
33 |
| FANUC Corporation | 6844 |
30 |
| Robert Bosch GmbH | 42984 |
28 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 542 |
28 |
| Nikon Corporation | 7308 |
27 |
| Bystronic Laser AG | 272 |
27 |
| Toyota Motor Corporation | 33275 |
25 |
| Coherent, Inc. | 303 |
25 |
| Other owners | 2553 |