- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3538
10-year publication summary
225
|
235
|
290
|
343
|
307
|
355
|
340
|
316
|
262
|
137
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
TRUMPF Laser- und Systemtechnik GmbH | 533 |
121 |
Disco Corporation | 1852 |
120 |
Hamamatsu Photonics K.K. | 4405 |
101 |
Samsung Display Co., Ltd. | 34539 |
78 |
Corning Incorporated | 10252 |
78 |
Panasonic Intellectual Property Management Co., Ltd. | 31221 |
63 |
Mitsubishi Electric Corporation | 45962 |
53 |
General Electric Company | 13811 |
52 |
Applied Materials, Inc. | 18530 |
44 |
IPG Photonics Corporation | 527 |
42 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6107 |
39 |
Precitec GmbH & Co. KG | 196 |
34 |
Electro Scientific Industries, Inc. | 375 |
32 |
FANUC Corporation | 6636 |
30 |
TRUMPF Werkzeugmaschinen GmbH + Co. KG | 548 |
29 |
Robert Bosch GmbH | 42632 |
28 |
Bystronic Laser AG | 271 |
27 |
Coherent, Inc. | 319 |
25 |
Toyota Motor Corporation | 31819 |
24 |
Nikon Corporation | 7158 |
24 |
Other owners | 2494 |