- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
Patent holdings for IPC class B23K 26/06
Total number of patents in this class: 3706
10-year publication summary
|
235
|
290
|
343
|
308
|
358
|
336
|
307
|
260
|
266
|
108
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1954 |
126 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
120 |
| Hamamatsu Photonics K.K. | 4654 |
100 |
| Samsung Display Co., Ltd. | 38470 |
87 |
| Panasonic Intellectual Property Management Co., Ltd. | 33792 |
65 |
| Corning Incorporated | 10496 |
62 |
| Mitsubishi Electric Corporation | 47893 |
56 |
| General Electric Company | 13886 |
52 |
| IPG Photonics Corporation | 581 |
43 |
| Applied Materials, Inc. | 20325 |
39 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6113 |
39 |
| Precitec GmbH & Co. KG | 202 |
34 |
| Electro Scientific Industries, Inc. | 349 |
33 |
| Nikon Corporation | 7240 |
31 |
| Robert Bosch GmbH | 44064 |
30 |
| FANUC Corporation | 7174 |
30 |
| EO Technics Co., Ltd. | 114 |
28 |
| Bystronic Laser AG | 278 |
27 |
| Gigaphoton Inc. | 1321 |
27 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 522 |
27 |
| Other owners | 2650 |