- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
Patent holdings for IPC class B23K 26/12
Total number of patents in this class: 928
10-year publication summary
|
92
|
88
|
87
|
85
|
96
|
77
|
64
|
56
|
55
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seurat Technologies, Inc. | 164 |
38 |
| Velo3D, Inc. | 149 |
26 |
| Applied Materials, Inc. | 19908 |
19 |
| Samsung Display Co., Ltd. | 37602 |
15 |
| IPG Photonics Corporation | 570 |
15 |
| The Boeing Company | 20102 |
11 |
| ArcelorMittal | 2517 |
11 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 533 |
11 |
| Renishaw plc | 773 |
10 |
| Mitsubishi Heavy Industries, Ltd. | 9004 |
9 |
| Foro Energy, Inc. | 106 |
9 |
| Gigaphoton Inc. | 1296 |
9 |
| General Electric Company | 13809 |
8 |
| Toshiba Corporation | 12698 |
8 |
| Jsw Aktina System, Co., Ltd. | 80 |
8 |
| Mitsubishi Electric Corporation | 47511 |
7 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10975 |
7 |
| Disco Corporation | 1920 |
7 |
| Max-Planck-Gesellschaft zur Forderung der Wissenschaften e.V. | 1817 |
7 |
| Rtx Corporation | 9825 |
7 |
| Other owners | 686 |