- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
Patent holdings for IPC class B23K 26/12
Total number of patents in this class: 939
10-year publication summary
|
92
|
89
|
91
|
87
|
100
|
80
|
66
|
57
|
58
|
21
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seurat Technologies, Inc. | 174 |
39 |
| Velo3D, Inc. | 149 |
26 |
| Applied Materials, Inc. | 20300 |
19 |
| Samsung Display Co., Ltd. | 38400 |
15 |
| IPG Photonics Corporation | 580 |
15 |
| ArcelorMittal | 2650 |
13 |
| The Boeing Company | 20145 |
11 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 523 |
11 |
| Renishaw plc | 759 |
10 |
| Mitsubishi Heavy Industries, Ltd. | 9080 |
9 |
| Foro Energy, Inc. | 106 |
9 |
| Gigaphoton Inc. | 1320 |
9 |
| General Electric Company | 13870 |
8 |
| Toshiba Corporation | 12542 |
8 |
| Max-Planck-Gesellschaft zur Forderung der Wissenschaften e.V. | 1839 |
8 |
| Jsw Aktina System, Co., Ltd. | 83 |
8 |
| Mitsubishi Electric Corporation | 47860 |
7 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11110 |
7 |
| Disco Corporation | 1953 |
7 |
| Rtx Corporation | 10009 |
7 |
| Other owners | 693 |