- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Patent holdings for IPC class B23K 35/26
Total number of patents in this class: 1431
10-year publication summary
|
131
|
124
|
111
|
134
|
106
|
103
|
82
|
65
|
68
|
39
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 689 |
306 |
| Murata Manufacturing Co., Ltd. | 25917 |
45 |
| Koki Company Limited | 72 |
44 |
| Alpha Assembly Solutions Inc. | 212 |
40 |
| Indium Corporation | 77 |
34 |
| Tamura Corporation | 360 |
34 |
| Panasonic Intellectual Property Management Co., Ltd. | 34471 |
31 |
| Mitsubishi Materials Corporation | 2482 |
30 |
| Nihon Superior Co., Ltd. | 80 |
30 |
| Harima Chemicals, Inc. | 203 |
29 |
| Fuji Electric Co., Ltd. | 5533 |
26 |
| Sekisui Chemical Co., Ltd. | 3639 |
21 |
| Panasonic Corporation | 18716 |
15 |
| Metallo Belgium | 50 |
13 |
| Denso Corporation | 25746 |
11 |
| Infineon Technologies AG | 8419 |
11 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48861 |
11 |
| Central Glass Company, Limited | 1296 |
11 |
| Hitachi Chemical Company, Ltd. | 2229 |
10 |
| Mitsubishi Electric Corporation | 48351 |
10 |
| Other owners | 669 |