- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Patent holdings for IPC class B23K 35/26
Total number of patents in this class: 1411
10-year publication summary
|
128
|
121
|
108
|
131
|
103
|
99
|
80
|
65
|
64
|
15
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 692 |
297 |
| Murata Manufacturing Co., Ltd. | 25356 |
45 |
| Koki Company Limited | 72 |
43 |
| Alpha Assembly Solutions Inc. | 210 |
38 |
| Indium Corporation | 77 |
34 |
| Tamura Corporation | 353 |
34 |
| Panasonic Intellectual Property Management Co., Ltd. | 33202 |
31 |
| Mitsubishi Materials Corporation | 2467 |
30 |
| Nihon Superior Co., Ltd. | 80 |
30 |
| Harima Chemicals, Inc. | 203 |
29 |
| Fuji Electric Co., Ltd. | 5359 |
27 |
| Sekisui Chemical Co., Ltd. | 3543 |
21 |
| Panasonic Corporation | 19843 |
19 |
| Metallo Belgium | 50 |
13 |
| Denso Corporation | 25074 |
11 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46877 |
11 |
| Central Glass Company, Limited | 1284 |
11 |
| Hitachi Chemical Company, Ltd. | 2288 |
10 |
| Infineon Technologies AG | 8343 |
10 |
| Nitto Denko Corporation | 8422 |
10 |
| Other owners | 657 |