- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Patent holdings for IPC class B23K 35/26
Total number of patents in this class: 1362
10-year publication summary
|
132
|
131
|
124
|
111
|
134
|
106
|
103
|
79
|
64
|
10
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 676 |
283 |
| Murata Manufacturing Co., Ltd. | 23784 |
45 |
| Koki Company Limited | 69 |
42 |
| Alpha Assembly Solutions Inc. | 191 |
35 |
| Indium Corporation | 76 |
33 |
| Tamura Corporation | 353 |
31 |
| Nihon Superior Co., Ltd. | 78 |
30 |
| Harima Chemicals, Inc. | 204 |
29 |
| Panasonic Intellectual Property Management Co., Ltd. | 29895 |
28 |
| Mitsubishi Materials Corporation | 2408 |
28 |
| Fuji Electric Co., Ltd. | 4991 |
27 |
| Panasonic Corporation | 20307 |
19 |
| Sekisui Chemical Co., Ltd. | 3316 |
19 |
| Metallo Belgium | 53 |
13 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40717 |
11 |
| Central Glass Company, Limited | 1248 |
11 |
| Nippon Micrometal Corporation | 140 |
11 |
| Hitachi Chemical Company, Ltd. | 2385 |
10 |
| Denso Corporation | 23823 |
10 |
| Infineon Technologies AG | 8138 |
10 |
| Other owners | 637 |