- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
Patent holdings for IPC class B23K 35/26
Total number of patents in this class: 1388
10-year publication summary
|
131
|
128
|
121
|
108
|
131
|
103
|
99
|
79
|
65
|
48
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 684 |
289 |
| Murata Manufacturing Co., Ltd. | 24621 |
45 |
| Koki Company Limited | 70 |
42 |
| Alpha Assembly Solutions Inc. | 203 |
36 |
| Indium Corporation | 76 |
33 |
| Tamura Corporation | 358 |
33 |
| Panasonic Intellectual Property Management Co., Ltd. | 31598 |
30 |
| Nihon Superior Co., Ltd. | 78 |
30 |
| Harima Chemicals, Inc. | 205 |
29 |
| Mitsubishi Materials Corporation | 2447 |
28 |
| Fuji Electric Co., Ltd. | 5162 |
27 |
| Panasonic Corporation | 20085 |
19 |
| Sekisui Chemical Co., Ltd. | 3436 |
19 |
| Metallo Belgium | 53 |
13 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43015 |
11 |
| Central Glass Company, Limited | 1264 |
11 |
| Nippon Micrometal Corporation | 150 |
11 |
| Hitachi Chemical Company, Ltd. | 2343 |
10 |
| Denso Corporation | 24372 |
10 |
| Infineon Technologies AG | 8235 |
10 |
| Other owners | 652 |