- All sections
- B - Performing operationstransporting
- B24B - Machines, devices, or processes for grinding or polishingdressing or conditioning of abrading surfacesfeeding of grinding, polishing, or lapping agents
- B24B 5/00 - Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfacesAccessories therefor
Patent holdings for IPC class B24B 5/00
Total number of patents in this class: 78
10-year publication summary
|
3
|
7
|
1
|
5
|
3
|
4
|
2
|
1
|
1
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Ebara Corporation | 2323 |
6 |
| JTEKT Corporation | 2580 |
4 |
| NSK Ltd. | 2831 |
2 |
| Komatsu NTC Ltd. | 120 |
2 |
| Globalwafers Co., Ltd. | 730 |
2 |
| Innopad, Inc. | 11 |
2 |
| REM Technologies, Inc. | 13 |
2 |
| Safran Landing Systems | 772 |
2 |
| Kede Numerical Control Co., Ltd | 62 |
2 |
| Winroth Industri AB | 2 |
2 |
| DuPont Electronic Materials Holding, Inc. | 201 |
2 |
| Samsung Electronics Co., Ltd. | 157557 |
1 |
| 3m Innovative Properties Company | 17488 |
1 |
| Illinois Tool Works Inc. | 11858 |
1 |
| Siemens AG | 24033 |
1 |
| Micron Technology, Inc. | 27626 |
1 |
| Applied Materials, Inc. | 20363 |
1 |
| Tokyo Electron Limited | 13796 |
1 |
| United Microelectronics Corp. | 4492 |
1 |
| The United States of America as represented by the Secretary of the Navy | 2856 |
1 |
| Other owners | 41 |