- All sections
- B - Performing operationstransporting
- B81C - Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems
- B81C 3/00 - Assembling of devices or systems from individually processed components
Patent holdings for IPC class B81C 3/00
Total number of patents in this class: 666
10-year publication summary
|
47
|
63
|
56
|
44
|
35
|
42
|
25
|
28
|
25
|
21
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
43 |
| Robert Bosch GmbH | 44128 |
40 |
| Murata Manufacturing Co., Ltd. | 25722 |
10 |
| Corning Incorporated | 10500 |
10 |
| Hamamatsu Photonics K.K. | 4669 |
9 |
| InvenSense, Inc. | 1207 |
9 |
| Konica Minolta Opto, Inc. | 914 |
8 |
| Pioneer Corporation | 3782 |
8 |
| Panasonic Corporation | 19060 |
7 |
| Alps Electric Co., Ltd. | 758 |
7 |
| Illumina, Inc. | 3517 |
7 |
| Hewlett-Packard Development Company, L.P. | 25216 |
6 |
| Seiko Epson Corporation | 20248 |
6 |
| Konica Minolta, Inc. | 9116 |
6 |
| Advanced Semiconductor Engineering, Inc. | 1740 |
6 |
| STMicroelectronics International N.V. | 4148 |
6 |
| Adeia Semiconductor Bonding Technologies Inc. | 594 |
6 |
| The Regents of the University of California | 20720 |
5 |
| Denso Corporation | 25513 |
5 |
| Massachusetts Institute of Technology | 10239 |
5 |
| Other owners | 457 |