- All sections
- B - Performing operationstransporting
- B81C - Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems
- B81C 3/00 - Assembling of devices or systems from individually processed components
Patent holdings for IPC class B81C 3/00
Total number of patents in this class: 646
10-year publication summary
|
39
|
47
|
63
|
56
|
43
|
35
|
41
|
24
|
28
|
14
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42118 |
39 |
| Robert Bosch GmbH | 42450 |
37 |
| Murata Manufacturing Co., Ltd. | 24342 |
10 |
| Corning Incorporated | 10240 |
9 |
| Konica Minolta Opto, Inc. | 1094 |
8 |
| Pioneer Corporation | 4399 |
8 |
| Hamamatsu Photonics K.K. | 4388 |
8 |
| Panasonic Corporation | 20173 |
7 |
| Hewlett-Packard Development Company, L.P. | 25954 |
7 |
| Alps Electric Co., Ltd. | 815 |
7 |
| Illumina, Inc. | 3272 |
7 |
| InvenSense, Inc. | 1043 |
7 |
| Seiko Epson Corporation | 19269 |
6 |
| Konica Minolta, Inc. | 8668 |
6 |
| Agency for Science, Technology and Research | 3584 |
6 |
| Advanced Semiconductor Engineering, Inc. | 1633 |
6 |
| The Regents of the University of California | 19812 |
5 |
| Mitsubishi Heavy Industries, Ltd. | 8647 |
5 |
| Denso Corporation | 24120 |
5 |
| Nikon Corporation | 7159 |
5 |
| Other owners | 448 |