- All sections
- B - Performing operationstransporting
- B81C - Processes or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems
- B81C 3/00 - Assembling of devices or systems from individually processed components
Patent holdings for IPC class B81C 3/00
Total number of patents in this class: 659
10-year publication summary
|
47
|
61
|
55
|
42
|
34
|
40
|
24
|
28
|
25
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47015 |
41 |
| Robert Bosch GmbH | 43504 |
40 |
| Murata Manufacturing Co., Ltd. | 25455 |
10 |
| Corning Incorporated | 10409 |
9 |
| Hamamatsu Photonics K.K. | 4590 |
9 |
| InvenSense, Inc. | 1203 |
9 |
| Konica Minolta Opto, Inc. | 976 |
8 |
| Pioneer Corporation | 3856 |
8 |
| Panasonic Corporation | 19829 |
7 |
| Alps Electric Co., Ltd. | 788 |
7 |
| Illumina, Inc. | 3450 |
7 |
| Hewlett-Packard Development Company, L.P. | 25403 |
6 |
| Seiko Epson Corporation | 19984 |
6 |
| Konica Minolta, Inc. | 9003 |
6 |
| Agency for Science, Technology and Research | 3684 |
6 |
| Advanced Semiconductor Engineering, Inc. | 1698 |
6 |
| Ushio Denki Kabushiki Kaisha | 1216 |
6 |
| Adeia Semiconductor Bonding Technologies Inc. | 540 |
6 |
| The Regents of the University of California | 20502 |
5 |
| Mitsubishi Heavy Industries, Ltd. | 9004 |
5 |
| Other owners | 452 |