- All sections
- G - Physics
- G01R - Measuring electric variablesmeasuring magnetic variables
- G01R 31/27 - Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects due to surrounding elements
Patent holdings for IPC class G01R 31/27
Total number of patents in this class: 251
10-year publication summary
|
11
|
19
|
16
|
24
|
29
|
21
|
23
|
23
|
31
|
20
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 147622 |
10 |
| Intel Corporation | 47129 |
9 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
9 |
| Tokyo Electron Limited | 12899 |
9 |
| Mitsubishi Electric Corporation | 46449 |
8 |
| Infineon Technologies AG | 8255 |
6 |
| Rohm Co., Ltd. | 6487 |
6 |
| Delphi Technologies IP Limited | 315 |
6 |
| Siemens AG | 24386 |
5 |
| ABB Schweiz AG | 7055 |
4 |
| STMicroelectronics (Crolles 2) SAS | 645 |
4 |
| STMicroelectronics International N.V. | 3260 |
4 |
| SambaNova Systems, Inc. | 336 |
4 |
| International Business Machines Corporation | 61471 |
3 |
| Renesas Electronics Corporation | 5987 |
3 |
| Robert Bosch GmbH | 42824 |
3 |
| Teradyne, Inc. | 540 |
3 |
| Advantest Test Solutions, Inc. | 45 |
3 |
| TSE Co., Ltd | 55 |
3 |
| Adeia Semiconductor Bonding Technologies Inc. | 366 |
3 |
| Other owners | 146 |