- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/52 - Mounting semiconductor bodies in containers
Patent holdings for IPC class H01L 21/52
Total number of patents in this class: 2149
10-year publication summary
|
147
|
157
|
173
|
178
|
164
|
148
|
182
|
167
|
139
|
131
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 46757 |
108 |
| Hitachi Chemical Company, Ltd. | 2327 |
97 |
| Shinkawa Ltd. | 425 |
75 |
| Lintec Corporation | 2000 |
73 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 44638 |
69 |
| Nitto Denko Corporation | 8350 |
58 |
| The Furukawa Electric Co., Ltd. | 3704 |
52 |
| Rohm Co., Ltd. | 6538 |
51 |
| Fuji Electric Co., Ltd. | 5233 |
44 |
| Sumitomo Bakelite Co., Ltd. | 1509 |
38 |
| Toray Engineering Co., Ltd. | 503 |
36 |
| Resonac Corporation | 2956 |
35 |
| Samsung Electronics Co., Ltd. | 148584 |
34 |
| Panasonic Corporation | 20001 |
34 |
| Sekisui Chemical Co., Ltd. | 3478 |
33 |
| Showa Denko Materials Co., Ltd. | 624 |
31 |
| Hitachi, Ltd. | 15627 |
24 |
| Infineon Technologies AG | 8271 |
24 |
| Mitsubishi Materials Corporation | 2473 |
24 |
| Kyocera Corporation | 14013 |
23 |
| Other owners | 1186 |