- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
Patent holdings for IPC class H01L 21/603
Total number of patents in this class: 161
10-year publication summary
|
6
|
5
|
7
|
18
|
16
|
14
|
15
|
10
|
5
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47675 |
6 |
| Shinkawa Ltd. | 414 |
6 |
| Intel Corporation | 46726 |
4 |
| Toray Engineering Co., Ltd. | 513 |
4 |
| Danfoss Silicon Power GmbH | 168 |
4 |
| Sharp Kabushiki Kaisha | 18601 |
4 |
| Changxin Memory Technologies, Inc. | 4924 |
4 |
| Nanowired GmbH | 23 |
4 |
| Samsung Electronics Co., Ltd. | 154987 |
3 |
| Siemens AG | 24159 |
3 |
| Nitto Denko Corporation | 8475 |
3 |
| Fuji Electric Co., Ltd. | 5413 |
3 |
| NXP USA, Inc. | 4447 |
3 |
| Tongfu Microelectronics Co., Ltd. | 75 |
3 |
| Kioxia Corporation | 10724 |
3 |
| Micron Technology, Inc. | 27370 |
2 |
| Sanyo Electric Co., Ltd. | 3515 |
2 |
| Raytheon Company | 8466 |
2 |
| STMicroelectronics (Grenoble 2) SAS | 631 |
2 |
| Mitsui Chemicals Tohcello, Inc. | 243 |
2 |
| Other owners | 94 |