- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/765 - Making of isolation regions between components by field-effect
Patent holdings for IPC class H01L 21/765
Total number of patents in this class: 272
10-year publication summary
|
12
|
11
|
17
|
22
|
35
|
38
|
54
|
27
|
17
|
3
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40717 |
33 |
| Infineon Technologies Austria AG | 2071 |
16 |
| Infineon Technologies AG | 8138 |
12 |
| Fuji Electric Co., Ltd. | 4991 |
11 |
| Mitsubishi Electric Corporation | 44962 |
10 |
| Texas Instruments Incorporated | 19443 |
9 |
| NXP USA, Inc. | 4220 |
9 |
| Intel Corporation | 46179 |
8 |
| Toshiba Corporation | 12076 |
7 |
| United Microelectronics Corp. | 4121 |
6 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1774 |
6 |
| Micron Technology, Inc. | 25874 |
5 |
| Rohm Co., Ltd. | 6381 |
5 |
| Semiconductor Components Industries, L.L.C. | 5241 |
5 |
| MACOM Technology Solutions Holdings, Inc. | 811 |
5 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1033 |
5 |
| TSMC China Company Limited | 182 |
5 |
| Toshiba Electronic Devices & Storage Corporation | 1804 |
5 |
| HRL Laboratories, LLC | 1584 |
4 |
| Infineon Technologies Americas Corp. | 723 |
4 |
| Other owners | 102 |