- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/782 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element
Patent holdings for IPC class H01L 21/782
Total number of patents in this class: 59
10-year publication summary
|
5
|
5
|
9
|
4
|
2
|
2
|
2
|
3
|
2
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
8 |
| Disco Corporation | 1945 |
4 |
| Plasma-therm, LLC | 82 |
4 |
| Samsung Electronics Co., Ltd. | 155224 |
3 |
| Texas Instruments Incorporated | 19636 |
3 |
| Texas Instruments Japan, Ltd. | 1656 |
3 |
| Cisco Technology, Inc. | 22386 |
3 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1739 |
3 |
| International Business Machines Corporation | 62325 |
2 |
| GLOBALFOUNDRIES U.S. Inc. | 6397 |
2 |
| Morgan Stanley Senior Funding, Inc., AS Agent | 1478 |
2 |
| STATS ChipPAC Pte. Lte. | 979 |
2 |
| STMicroelectronics France | 730 |
2 |
| Toshiba Corporation | 12687 |
1 |
| Hewlett-Packard Development Company, L.P. | 25317 |
1 |
| Micron Technology, Inc. | 27384 |
1 |
| Infineon Technologies AG | 8382 |
1 |
| Panasonic Intellectual Property Management Co., Ltd. | 33812 |
1 |
| United Microelectronics Corp. | 4463 |
1 |
| The Board of Trustees of the Leland Stanford Junior University | 6615 |
1 |
| Other owners | 11 |