• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology

Patent holdings for IPC class H01L 21/822

Total number of patents in this class: 2883

10-year publication summary

153
210
255
275
222
219
214
232
152
39
2017 2018 2019 2020 2021 2022 2023 2024 2025 2026

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
47734
212
Semiconductor Energy Laboratory Co., Ltd.
11705
206
International Business Machines Corporation
62325
172
Panasonic Corporation
19386
142
Murata Manufacturing Co., Ltd.
25590
135
Sony Semiconductor Solutions Corporation
11342
120
Rohm Co., Ltd.
6778
115
Socionext Inc.
1595
95
Samsung Electronics Co., Ltd.
155224
87
Monolithic 3D Inc.
331
79
Tokyo Electron Limited
13617
75
NEC Corporation
36631
71
Intel Corporation
46737
65
Fuji Electric Co., Ltd.
5422
53
Sony Corporation
30327
43
Sharp Kabushiki Kaisha
18585
43
Mitsubishi Electric Corporation
47722
41
Renesas Electronics Corporation
5862
39
Applied Materials, Inc.
20145
37
Panasonic Intellectual Property Management Co., Ltd.
33812
37
Other owners 1016