- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
Patent holdings for IPC class H01L 21/822
Total number of patents in this class: 2883
10-year publication summary
|
153
|
210
|
255
|
275
|
222
|
219
|
214
|
232
|
152
|
39
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47734 |
212 |
| Semiconductor Energy Laboratory Co., Ltd. | 11705 |
206 |
| International Business Machines Corporation | 62325 |
172 |
| Panasonic Corporation | 19386 |
142 |
| Murata Manufacturing Co., Ltd. | 25590 |
135 |
| Sony Semiconductor Solutions Corporation | 11342 |
120 |
| Rohm Co., Ltd. | 6778 |
115 |
| Socionext Inc. | 1595 |
95 |
| Samsung Electronics Co., Ltd. | 155224 |
87 |
| Monolithic 3D Inc. | 331 |
79 |
| Tokyo Electron Limited | 13617 |
75 |
| NEC Corporation | 36631 |
71 |
| Intel Corporation | 46737 |
65 |
| Fuji Electric Co., Ltd. | 5422 |
53 |
| Sony Corporation | 30327 |
43 |
| Sharp Kabushiki Kaisha | 18585 |
43 |
| Mitsubishi Electric Corporation | 47722 |
41 |
| Renesas Electronics Corporation | 5862 |
39 |
| Applied Materials, Inc. | 20145 |
37 |
| Panasonic Intellectual Property Management Co., Ltd. | 33812 |
37 |
| Other owners | 1016 |