• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Patent holdings for IPC class H01L 21/84

Total number of patents in this class: 4060

10-year publication summary

528
487
492
417
316
216
144
177
144
39
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
41951
570
International Business Machines Corporation
60806
435
GLOBALFOUNDRIES U.S. Inc.
6436
340
Samsung Electronics Co., Ltd.
143555
180
Semiconductor Energy Laboratory Co., Ltd.
11350
137
Boe Technology Group Co., Ltd.
40474
127
Intel Corporation
46664
119
Qualcomm Incorporated
84189
85
Samsung Display Co., Ltd.
34120
79
Monolithic 3D Inc.
308
77
Renesas Electronics Corporation
6063
69
Commissariat à l'énergie atomique et aux energies alternatives
10810
68
United Microelectronics Corp.
4202
64
Semiconductor Manufacturing International (Shanghai) Corporation
1774
62
Micron Technology, Inc.
26169
60
Au Optronics Corporation
3535
51
Institute of Microelectronics, Chinese Academy of Sciences
1370
45
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8479
39
LG Display Co., Ltd.
13131
37
Skyworks Solutions, Inc.
3658
36
Other owners 1380