• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body

Patent holdings for IPC class H01L 21/84

Total number of patents in this class: 4071

10-year publication summary

528
488
493
417
316
215
144
181
145
8
2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
40608
568
International Business Machines Corporation
60129
436
GLOBALFOUNDRIES U.S. Inc.
6433
339
Samsung Electronics Co., Ltd.
139001
183
Semiconductor Energy Laboratory Co., Ltd.
11101
138
Boe Technology Group Co., Ltd.
38881
127
Intel Corporation
46126
117
Qualcomm Incorporated
81865
83
Samsung Display Co., Ltd.
32798
80
Monolithic 3D Inc.
299
77
Renesas Electronics Corporation
6148
69
Commissariat à l'énergie atomique et aux energies alternatives
10692
69
Micron Technology, Inc.
25824
64
United Microelectronics Corp.
4106
62
Semiconductor Manufacturing International (Shanghai) Corporation
1773
62
Au Optronics Corporation
3605
52
Institute of Microelectronics, Chinese Academy of Sciences
1344
45
Shenzhen China Star Optoelectronics Technology Co., Ltd.
8482
39
LG Display Co., Ltd.
12892
38
Tessera, Inc.
634
36
Other owners 1387