- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/86 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
Patent holdings for IPC class H01L 21/86
Total number of patents in this class: 38
10-year publication summary
3
|
6
|
6
|
3
|
1
|
1
|
1
|
0
|
2
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Tessera, Inc. | 630 |
3 |
Psemi Corporation | 968 |
3 |
Shin-Etsu Chemical Co., Ltd. | 5495 |
2 |
Inoso, LLC | 8 |
2 |
Saint-Gobain Ceramics & Plastics, Inc. | 839 |
2 |
Innoscience (Suzhou) Technology Co., ltd. | 170 |
2 |
Apple Inc. | 53280 |
1 |
Qualcomm Incorporated | 82781 |
1 |
International Business Machines Corporation | 60389 |
1 |
Honeywell International Inc. | 14031 |
1 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 41068 |
1 |
Murata Manufacturing Co., Ltd. | 23928 |
1 |
Advanced Micro Devices, Inc. | 5474 |
1 |
TDK Corporation | 6580 |
1 |
Kyocera Corporation | 13445 |
1 |
National Semiconductor Corporation | 1158 |
1 |
Microsoft Technology Licensing, LLC | 53087 |
1 |
GLOBALFOUNDRIES U.S. Inc. | 6437 |
1 |
Korea Electronics Technology Institute | 1534 |
1 |
OmniVision Technologies, Inc. | 1537 |
1 |
Other owners | 10 |