- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/055 - ContainersSeals characterised by the shape the container being a hollow construction and having an insulating base as a mounting for the semiconductor body the leads having a passage through the base
Patent holdings for IPC class H01L 23/055
Total number of patents in this class: 237
10-year publication summary
|
22
|
25
|
36
|
23
|
13
|
10
|
16
|
3
|
15
|
3
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fuji Electric Co., Ltd. | 5548 |
12 |
| Infineon Technologies AG | 8427 |
11 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 49324 |
11 |
| Mitsubishi Electric Corporation | 48460 |
11 |
| Samsung Electronics Co., Ltd. | 159473 |
6 |
| Kyocera Corporation | 14502 |
6 |
| Canon Inc. | 44490 |
5 |
| Intel Corporation | 46327 |
4 |
| Semiconductor Components Industries, L.L.C. | 5259 |
4 |
| Amkor Technology Singapore Holding Pte. Ltd | 495 |
4 |
| Qualcomm Mems Technologies, Inc. | 574 |
3 |
| Renesas Electronics Corporation | 5846 |
3 |
| Medtronic MiniMed, Inc. | 1788 |
3 |
| Huawei Technologies Co., Ltd. | 125335 |
3 |
| Murata Manufacturing Co., Ltd. | 25998 |
3 |
| Northrop Grumman Systems Corporation | 2912 |
3 |
| OSRAM Opto Semiconductors GmbH | 3215 |
3 |
| Shinko Electric Industries Co., Ltd. | 1247 |
3 |
| Qorvo US, Inc. | 2441 |
3 |
| Adeia Semiconductor Bonding Technologies Inc. | 621 |
3 |
| Other owners | 133 |