- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/06 - Containers; Seals characterised by the material of the container or its electrical properties
Patent holdings for IPC class H01L 23/06
Total number of patents in this class: 388
10-year publication summary
32
|
28
|
35
|
25
|
28
|
25
|
23
|
22
|
17
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Texas Instruments Incorporated | 19405 |
15 |
Kyocera Corporation | 13327 |
14 |
Infineon Technologies AG | 8134 |
13 |
Mitsubishi Electric Corporation | 44738 |
13 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
11 |
International Business Machines Corporation | 60075 |
9 |
Intel Corporation | 46097 |
9 |
Fuji Electric Co., Ltd. | 4956 |
9 |
Skyworks Solutions, Inc. | 3603 |
9 |
Nepes Co., Ltd. | 68 |
7 |
Hitachi Metals, Ltd. | 2026 |
6 |
Murata Manufacturing Co., Ltd. | 23648 |
6 |
STMicroelectronics S.r.l. | 3656 |
6 |
Jcet Semiconductor (shaoxing) Co., Ltd. | 364 |
6 |
Samsung Electronics Co., Ltd. | 138518 |
5 |
Shinko Electric Industries Co., Ltd. | 1186 |
5 |
Advanced Semiconductor Engineering, Inc. | 1594 |
5 |
Infineon Technologies Americas Corp. | 730 |
5 |
STATS ChipPAC Pte. Lte. | 1531 |
5 |
Analog Devices, Inc. | 3431 |
4 |
Other owners | 226 |