- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
Patent holdings for IPC class H01L 23/12
Total number of patents in this class: 4113
10-year publication summary
|
219
|
261
|
310
|
286
|
270
|
223
|
298
|
214
|
223
|
7
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 23648 |
382 |
| Kyocera Corporation | 13327 |
239 |
| Intel Corporation | 46097 |
147 |
| Mitsubishi Electric Corporation | 44738 |
132 |
| Mitsubishi Materials Corporation | 2408 |
103 |
| Rohm Co., Ltd. | 6314 |
96 |
| NEC Corporation | 34337 |
95 |
| Panasonic Corporation | 20327 |
82 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
80 |
| Sony Semiconductor Solutions Corporation | 9656 |
67 |
| Sumitomo Bakelite Co., Ltd. | 1469 |
55 |
| Fuji Electric Co., Ltd. | 4956 |
49 |
| LG Innotek Co., Ltd. | 7213 |
48 |
| Renesas Electronics Corporation | 6155 |
46 |
| Panasonic Intellectual Property Management Co., Ltd. | 29620 |
45 |
| Samsung Electronics Co., Ltd. | 138518 |
40 |
| Showa Denko Materials Co., Ltd. | 624 |
36 |
| Sony Corporation | 31565 |
35 |
| Texas Instruments Incorporated | 19405 |
35 |
| Dai Nippon Printing Co., Ltd. | 3970 |
34 |
| Other owners | 2267 |