- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
Patent holdings for IPC class H01L 23/12
Total number of patents in this class: 4171
10-year publication summary
|
219
|
261
|
310
|
286
|
270
|
223
|
299
|
215
|
223
|
121
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 24369 |
387 |
| Kyocera Corporation | 13706 |
254 |
| Intel Corporation | 46751 |
147 |
| Mitsubishi Electric Corporation | 45860 |
136 |
| Mitsubishi Materials Corporation | 2432 |
104 |
| Rohm Co., Ltd. | 6410 |
96 |
| NEC Corporation | 35424 |
94 |
| Panasonic Corporation | 20166 |
82 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42222 |
81 |
| Sony Semiconductor Solutions Corporation | 10315 |
71 |
| Sumitomo Bakelite Co., Ltd. | 1488 |
54 |
| LG Innotek Co., Ltd. | 7552 |
53 |
| Fuji Electric Co., Ltd. | 5114 |
49 |
| Panasonic Intellectual Property Management Co., Ltd. | 31022 |
47 |
| Renesas Electronics Corporation | 6054 |
43 |
| Samsung Electronics Co., Ltd. | 144426 |
40 |
| Dai Nippon Printing Co., Ltd. | 4061 |
40 |
| Kabushiki Kaisha Toshiba, doing business as Toshiba Corporation | 6269 |
39 |
| Resonac Corporation | 2702 |
37 |
| Showa Denko Materials Co., Ltd. | 624 |
36 |
| Other owners | 2281 |