- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
Patent holdings for IPC class H01L 23/13
Total number of patents in this class: 2451
10-year publication summary
|
192
|
180
|
236
|
236
|
246
|
199
|
206
|
169
|
204
|
126
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46699 |
187 |
| Samsung Electronics Co., Ltd. | 144143 |
149 |
| Kyocera Corporation | 13689 |
124 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42118 |
94 |
| Murata Manufacturing Co., Ltd. | 24342 |
63 |
| Mitsubishi Materials Corporation | 2431 |
63 |
| Mitsubishi Electric Corporation | 45811 |
52 |
| Micron Technology, Inc. | 26209 |
50 |
| Toshiba Materials Co., Ltd. | 657 |
49 |
| Invensas Corporation | 614 |
48 |
| Advanced Semiconductor Engineering, Inc. | 1633 |
44 |
| Kabushiki Kaisha Toshiba, doing business as Toshiba Corporation | 6274 |
42 |
| Samsung Electro-mechanics Co., Ltd. | 5512 |
36 |
| Qualcomm Incorporated | 84501 |
33 |
| International Business Machines Corporation | 61023 |
32 |
| Denka Company Limited | 2533 |
30 |
| Infineon Technologies AG | 8199 |
29 |
| Rohm Co., Ltd. | 6411 |
29 |
| Texas Instruments Incorporated | 19487 |
27 |
| NGK Insulators, Ltd. | 4920 |
27 |
| Other owners | 1243 |