- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
Patent holdings for IPC class H01L 23/13
Total number of patents in this class: 2324
10-year publication summary
|
192
|
180
|
236
|
236
|
246
|
199
|
204
|
163
|
202
|
13
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46126 |
176 |
| Samsung Electronics Co., Ltd. | 139001 |
128 |
| Kyocera Corporation | 13344 |
117 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40608 |
90 |
| Murata Manufacturing Co., Ltd. | 23702 |
62 |
| Mitsubishi Materials Corporation | 2406 |
61 |
| Micron Technology, Inc. | 25824 |
50 |
| Mitsubishi Electric Corporation | 44851 |
50 |
| Invensas Corporation | 621 |
48 |
| Toshiba Materials Co., Ltd. | 631 |
46 |
| Advanced Semiconductor Engineering, Inc. | 1596 |
42 |
| Kabushiki Kaisha Toshiba, doing business as Toshiba Corporation | 6235 |
39 |
| Samsung Electro-mechanics Co., Ltd. | 5206 |
34 |
| International Business Machines Corporation | 60129 |
31 |
| Denka Company Limited | 2459 |
30 |
| Rohm Co., Ltd. | 6346 |
29 |
| Qualcomm Incorporated | 81865 |
27 |
| Texas Instruments Incorporated | 19432 |
27 |
| Infineon Technologies AG | 8137 |
27 |
| NGK Insulators, Ltd. | 4792 |
27 |
| Other owners | 1183 |