- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/15 - Ceramic or glass substrates
Patent holdings for IPC class H01L 23/15
Total number of patents in this class: 1827
10-year publication summary
|
100
|
112
|
125
|
151
|
115
|
144
|
124
|
243
|
273
|
178
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 47102 |
280 |
| Corning Incorporated | 10500 |
73 |
| Kyocera Corporation | 14335 |
55 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
45 |
| Absolics Inc. | 102 |
44 |
| Agc, Inc. | 5502 |
43 |
| BorgWarner US Technologies LLC | 432 |
43 |
| Murata Manufacturing Co., Ltd. | 25722 |
36 |
| Samsung Electronics Co., Ltd. | 157557 |
35 |
| Amosense Co., Ltd. | 501 |
34 |
| Toshiba Materials Co., Ltd. | 564 |
34 |
| Semiconductor Components Industries, L.L.C. | 5264 |
29 |
| Mitsubishi Materials Corporation | 2468 |
27 |
| Dai Nippon Printing Co., Ltd. | 4237 |
26 |
| Amogreentech Co., Ltd. | 644 |
25 |
| NGK Insulators, Ltd. | 5232 |
23 |
| Qualcomm Incorporated | 91997 |
22 |
| Toppan Printing Co., Ltd. | 2088 |
22 |
| Infineon Technologies AG | 8400 |
21 |
| Shinko Electric Industries Co., Ltd. | 1230 |
21 |
| Other owners | 889 |