- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/15 - Ceramic or glass substrates
Patent holdings for IPC class H01L 23/15
Total number of patents in this class: 1801
10-year publication summary
|
100
|
112
|
125
|
151
|
115
|
145
|
130
|
247
|
273
|
126
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Intel Corporation | 46718 |
257 |
| Corning Incorporated | 10431 |
73 |
| Kyocera Corporation | 14263 |
55 |
| Agc, Inc. | 5355 |
43 |
| BorgWarner US Technologies LLC | 434 |
43 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 47602 |
42 |
| Absolics Inc. | 82 |
42 |
| Samsung Electronics Co., Ltd. | 154751 |
35 |
| Murata Manufacturing Co., Ltd. | 25588 |
35 |
| Amosense Co., Ltd. | 499 |
34 |
| Toshiba Materials Co., Ltd. | 567 |
34 |
| Semiconductor Components Industries, L.L.C. | 5276 |
29 |
| Mitsubishi Materials Corporation | 2465 |
27 |
| Dai Nippon Printing Co., Ltd. | 4218 |
26 |
| NGK Insulators, Ltd. | 5215 |
23 |
| Amogreentech Co., Ltd. | 632 |
23 |
| Qualcomm Incorporated | 90674 |
22 |
| Toppan Printing Co., Ltd. | 2096 |
22 |
| Toshiba Corporation | 12694 |
21 |
| Infineon Technologies AG | 8382 |
21 |
| Other owners | 894 |