- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/16 - Fillings or auxiliary members in containers, e.g. centering rings
Patent holdings for IPC class H01L 23/16
Total number of patents in this class: 638
10-year publication summary
|
45
|
44
|
68
|
62
|
60
|
82
|
69
|
62
|
51
|
40
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
106 |
| Samsung Electronics Co., Ltd. | 147622 |
66 |
| Intel Corporation | 47129 |
48 |
| Infineon Technologies AG | 8255 |
19 |
| Advanced Semiconductor Engineering, Inc. | 1664 |
17 |
| Texas Instruments Incorporated | 19445 |
16 |
| Amkor Technology Singapore Holding Pte. Ltd | 417 |
16 |
| Siliconware Precision Industries Co., Ltd. | 605 |
15 |
| Mitsubishi Electric Corporation | 46449 |
14 |
| International Business Machines Corporation | 61471 |
13 |
| Micron Technology, Inc. | 26210 |
13 |
| Mediatek Inc. | 5162 |
13 |
| Qualcomm Incorporated | 86553 |
10 |
| Fuji Electric Co., Ltd. | 5203 |
9 |
| STATS ChipPAC Pte. Lte. | 1552 |
9 |
| STMicroelectronics S.r.l. | 3600 |
7 |
| Avago Technologies International Sales Pte. Limited | 8701 |
7 |
| Kioxia Corporation | 10441 |
7 |
| Apple Inc. | 55446 |
6 |
| Huawei Technologies Co., Ltd. | 113853 |
6 |
| Other owners | 221 |