- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/20 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
Patent holdings for IPC class H01L 23/20
Total number of patents in this class: 103
10-year publication summary
|
10
|
11
|
6
|
4
|
5
|
7
|
4
|
8
|
4
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
9 |
| Global Circuit Innovations Incorporated | 20 |
6 |
| Infineon Technologies AG | 8400 |
5 |
| Qorvo US, Inc. | 2394 |
4 |
| Micron Technology, Inc. | 27626 |
3 |
| Analog Devices International Unlimited Company | 2022 |
3 |
| Qualcomm Incorporated | 91997 |
2 |
| Siemens AG | 24033 |
2 |
| International Business Machines Corporation | 62621 |
2 |
| Seiko Epson Corporation | 20248 |
2 |
| Texas Instruments Incorporated | 19663 |
2 |
| Kyocera Corporation | 14335 |
2 |
| Analog Devices, Inc. | 3321 |
2 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11127 |
2 |
| Advanced Semiconductor Engineering, Inc. | 1740 |
2 |
| Frampton E. Ellis | 10 |
2 |
| Sony Semiconductor Solutions Corporation | 11551 |
2 |
| Spatial Photonics, Inc. | 32 |
2 |
| Amkor Technology Japan, Inc. | 45 |
2 |
| Adeia Semiconductor Bonding Technologies Inc. | 594 |
2 |
| Other owners | 45 |