- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 23/28
Total number of patents in this class: 2218
10-year publication summary
|
163
|
210
|
183
|
177
|
131
|
153
|
100
|
78
|
124
|
38
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 25708 |
215 |
| Mitsubishi Electric Corporation | 47943 |
179 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48214 |
101 |
| Rohm Co., Ltd. | 6811 |
94 |
| Intel Corporation | 47063 |
61 |
| STATS ChipPAC Pte. Lte. | 975 |
53 |
| Samsung Electronics Co., Ltd. | 157300 |
50 |
| Denso Corporation | 25495 |
49 |
| STATS ChipPAC Management Pte. Ltd. | 545 |
41 |
| Texas Instruments Incorporated | 19653 |
38 |
| Infineon Technologies AG | 8398 |
37 |
| Panasonic Corporation | 19103 |
33 |
| Fuji Electric Co., Ltd. | 5461 |
33 |
| Advanced Semiconductor Engineering, Inc. | 1736 |
30 |
| Micron Technology, Inc. | 27611 |
28 |
| Shindengen Electric Manufacturing Co., Ltd. | 839 |
24 |
| Sony Semiconductor Solutions Corporation | 11543 |
20 |
| Hitachi Automotive Systems, Ltd. | 3954 |
19 |
| Renesas Electronics Corporation | 5874 |
19 |
| Amkor Technology Singapore Holding Pte.ltd. | 485 |
16 |
| Other owners | 1078 |