- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
Patent holdings for IPC class H01L 23/28
Total number of patents in this class: 2228
10-year publication summary
|
163
|
210
|
183
|
177
|
131
|
154
|
98
|
77
|
124
|
3
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 25107 |
215 |
| Mitsubishi Electric Corporation | 47131 |
175 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46308 |
100 |
| STATS ChipPAC Pte. Lte. | 1554 |
96 |
| Rohm Co., Ltd. | 6590 |
94 |
| Intel Corporation | 46510 |
60 |
| Denso Corporation | 24863 |
49 |
| Samsung Electronics Co., Ltd. | 149838 |
43 |
| Texas Instruments Incorporated | 19521 |
40 |
| Infineon Technologies AG | 8290 |
38 |
| Panasonic Corporation | 19924 |
34 |
| Fuji Electric Co., Ltd. | 5290 |
31 |
| Advanced Semiconductor Engineering, Inc. | 1683 |
30 |
| Micron Technology, Inc. | 26703 |
28 |
| Shindengen Electric Manufacturing Co., Ltd. | 831 |
24 |
| Hitachi Automotive Systems, Ltd. | 3955 |
19 |
| Renesas Electronics Corporation | 5920 |
19 |
| Sony Semiconductor Solutions Corporation | 10923 |
19 |
| Amkor Technology Singapore Holding Pte.ltd. | 496 |
17 |
| Siliconware Precision Industries Co., Ltd. | 633 |
15 |
| Other owners | 1082 |