- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
Patent holdings for IPC class H01L 23/29
Total number of patents in this class: 6118
10-year publication summary
|
534
|
512
|
532
|
513
|
379
|
420
|
416
|
405
|
459
|
216
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48560 |
407 |
| Mitsubishi Electric Corporation | 48172 |
215 |
| Samsung Electronics Co., Ltd. | 158442 |
194 |
| Rohm Co., Ltd. | 6877 |
172 |
| Murata Manufacturing Co., Ltd. | 25809 |
144 |
| Resonac Corporation | 3610 |
138 |
| Infineon Technologies AG | 8410 |
132 |
| Lintec Corporation | 2024 |
130 |
| Hitachi Chemical Company, Ltd. | 2236 |
122 |
| Namics Corporation | 488 |
106 |
| DIC Corporation | 3974 |
105 |
| Sumitomo Bakelite Co., Ltd. | 1541 |
104 |
| LG Chem, Ltd. | 17950 |
103 |
| Shin-Etsu Chemical Co., Ltd. | 6120 |
102 |
| Intel Corporation | 47178 |
98 |
| Nitto Denko Corporation | 8558 |
92 |
| Denso Corporation | 25645 |
86 |
| Fuji Electric Co., Ltd. | 5511 |
77 |
| Panasonic Intellectual Property Management Co., Ltd. | 34265 |
74 |
| Texas Instruments Incorporated | 19640 |
70 |
| Other owners | 3447 |