- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/373 - Cooling facilitated by selection of materials for the device
Patent holdings for IPC class H01L 23/373
Total number of patents in this class: 5668
10-year publication summary
|
450
|
509
|
539
|
590
|
494
|
521
|
500
|
473
|
585
|
281
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 42118 |
240 |
| Mitsubishi Electric Corporation | 45811 |
204 |
| Fuji Electric Co., Ltd. | 5106 |
179 |
| Intel Corporation | 46699 |
170 |
| Samsung Electronics Co., Ltd. | 144143 |
133 |
| Infineon Technologies AG | 8199 |
120 |
| Mitsubishi Materials Corporation | 2431 |
114 |
| Denka Company Limited | 2533 |
111 |
| Semiconductor Components Industries, L.L.C. | 5249 |
97 |
| International Business Machines Corporation | 61023 |
96 |
| Rohm Co., Ltd. | 6411 |
80 |
| Siemens AG | 24561 |
74 |
| Micron Technology, Inc. | 26209 |
74 |
| Dexerials Corporation | 1952 |
74 |
| Denso Corporation | 24120 |
66 |
| Shin-Etsu Chemical Co., Ltd. | 5598 |
56 |
| Toshiba Corporation | 12286 |
53 |
| Texas Instruments Incorporated | 19487 |
52 |
| Qorvo US, Inc. | 2194 |
47 |
| Rogers Germany GmbH | 140 |
46 |
| Other owners | 3582 |