- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/373 - Cooling facilitated by selection of materials for the device
Patent holdings for IPC class H01L 23/373
Total number of patents in this class: 6061
10-year publication summary
|
446
|
509
|
537
|
586
|
493
|
520
|
503
|
478
|
600
|
636
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46161 |
305 |
| Mitsubishi Electric Corporation | 46926 |
210 |
| Fuji Electric Co., Ltd. | 5253 |
186 |
| Intel Corporation | 46460 |
161 |
| Samsung Electronics Co., Ltd. | 149087 |
156 |
| Infineon Technologies AG | 8287 |
125 |
| Denka Company Limited | 2655 |
115 |
| Mitsubishi Materials Corporation | 2472 |
114 |
| Semiconductor Components Industries, L.L.C. | 5297 |
105 |
| International Business Machines Corporation | 61721 |
99 |
| Rohm Co., Ltd. | 6560 |
89 |
| Micron Technology, Inc. | 26558 |
82 |
| Siemens AG | 24333 |
76 |
| Denso Corporation | 24783 |
72 |
| Sekisui Chemical Co., Ltd. | 3493 |
58 |
| Texas Instruments Incorporated | 19495 |
57 |
| Shin-Etsu Chemical Co., Ltd. | 5784 |
56 |
| Toshiba Corporation | 12548 |
55 |
| Huawei Technologies Co., Ltd. | 115827 |
52 |
| Qorvo US, Inc. | 2289 |
50 |
| Other owners | 3838 |