- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/373 - Cooling facilitated by selection of materials for the device
Patent holdings for IPC class H01L 23/373
Total number of patents in this class: 5859
10-year publication summary
|
446
|
509
|
537
|
586
|
493
|
520
|
502
|
473
|
591
|
449
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 43064 |
257 |
| Mitsubishi Electric Corporation | 46295 |
207 |
| Fuji Electric Co., Ltd. | 5168 |
181 |
| Intel Corporation | 47062 |
172 |
| Samsung Electronics Co., Ltd. | 147131 |
144 |
| Infineon Technologies AG | 8244 |
124 |
| Mitsubishi Materials Corporation | 2447 |
114 |
| Denka Company Limited | 2596 |
112 |
| Semiconductor Components Industries, L.L.C. | 5270 |
98 |
| International Business Machines Corporation | 61353 |
97 |
| Rohm Co., Ltd. | 6464 |
85 |
| Micron Technology, Inc. | 26138 |
77 |
| Siemens AG | 24436 |
75 |
| Denso Corporation | 24387 |
72 |
| Sekisui Chemical Co., Ltd. | 3439 |
57 |
| Shin-Etsu Chemical Co., Ltd. | 5676 |
56 |
| Texas Instruments Incorporated | 19450 |
55 |
| Toshiba Corporation | 12383 |
53 |
| Huawei Technologies Co., Ltd. | 113340 |
50 |
| Qorvo US, Inc. | 2231 |
49 |
| Other owners | 3724 |