- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/373 - Cooling facilitated by selection of materials for the device
Patent holdings for IPC class H01L 23/373
Total number of patents in this class: 5385
10-year publication summary
|
450
|
509
|
539
|
590
|
494
|
518
|
494
|
463
|
568
|
28
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 40539 |
214 |
| Mitsubishi Electric Corporation | 44738 |
199 |
| Fuji Electric Co., Ltd. | 4956 |
171 |
| Intel Corporation | 46097 |
166 |
| Infineon Technologies AG | 8134 |
115 |
| Mitsubishi Materials Corporation | 2408 |
114 |
| Samsung Electronics Co., Ltd. | 138518 |
111 |
| Denka Company Limited | 2454 |
110 |
| International Business Machines Corporation | 60075 |
96 |
| Semiconductor Components Industries, L.L.C. | 5242 |
84 |
| Rohm Co., Ltd. | 6314 |
76 |
| Micron Technology, Inc. | 25756 |
72 |
| Dexerials Corporation | 1915 |
72 |
| Siemens AG | 24572 |
71 |
| Denso Corporation | 23721 |
61 |
| Toshiba Corporation | 12037 |
52 |
| Shin-Etsu Chemical Co., Ltd. | 5439 |
52 |
| Texas Instruments Incorporated | 19405 |
48 |
| Huawei Technologies Co., Ltd. | 106498 |
45 |
| Qorvo US, Inc. | 2133 |
45 |
| Other owners | 3411 |