- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
Patent holdings for IPC class H01L 23/40
Total number of patents in this class: 2049
10-year publication summary
|
138
|
197
|
217
|
185
|
160
|
137
|
148
|
185
|
127
|
68
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 48018 |
140 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48302 |
118 |
| Intel Corporation | 47106 |
87 |
| Fuji Electric Co., Ltd. | 5478 |
78 |
| Denso Corporation | 25534 |
65 |
| BorgWarner US Technologies LLC | 432 |
44 |
| International Business Machines Corporation | 62634 |
38 |
| Mitsubishi Materials Corporation | 2472 |
35 |
| Semiconductor Components Industries, L.L.C. | 5262 |
34 |
| Rohm Co., Ltd. | 6826 |
33 |
| Infineon Technologies AG | 8402 |
32 |
| Siemens AG | 24029 |
29 |
| Huawei Technologies Co., Ltd. | 123385 |
27 |
| Apple Inc. | 58742 |
26 |
| Samsung Electronics Co., Ltd. | 157719 |
25 |
| Micron Technology, Inc. | 27657 |
19 |
| Hitachi Astemo, Ltd. | 6410 |
17 |
| Sumitomo Electric Industries, Ltd. | 16331 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 33997 |
16 |
| Asia Vital Components Co., Ltd. | 432 |
16 |
| Other owners | 1154 |