- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
Patent holdings for IPC class H01L 23/40
Total number of patents in this class: 2033
10-year publication summary
|
138
|
197
|
215
|
185
|
160
|
138
|
149
|
189
|
123
|
31
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Mitsubishi Electric Corporation | 47449 |
139 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46813 |
113 |
| Intel Corporation | 46597 |
88 |
| Fuji Electric Co., Ltd. | 5345 |
75 |
| Denso Corporation | 25062 |
63 |
| BorgWarner US Technologies LLC | 440 |
42 |
| International Business Machines Corporation | 62049 |
39 |
| Mitsubishi Materials Corporation | 2467 |
36 |
| Rohm Co., Ltd. | 6696 |
33 |
| Semiconductor Components Industries, L.L.C. | 5276 |
33 |
| Infineon Technologies AG | 8331 |
30 |
| Siemens AG | 24329 |
28 |
| Apple Inc. | 57432 |
27 |
| Huawei Technologies Co., Ltd. | 118879 |
26 |
| Samsung Electronics Co., Ltd. | 152304 |
24 |
| Micron Technology, Inc. | 27221 |
19 |
| Asia Vital Components Co., Ltd. | 427 |
17 |
| Hitachi Astemo, Ltd. | 6389 |
17 |
| Sumitomo Electric Industries, Ltd. | 16000 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 33168 |
16 |
| Other owners | 1152 |