- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
Patent holdings for IPC class H01L 23/42
Total number of patents in this class: 950
10-year publication summary
|
56
|
80
|
105
|
114
|
66
|
62
|
68
|
81
|
88
|
18
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48490 |
130 |
| Intel Corporation | 47100 |
68 |
| International Business Machines Corporation | 62672 |
41 |
| Samsung Electronics Co., Ltd. | 158156 |
31 |
| Micron Technology, Inc. | 27709 |
24 |
| Laird Technologies, Inc. | 377 |
17 |
| Frore Systems Inc. | 115 |
16 |
| Mitsubishi Electric Corporation | 48097 |
15 |
| Amkor Technology Singapore Holding Pte. Ltd | 483 |
15 |
| Infineon Technologies AG | 8405 |
14 |
| Denso Corporation | 25607 |
11 |
| Fuji Electric Co., Ltd. | 5498 |
11 |
| Qualcomm Incorporated | 92563 |
10 |
| Siliconware Precision Industries Co., Ltd. | 692 |
10 |
| Huawei Technologies Co., Ltd. | 123677 |
9 |
| Advanced Micro Devices, Inc. | 6121 |
9 |
| Qorvo US, Inc. | 2407 |
9 |
| Toyota Motor Corporation | 35857 |
8 |
| Advanced Semiconductor Engineering, Inc. | 1749 |
8 |
| SK hynix NAND Product Solutions Corp. | 1091 |
8 |
| Other owners | 486 |